CN117276215A - 3D phase-change radiator and manufacturing method thereof - Google Patents
3D phase-change radiator and manufacturing method thereof Download PDFInfo
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- CN117276215A CN117276215A CN202311339138.XA CN202311339138A CN117276215A CN 117276215 A CN117276215 A CN 117276215A CN 202311339138 A CN202311339138 A CN 202311339138A CN 117276215 A CN117276215 A CN 117276215A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000009833 condensation Methods 0.000 claims abstract description 136
- 230000005494 condensation Effects 0.000 claims abstract description 136
- 238000001704 evaporation Methods 0.000 claims abstract description 68
- 230000008020 evaporation Effects 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 230000008859 change Effects 0.000 claims abstract description 50
- 238000010521 absorption reaction Methods 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims description 26
- 238000007789 sealing Methods 0.000 claims description 25
- 238000002347 injection Methods 0.000 claims description 18
- 239000007924 injection Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 238000005219 brazing Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract 2
- 230000017525 heat dissipation Effects 0.000 description 43
- 239000007788 liquid Substances 0.000 description 26
- 238000010586 diagram Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a 3D phase-change radiator and a manufacturing method thereof, wherein the phase-change radiator comprises: the evaporator comprises a substrate, a first cover plate and a porous capillary structure positioned on the inner surface of the substrate, wherein the substrate and the first cover plate are oppositely arranged and sealed to form an evaporation cavity, and the outer surface of the substrate, which is far away from the first cover plate, is a heat absorption surface; the condensing part at least comprises a plurality of condensing shells, and the condensing shells are arranged above the first cover plate at intervals in parallel; the guide teeth are positioned in the condensation shell, one end of the guide teeth protrudes out of the condensation shell and is in contact with the porous capillary structure, and the guide teeth are obliquely arranged in the condensation shell and form a preset angle with the inner surface of the substrate; the heat transfer working medium is positioned in the evaporation cavity. According to the 3D phase change radiator, the heat radiation capability is enhanced and the heat radiation resistance is reduced by arranging the porous capillary structure and the diversion teeth which are in contact.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a 3D phase-change heat radiator and a manufacturing method thereof.
Background
With the rapid development of semiconductor technology, the integration level of high-power components is higher and higher, the power density is higher and higher, the heat generated during operation is higher and higher, the heat flux density is higher and higher, the conventional radiator has difficulty in meeting the heat dissipation requirement of high heat flux density, if the heat generated by the power components cannot be timely and rapidly dissipated, the temperature of chips in the power components is increased, the working efficiency is reduced due to light weight, the service life is shortened, and the devices are damaged and fail due to heavy weight.
In view of this, there is an urgent need for a 3D phase change heat sink with high heat dissipation efficiency for high power components.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide a 3D phase-change radiator and a method for manufacturing the same, which are used for solving the problem of low heat dissipation efficiency of the radiator on high-power components in the prior art.
To achieve the above and other related objects, the present invention provides a 3D phase change heat sink comprising:
the evaporation part comprises a substrate, a first cover plate and a porous capillary structure, wherein the substrate and the first cover plate are oppositely arranged and are in sealing connection to form an evaporation cavity, the porous capillary structure is positioned on the inner surface of the substrate, and the outer surface of the substrate, which is far away from the first cover plate, is a heat absorption surface;
the condensing part at least comprises a plurality of condensing shells, and the condensing shells are arranged above the first cover plate at intervals in parallel;
the guide teeth are positioned in the condensation shell, one end of each guide tooth protrudes out of the condensation shell and is in contact with the porous capillary structure, and each guide tooth is obliquely arranged in the condensation shell and forms a preset angle with the inner surface of the substrate;
and the heat transfer working medium is positioned in the evaporation cavity.
Optionally, the preset angle between the guide teeth and the inner surface of the substrate ranges from 30 degrees to 90 degrees.
Optionally, the guide teeth are corrugated fin structures.
Optionally, the porous capillary structure comprises at least one of a braided wire mesh structure, a metal powder sintered porous structure, and braided wire grooves.
Optionally, the side wall of the substrate is further provided with an injection port, and the injection port is used for filling the heat transfer working medium.
Optionally, the guide teeth are spaced from the interior of the condensation housing sidewall by a predetermined distance.
Optionally, one end of the condensation shell, which is far away from the first cover plate, is welded in a sealing manner, the condensation shell is connected with the first cover plate in a sealing manner to form a condensation cavity, and the condensation cavity is communicated with the evaporation cavity.
Optionally, the condensation part further comprises a second cover plate and a third cover plate which are sequentially stacked, the second cover plate is located above the condensation shell, the second cover plate, the third cover plate, the condensation shell and the first cover plate are in sealing connection to form a condensation cavity, and the condensation cavity is communicated with the evaporation cavity.
Optionally, a plurality of slots are further formed in the second cover plate, and one end, far away from the first cover plate, of the condensation shell is inserted into the second cover plate through the slots.
Optionally, the 3D phase change radiator further comprises a plurality of radiating fins, wherein the radiating fins are located on the outer surface of the condensation shell and located between adjacent condensation shells.
Optionally, a plurality of clamping grooves are further formed in the first cover plate, and protruding ends of the guide teeth are inserted into the first cover plate through the clamping grooves.
The invention also provides a manufacturing method of the 3D phase-change radiator, which comprises the following steps:
providing an evaporation part, wherein the evaporation part comprises a substrate, a first cover plate and a porous capillary structure, the substrate and the first cover plate are oppositely arranged and are in sealing connection to form an evaporation cavity, and the porous capillary structure is positioned on the inner surface of the substrate;
providing a condensing part, wherein the condensing part at least comprises a plurality of condensing shells, and the condensing shells are arranged above the first cover plate at intervals in parallel;
providing a guide tooth, wherein the guide tooth is positioned in the condensation shell, one end of the guide tooth protrudes out of the condensation shell and is in contact with the porous capillary structure, and the guide tooth is obliquely arranged in the condensation shell and forms a preset angle with the inner surface of the substrate;
and fixedly connecting the evaporation part and the condensation part in a welding mode, discharging non-condensable gas in the evaporation cavity through an injection port after welding, filling a heat transfer working medium, and sealing the injection port to obtain the 3D phase change radiator.
Optionally, the guide teeth are fixedly connected with the condensation shell in a welding manner.
Optionally, the method for welding the evaporation part and the condensation part comprises atmosphere protection brazing furnace welding and vacuum brazing furnace welding.
As described above, the 3D phase-change radiator and the manufacturing method thereof of the present invention have the following beneficial effects: the evaporation part and the condensation part which are sequentially stacked are arranged in the phase-change radiator, and the condensation cavity is communicated with the evaporation cavity through the contact of the diversion teeth and the porous capillary structure, so that a three-dimensional uniform-temperature phase-change heat dissipation structure is formed, the structure is compact, the volume is small, the weight is light, the heat conduction rate of the phase-change radiator is improved, the heat dissipation capacity is increased, the heat dissipation resistance is reduced, and the phase-change heat dissipation device is suitable for heat dissipation of high-heat-flow high-power electronic devices and has wide application prospects; the porous capillary structure is arranged on the inner surface of the substrate, and has high capillary pressure, so that the wetting and reflux of the liquid heat transfer working medium are increased in the working process of the phase change radiator, the evaporation surface area and the liquid heat transfer working medium evaporation core are increased, the phase change superheat degree is reduced, the evaporation phase change heat transfer is enhanced, and the evaporation thermal resistance and the temperature difference are reduced; the guide teeth are arranged in the condensation shell, and are obliquely arranged in the condensation cavity and form an included angle with the inner surface of the substrate within a range of 30-90 degrees, so that the condensation heat exchange surface area of the phase-change radiator is increased, the condensation heat dissipation capacity of the phase-change radiator is enhanced, the condensation heat dissipation thermal resistance is reduced, gravity can be utilized in the working process by the obliquely arranged guide teeth, the liquid heat transfer working medium of the condensation part can be conveniently guided to the inner surface of the substrate, the phenomenon that the inner surface of the substrate is dry due to insufficient backflow of the liquid heat transfer working medium, the damage of the phase-change radiator due to overhigh local temperature is avoided, the heat conduction rate of the phase-change radiator is further improved, the heat dissipation capacity is increased, and the heat dissipation resistance is reduced; in addition, through setting up between adjacent condensation casing the radiating fin has further strengthened the heat dispersion of 3D phase transition radiator, through condensation casing one end seal welding's mode and first apron seal constitution condensation cavity, further enlarged the application of 3D phase transition radiator.
Drawings
Fig. 1 is a schematic structural diagram of a 3D phase-change radiator according to the present invention.
Fig. 2 is a schematic diagram of another structure of the 3D phase-change radiator of the present invention.
Fig. 3 is a schematic view of a portion of a 3D phase-change radiator according to the present invention.
Fig. 4 is a schematic diagram showing a third structure of the 3D phase-change radiator of the present invention.
Fig. 5 is a schematic diagram showing a fourth structure of the 3D phase-change radiator of the present invention.
Fig. 6 is a schematic diagram showing a fifth structure of the 3D phase-change radiator of the present invention.
Fig. 7 is a schematic diagram showing a sixth structure of the 3D phase-change radiator of the present invention.
Description of element reference numerals
1. Evaporating part
11. Substrate board
12. First cover plate
121. Clamping groove
13. Porous capillary structure
14. Evaporation cavity
2. Condensing unit
21. Second cover plate
211. Slot groove
22. Third cover plate
23. Side plate
24. Condensing shell
25. Condensation cavity
3. Flow guiding tooth
4. Injection port
5. Radiating fin
6. Power device
Detailed Description
Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present invention, which is described by the following specific examples.
Please refer to fig. 1 to 7. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the invention to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the invention, are not intended to be critical to the essential characteristics of the invention, but are intended to fall within the spirit and scope of the invention. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the invention, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the invention may be practiced.
Example 1
The embodiment provides a 3D phase-change radiator, as shown in fig. 1-2, which are a schematic structural diagram of the 3D phase-change radiator and another schematic structural diagram of the 3D phase-change radiator, respectively, including: the evaporator comprises an evaporator 1, a condenser 2, guide teeth 3 and a heat transfer working medium (not shown), wherein the evaporator 1 comprises a substrate 11, a first cover plate 12 and a porous capillary structure 13, the substrate 11 and the first cover plate 12 are oppositely arranged and are in sealing connection to form an evaporation cavity 14, the porous capillary structure 13 is positioned on the inner surface of the substrate 11, and the outer surface of the substrate 11 away from the first cover plate 12 is a heat absorption surface; the condensation part 2 at least comprises a plurality of condensation shells 24, and the condensation shells 24 are arranged above the first cover plate 21 at intervals in parallel; the guide teeth 3 are located inside the condensation housing 24, one end of each guide tooth 3 protrudes out of the condensation housing 24 and contacts with the porous capillary structure 13, and the guide teeth 3 are obliquely arranged inside the condensation housing 24 and form a preset angle with the inner surface of the substrate 11; the heat transfer medium is located inside the evaporation cavity 14.
Specifically, as shown in fig. 3, a schematic diagram of a part of the structure of the 3D phase-change radiator is shown, and the power device 6 is attached to the outer surface of the substrate 11 of the 3D phase-change radiator, that is, the phase-change radiator is installed and used with a heat source on a side of the side.
Specifically, the power device 6 may also be located below the phase-change radiator, so that the phase-change radiator is installed and used as a heat source in a lower horizontal mode.
Specifically, an air cooling device (not shown) is further disposed on any side wall of the phase-change radiator, so as to enhance the heat dissipation capability of the 3D phase-change radiator.
Specifically, by setting different installation positions of the air cooling device and the power device 6, the application range of the 3D phase change radiator is enlarged.
Specifically, the power device 6 includes a laser generator, an AIGPU power chip, a CPU processor chip, silicon carbide, or other high power semiconductor device.
Specifically, the power device 6 with high density and large heat flow can release a large amount of heat as a heat source in the working process, and can dissipate heat through the 3D phase change radiator.
Specifically, in the case of satisfying the performance of the 3D phase-change radiator, the size and shape of the substrate 11 may be selected according to practical situations, which is not limited herein.
Specifically, the material of the substrate 11 includes at least one of copper, aluminum, iron, or other suitable materials.
Specifically, the substrate 11 is configured to absorb heat generated by the power device 6 during operation.
By way of example, the porous capillary structure 13 may comprise at least one of a braided wire mesh structure, a sintered metal powder porous structure, braided wire-bonded grooves, or other suitable structure.
Specifically, in the case of meeting the performance of the 3D phase-change radiator, the size and the material of the first cover plate 12 may be selected according to practical situations, which is not limited herein.
Specifically, the evaporation cavity 14 is formed by clamping and sealing the base plate 11 and the first cover plate 12.
Specifically, in the case of meeting the performance of the phase change radiator, the size, material, number and shape of the condensation housing 24 may be selected according to practical situations, which is not limited herein.
Specifically, the condensation housing 24 is of a hollow structure, and is used for placing the guide teeth 3.
Specifically, in the case of meeting the performance of the phase change radiator, the size, material, shape and number of the condensation housing 24 may be selected according to practical situations, which is not limited herein.
As an example, the condensation portion 2 further includes a second cover plate 21 and a third cover plate 22 stacked in sequence, the second cover plate 21 is located above the condensation housing 24, the second cover plate 21, the third cover plate 22, the condensation housing 24 and the first cover plate 12 are connected in a sealing manner to form a condensation cavity 25, and the condensation cavity 25 is communicated with the evaporation cavity 14.
Specifically, in the case of meeting the performance of the phase-change radiator, the size, shape and material of the second cover plate 21 may be selected according to practical situations, which is not limited herein.
Specifically, in the case of meeting the performance of the phase-change radiator, the size, material and shape of the third cover plate 22 may be selected according to practical situations, which is not limited herein.
Specifically, the 3D phase-change radiator further includes a side plate 23, where the side plate 23 is located between the second cover plate 21 and the first cover plate 12 and is located outside the condensation housing 24 at the outermost periphery.
Specifically, in the case of satisfying the performance of the 3D phase-change radiator, the size, material, number and shape of the side plates 23 may be selected according to practical situations, which is not limited herein.
Specifically, the side plate 23 is located between the second cover plate 21 and the first cover plate 12, and is located outside the condensation housing 24 at the outermost periphery, so as to protect the condensation housing 24 and support the 3D phase change radiator.
As an example, a plurality of slots 211 are further provided in the second cover 22, and an end of the condensation housing 24 away from the first cover 12 is inserted into the second cover 22 through the slots 211.
Specifically, in the case of satisfying the performance of the phase change radiator, the size and number of the slots 211 may be selected according to practical situations, which is not limited herein.
As an example, the guide teeth 3 are of a corrugated fin structure.
As an example, the preset angle between the guide teeth 3 and the inner surface of the base plate 11 ranges from 30 degrees to 90 degrees.
As an example, the first cover 12 is further provided with a plurality of clamping grooves 121, and protruding ends of the guide teeth 3 are inserted into the first cover 12 through the clamping grooves 121.
Specifically, in the case of meeting the performance of the phase-change radiator, the size and shape of the slot 121 may be selected according to practical situations, which is not limited herein.
As an example, the guide teeth 3 are spaced apart from the inside of the side wall of the condensation housing 24 by a predetermined distance.
Specifically, in the case of satisfying the performance of the phase-change radiator, the range of the distance between the guide teeth 3 and the side wall of the condensation housing 24 may be selected according to practical situations, which is not limited herein.
Specifically, the condensation cavity 25 contacts the porous capillary structure 13 on the inner surface of the substrate 11 through the protruding end of the guide tooth 3, and is mutually communicated with the evaporation cavity 14, so as to form a three-dimensional temperature-equalizing phase heat dissipation structure, thereby improving the heat conduction rate of the phase-change radiator, increasing the heat dissipation capacity, reducing the heat dissipation resistance, and being suitable for heat dissipation of high-heat-flow high-power electronic devices.
As an example, the substrate side wall is further provided with an injection port 4, and the injection port is used for filling the heat transfer working medium.
Specifically, in the case of satisfying the performance of the phase-change radiator, the size and shape of the injection port 4 may be selected according to the actual situation, and are not limited herein.
Specifically, the heat transfer working medium is filled in the evaporation cavity 14 of the phase change radiator through the injection port 4, is evaporated into gas through heat absorption at the base plate 11, flows to the condensation part 2 along the guide teeth 3 through the porous capillary structure 13 to release heat, is condensed into liquid, and returns to the base plate 11 of the evaporation part 1 along the guide teeth 3 to perform the next phase change heat transfer cycle.
Specifically, in the heat transfer process, boiling of the liquid heat transfer working medium (or condensation of the gaseous heat transfer working medium) is inhibited, and the consistency of the microstructure of the heat transfer working medium is achieved on the basis, so that the Phase Change Inhibition (PCI) heat transfer technology of efficient heat transfer is realized.
Specifically, the porous capillary structure 13 is located on the inner surface of the substrate 11, and has a larger capillary pressure, so that the wetting and backflow of the liquid heat transfer working medium to the substrate 11 are increased in the working process of the phase change radiator, the evaporation surface area and the liquid heat transfer working medium evaporation core are increased, the phase change superheat degree is reduced, the evaporation phase change heat transfer of the liquid heat transfer working medium is enhanced, and the evaporation thermal resistance and the temperature difference are reduced.
Specifically, the guide teeth 3 in the condensation part 2 are in contact with the porous capillary structure 13 on the inner surface of the substrate 11, so that the liquid heat transfer working medium condensed by the condensation part 2 directly flows back to the inner surface of the substrate 11 along the guide teeth 3, the heat transfer working medium in a liquid state is guaranteed to evaporate and absorb heat on the surface of the substrate 11, the phenomenon that the liquid state lacks liquid on the surface of the substrate 11 due to insufficient backflow of the liquid heat transfer working medium is avoided, the damage to the phase-change radiator is caused by the phenomenon of local overhigh temperature, the heat conduction rate of the phase-change radiator is further improved, the heat dissipation capacity is increased, and the heat dissipation resistance is reduced.
Specifically, through setting up in the condensation casing 24 water conservancy diversion tooth 3, just water conservancy diversion tooth 3 with the contained angle scope of base plate 11 internal surface is 30 degrees ~ 90 degrees, has increased the surface area of phase change radiator condensation heat transfer has strengthened the condensation heat dissipation ability of phase change radiator has reduced condensation heat dissipation thermal resistance, and the slope sets up water conservancy diversion tooth 3 is in the course of the work, be convenient for the liquid of condensation portion 2 water conservancy diversion tooth 3 is followed water conservancy diversion tooth 3 backward flow to on the base plate 11 internal surface, in addition, water conservancy diversion tooth 3 with the interval is predetermine the distance between the condensation casing lateral wall, be convenient for liquid water conservancy diversion working medium with gaseous state the circulation of water conservancy diversion working medium has strengthened the heat dissipation ability of phase change radiator.
The evaporation part 1 and the condensation part 2 in the 3D phase-change radiator of the embodiment are sequentially stacked, and the condensation cavity 14 is connected with the porous capillary structure 13 through the diversion teeth 3 to form a three-dimensional uniform-temperature-phase-change radiating structure, so that the structure is compact, the volume is small, the weight is light, the heat conduction rate of the phase-change radiator is improved, the radiating capacity is increased, the radiating resistance is reduced, and the phase-change radiator is suitable for radiating high-heat-flow high-power electronic devices and has wide application prospects; by arranging the porous capillary structure 13 on the inner surface of the substrate 11, the porous capillary structure 13 has larger capillary pressure, so that the wetting and reflux of the liquid heat transfer working medium are increased in the working process of the phase change radiator, the evaporation surface area and the liquid heat transfer working medium evaporation core are increased, the phase change superheat degree is reduced, the evaporation phase change heat transfer is enhanced, and the evaporation thermal resistance and the temperature difference are reduced; the guide teeth 3 are arranged in the condensation shell 24, the guide teeth 3 are obliquely arranged in the condensation shell 24 and form an included angle range of 30-90 degrees with the inner surface of the base plate 11, the condensation heat exchange surface area of the phase-change radiator is increased, the condensation heat dissipation capacity of the phase-change radiator is enhanced, the condensation heat dissipation heat resistance is reduced, the obliquely arranged guide teeth 3 can utilize gravity in the working process, the liquid state of the condensation part 2 is conveniently led to the inner surface of the base plate 11, the phenomenon that the liquid state is insufficient due to the backflow of the heat transfer working medium, the defect of liquid is caused on the inner surface of the base plate, the damage of the phase-change radiator is avoided due to the fact that the local temperature is too high, the heat conduction rate of the phase-change radiator is further improved, the heat dissipation capacity is increased, the heat dissipation resistance is reduced, the 3D phase-change radiator is cooled in a natural air cooling mode, and the application range and the field of the 3D phase-change radiator are widened.
Example two
The present embodiment provides another 3D phase-change radiator, as shown in fig. 4-6, which are respectively a third structural schematic diagram of the 3D phase-change radiator, a fourth structural schematic diagram of the 3D phase-change radiator, and a fifth structural schematic diagram of the 3D phase-change radiator, where the 3D phase-change radiator in the first embodiment is provided, and the 3D phase-change radiator further includes a plurality of heat dissipation fins 5, where the heat dissipation fins 5 are located on an outer surface of the condensation shell 24 and between adjacent condensation shells 24.
Specifically, the material of the heat dissipating fin 5 includes at least one of copper, aluminum, iron, or other suitable materials.
Specifically, in the case of satisfying the performance of the phase-change radiator, the size and shape of the heat dissipation fin 5 may be selected according to the actual situation, which is not limited herein.
Specifically, through set up between the condensation casing radiating fin 5 has increased the radiating area of phase change radiator has promoted the radiating efficiency of phase change radiator.
The 3D phase-change radiator of the present embodiment increases the heat dissipation area of the 3D phase-change radiator and improves the heat dissipation efficiency of the 3D phase-change radiator by arranging the heat dissipation fins 5 between the condensation shells 24 in the 3D phase-change radiator of the first embodiment.
Example III
The third 3D phase-change radiator according to this embodiment is shown in fig. 7, and is a sixth structural schematic diagram of the 3D phase-change radiator, the 3D phase-change radiator is formed by improving the 3D phase-change radiator in the first embodiment, one end of the condensation housing 24, which is far away from the first cover plate 11, is sealed and welded, the condensation housing 24 is in sealing connection with the first cover plate 11 to form a condensation cavity 25, and the condensation cavity 25 is communicated with the evaporation cavity 14.
Specifically, by sealing and welding the end of the condensation housing 24 away from the first cover plate 11, the condensation housing 24 is in sealing connection with the first cover plate 11 to form a condensation cavity 25, which simplifies the structure of the 3D phase-change radiator and further increases the application range and field of the 3D phase-change radiator.
The 3D phase-change radiator of the present embodiment is formed by improving the 3D phase-change radiator of the first embodiment, and by sealing and welding the end of the condensation shell 24 away from the first cover plate 11, the condensation shell 24 is in sealing connection with the first cover plate 11 to form a condensation cavity 25, which simplifies the structure of the 3D phase-change radiator and further increases the application range and field of the 3D phase-change radiator.
Example IV
The embodiment provides a manufacturing method of a 3D phase-change radiator, which comprises the following steps:
s1: providing an evaporation part, wherein the evaporation part comprises a substrate, a first cover plate and a porous capillary structure, the substrate and the first cover plate are oppositely arranged and are in sealing connection to form an evaporation cavity, the porous capillary structure is positioned on the inner surface of the substrate, and the outer surface of the substrate far away from the first cover plate is a heat absorption surface;
s2: providing a condensing part, wherein the condensing part at least comprises a plurality of condensing shells, and the condensing shells are arranged above the first cover plate at intervals in parallel;
s3: providing a guide tooth, wherein the guide tooth is positioned in the condensation shell, one end of the guide tooth protrudes out of the condensation shell and is in contact with the porous capillary structure, and the guide tooth is obliquely arranged in the condensation shell and forms a preset angle with the inner surface of the substrate;
s4: and fixedly connecting the evaporation part and the condensation part in a welding mode, discharging non-condensable gas in the evaporation cavity through an injection port after welding, filling a heat transfer working medium, and sealing the injection port to obtain the 3D phase change radiator.
Specifically, the step S1 is performed, and an evaporation portion 1 is provided, where the evaporation portion 1 includes a substrate 11, a first cover plate 12, and a porous capillary structure 13, the substrate 11 and the first cover plate 12 are disposed opposite to each other and are connected in a sealing manner to form an evaporation cavity 14, the porous capillary structure 13 is located on an inner surface of the substrate 11, and an outer surface of the substrate 11 away from the first cover plate 12 is a heat absorbing surface.
In particular, the method of forming the porous capillary structure 13 includes sintering or other suitable method.
Specifically, the porous capillary structure 13 is formed by sintering metal powder.
Specifically, the steps S2-S3 are performed, a condensation portion 2 is provided, the condensation portion 2 at least includes a condensation housing 24, and a plurality of condensation housings 24 are disposed above the first cover 12 in parallel and spaced apart from each other; the guide teeth 3 are provided, the guide teeth 3 are located inside the condensation shell 24, one ends of the guide teeth 3 protrude out of the condensation shell 24 and are in contact with the porous capillary structure 13, and the guide teeth 3 are obliquely arranged inside the condensation shell 24 and form a preset angle with the inner surface of the base plate 11.
As an example, the guide teeth 3 are fixedly connected to the condensation housing 24 by welding.
Specifically, the condensation cavity in the condensation portion 2 may be formed by pressing and sealing one end of the condensation housing 24 away from the first cover plate 12 to seal the first cover plate 12, or may be formed by sealing and welding the second cover plate 21, the third cover plate 22, the condensation housing 24 and the first cover plate 12.
Specifically, the step S4 is performed, the evaporation portion 1 and the condensation portion 2 are fixedly connected by a welding manner, after the welding is completed, non-condensable gas in the evaporation cavity 14 which is communicated is discharged through the injection port 4, and the heat transfer working medium is filled, so that the injection port 4 is closed, and the 3D phase change radiator is manufactured.
Specifically, the first cover plate 12 is further provided with a plurality of clamping grooves 121, and protruding ends of the guide teeth 3 are inserted into the first cover plate 12 through the clamping grooves 121, that is, the evaporation portion 1 and the condensation portion 2 are fixedly connected through inserting the protruding ends of the guide teeth 3 into the first cover plate 12.
By way of example, the method of welding the evaporation portion 1 and the condensation portion 2 may include atmosphere protection brazing furnace welding, vacuum brazing furnace welding, or other suitable welding means.
Specifically, the heat transfer working medium is filled and injected into the evaporation cavity 14 through the injection port 4 on the side wall of the substrate 11.
The 3D phase-change radiator manufactured by the manufacturing method of the 3D phase-change radiator has the advantages of high heat conduction rate, strong heat dissipation capacity, small heat dissipation resistance, compact structure, small volume, light weight and wide application prospect.
In summary, according to the 3D phase-change radiator and the manufacturing method thereof, the evaporation part and the condensation part are sequentially stacked, and the condensation cavity is connected with the evaporation cavity through the diversion teeth and the porous capillary structure, so that a three-dimensional uniform-temperature-phase heat dissipation structure is formed, the structure is compact, the volume is small, the weight is light, the heat conduction rate of the phase-change radiator is improved, the heat dissipation capacity is increased, the heat dissipation resistance is reduced, and the 3D phase-change radiator is suitable for heat dissipation of high-heat-flow high-power electronic devices and has wide application prospect; the porous capillary structure is arranged on the inner surface of the substrate, and has larger capillary pressure, so that the wetting and reflux of the liquid heat transfer working medium are increased in the working process of the phase change radiator, the evaporation surface area and the liquid heat transfer working medium evaporation core are increased, the phase change superheat degree is reduced, the evaporation phase change heat transfer is enhanced, and the evaporation thermal resistance and the temperature difference are reduced; the guide teeth are arranged in the condensation shell, the guide body is obliquely arranged in the condensation cavity, the included angle between the guide teeth and the inner surface of the substrate ranges from 30 degrees to 90 degrees, the condensation heat exchange surface area of the phase-change radiator is increased, the condensation heat dissipation capacity of the phase-change radiator is enhanced, the condensation heat dissipation heat resistance is reduced, gravity can be utilized by the obliquely arranged guide teeth in the working process, the liquid heat transfer working medium of the condensation part is conveniently guided and flowed onto the inner surface of the substrate, the phenomenon that the liquid shortage of the inner surface of the substrate is dried due to insufficient backflow of the liquid heat transfer working medium is avoided, the damage to the phase-change radiator due to the fact that the local temperature is too high is further improved, the heat conduction rate of the phase-change radiator is increased, the heat dissipation capacity is improved, and the heat dissipation resistance is reduced; in addition, through set up radiating fin between adjacent condensation casing further strengthened 3D phase change radiator's heat dispersion, sealed constitution condensation cavity with first apron through condensation casing one end seal welding's mode, further enlarge 3D phase change radiator's application. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (14)
1. A 3D phase change heat sink, comprising:
the evaporation part comprises a substrate, a first cover plate and a porous capillary structure, wherein the substrate and the first cover plate are oppositely arranged and are in sealing connection to form an evaporation cavity, the porous capillary structure is positioned on the inner surface of the substrate, and the outer surface of the substrate, which is far away from the first cover plate, is a heat absorption surface;
the condensing part at least comprises a plurality of condensing shells, and the condensing shells are arranged above the first cover plate at intervals in parallel;
the guide teeth are positioned in the condensation shell, one end of each guide tooth protrudes out of the condensation shell and is in contact with the porous capillary structure, and each guide tooth is obliquely arranged in the condensation shell and forms a preset angle with the inner surface of the substrate;
and the heat transfer working medium is positioned in the evaporation cavity.
2. The 3D phase change heat sink of claim 1, wherein: the preset angle range between the guide teeth and the inner surface of the substrate is 30-90 degrees.
3. The 3D phase change heat sink of claim 1, wherein: the structure of the guide teeth is a corrugated fin structure.
4. The 3D phase change heat sink of claim 1, wherein: the porous capillary structure comprises at least one of a woven silk screen structure, a metal powder sintering porous structure and a woven line groove.
5. The 3D phase change heat sink of claim 1, wherein: the side wall of the substrate is also provided with an injection port, and the injection port is used for filling the heat transfer working medium.
6. The 3D phase change heat sink of claim 1, wherein: the guide teeth and the inner part of the side wall of the condensation shell are spaced at a preset distance.
7. The 3D phase change heat sink of claim 1, wherein: the first cover plate is also provided with a plurality of clamping grooves, and the protruding ends of the guide teeth are inserted into the first cover plate through the clamping grooves.
8. The 3D phase change heat sink of claim 1, wherein: one end of the condensation shell, which is far away from the first cover plate, is welded in a sealing way, the condensation shell is connected with the first cover plate in a sealing way to form a condensation cavity, and the condensation cavity is communicated with the evaporation cavity.
9. The 3D phase change heat sink of claim 1, wherein: the condensing part is characterized by further comprising a second cover plate and a third cover plate which are sequentially stacked, the second cover plate is positioned above the condensing shell, the second cover plate, the third cover plate, the condensing shell and the first cover plate are in sealing connection to form a condensing cavity, and the condensing cavity is communicated with the evaporating cavity.
10. The 3D phase change heat sink of claim 9, wherein: and a plurality of slots are further formed in the second cover plate, and one end, far away from the first cover plate, of the condensing shell is inserted into the second cover plate through the slots.
11. The 3D phase change heat sink of claim 1, wherein: the 3D phase change radiator also comprises a plurality of radiating fins, wherein the radiating fins are positioned on the outer surface of the condensation shell and between adjacent condensation shells.
12. The manufacturing method of the 3D phase-change radiator is characterized by comprising the following steps of:
providing an evaporation part, wherein the evaporation part comprises a substrate, a first cover plate and a porous capillary structure, the substrate and the first cover plate are oppositely arranged and are in sealing connection to form an evaporation cavity, the porous capillary structure is positioned on the inner surface of the substrate, and the outer surface of the substrate far away from the first cover plate is a heat absorption surface;
providing a condensing part, wherein the condensing part at least comprises a plurality of condensing shells, and the condensing shells are arranged above the first cover plate at intervals in parallel;
providing a guide tooth, wherein the guide tooth is positioned in the condensation shell, one end of the guide tooth protrudes out of the condensation shell and is in contact with the porous capillary structure, and the guide tooth is obliquely arranged in the condensation shell and forms a preset angle with the inner surface of the substrate;
and fixedly connecting the evaporation part and the condensation part in a welding mode, discharging non-condensable gas in the evaporation cavity through an injection port after welding, filling a heat transfer working medium, and sealing the injection port to obtain the 3D phase change radiator.
13. The method for manufacturing a 3D phase change heat sink according to claim 12, wherein: the guide teeth are fixedly connected with the condensation shell in a welding mode.
14. The method for manufacturing a 3D phase change heat sink according to claim 12, wherein: the method for welding the evaporation part and the condensation part comprises atmosphere protection brazing furnace welding and vacuum brazing furnace welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311339138.XA CN117276215A (en) | 2023-10-16 | 2023-10-16 | 3D phase-change radiator and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311339138.XA CN117276215A (en) | 2023-10-16 | 2023-10-16 | 3D phase-change radiator and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117276215A true CN117276215A (en) | 2023-12-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311339138.XA Pending CN117276215A (en) | 2023-10-16 | 2023-10-16 | 3D phase-change radiator and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117276215A (en) |
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2023
- 2023-10-16 CN CN202311339138.XA patent/CN117276215A/en active Pending
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