CN117320306A - Method for manufacturing Printed Circuit Board (PCB) with convenient film coating - Google Patents
Method for manufacturing Printed Circuit Board (PCB) with convenient film coating Download PDFInfo
- Publication number
- CN117320306A CN117320306A CN202311519712.XA CN202311519712A CN117320306A CN 117320306 A CN117320306 A CN 117320306A CN 202311519712 A CN202311519712 A CN 202311519712A CN 117320306 A CN117320306 A CN 117320306A
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- Prior art keywords
- core plate
- flexible core
- layer
- protective film
- film
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- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 239000007888 film coating Substances 0.000 title description 2
- 238000009501 film coating Methods 0.000 title description 2
- 230000001681 protective effect Effects 0.000 claims abstract description 104
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- 239000010408 film Substances 0.000 claims description 176
- 239000010410 layer Substances 0.000 claims description 91
- 239000013039 cover film Substances 0.000 claims description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 41
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 238000003466 welding Methods 0.000 claims description 11
- 230000007797 corrosion Effects 0.000 claims description 7
- 238000005260 corrosion Methods 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000011282 treatment Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 8
- 238000000576 coating method Methods 0.000 claims 8
- 238000004026 adhesive bonding Methods 0.000 description 5
- 238000010030 laminating Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a method for manufacturing a PCB board with a convenient film, which comprises the following steps: step S1: preparing a first flexible core plate, a second flexible core plate, a first rigid core plate and a second rigid core plate; step S2: firstly, adsorbing a protective film on an external covering film, and then respectively cutting and forming the protective film and the external covering film; step S3: the inner side of the first flexible core plate and the inner side of the second flexible core plate are respectively fixed with an inner covering film, and the outer sides of the first flexible core plate and the second flexible core plate are respectively fixed with an outer protective film unit. According to the invention, the protective film is adsorbed on the external covering film, then cutting processing is carried out to form the external protective film unit, and then the external protective film unit can be fixed on the outer side of the first flexible core plate and the outer side of the second flexible core plate respectively at one time, so that the fixing flow of the protective film and the external covering film can be simplified, the manufacturing time of a PCB (printed circuit board) is shortened, and the efficiency is improved.
Description
Technical Field
The invention relates to a method for manufacturing a PCB with a convenient film.
Background
For a PCB board using a flexible core board, in the process of manufacturing the PCB board, it is often necessary to first pseudo-attach an external cover film to the flexible core board, and then rapidly press the pseudo-attach of a protective film to the external cover film. The specific manufacturing method is as follows: firstly, cutting and forming an external covering film, then quickly pressing the cut and formed external covering film on a flexible core board in a false way to form a welding-preventing protective layer of a circuit pattern of the flexible core board, then cutting and forming a protective film, smearing AD glue on the periphery of the protective film, aligning the protective film with the external covering film, and then pressing the protective film on the external covering film, wherein the size of the cut and formed protective film is smaller than that of the cut and formed external covering film, so that the protective film and the external covering film need to be aligned and centered for a long time, and the gluing and pressing procedures of the protective film need to take time, so that the fixing procedures of the protective film and the external covering film are complicated, the manufacturing time of a PCB is prolonged, and the efficiency is reduced.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a convenient film-covered PCB manufacturing method which can simplify the fixing flow of a protective film and an external film, shorten the manufacturing time of a PCB and improve the manufacturing efficiency of the PCB.
The invention adopts the following technical scheme:
a method for manufacturing a PCB with a convenient film comprises the following steps:
step S1: preparing a first flexible core plate, a second flexible core plate, a first rigid core plate and a second rigid core plate;
step S2: firstly, adsorbing a protective film on an external covering film with the same size as the protective film, then cutting and forming the protective film and the external covering film respectively, and forming the protective film and the external covering film which are adsorbed together after cutting and forming into an external protective film unit;
step S3: an inner covering film is fixed on the inner side of the first flexible core plate and the inner side of the second flexible core plate, and an outer protective film unit is fixed on the outer side of the first flexible core plate and the outer side of the second flexible core plate; the external protection film unit fixed on the outer side of the first flexible core plate is formed into a first protection film unit, and the external protection film unit fixed on the outer side of the second flexible core plate is formed into a second protection film unit;
step S4: stacking the first flexible core plate, the second flexible core plate, the first rigid core plate, the second rigid core plate and the prepreg units together in a manner that the prepreg units are placed between the first rigid core plate and the first flexible core plate, between the first flexible core plate and the second flexible core plate and between the second flexible core plate and the second rigid core plate, and then forming a stacked body through lamination;
step S5: drilling a via hole in the stack;
step S6: copper deposition treatment is carried out on the stacked body;
step S7: electroplating the stack;
step S8: forming an outer layer circuit pattern on the stacked body;
step S9: printing solder resist ink on the rest parts of the stacked body except the outer layer circuit pattern welding pads to form a solder resist ink body, wherein the part of the solder resist ink body covered on the first rigid core board forms a first printing solder resist ink layer, and the part of the solder resist ink body covered on the second rigid core board forms a second printing solder resist ink layer;
step S10: performing surface treatment on the outer layer circuit pattern welding pad to form an oxidation preventing layer on the outer layer circuit pattern welding pad;
step S11: removing the first printing solder resist ink layer and the first rigid core board at the position corresponding to the first protective film unit, exposing the first protective film unit, and removing the protective film of the first protective film unit; removing the parts of the second printing solder resist ink layer and the second rigid core board corresponding to the second protective film unit, exposing the second protective film unit, and removing the protective film of the second protective film unit;
step S12: and routing and forming the stacked body into a PCB.
In step S2, the distance between the side edge of the cut protection film and the corresponding side edge of the cut external cover film is 1-1.4mm.
Step S8 comprises the following sub-steps:
substep 81: covering a first resist layer on the outer copper layer of the stack; wherein, the part covered by the first resist layer on the outer copper layer is formed as a side copper part;
substep 82: electroplating the part, which is not covered by the first corrosion resistant layer, of the outer copper layer of the stacked body to thicken the part, which is not covered by the first corrosion resistant layer, of the outer copper layer of the stacked body to form a thickened line copper part;
substep 83: covering a second corrosion-resistant layer on the thickened line copper part;
substep 84: removing the first resist layer, removing the side copper part, removing the second resist layer, and exposing the thickened circuit copper part to form an outer circuit pattern.
The second resist layer is a tin layer.
In substep 83, the thickened line copper portion is covered with a second resist layer by means of tin plating or tinning.
In substep 84, the edge copper is removed by etching.
The built-in covering film is provided with a first covering film adhesive layer; in step S3, each built-in cover film is fixed on the inner side of the first flexible core board and the inner side of the second flexible core board respectively through the first cover film adhesive layer.
The external covering film is provided with a second covering film adhesive layer; in step S3, each external protection film unit is fixed on the outer side of the first flexible core board and the outer side of the second flexible core board respectively through the second covering film adhesive layer.
In step S3, the inner cover films are respectively and correspondingly pressed and fixed on the inner side of the first flexible core plate and the inner side of the second flexible core plate by using a quick press, and the outer cover film units are respectively and correspondingly pressed and fixed on the outer side of the first flexible core plate and the outer side of the second flexible core plate by using the quick press.
After completion of step S11, and before starting step S12, there is further provided step 111: characters and marks are printed on the outer layer circuit patterns of the stacked body.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a method for manufacturing a PCB board with a convenient film, which comprises the steps of S1-S12, wherein in the step S2, a protective film is firstly adsorbed on an external film with the same size as the protective film, then the protective film and the external film are respectively cut and molded, and the protective film and the external film which are adsorbed together after the cutting and molding are formed into an external film protecting unit; then in step S3, external protective film units are fixed on the outer side of the first flexible core plate and the outer side of the second flexible core plate; therefore, the external protective film unit is formed by firstly adsorbing the protective film on the external protective film with the same size as the protective film and then cutting, and then the external protective film unit can be fixed at one time respectively on the outer side of the first flexible core plate and the outer side of the second flexible core plate, so that longer alignment time can be avoided, the processes of gluing and laminating the protective film are reduced, the gluing and laminating time of the protective film is reduced, the fixing flow of the protective film and the external protective film can be simplified, the manufacturing time of a PCB (printed circuit board) is shortened, and the manufacturing efficiency of the PCB is improved.
Drawings
FIG. 1 is a schematic diagram of step S2 of the present invention;
FIG. 2 is a schematic structural view of a stack;
10. a first flexible core plate; 20. a second flexible core plate; 30. a first rigid core plate; 40. a second rigid core plate; 50. an external protective film unit; 51. a protective film; 52. an external cover film; 53. a second coverlay film adhesive layer; 54. a second release paper layer; 60. a built-in cover film; 61. a first coverlay film adhesive layer; 70. a prepreg unit; 71. a first slot; 72. a second slot; 80. a stack; 91. a first printed solder resist ink layer; 92. and a second printing solder resist ink layer.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, on the premise of no conflict, the following embodiments or technical features may be arbitrarily combined to form new embodiments.
A method for manufacturing a PCB with a convenient film comprises the following steps:
step S1: preparing a first flexible core board 10, a second flexible core board 20, a first rigid core board 30, and a second rigid core board 40;
step S2: firstly, adsorbing the protective film 51 on an external cover film 52 with the same size as the protective film 51, then cutting and forming the protective film 51 and the external cover film 52 respectively, and forming the protective film 51 and the external cover film 52 which are adsorbed together after cutting and forming into an external protective film unit 50 (shown in figure 1);
step S3: an inner cover film 60 is fixed to both the inner side of the first flexible core board 10 and the inner side of the second flexible core board 20, and an outer cover film unit 50 is fixed to both the outer side of the first flexible core board 10 and the outer side of the second flexible core board 20; wherein, the external protection film unit 50 fixed at the outer side of the first flexible core board 10 is formed as a first protection film unit, and the external protection film unit 50 fixed at the outer side of the second flexible core board 20 is formed as a second protection film unit;
step S4: the first flexible core board 10, the second flexible core board 20, the first rigid core board 30, the second rigid core board 40 and the prepreg unit 70 are stacked together in such a manner that the prepreg unit 70 is placed between the first rigid core board 30 and the first flexible core board 10, between the first flexible core board 10 and the second flexible core board 20, and between the second flexible core board 20 and the second rigid core board 40, and then formed into a stack 80 (as shown in fig. 2) by lamination;
step S5: drilling vias in the stack 80;
step S6: copper deposition is carried out on the stacked body 80;
step S7: electroplating the stack 80;
step S8: forming an outer layer wiring pattern on the stack 80;
step S9: printing a solder resist ink on the rest of the stack 80 except the outer layer of the circuit pattern bonding pads to form a solder resist ink body, wherein the solder resist ink body covers the first rigid core board 30 to form a first printed solder resist ink layer 91, and the solder resist ink body covers the second rigid core board 40 to form a second printed solder resist ink layer 92;
step S10: performing surface treatment on the outer layer circuit pattern welding pad to form an oxidation preventing layer on the outer layer circuit pattern welding pad;
step S11: removing the first printing solder resist ink layer 91 and the first rigid core board 30 at the position corresponding to the first protective film unit, exposing the first protective film unit, and removing the protective film 51 of the first protective film unit; removing the second printing solder resist ink layer 92 and the part of the second rigid core board 40 corresponding to the second protective film unit, exposing the second protective film unit, and removing the protective film 51 of the second protective film unit;
step S12: the stack 80 is gong-cut to form a PCB.
The invention provides a method for manufacturing a PCB board with a convenient film, which comprises the steps of adopting the steps S1-S11, firstly adsorbing a protective film 51 on an external film 52 with the same size as the protective film 51 in the step S2, then respectively cutting and forming the protective film 51 and the external film 52, and forming the protective film 51 and the external film 52 which are adsorbed together after cutting and forming into an external film protecting unit 50; then in step S3, an external protection film unit 50 is fixed on the outer side of the first flexible core board 10 and the outer side of the second flexible core board 20; therefore, by firstly adsorbing the protective film 51 on the external cover film 52 with the same size as the protective film 51, the longer counterpoint time consumed by complicated counterpoint operation and larger difficulty can be avoided, then cutting processing is carried out to form the external protective film unit 50, and then the external protective film unit 50 can be respectively fixed at one time on the outer side of the first flexible core board 10 and the outer side of the second flexible core board 20, so that the gluing and laminating procedures of the protective film 51 can be reduced, the gluing and laminating time of the protective film 51 can be shortened, the fixing procedures of the protective film 51 and the external cover film 52 can be simplified, the manufacturing time of a PCB (printed circuit board) can be shortened, and the manufacturing efficiency of the PCB can be improved.
In the present embodiment, the protective film 51 is a non-adhesive polyester or polyimide, and any commercially available protective film may be used, as long as the protective effect of the external cover film 52 is achieved.
In step S10: the outer layer circuit pattern welding pad can be subjected to treatments such as gold melting, tin spraying and silver plating so as to form an anti-oxidation layer on the outer layer circuit pattern welding pad, and the anti-oxidation layer plays a role in preventing the outer layer circuit pattern welding pad from being oxidized by air.
In step S2, the cross-sectional area of the cut-formed protective film 51 is smaller than the cross-sectional area of the cut-formed external cover film 52, and the distance d between the side edge of the cut-formed protective film 51 and the corresponding side edge of the cut-formed external cover film 52 is 1-1.4mm, so as to ensure the covering protection effect and prevent the protective film 51 from being embedded into the hard board part to cause the quality problem of the PCB board. As a preferred embodiment of the present invention, the distance d between the side edge of the cut-molded protective film 51 and the corresponding side edge of the cut-molded external cover film 52 is 1.2mm.
Preferably, in step S2, the protective film 51 and the external cover film 52 having the same size as the protective film 51 are electrostatically adsorbed together by the thermoplastic machine, so that the operation is facilitated and the operation time can be further saved. Specifically, the protective film 51 and the external cover film 52 having the same size as the protective film 51 are electrostatically adsorbed together by a thermoplastic machine at a temperature of 120-150 ℃ to enhance the adsorption effect of the two.
Specifically, the protective film 51 and the external cover film 52 are cut and formed respectively, the protective film 51 is cut off by a horizontal cutter, then the cut waste of the protective film 51 is stripped, then the external cover film 52 is cut off by the horizontal cutter, and then the cut waste of the external cover film 52 is stripped. By adopting the above arrangement, the efficiency of cutting and molding the protective film 51 and the external cover film 52 can be improved.
Preferably, the built-in cover film 60 is provided with a first cover film adhesive layer 61; in step S3, the built-in cover films 60 are fixed to the inner side of the first flexible core board 10 and the inner side of the second flexible core board 20 by the first cover film adhesive layers 61, respectively. The external covering film 52 is provided with a second covering film adhesive layer 53; in step S3, each external protection film unit 50 is fixed on the outer side of the first flexible core board 10 and the outer side of the second flexible core board 20 respectively through the second covering film adhesive layer 53.
Further preferably, in step S3, the inner cover films 60 are respectively and correspondingly pressed and fixed on the inner side of the first flexible core board 10 and the inner side of the second flexible core board 20 by a quick press, and the outer cover film units 50 are respectively and correspondingly pressed and fixed on the outer side of the first flexible core board 10 and the outer side of the second flexible core board 20 by a quick press.
Specifically, a first release paper layer is disposed below the first cover film adhesive layer 61 of each internal cover film 60, a second release paper layer 54 is disposed below the second cover film adhesive layer 53 of each external protection film unit 50, in step S3, the first release paper layer below the first cover film adhesive layer 61 of each internal cover film 60 is peeled off, then each internal cover film 60 is respectively and correspondingly attached to the inner side of the first flexible core board 10 and the inner side of the second flexible core board 20, and then each internal cover film 60 is respectively and correspondingly pressed and fixed on the inner side of the first flexible core board 10 and the inner side of the second flexible core board 20 by a quick press. In step S3, the second release paper layer 54 under the second cover film adhesive layer 53 of each external protection film unit 50 is peeled off, then each external protection film unit 50 is correspondingly and pseudo-adhered to the outer side of the first flexible core board 10 and the outer side of the second flexible core board 20, and each external protection film unit 50 is correspondingly pressed and fixed on the outer side of the first flexible core board 10 and the outer side of the second flexible core board 20 by a quick press. By adopting the above arrangement, the firmness of fixing the respective inner cover films 60 to the inner side of the first flexible core board 10 and the inner side of the second flexible core board 20 can be ensured, and the firmness of fixing the respective outer cover film units 50 to the outer side of the first flexible core board 10 and the outer side of the second flexible core board 20 can be ensured.
Preferably, step S8 comprises the sub-steps of:
substep 81: covering the first resist layer on the outer copper layer of stack 80; wherein, the part covered by the first resist layer on the outer copper layer is formed as a side copper part;
substep 82: electroplating the portion of the outer copper layer of the stack 80 not covered by the first resist layer to thicken the portion of the outer copper layer of the stack not covered by the first resist layer to form a thickened line copper portion;
substep 83: covering a second corrosion-resistant layer on the thickened line copper part;
substep 84: removing the first resist layer, removing the side copper part, removing the second resist layer, and exposing the thickened circuit copper part to form an outer circuit pattern.
By using sub-steps 81-84 in step S8, which is the most preferred embodiment of the present invention, the formation of the outer layer wiring pattern can be facilitated.
In substep 84, the edge copper is removed by etching.
Specifically, the first resist layer may be a dry film, and the second resist layer is a tin layer. In substep 81, the thickened line copper portion is covered with a second resist layer by means of tin-plating or tin-plating in substep 83. By adopting the above arrangement, the formation of the second resist layer can be facilitated.
After completion of step S11, and before starting step S12, there is further provided step 111: text and logos are printed on the outer layer of the stack 80.
The prepreg unit 70 includes a prepreg, the prepreg unit 70 between the first rigid core board 30 and the first flexible core board 10 is a first prepreg bonding unit, the prepreg unit 70 between the second rigid core board 40 and the second flexible core board 20 is a second prepreg bonding unit, and the prepreg unit 70 between the first flexible core board 10 and the second flexible core board 20 is a third prepreg bonding unit; in step S4, a first slot 71 corresponding to the first protective film unit is formed in the first prepreg bonding unit, a second slot 72 corresponding to the second protective film unit is formed in the second prepreg bonding unit, and a third slot corresponding to the built-in cover film 60 is formed in the third prepreg bonding unit; and then the first flexible core board 10, the second flexible core board 20, the first rigid core board 30, the second rigid core board 40, the first prepreg bonding unit, the second prepreg bonding unit, and the third prepreg bonding unit are stacked together. By adopting the arrangement, the first protective film unit and the second protective film unit in the step S10 can be conveniently exposed.
In step S4, after the first flexible core board 10, the second flexible core board 20, the first rigid core board 30, the second rigid core board 40, the first prepreg bonding unit, the second prepreg bonding unit, and the third prepreg bonding unit are stacked together, they are pressed by a press so that the first prepreg bonding unit is bonded between the first rigid core board 30 and the first flexible core board 10, the second prepreg bonding unit is bonded between the second rigid core board 40 and the second flexible core board 20, and the third prepreg bonding unit is bonded between the first flexible core board 10 and the second flexible core board 20 to be combined into the stack 80.
Specifically, in step S5, a via hole is drilled in the stack 80 and the orifice burr is processed; in step S6, copper deposition is performed on the stack 80 to deposit a copper layer on the surface of the stack 80 and in the via hole, so as to form a conductive effect; in step S7, the stack 80 is subjected to an electroplating process to form an electroplated thickening layer on the basis of the copper layer, so that the surface copper and the hole copper meet the customer requirements.
After step S8 is completed, and before starting step S9, step a is provided: scanning the outer layer circuit pattern, picking out the open circuit and the short circuit of the circuit and carrying out VRS maintenance
After step S12 is completed, step S13 is further provided: and carrying out open-short circuit test on the PCB, and detecting the conduction performance. After step S13 is completed, step S14 is further provided: and performing appearance inspection on the finished PCB.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention are intended to be within the scope of the present invention as claimed.
Claims (10)
1. A method for manufacturing a PCB with a convenient film is characterized by comprising the following steps: the method comprises the following steps:
step S1: preparing a first flexible core plate, a second flexible core plate, a first rigid core plate and a second rigid core plate;
step S2: firstly, adsorbing a protective film on an external covering film with the same size as the protective film, then cutting and forming the protective film and the external covering film respectively, and forming the protective film and the external covering film which are adsorbed together after cutting and forming into an external protective film unit;
step S3: an inner covering film is fixed on the inner side of the first flexible core plate and the inner side of the second flexible core plate, and an outer protective film unit is fixed on the outer side of the first flexible core plate and the outer side of the second flexible core plate; the external protection film unit fixed on the outer side of the first flexible core plate is formed into a first protection film unit, and the external protection film unit fixed on the outer side of the second flexible core plate is formed into a second protection film unit;
step S4: stacking the first flexible core plate, the second flexible core plate, the first rigid core plate, the second rigid core plate and the prepreg units together in a manner that the prepreg units are placed between the first rigid core plate and the first flexible core plate, between the first flexible core plate and the second flexible core plate and between the second flexible core plate and the second rigid core plate, and then forming a stacked body through lamination;
step S5: drilling a via hole in the stack;
step S6: copper deposition treatment is carried out on the stacked body;
step S7: electroplating the stack;
step S8: forming an outer layer circuit pattern on the stacked body;
step S9: printing solder resist ink on the rest parts of the stacked body except the outer layer circuit pattern welding pads to form a solder resist ink body, wherein the part of the solder resist ink body covered on the first rigid core board forms a first printing solder resist ink layer, and the part of the solder resist ink body covered on the second rigid core board forms a second printing solder resist ink layer;
step S10: performing surface treatment on the outer layer circuit pattern welding pad to form an oxidation preventing layer on the outer layer circuit pattern welding pad;
step S11: removing the first printing solder resist ink layer and the first rigid core board at the position corresponding to the first protective film unit, exposing the first protective film unit, and removing the protective film of the first protective film unit; removing the parts of the second printing solder resist ink layer and the second rigid core board corresponding to the second protective film unit, exposing the second protective film unit, and removing the protective film of the second protective film unit;
step S12: and routing and forming the stacked body into a PCB.
2. The method for manufacturing the PCB with the convenient coating film according to claim 1, wherein the method comprises the following steps: in step S2, the distance between the side edge of the cut protection film and the corresponding side edge of the cut external cover film is 1-1.4mm.
3. The method for manufacturing the PCB with the convenient coating film according to claim 1, wherein the method comprises the following steps: step S8 comprises the following sub-steps:
substep 81: covering a first resist layer on the outer copper layer of the stack; wherein, the part covered by the first resist layer on the outer copper layer is formed as a side copper part;
substep 82: electroplating the part, which is not covered by the first corrosion resistant layer, of the outer copper layer of the stacked body to thicken the part, which is not covered by the first corrosion resistant layer, of the outer copper layer of the stacked body to form a thickened line copper part;
substep 83: covering a second corrosion-resistant layer on the thickened line copper part;
substep 84: removing the first resist layer, removing the side copper part, removing the second resist layer, and exposing the thickened circuit copper part to form an outer circuit pattern.
4. The method for manufacturing the PCB board with the convenient film according to claim 3, wherein: the second resist layer is a tin layer.
5. The method for manufacturing the PCB with the convenient coating film according to claim 4, wherein the method comprises the following steps: in substep 83, the thickened line copper portion is covered with a second resist layer by means of tin plating or tinning.
6. The method for manufacturing the PCB with the convenient coating film according to claim 4, wherein the method comprises the following steps: in substep 84, the edge copper is removed by etching.
7. The method for manufacturing the PCB with the convenient coating film according to claim 1, wherein the method comprises the following steps: the built-in covering film is provided with a first covering film adhesive layer; in step S3, each built-in cover film is fixed on the inner side of the first flexible core board and the inner side of the second flexible core board respectively through the first cover film adhesive layer.
8. The method for manufacturing the PCB with the convenient coating film according to claim 7, wherein the method comprises the following steps: the external covering film is provided with a second covering film adhesive layer; in step S3, each external protection film unit is fixed on the outer side of the first flexible core board and the outer side of the second flexible core board respectively through the second covering film adhesive layer.
9. The method for manufacturing the PCB with the convenient coating film according to claim 8, wherein the method comprises the following steps: in step S3, the inner cover films are respectively and correspondingly pressed and fixed on the inner side of the first flexible core plate and the inner side of the second flexible core plate by using a quick press, and the outer cover film units are respectively and correspondingly pressed and fixed on the outer side of the first flexible core plate and the outer side of the second flexible core plate by using the quick press.
10. The method for manufacturing the PCB with the convenient coating film according to claim 1, wherein the method comprises the following steps: after completion of step S11, and before starting step S12, there is further provided step 111: characters and marks are printed on the outer layer circuit patterns of the stacked body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311519712.XA CN117320306A (en) | 2023-11-14 | 2023-11-14 | Method for manufacturing Printed Circuit Board (PCB) with convenient film coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311519712.XA CN117320306A (en) | 2023-11-14 | 2023-11-14 | Method for manufacturing Printed Circuit Board (PCB) with convenient film coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117320306A true CN117320306A (en) | 2023-12-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311519712.XA Pending CN117320306A (en) | 2023-11-14 | 2023-11-14 | Method for manufacturing Printed Circuit Board (PCB) with convenient film coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117320306A (en) |
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2023
- 2023-11-14 CN CN202311519712.XA patent/CN117320306A/en active Pending
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