CN117310424A - Detection device and light-emitting device detection method - Google Patents

Abstract

According to the detection device and the detection method for the light emitting device, the bearing plate with the plurality of probe moving areas is arranged, so that the probes can move in the probe moving areas on the bearing plate and are matched with the first magnetic control assembly connected with the first electromagnetic component of the probes, and each probe can be attracted to the position corresponding to the pin of each light emitting device to be detected. When detecting the light emitting devices distributed on different pins, the same bearing plate can be used after the position of the probe is adjusted, so that the detection cost can be reduced.

Description

Detection device and light-emitting device detection method

Technical Field

The application relates to the technical field of manufacturing of display equipment, in particular to a detection device and a detection method of a light emitting device.

Background

With the development of display device manufacturing technology, mini light emitting diodes (Mini LEDs) and Micro light emitting diodes (Micro-LEDs) have been widely used because of their superior brightness, resolution, contrast, power consumption, lifetime, response speed, thermal stability, and the like.

The manufacturing process of Mini LEDs or Micro-LEDs is typically to form a plurality of light emitting devices (LED chips) on a sapphire wafer through a semiconductor generation process. After forming a plurality of light emitting devices, it is generally necessary to use a probe card with probes to inspect each light emitting device on a wafer, and when inspecting, it is necessary to electrically contact the probes on the probe card with pins of each light emitting device on the wafer and then transmit test electrical signals to the light emitting devices for inspection.

However, the distribution positions of the pins of the light emitting devices of different types may be different, and the probe distribution of a single detection board cannot be adapted to the light emitting devices of different types, so that the detection board adapted to each light emitting device with different pin distribution needs to be manufactured, and the production cost is increased.

Disclosure of Invention

In order to overcome the technical problems mentioned in the background of the present application, embodiments of the present application provide a detection device, including:

the probe comprises a bearing plate, a probe body and a probe cover, wherein the bearing plate comprises a first surface and a second surface, and the first surface is provided with a plurality of probe activity areas;

the probes are respectively arranged in the probe moving areas of the bearing plate, and can move in the probe moving areas; each probe comprises a first electromagnetic component and a signal contact, wherein the signal contact is positioned at one end of the probe far away from the bearing plate and is used for electrically contacting with a pin of a light-emitting device to be detected;

the first magnetic control assembly is respectively and electrically connected with the first electromagnetic component of each probe and is used for controlling the first electromagnetic component to generate magnetism;

the signal transmission assembly is electrically connected with the signal contact of each probe respectively and used for transmitting the test electric signals to the signal contact of each probe.

In one possible implementation, the carrier plate includes a rail disposed in the probe active area and extending in at least one direction, the probe being disposed on and movable along the rail.

In one possible implementation, the plurality of probes comprises a plurality of probe sets, each of the probe sets comprising two adjacent ones of the probes; the guide rails in the two probe activity areas corresponding to each probe group are axisymmetric or centrosymmetric;

preferably, the two probe active areas corresponding to each probe set respectively comprise at least two guide rails, the guide rails extend from a central point to different directions, and the guide rails in the two probe active areas corresponding to each probe set are centrosymmetric with the central point.

In one possible implementation manner, each probe activity area includes a fixing portion, a probe mounting portion and an elastic connection portion, the fixing portion and the probe mounting portion are connected through the elastic connection portion, the probe mounting portion is used for mounting the probe, and the probe mounting portion can move relative to the fixing portion along a direction parallel to the first face under the action of the elastic connection portion.

In one possible implementation, the detection device further includes:

the positioning plate is detachably connected with the second surface of the bearing plate; the positioning plate comprises a plurality of magnetic positioning points corresponding to the positions of pins of the light emitting device to be detected, so that the first electromagnetic component drives the probe to move to the positions corresponding to the corresponding magnetic positioning points after magnetism is generated.

In one possible implementation, the probe active area is provided with a reset means for restoring or holding the probe in a set initial position in the probe active area in a state in which the positioning plate is disconnected from the carrier plate.

In a possible implementation manner, the detection device comprises a plurality of positioning plates, and the positions of the magnetic positioning points on different positioning plates are distributed differently.

In one possible implementation manner, the detection device further includes a second magnetic control assembly, the magnetic positioning point of the positioning plate includes second electromagnetic components, the second magnetic control assembly is electrically connected with each second electromagnetic component, and the second magnetic control assembly is used for controlling the second electromagnetic components to generate magnetism so that the second electromagnetic components attract the first electromagnetic components at corresponding positions.

In one possible implementation manner, the positioning plate further includes a plurality of magnetic reset points, the magnetic reset points include third electromagnetic components, the second magnetic control assemblies are respectively electrically connected with the third electromagnetic components, and the second magnetic control assemblies are further used for controlling the third electromagnetic components to generate magnetism so that the third electromagnetic components adsorb the first electromagnetic components at corresponding positions to a set initial position in the probe active area.

Another object of the present application is to provide a light emitting device detection method, using the detection device provided by the present application to detect a light emitting device to be tested, the method including:

determining the positioning plate with the same distribution mode of the magnetic positioning points as the pin distribution mode of the light-emitting device to be detected;

the first electromagnetic component of each probe is controlled to generate magnetism, so that the first electromagnetic component drives the probe to move to a position corresponding to a pin of a corresponding light emitting device to be detected;

moving the bearing plate to ensure that the signal contact of each probe is respectively and electrically contacted with the pin of each light emitting device to be detected;

and transmitting a test electric signal to the light emitting device to be detected through each signal contact by the signal transmission component.

Compared with the prior art, the application has the following beneficial effects:

the application provides a detection device and a light-emitting device detection method, through setting up the loading board that has a plurality of probe activity regions, make the probe can be in the probe activity region on the loading board remove to through the cooperation of the first magnetism control assembly who is connected with the first electromagnetic component of probe, can make first magnetic component produce magnetism in order to attract each probe to the position that corresponds with each pin that waits to detect light-emitting device. Therefore, when detecting the light emitting devices distributed on different pins, the same bearing plate can be used after the position of the probe is adjusted, and therefore the detection cost can be reduced.

Further, by providing the positioning plate having a plurality of magnetic points, each of the first magnetic portions can be accurately attracted to a position corresponding to each of the magnetic positioning points so as to be aligned with the pin of each of the light emitting devices to be detected. Therefore, when detecting the light emitting devices distributed on different pins, only the corresponding positioning plate is needed to be prepared, and the same bearing plate and the probes arranged on the bearing plate are multiplexed, so that the detection cost can be reduced, and the production efficiency is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a wafer on which a light emitting device to be inspected is located;

FIG. 2 is a second schematic diagram of a wafer on which a light emitting device to be inspected is located;

FIG. 3 is a schematic diagram of a detection mode of a detection plate in the prior art;

FIG. 4 is a schematic diagram of a detection device according to an embodiment of the present disclosure;

fig. 5 is a schematic view of a carrier plate according to an embodiment of the present application;

fig. 6 is a schematic circuit connection diagram of a detection device according to an embodiment of the present application;

FIG. 7 is a second schematic diagram of a detection device according to an embodiment of the present disclosure;

FIG. 8 is a schematic diagram of a positioning plate according to an embodiment of the present disclosure;

FIG. 9 is a second schematic view of a positioning plate according to an embodiment of the present disclosure;

fig. 10 is a schematic diagram of the working principle of different positioning plates according to the embodiment of the present application;

FIG. 11 is a schematic diagram of a probe active area according to an embodiment of the present application;

FIG. 12 is a second schematic view of a probe active area according to an embodiment of the present disclosure;

FIG. 13 is a third schematic view of the probe active area according to the embodiment of the present application.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present application, it should be noted that, the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that is commonly put when the product of the application is used, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

It should be noted that, in the case of no conflict, different features in the embodiments of the present application may be combined with each other.

Referring to fig. 1 and 2, in general, a Mini LED or Micro-LED is fabricated by forming a plurality of light emitting devices 200 to be inspected on a sapphire wafer 100 through a semiconductor manufacturing process, and the relative distribution positions of the pins 210 of the light emitting devices 200 to be inspected of different types may be different.

Referring to fig. 3, after a plurality of light emitting devices 200 to be inspected are formed on a wafer 100, inspection of each light emitting device is generally performed by using an inspection board 800. The inspection board 800 is provided with a plurality of probes 400, and the probes 400 are connected with a signal providing device, and in the inspection process, after the probes 400 on the inspection board 800 are required to be in electrical contact with the pins 210 of each light emitting device 200 to be inspected on the wafer 100, test electrical signals are transmitted to the light emitting devices 200 through the probes 400 for inspection.

The inventor researches have found that the distribution positions of the pins 210 of the light emitting devices 200 to be tested may be different in different types, and the probe distribution of the test board 800 may not be suitable for the light emitting devices 200 of different types, so that the test board 800 suitable for each of the light emitting devices 200 to be tested with different pin distributions needs to be manufactured. However, when the inspection board 800 is manufactured, a large number of traces connected to the probes 400 need to be formed, and a plurality of probes 400 need to be installed, so that the inspection board 800 adapted to the light emitting devices 200 to be inspected with different pin distribution needs to be manufactured, which greatly increases the inspection cost and reduces the production efficiency of the product.

In view of the findings of the above-described problems, the present embodiment provides a solution for reducing the detection cost of the light emitting device, and the solution provided by the present embodiment is described in detail below.

Referring to fig. 4, fig. 4 is a schematic diagram of a detection apparatus according to the present embodiment, where the detection apparatus may include a carrier 300 and a plurality of probes 400.

The carrier 300 includes a first surface and a second surface opposite to each other, and referring to fig. 5, the first surface is provided with a plurality of probe active areas 310. The plurality of probes 400 may be respectively disposed in the plurality of probe activity areas 310, and the probes 400 may be movable in the probe activity areas 310 in a direction parallel to the first surface. For example, a plurality of the probes 400 may extend in a direction perpendicular to the first face, and the probe activity areas 310 may limit a moving direction of the probes 400 such that each of the probes 400 may move relatively independently in a direction parallel to the first face within its corresponding probe activity area 310.

Referring to fig. 4 again, each of the probes 400 includes a first electromagnetic component 410 and a signal contact 420, the signal contact 420 is located at one end of the probe 400 away from the carrier 300, and the signal contact 420 is used for electrically contacting with the pin 210 of the light emitting device 200 to be tested. In one example, the first electromagnetic component 410 may include an electromagnetic coil that is magnetic when energized, and the signal contact 420 may be a needle-like structure.

Referring to fig. 6, the detection apparatus provided in this embodiment may further include a first magnetic control component 600 and a signal transmission component 700.

The first magnetic control assembly 600 may be electrically connected to the first electromagnetic component 410 of each probe 400, where the first magnetic control assembly 600 is configured to control the first electromagnetic component 410 to generate magnetism, so that the first electromagnetic component 410 drives the probe 400 to move to a position corresponding to the pin 210 of the light emitting device 200 to be detected.

The signal transmission assemblies 700 are respectively electrically connected with the signal contacts 420 of each probe 400, and the signal transmission assemblies 700 are used for transmitting test electrical signals to the signal contacts 420 of each probe 400. After the signal contacts 420 of the probes 400 are electrically contacted with the pins 210 of the light emitting devices 200 to be tested, the test electrical signals can be transmitted to the light emitting devices 200 to be tested through the signal transmission assemblies 700 by the signal contacts 420. For example, an image capturing device may capture the light emitting effect after the light emitting devices 200 to be detected on the wafer 100 obtain the test electrical signal, and determine whether the light emitting devices 200 to be detected are operating normally according to the light emitting effect.

Based on the above design, by providing the carrier plate 300 having the plurality of probe activity areas 310 such that the probes 400 can move within the probe activity areas 310 on the carrier plate 300 and by cooperating with the first magnetic control assembly 600 connected to the first electromagnetic part 410 of the probes 400, each of the probes 400 can be attracted to a position corresponding to the pins 210 of each of the light emitting devices 200 to be detected. In this way, when detecting the light emitting devices 200 to be detected with different pin distributions, the same carrier plate 300 and a plurality of probes 400 thereon can be used after the positions of the probes 400 are adjusted, so that the detection cost can be reduced.

In a possible implementation, referring to fig. 7, the detecting device may further include the positioning plate 500, where the positioning plate 500 is detachably connected to the carrier plate 300. Referring to fig. 8 and 9, the positioning board 500 includes a plurality of magnetic positioning points 510 corresponding to positions of the pins 210 of the light emitting device 200 to be detected. The first electromagnetic component 410 drives the probe 400 to move to a position corresponding to the corresponding magnetic positioning point 510 after magnetism is generated, so as to align with the pin 210 of the light emitting device 200 to be detected.

For example, the first magnetic control assembly 600 may respectively provide power to the first electromagnetic components 410 of each probe 400, so that the polarity of each first electromagnetic component 410 facing one end of the positioning plate 500 is opposite to that of the magnetic positioning point 510, and the magnetic positioning point 510 may attract the first electromagnetic component 410 to move close to the magnetic positioning point 510, thereby driving the whole probe 400 to move to a position corresponding to the corresponding magnetic positioning point 510.

It should be noted that, in this embodiment, by setting the relative positions of the probe active area 310 and the magnetic positioning points 510, each of the first electromagnetic components 410 may attract only the nearest probe 400 after magnetism is generated by one of the magnetic positioning points 510.

Optionally, in this embodiment, the detecting device includes a plurality of positioning plates 500, and the positions of the magnetic positioning points 510 on different positioning plates 500 are distributed differently. In this way, the positioning plates 500 with different arrangement modes of the magnetic positioning points 510 can be provided for the light emitting devices 200 to be detected with different positions of the pins 210. Compared with the test boards with different probe arrangement modes in the prior art, the locating board 500 with different magnetic locating points 510 arrangement modes in the embodiment is simpler in process and lower in manufacturing cost.

Based on the above design, by providing the carrier plate 300 having the plurality of probe activity areas 310 such that the probes 400 can move within the probe activity areas 310 on the carrier plate 300, and by cooperation of the positioning plate 500 having the plurality of magnetic positioning points 510 and the first magnetic control assembly 600 connected to the first electromagnetic part 410 of the probes 400, the respective probes 400 can be attracted to the positions corresponding to the respective magnetic positioning points 510. Referring to fig. 10, when detecting light emitting devices with different pin distributions, only the corresponding positioning plate 500 needs to be prepared, and after the first electromagnetic component 410 obtains magnetism, the different positioning plates 500 can attract the probe 400 to different positions to correspond to the positions of the pins 210 of the light emitting device 200 to be detected due to different distribution positions of the magnetic positioning points 510 on the different positioning plates 500. In this way, the same bearing plate 300 and the probes 400 arranged on the bearing plate 300 can be reused to detect the light emitting devices 200 to be detected with different models, so that the detection cost is reduced, and the production efficiency is improved.

In one possible implementation, referring to fig. 11, the carrier plate 300 includes a guide rail 311 disposed at the probe activity area 310 and extending in at least one direction, and the probe 400 is disposed on the guide rail 311 and movable along the guide rail 311. For example, the guide rail 311 may extend in a direction parallel to the first surface, and may correspond to positions of the pins 210 of the light emitting device 200 to be detected of different models when the probe 400 is positioned at different positions on the guide rail 311. Alternatively, in the present embodiment, the positioning plate 500 may be disposed on the second surface of the carrier plate 300, and the position of the magnetic positioning point 510 may correspond to one end position of the guide rail 311.

Since the light emitting device 200 to be detected generally has two pins 210, and the two pins 210 are generally symmetrically distributed, referring to fig. 12, in this embodiment, the plurality of probes 400 may include a plurality of probe groups, each of the probe groups includes two adjacent probes 400, and the guide rail 311 in the two probe active regions 310 corresponding to each probe group is axisymmetric or centrosymmetric.

Further, referring to fig. 12 again, the two probe active areas 310 corresponding to each probe set respectively include at least two guide rails 311, the guide rails 311 extend from a center point to different directions, and the guide rails 311 in the two probe active areas 310 corresponding to each probe set are symmetrical about the center point, for example, may be in a shape of a m. In this way, two probes 400 in the probe set can be moved in a plurality of different directions to adapt to a plurality of different types of light emitting devices 200 to be detected.

In some possible implementations, the probe activity area 310 is provided with a reset means for restoring or maintaining the probe 400 in a set initial position in the probe activity area 310 in a state in which the positioning plate 500 is disconnected from the carrier plate 300. For example, in the probe moving area 310 shown in fig. 12, the reset means may restore or maintain the probe 400 at the center position of the guide rail in a shape of a letter of a Chinese character 'mi' in a state that the positioning plate 500 is disconnected from the carrier plate 300. In this way, when different positioning plates 500 are provided, the probe 400 can be attracted from the initial position to the position corresponding to the magnetic positioning point 510. After the positioning plate 500 is removed, the reset means restores the probe 400 to the initial position again so that the probe 400 can smoothly start to move from the initial position when the other positioning plates 500 are next set.

In another possible implementation, referring to fig. 13, each probe moving area 310 may further include a fixing portion 312, a probe mounting portion 314, and an elastic connection portion 313, where the fixing portion 312 and the probe mounting portion 314 are connected by the elastic connection portion 313, the probe mounting portion 314 is used for mounting the probe 400, and the probe mounting portion 314 is movable relative to the fixing portion 312 along a direction parallel to the first surface under the action of the elastic connection portion 313. For example, the elastic connection portion 313 may include a spring or a deformable reed, etc., and the elastic connection portion 313 may hold the probe mount 314 at an initial position when the positioning plate 500 is not disposed on the second surface of the carrier plate 300; after the positioning plate 500 is disposed on the second surface of the carrier 300, the magnetic positioning point 510 attracts the probe 400, and at this time, the elastic connection portion 313 may be deformed to move the probe 400 in a direction parallel to the first surface so as to approach the magnetic positioning point 510.

In one possible implementation, the positioning plate 500 may be obtained by etching a functional film layer having magnetism.

In another possible implementation manner, the detecting device may further include a second magnetic control assembly, where the magnetic positioning point 510 of the positioning plate 500 includes second electromagnetic components, the second magnetic control assemblies are electrically connected to each of the second electromagnetic components, and the second magnetic control assembly is used to control the second electromagnetic components to generate magnetism so that the second electromagnetic components attract the first electromagnetic components 410 at corresponding positions.

Further, the positioning plate 500 further includes a plurality of magnetic reset points, the magnetic reset points include third electromagnetic components, the second magnetic control assembly is electrically connected to each of the third electromagnetic components, and the second magnetic control assembly is further configured to control the third electromagnetic components to generate magnetism, so that the third electromagnetic components attract the first electromagnetic components 410 at corresponding positions to a set initial position in the probe moving area 310.

Based on the same inventive concept, the present embodiment also provides a light emitting device detection method, which mainly uses the detection device of the present embodiment to detect a light emitting device to be tested, and the light emitting device detection method may include the following steps.

Step S110, determining the positioning board 500 with the distribution mode of the magnetic positioning points 510 being the same as the pin distribution mode of the light emitting device 200 to be detected.

In this embodiment, the positioning plate 500 with the same distribution manner of the magnetic positioning points 510 may be selected or manufactured according to the pin distribution manner of the light emitting device to be tested.

In this embodiment, the determined positioning plate 500 may be disposed on the second surface of the carrier plate 300, and may be fixedly connected to the carrier plate 300 by threads, buckles, or the like.

In step S120, the first electromagnetic component 410 of each probe 400 is controlled to generate magnetism by the first magnetic control assembly 600, so that the first electromagnetic component 410 drives the probe 400 to move to a position corresponding to the pin 210 of the light emitting device 200 to be detected.

In step S130, the carrier plate 300 is moved, so that the signal contacts 420 of the probes 400 are respectively electrically contacted with the pins 210 of the light emitting devices 200 to be tested.

In this embodiment, after each probe 400 moves to a corresponding position, the surface of the whole carrier 300 on which the probe 400 is disposed faces the wafer 100 on which each light emitting device 200 to be detected is located, and is close to the wafer 100, so that the signal contact 420 of each probe 400 is electrically contacted with the pin 210 of each light emitting device 200 to be detected.

In step S140, a test electrical signal is transmitted to the light emitting device 200 to be tested through each of the signal contacts 420 by the signal transmission assembly 700.

In this embodiment, after the signal contacts 420 of each probe 400 are respectively electrically contacted with the pins 210 of each light emitting device 200 to be detected, the signal transmission assembly 700 may transmit a test electrical signal to each light emitting device 200 to be detected through each signal contact 420, so that each light emitting device 200 to be detected emits light. In addition, an image acquisition device may also acquire the light-emitting effect of each light-emitting device 200 to be detected on the wafer 100 after the test electrical signal is obtained, and determine whether each light-emitting device 200 to be detected works normally according to the light-emitting effect.

In some possible implementations, step S200 may also be included before step S120.

In step S200, the positioning plate 500 is disposed on the second surface of the carrier plate 300.

In step S120, the first magnetic control component 600 may control the first electromagnetic component 410 of each probe 400 to generate magnetism, so that the first electromagnetic component 410 drives the probe 400 to move to a position corresponding to each magnetic positioning point 510, thereby aligning with the pin 210 of the light emitting device 200 to be detected.

For example, the first magnetic control assembly 600 may control each of the first electromagnetic components 410 to generate magnetism with polarity opposite to that of the magnetic positioning point 510, so that the magnetic positioning point 510 attracts the first electromagnetic component 410, and further drives the entire probe 400 to move in a direction parallel to the first surface and approaching to the magnetic positioning point 510 until reaching a position corresponding to the corresponding magnetic positioning point 510. In this state, each probe 400 corresponds to the position of the pin 210 of each light emitting device 200 to be detected.

In summary, according to the detection apparatus and the detection method for a light emitting device provided in the present application, by providing the carrier plate 300 having the plurality of probe moving areas 310, the probes 400 can move in the probe moving areas 310 on the carrier plate 300, and by matching the positioning plate 500 having the plurality of magnetic positioning points 510 with the first magnetic control assembly 600 connected to the first electromagnetic component 410 of the probes 400, each probe 400 can be attracted to a position corresponding to each magnetic positioning point 510. When detecting the light emitting devices with different pin distributions, only the corresponding positioning plate 500 is needed to be prepared, and the same bearing plate 300 and the probes 400 arranged on the bearing plate 300 are multiplexed, so that the detection cost can be reduced, and the production efficiency is improved.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (10)

1. A detection device, characterized in that the detection device comprises:

the probe comprises a bearing plate, a probe body and a probe cover, wherein the bearing plate comprises a first surface and a second surface, and the first surface is provided with a plurality of probe activity areas;

the probes are respectively arranged in the probe moving areas of the bearing plate, and can move in the probe moving areas; each probe comprises a first electromagnetic component and a signal contact, wherein the signal contact is positioned at one end of the probe far away from the bearing plate and is used for electrically contacting with a pin of a light-emitting device to be detected;

the first magnetic control assembly is respectively and electrically connected with the first electromagnetic component of each probe and is used for controlling the first electromagnetic component to generate magnetism;

the signal transmission assembly is electrically connected with the signal contact of each probe respectively and used for transmitting the test electric signals to the signal contact of each probe.

2. The test device of claim 1, wherein the carrier plate includes a rail disposed in the probe active area and extending in at least one direction, the probe being disposed on and movable along the rail.

3. The test device of claim 2, wherein the plurality of probes comprises a plurality of probe sets, each probe set comprising two adjacent probes; the guide rails in the two probe activity areas corresponding to each probe group are axisymmetric or centrosymmetric;

preferably, the two probe active areas corresponding to each probe set respectively comprise at least two guide rails, the guide rails extend from a central point to different directions, and the guide rails in the two probe active areas corresponding to each probe set are centrosymmetric with the central point.

4. The apparatus according to claim 1, wherein each of the probe moving areas includes a fixing portion, a probe mounting portion, and an elastic connection portion, the fixing portion and the probe mounting portion being connected by the elastic connection portion, the probe mounting portion being configured to mount the probe, the probe mounting portion being movable relative to the fixing portion in a direction parallel to the first face by the elastic connection portion.

5. The detection apparatus according to claim 1, characterized in that the detection apparatus further comprises:

the positioning plate is detachably connected with the second surface of the bearing plate; the positioning plate comprises a plurality of magnetic positioning points corresponding to the positions of pins of the light emitting device to be detected, so that the first electromagnetic component drives the probe to move to the positions corresponding to the corresponding magnetic positioning points after magnetism is generated.

6. The detecting apparatus according to claim 5, wherein the probe moving area is provided with a reset means for restoring or holding the probe to a set initial position in the probe moving area in a state where the positioning plate is disconnected from the carrier plate.

7. The apparatus of claim 5, wherein the apparatus comprises a plurality of positioning plates, and the distribution of the positions of the magnetic positioning points on different positioning plates is different.

8. The device of claim 5, further comprising a second magnetic control assembly, wherein the magnetic positioning point of the positioning plate comprises second electromagnetic components, the second magnetic control assembly is electrically connected with each of the second electromagnetic components, and the second magnetic control assembly is used for controlling the second electromagnetic components to generate magnetism so that the second electromagnetic components attract the first electromagnetic components at corresponding positions.

9. The detecting device for detecting the movement of a probe as claimed in claim 8, wherein the positioning plate further includes a plurality of magnetic restoring points, the magnetic restoring points include third electromagnetic members, the second magnetic control units are electrically connected with the respective third electromagnetic members, and the second magnetic control units are further configured to control the third electromagnetic members to generate magnetism so that the third electromagnetic members attract the first electromagnetic members at the corresponding positions to a set initial position in the probe moving area.

10. A light emitting device inspection method, characterized in that the light emitting device to be tested is inspected using the inspection apparatus according to any one of claims 1 to 9, the method comprising:

determining the positioning plate with the same distribution mode of the magnetic positioning points as the pin distribution mode of the light-emitting device to be detected;

the first electromagnetic component of each probe is controlled by the first magnetic control component to generate magnetism, so that the first electromagnetic component drives the probe to move to a position corresponding to a pin of a corresponding light emitting device to be detected;

moving the bearing plate to ensure that the signal contact of each probe is respectively and electrically contacted with the pin of each light emitting device to be detected;

and transmitting a test electric signal to the light emitting device to be detected through each signal contact by the signal transmission component.