CN117260027A - Laser system and method for separating brittle and hard components - Google Patents
Laser system and method for separating brittle and hard components Download PDFInfo
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- CN117260027A CN117260027A CN202311220823.0A CN202311220823A CN117260027A CN 117260027 A CN117260027 A CN 117260027A CN 202311220823 A CN202311220823 A CN 202311220823A CN 117260027 A CN117260027 A CN 117260027A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The present disclosure proposes a laser system and method for brittle component separation, wherein the laser system comprises: the carrier is used for bearing the brittle and hard component; the first optical path is used for emitting focused laser beams when the carrier moves along the first path so as to form a plurality of gaps which are positioned in the same plane and distributed at intervals in the brittle and hard component by utilizing the focused laser beams; and a second optical path for emitting a second parallel laser beam along the second path to expand the voids with the second parallel laser beam, thereby communicating the plurality of voids and forming the modified layer. In the laser system and the method for separating the brittle and hard components, the intervention of external larger load is avoided, the higher processing quality of the brittle and hard components is ensured, and the operations such as focusing control and precise movement control are avoided, so that the separation process of the brittle and hard components is effectively simplified, the processing efficiency of the brittle and hard components is improved, and the processing cost of the brittle and hard components is reduced.
Description
Technical Field
The present disclosure relates to the field of brittle and hard component separation technology, and in particular, to a laser system and method for brittle and hard component separation.
Background
Brittle and hard materials are widely applied to manufacturing of electronic devices such as high temperature, high frequency, high power and radiation resistance, and play a significant role in the development of fields such as laser, photoelectricity and semiconductors.
At present, the brittle and hard material is mostly separated by adopting the wire saw technology during processing, but the wire saw processing time is longer, more material waste is caused, the surface of the brittle and hard member is extremely easy to crack during processing, and the strength of the brittle and hard member is also reduced by generated chips. Thus, the processing efficiency of the brittle and hard member is low, the processing cost is high, and the processing quality of the brittle and hard member cannot be ensured.
Disclosure of Invention
The present disclosure aims to solve, at least to some extent, one of the technical problems in the related art.
To this end, it is an object of the present disclosure to provide a laser system and method for brittle component separation.
To achieve the above object, a first aspect of the present disclosure provides a laser system for brittle-hard member separation, comprising: a carrier for carrying the fragile components; the first light path is used for emitting focused laser beams when the carrier moves along the first path so as to form a plurality of gaps which are positioned in the same plane and distributed at intervals in the brittle and hard component by utilizing the focused laser beams; the second light path, the exit end of the second light path with the microscope carrier is relative setting, the second light path is used for following the second parallel laser beam of second route outgoing to utilize the second parallel laser beam expands the space, thereby make a plurality of the space intercommunication and form the modification layer.
Optionally, the carrier further includes: the metal table is internally provided with a negative pressure passage, the air inlet end of the negative pressure passage is arranged on the bearing surface of the metal table, and the air outlet end of the negative pressure passage is used for discharging the air in the negative pressure passage; the bearing surface of the metal table is used for bearing the brittle and hard component, and the bearing surface of the metal table is arranged opposite to the emergent end of the first optical path and the emergent end of the second optical path respectively.
Optionally, the carrier further includes: the heat sink, the metal platform sets up on the heat sink, be provided with the heat dissipation passageway in the heat sink, the feed liquor end of heat dissipation passageway is used for letting in the endothermic fluid, the play liquid end of heat dissipation passageway is used for discharging the endothermic fluid.
Optionally, the carrier further includes: the first moving device is used for driving the heat sink to move along a first direction; the first moving device is arranged on the second moving device and is used for driving the first moving device to move along a second direction; the first direction, the second direction and the thickness direction of the brittle and hard component are perpendicular to each other.
Optionally, the first optical path includes: a pulse laser for emitting a first parallel laser beam; the incidence end of the objective lens is opposite to the emergent end of the pulse laser, the emergent end of the objective lens is opposite to the carrying platform, and the objective lens is used for converting the first parallel laser beam into the focused laser beam.
Optionally, the first optical path further includes: the incident end of the polaroid is opposite to the emergent end of the pulse laser; the incidence end of the half-wave plate and the emergent end of the polaroid are arranged oppositely; the incidence end of the electronic shutter and the emergent end of the half-wave plate are arranged oppositely; the incidence end of the beam expander is opposite to the emergent end of the electronic shutter; the incidence end of the reflecting mirror is opposite to the emergent end of the beam expander, and the emergent end of the reflecting mirror is opposite to the incidence end of the objective lens; the first parallel laser beam sequentially passes through the polaroid, the half-wave plate, the electronic shutter, the beam expander, the reflector and the objective lens and then is converted into the focused laser beam.
Optionally, the first optical path further includes: the third moving device is used for driving the objective lens to move along a third direction; wherein the third direction and the thickness direction of the brittle and hard member are arranged in parallel.
Optionally, the second optical path includes: a continuous laser for emitting the second parallel laser beam; the incident end of the two-dimensional vibrating mirror is opposite to the emergent end of the continuous laser, the emergent end of the two-dimensional vibrating mirror is opposite to the carrying platform, and the two-dimensional vibrating mirror is used for emergent the second parallel laser beam along the second path.
Optionally, the laser system further includes: the first output end of the controller is connected with the input end of the first light path, the second output end of the controller is connected with the input end of the second light path, the third output end of the controller is connected with the input end of the carrier, and the controller is used for controlling the first light path to emit the focused laser beam, controlling the second light path to emit the second parallel laser beam along the second path and controlling the carrier to move along the first path.
A second aspect of the present disclosure provides a method for brittle and hard component separation, comprising: moving the brittle member along a first path; emitting a focused laser beam to the brittle and hard component so as to form a plurality of gaps which are positioned in the same plane and distributed at intervals in the brittle and hard component by utilizing the focused laser beam; and emitting a second parallel laser beam to the brittle and hard member along a second path so as to expand the gaps by using the second parallel laser beam, thereby communicating a plurality of the gaps and forming a modified layer.
The technical scheme provided by the disclosure can comprise the following beneficial effects:
after focusing and irradiating the focusing laser beams, the brittle and hard components are separated by irradiating the second parallel laser beams, so that the intervention of external larger load is avoided, the higher processing quality of the brittle and hard components is ensured, and the operations such as focusing control and precise movement control are avoided, thereby effectively simplifying the separation process of the brittle and hard components, improving the processing efficiency of the brittle and hard components and reducing the processing cost of the brittle and hard components.
Additional aspects and advantages of the disclosure will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the disclosure.
Drawings
The foregoing and/or additional aspects and advantages of the present disclosure will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic diagram of a laser system for brittle component separation according to a related embodiment;
FIG. 2 is a schematic diagram of a laser system for brittle component separation according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of a modified layer forming process in a laser system for brittle-hard component separation according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a laser system for brittle component separation according to an embodiment of the present disclosure;
FIG. 5 is a flow chart illustrating a method for brittle component separation according to an embodiment of the present disclosure;
as shown in the figure: a1, a carrying platform, A2, a light path, A21, a focusing laser beam, A3, a brittle and hard component, A31 and a gap;
1. a carrier;
11. a metal stage 111, a negative pressure passage;
12. a heat sink, 121, a heat dissipation path;
13. a first mobile device, 14, a second mobile device;
2. a first optical path 21, a pulse laser 22, a polaroid 23, a half-wave plate 24, an electronic shutter 25, a beam expander 26, a reflector 27, an objective lens 28, a third moving device 29, a first parallel laser beam 210 and a focused laser beam;
3. a second light path 31, a continuous laser 32, a two-dimensional vibrating mirror 33 and a second parallel laser beam;
4. a controller;
5. brittle and hard components, 51, gaps, 52 and modified layers.
Detailed Description
Embodiments of the present disclosure are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present disclosure and are not to be construed as limiting the present disclosure. On the contrary, the embodiments of the disclosure include all alternatives, modifications, and equivalents as may be included within the spirit and scope of the appended claims.
The brittle and hard components are separated by adopting the wire saw technology, but the wire saw processing time is long, about 50% of materials are wasted, the surface of the brittle and hard components is extremely easy to crack in the processing process, and the strength of the brittle and hard components is reduced by generated chips. Thus, the processing efficiency of the brittle and hard member is low, the processing cost is high, and the processing quality of the brittle and hard member cannot be ensured.
As shown in fig. 1, a related embodiment proposes a laser system for separating a brittle and hard component A3, which includes a stage A1 and an optical path A2, wherein the stage A1 is used for carrying the brittle and hard component A3, an exit end of the optical path A2 is opposite to the stage A1, and the optical path A2 is used for emitting a focused laser beam a21 when the stage A1 moves along a set path, so as to form a plurality of voids a31 in the brittle and hard component A3, which are located in the same plane and are distributed at intervals by using the focused laser beam a 21.
Wherein, as the focused laser beam a21 is focused in the brittle and hard member A3, the brittle and hard material in the brittle and hard member A3 undergoes multiphoton absorption at high peak power density, so that micro-explosion occurs, and a gap a31 is generated in the brittle and hard member A3, and as the brittle and hard member A3 moves along a set path along with the carrier A1, the focused laser beam a21 forms a plurality of gaps a31 in the brittle and hard member A3, which are located in the same plane and are distributed at intervals.
Since the bonding force at the void a31 formed in the brittle and hard member A3 is small, the brittle and hard member A3 can be separated from the plane of the void a31 by an external mechanical load such as stretching, twisting, etc., thereby realizing the separation process of the brittle and hard member A3.
However, since the plurality of voids a31 are spaced apart in the brittle and hard member A3, the brittle and hard member A3 does not form an integral gap, there are still many connecting structures, and a large external load is required for separating the brittle and hard member A3, so that damage to the brittle and hard member A3 is easily caused.
To solve the above-mentioned problems, as shown in fig. 2, 3 and 4, the disclosed embodiment proposes a laser system for separating a brittle and hard component 5, which includes a stage 1, a first optical path 2 and a second optical path 3, the stage 1 is used for carrying the brittle and hard component 5, an exit end of the first optical path 2 is opposite to the stage 1, the first optical path 2 is used for emitting a focused laser beam 210 when the stage 1 moves along the first path, so as to form a plurality of voids 51 located in the same plane and distributed at intervals in the brittle and hard component 5 by using the focused laser beam 210, the exit end of the second optical path 3 is opposite to the stage 1, and the second optical path 3 is used for emitting a second parallel laser beam 33 along the second path to expand the voids 51 by using the second parallel laser beam 33, so that the plurality of voids 51 are communicated and form a modified layer 52.
It will be appreciated that as a result of the focusing of the focused laser beam 210 in the brittle member 5, the brittle material in the brittle member 5 undergoes multiphoton absorption at high peak power density, thereby causing a micro-explosion, thereby creating voids 51 in the brittle member 5, and as a result of the movement of the brittle member 5 along the first path with the stage 1, the focused laser beam 210 forms a plurality of voids 51 in the brittle member 5 that lie in the same plane and are spaced apart.
In addition, since the gap 51 in the brittle and hard member 5 has a larger laser absorptivity, when the brittle and hard member 5 is irradiated by the second parallel laser beam 33 along the second path, the gap 51 in the brittle and hard member 5 can absorb laser energy and generate a thermal expansion effect, so that thermal stress is generated to expand the gap 51, and further, the plurality of gaps 51 are communicated and form the modified layer 52 of the integral gap structure, and simultaneously, under the continuous driving of the thermal stress, the brittle and hard member 5 can be separated from the modified layer 52, thereby realizing the separation processing of the brittle and hard member 5 and meeting the use requirement.
Wherein, after focusing and irradiating the brittle and hard member 5 by the focusing laser beam 210, the brittle and hard member 5 is separated by irradiating the second parallel laser beam 33, which not only avoids the intervention of larger external load and ensures higher processing quality of the brittle and hard member 5, but also avoids the operations of focusing control, precise movement control and the like, thereby effectively simplifying the separation process of the brittle and hard member 5, improving the processing efficiency of the brittle and hard member 5 and reducing the processing cost of the brittle and hard member 5.
It should be noted that the first optical path 2 is used to emit the focused laser beam 210 to generate micro-explosion marks, that is, voids 51, in the brittle and hard member 5 by using the focused laser beam 210, and the bonding force in the brittle and hard member 5 is reduced due to the presence of the voids 51, thereby facilitating the separation of the brittle and hard member 5. The specific type of the first optical path 2 may be set according to actual needs, and is not limited thereto, and the wavelength range of the focused laser beam 210 may be 355nm to 1100nm, and the spot diameter of the focused laser beam 210 may be less than 10 μm.
The second optical path 3 is used for emitting the second parallel laser beam 33 to expand the gap 51 in the brittle and hard member 5 by using the second parallel laser beam 33, and when the brittle and hard member 5 is irradiated by the second parallel laser beam 33 due to the larger laser absorptivity at the gap 51 in the brittle and hard member 5, part of the light beam in the second parallel laser beam 33 is absorbed by the brittle and hard member 5, and the rest of the light beam irradiates the carrier 1 through the brittle and hard member 5, based on which the second path is not required to be precisely controlled as a whole, so that the separation of the brittle and hard member 5 is simpler. The specific type of the second optical path 3 may be set according to practical needs, and is not limited thereto, and the gap 51 in the brittle member 5 has a high absorptivity for laser light in the infrared band, so that the wavelength range of the second parallel laser beam 33 may be 800nm-1100nm, the laser power range may be 50W-100W, and the beam diameter range may be 3mm-8mm.
The carrier 1 is configured to carry the brittle and hard member 5 and drive the brittle and hard member 5 to move along the first path, and the specific type of the carrier 1 may be set according to actual needs, which is not limited.
The brittle and hard member 5 is a member having high brittleness and high hardness, and the brittle and hard member 5 may be made of diamond, silicon carbide (SiC), ceramic crystal, silicon, sapphire, gallium nitride, or the like, without limitation. Wherein the thickness of the brittle and hard member 5 may range from 0.05mm to 20mm.
The specific type of the voids 51 of the brittle and hard member 5 may be set according to actual needs, and the voids 51 of the brittle and hard member 5 may be nano-scale holes, micro-scale micro-cracks, etc., the thickness of the voids 51 may be less than 10 μm, and the width of the voids 51 may range from 20 μm to 50 μm, for example.
The position of the modified layer 52 in the brittle member 5 may be set according to actual needs, and is not limited thereto, and the planar direction of the modified layer 52 and the thickness direction of the brittle member 5 may be perpendicular, and the distance between the modified layer 52 and the brittle member 5 at the end away from the stage 1 may be in the range of 150 μm to 500 μm.
The relative arrangement of the exit end of the first optical path 2 and the stage 1 and the relative arrangement of the exit end of the second optical path 3 and the stage 1 may be set according to actual needs, which is not limited to this, and when the fragile and hard component 5 is set on the stage 1, the exit end direction of the first optical path 2 and the exit end direction of the second optical path 3 are respectively parallel to the thickness direction of the fragile and hard component 5.
The specific types of the first path and the second path may be set according to actual needs, which are not limited, and the first path and the second path may be in an "arcuate" shape, a "Z" shape, or the like, as an example.
As shown in fig. 4, in some embodiments, the carrier 1 further includes a metal table 11, a negative pressure passage 111 is disposed in the metal table 11, an air inlet end of the negative pressure passage 111 is disposed on a carrying surface of the metal table 11, an air outlet end of the negative pressure passage 111 is used for discharging air in the negative pressure passage 111, wherein the carrying surface of the metal table 11 is used for carrying the brittle and hard member 5, and the carrying surface of the metal table 11 is disposed opposite to the emitting end of the first optical path 2 and the emitting end of the second optical path 3, respectively.
It can be appreciated that when the brittle and hard member 5 is disposed on the bearing surface of the metal table 11, the air outlet end of the negative pressure passage 111 discharges the air in the negative pressure passage 111, so that the air inlet end of the negative pressure passage 111 forms negative pressure, and the brittle and hard member 5 is stably adsorbed on the bearing surface of the metal table 11 by using the negative pressure, thereby ensuring the accurate separation of the brittle and hard member 5.
Wherein, part of the light beams in the second parallel laser beams 33 are absorbed by the brittle and hard member 5, and the rest of the light beams pass through the brittle and hard member 5 and irradiate on the metal table 11 so as to generate more heat on the metal table 11, and the metal table 11 adopts a metal material with higher heat conduction efficiency, so that the metal table 11 can rapidly conduct out the heat in the metal table, avoid heat accumulation, and further ensure stable separation of the brittle and hard member 5.
The metal table 11 is used to carry the brittle and hard member 5, and the specific type of the metal table 11 may be set according to actual needs, which is not limited to this, and the metal table 11 may be a disc-shaped structure, and the material of the metal table 11 may be copper, copper alloy, aluminum alloy, or the like.
The negative pressure passage 111 is used for exhausting gas between the brittle and hard member 5 and the bearing surface of the metal table 11, and the specific type of the negative pressure passage 111 can be set according to actual needs, which is not limited by this, and the air outlet end of the negative pressure passage 111 is set at one side of the metal table 11, and the air inlet end of the negative pressure passage 111 is provided with a plurality of suction holes, and the plurality of suction holes are uniformly distributed on the bearing surface of the metal table 11.
The air outlet end of the negative pressure passage 111 may be connected to the air inlet end of the negative pressure device, and the specific type of the negative pressure device may be set according to actual needs, which is not limited, and the negative pressure device may be an induced draft fan.
As shown in fig. 4, in some embodiments, the carrier 1 further includes a heat sink 12, the metal table 11 is disposed on the heat sink 12, a heat dissipation passage 121 is disposed in the heat sink 12, a liquid inlet end of the heat dissipation passage 121 is used for introducing the heat absorption fluid, and a liquid outlet end of the heat dissipation passage 121 is used for discharging the heat absorption fluid.
It will be appreciated that under the action of the second parallel laser beam 33, more heat is generated on the metal table 11, and is conducted from the metal table 11 to the heat sink 12, and because the heat dissipation passage 121 is provided in the heat sink 12, the heat absorption fluid can absorb the heat in the heat sink 12 when passing through the heat dissipation passage 121, thereby realizing the cooling of the heat sink 12, further avoiding the accumulation of the heat in the metal table 11, and ensuring the stable separation of the brittle and hard member 5.
It should be noted that, the heat sink 12 is used for cooling the metal table 11, the specific type of the heat sink 12 may be set according to actual needs, which is not limited to this, and the heat sink 12 may be a truncated cone structure, and the heat sink 12 is made of a metal material.
The heat dissipation path 121 is used for circulating heat absorption fluid to absorb heat in the heat sink 12 by using the heat absorption fluid, and specific types of the heat dissipation path 121 can be set according to actual needs, which is not limited, and the liquid inlet end and the liquid outlet end of the heat dissipation path 121 are respectively set at two sides of the heat sink 12, and the main body part of the heat dissipation path 121 is arranged in the heat sink 12 in a serpentine shape, a spiral shape, or the like.
The heat absorbing fluid is used to absorb heat in the heat sink 12, and the specific type of heat absorbing fluid may be set according to actual needs, and is not limited thereto, and the heat absorbing fluid may be low temperature water, low temperature oil, low temperature gas, or the like, as an example.
As shown in fig. 4, in some embodiments, the carrier 1 further includes a first moving device 13 and a second moving device 14, the heat sink 12 is disposed on the first moving device 13, the first moving device 13 is used for driving the heat sink 12 to move along a first direction, the first moving device 13 is disposed on the second moving device 14, and the second moving device 14 is used for driving the first moving device 13 to move along a second direction, where the first direction, the second direction and the thickness direction of the brittle and hard member 5 are disposed two by two perpendicularly.
It will be appreciated that, since the heat sink 12 is disposed on the first moving means 13, and the first moving means 13 drives the heat sink 12 to move in the first direction, the brittle member 5 can be moved in the first direction by the driving of the first moving means 13 when the brittle member 5 is disposed on the metal table 11; since the first moving means 13 is disposed on the second moving means 14, and the second moving means 14 drives the first moving means 13 to move in the second direction, the brittle and hard member 5 can be moved in the second direction by the driving of the second moving means 14 when the brittle and hard member 5 is disposed on the metal table 11. Thus, the brittle and hard component 5 on the metal table 11 can move along the first path by the cooperation of the first moving means 13 and the second moving means 14, thereby ensuring the stable formation of the gap 51 in the brittle and hard component 5.
It should be noted that, the first moving device 13 is configured to drive the heat sink 12 to move along the first direction, a specific type of the first moving device 13 may be set according to actual needs, which is not limited in this respect, and the first moving device 13 includes a first base, a first sliding table, a first screw rod and a first driving motor, where the heat sink 12 is disposed on the first sliding table, the first sliding table is slidably disposed on the first base along the first direction, the first screw rod is rotationally disposed on the first base around the first direction, and the first screw rod is connected with the first sliding table through a screw transmission, the first driving motor is disposed on the first base, and an output shaft of the first driving motor is coaxially connected with one end of the first screw rod. Therefore, the first screw rod is driven by the first driving motor to rotate and drive the first sliding table to move along the first direction, and then the heat sink 12 on the first sliding table is driven to move along the first direction.
The second moving device 14 is configured to drive the first moving device 13 to move along the second direction, a specific type of the second moving device 14 may be set according to actual needs, which is not limited in this respect, and the second moving device 14 includes a second base, a second sliding table, a second screw rod and a second driving motor, where the first base is disposed on the second sliding table, the second sliding table is slidably disposed on the second base along the second direction, the second screw rod is rotatably disposed on the second base around the second direction, and the second screw rod is connected with the second sliding table through a screw transmission, and the second driving motor is disposed on the second base, and an output shaft of the second driving motor is coaxially connected with one end of the second screw rod. Therefore, the second screw rod is driven by the second driving motor to rotate and drive the second sliding table to move along the second direction, and then the first moving device 13 on the second sliding table is driven to move along the second direction.
The moving speeds of the first moving device 13 and the second moving device 14 may be set according to actual needs, which is not limited, and the moving speeds of the first moving device 13 and the second moving device 14 may be in the range of 150mm/s-400mm/s, for example.
When the brittle and hard member 5 is disposed on the metal stage 11, it should be ensured that the centers of the brittle and hard member 5 coincide with the center zero positions of the first moving means 13 and the second moving means 14, respectively, in the thickness direction of the brittle and hard member 5, and that the centers of the focused laser beams 210 coincide with the center zero positions of the first moving means 13 and the second moving means 14, respectively, in the thickness direction of the brittle and hard member 5, and that the centers of the second parallel laser beams 33 deviate from the center zero positions of the first moving means 13 and the second moving means 14, respectively, in the thickness direction of the brittle and hard member 5 by no more than 100mm.
As shown in fig. 4, in some embodiments, the first optical path 2 includes a pulse laser 21 and an objective lens 27, the pulse laser 21 is configured to emit a first parallel laser beam 29, an incident end of the objective lens 27 is disposed opposite to an emitting end of the pulse laser 21, the emitting end of the objective lens 27 is disposed opposite to the stage 1, and the objective lens 27 is configured to convert the first parallel laser beam 29 into a focused laser beam 210.
It will be appreciated that the pulsed laser 21 irradiates a pulsed first parallel laser beam 29 and the objective lens 27 focuses the first parallel laser beam 29 into a focused laser beam 210 that is then irradiated into the brittle component 5 to ensure stable separation of the brittle component 5.
It should be noted that, the pulse laser 21 is used to emit the first parallel laser beam 29 of the pulse type, and the specific type of the pulse laser 21 may be set according to actual needs, which is not limited thereto, and the pulse laser 21 may be an ultrashort pulse laser 21, an ultrafast laser, or the like, for example.
As shown in fig. 4, in some embodiments, the first optical path 2 further includes a polarizer 22, a half-wave plate 23, an electronic shutter 24, a beam expander 25, and a mirror 26, where an incident end of the polarizer 22 and an exit end of the pulse laser 21 are disposed opposite to each other, an incident end of the half-wave plate 23 and an exit end of the polarizer 22 are disposed opposite to each other, an incident end of the electronic shutter 24 and an exit end of the half-wave plate 23 are disposed opposite to each other, an incident end of the beam expander 25 and an exit end of the electronic shutter 24 are disposed opposite to each other, an incident end of the mirror 26 and an exit end of the beam expander 25 are disposed opposite to each other, and an exit end of the mirror 26 and an incident end of the objective lens 27 are disposed opposite to each other, wherein the first parallel laser beam 29 is converted into a focused laser beam 210 after sequentially passing through the polarizer 22, the half-wave plate 23, the electronic shutter 24, the beam expander 25, the mirror 26, and the objective lens 27.
It will be appreciated that the first parallel laser beam 29 is converted into the focused laser beam 210 after passing through the polarizing plate 22, the half-wave plate 23, the electronic shutter 24, the beam expander 25, the reflecting mirror 26 and the objective lens 27 in this order, and that the power of the first parallel laser beam 29 is adjusted by using the relative position between the polarizing plate 22 and the half-wave plate 23 when the first parallel laser beam 29 passes through the polarizing plate 22 and the half-wave plate 23; when the first parallel laser beam 29 passes through the electronic shutter 24, the electronic shutter 24 is used to control the opening and closing of the first parallel laser beam 29; when the first parallel laser beam 29 passes through the beam expander 25, the diameter of the first parallel laser beam 29 is expanded by the beam expander 25; the direction of the first parallel laser beam 29 is adjusted by the mirror 26 when the first parallel laser beam 29 passes the mirror 26. Thus, by the arrangement of the polarizing plate 22, the half wave plate 23, the electronic shutter 24, the beam expander 25 and the reflecting mirror 26, stable transmission of the first parallel laser beam 29 from the pulse laser 21 to the objective lens 27 is ensured, and the separation processing requirement of the brittle and hard member 5 is satisfied.
It should be noted that, the polarizer 22 and the half-wave plate 23 are used to cooperate to adjust the power of the first parallel laser beam 29, and the specific types of the polarizer 22 and the half-wave plate 23 may be set according to actual needs, which is not limited.
The electronic shutter 24 is used to control the on-off of the path of the first parallel laser beam 29, and the specific type of the electronic shutter 24 may be set according to actual needs, which is not limited.
The beam expander 25 is used to change the diameter and divergence angle of the first parallel laser beam 29, and the specific type of the beam expander 25 may be set according to actual needs, which is not limited.
The reflecting mirror 26 is used for reflecting the first parallel laser beam 29, and the specific type of the reflecting mirror 26 may be set according to actual needs, which is not limited.
The relative positions of the pulse laser 21, the polarizing plate 22, the half-wave plate 23, the electronic shutter 24, the beam expander 25, the reflecting mirror 26 and the objective lens 27 may be set according to actual needs, which is not limited thereto, and the pulse laser 21, the polarizing plate 22, the half-wave plate 23, the electronic shutter 24 and the beam expander 25 may be sequentially set in the first direction or the second direction, the objective lens 27 may be set in the thickness direction of the brittle member 5, and the reflecting mirror 26 is set at an angle of 45 degrees, which diverts the first parallel laser beam 29 at the exit end of the beam expander 25 to the incident end of the objective lens 27.
As shown in fig. 4, in some embodiments, the first optical path 2 further includes a third moving device 28, the objective lens 27 is disposed on the third moving device 28, and the third moving device 28 is configured to drive the objective lens 27 to move along a third direction, where the third direction and the thickness direction of the brittle and hard member 5 are disposed in parallel.
It can be appreciated that, since the objective lens 27 is disposed on the third moving device 28, and the third moving device 28 drives the objective lens 27 to move along the third direction, the objective lens 27 can adjust the focal position in the third direction by using the driving of the third moving device 28, so that when the first parallel laser beam 29 is converted into the focused laser beam 210 through the objective lens 27, the position of the modified layer 52 can be adjusted in the thickness direction of the brittle and hard member 5 by using the movement of the objective lens 27, thereby meeting different separation requirements of the brittle and hard member 5.
It should be noted that, the third moving device 28 is configured to drive the objective lens 27 to move along the third direction, a specific type of the third moving device 28 may be set according to actual needs, which is not limited in this respect, and the third moving device 28 includes a third base, a third sliding table, a third screw rod and a third driving motor, where the objective lens 27 is disposed on the third sliding table, the third sliding table is slidably disposed on the third base along the third direction, the third screw rod is rotatably disposed on the third base around the third direction, and the third screw rod is in threaded transmission connection with the third sliding table, and the third driving motor is disposed on the third base, and an output shaft of the third driving motor is coaxially connected with one end of the third screw rod. Therefore, the third screw rod is driven by the third driving motor to rotate and drive the third sliding table to move along the third direction, and then the objective lens 27 on the third sliding table is driven to move along the third direction.
As shown in fig. 4, in some embodiments, the second optical path 3 includes a continuous laser 31 and a two-dimensional galvanometer 32, the continuous laser 31 is configured to emit the second parallel laser beam 33, an incident end of the two-dimensional galvanometer 32 is disposed opposite to an emitting end of the continuous laser 31, the emitting end of the two-dimensional galvanometer 32 is disposed opposite to the stage 1, and the two-dimensional galvanometer 32 is configured to emit the second parallel laser beam 33 along the second path.
It will be appreciated that the continuous laser 31 irradiates a continuous second parallel laser beam 33 and the two-dimensional galvanometer 32 directs the second parallel laser beam 33 along a second path into the brittle component 5 to ensure stable separation of the brittle component 5.
Wherein, because the second light path 3 emits the continuous second parallel laser beam 33 to the brittle and hard member 5, when the second parallel laser beam 33 irradiates the brittle and hard member 5 along the second path, the gaps 51 in the brittle and hard member 5 can be completely covered, thereby ensuring stable communication among the gaps 51 and further ensuring stable separation of the brittle and hard member 5.
Note that, the continuous laser 31 is used to irradiate the continuous second parallel laser beam 33, and the specific type of the continuous laser 31 may be set according to actual needs, which is not limited.
The two-dimensional galvanometer 32 is used for adjusting the direction and the position of the second parallel laser beam 33 by vibration so as to realize the irradiation of the second parallel laser beam 33 along the second path, and the specific type of the two-dimensional galvanometer 32 can be set according to actual needs, which is not limited.
As shown in fig. 4, in some embodiments, the laser system further includes a controller 4, a first output terminal of the controller 4 is connected to the input terminal of the first optical path 2, a second output terminal of the controller 4 is connected to the input terminal of the second optical path 3, a third output terminal of the controller 4 is connected to the input terminal of the stage 1, and the controller 4 is configured to control the first optical path 2 to emit the focused laser beam 210, control the second optical path 3 to emit the second parallel laser beam 33 along the second path, and control the stage 1 to move along the first path.
It can be appreciated that, by the arrangement of the controller 4, the control of the first optical path 2 to emit the focused laser beam 210, the control of the second optical path 3 to emit the second parallel laser beam 33 along the second path, and the control of the movement of the carrier 1 along the first path are facilitated, so that the automation level of the laser system is effectively improved, and the requirements of high-efficiency and high-quality separation and processing of the brittle and hard component 5 are met.
It should be noted that the specific type of the controller 4 may be set according to actual needs, which is not limited thereto, and the controller 4 may be a PLC controller 4, a micro control unit, or the like, by way of example.
As shown in fig. 5, the embodiment of the present disclosure further proposes a method for separating a brittle member 5, comprising:
s1: moving the brittle member 5 along a first path;
s2: emitting a focused laser beam 210 toward the brittle and hard member 5 to form a plurality of voids 51 located in the same plane and spaced apart in the brittle and hard member 5 by the focused laser beam 210;
s3: the second parallel laser beam 33 is emitted toward the brittle and hard member 5 along the second path to expand the voids 51 with the second parallel laser beam 33, thereby causing the plurality of voids 51 to communicate and forming the modified layer 52.
It will be appreciated that as a result of focusing the focused laser beam 210 in the brittle component 5, the brittle material in the brittle component 5 undergoes multiphoton absorption at high peak power density, thereby causing a micro-explosion, thereby creating voids 51 in the brittle component 5, and as a result of the brittle component 5 moving along the first path, the focused laser beam 210 forms a plurality of voids 51 in the brittle component 5 that lie in the same plane and are spaced apart.
In addition, since the gap 51 in the brittle and hard member 5 has a larger laser absorptivity, when the brittle and hard member 5 is irradiated by the second parallel laser beam 33 along the second path, the gap 51 in the brittle and hard member 5 can absorb laser energy and generate a thermal expansion effect, so that thermal stress is generated to expand the gap 51, and further, the plurality of gaps 51 are communicated and form the modified layer 52 of the integral gap structure, and simultaneously, under the continuous driving of the thermal stress, the brittle and hard member 5 can be separated from the modified layer 52, thereby realizing the separation processing of the brittle and hard member 5 and meeting the use requirement.
Wherein, after focusing and irradiating the brittle and hard member 5 by the focusing laser beam 210, the brittle and hard member 5 is separated by irradiating the second parallel laser beam 33, which not only avoids the intervention of larger external load and ensures higher processing quality of the brittle and hard member 5, but also avoids the operations of focusing control, precise movement control and the like, thereby effectively simplifying the separation process of the brittle and hard member 5, improving the processing efficiency of the brittle and hard member 5 and reducing the processing cost of the brittle and hard member 5.
In the first and second embodiments, the laser system and method for separating the brittle and hard member 5 in the present embodiment are further described.
In the first embodiment, a wafer of semi-insulating 4H-SiC is taken as an example of the brittle member 5, and the brittle member 5 has a diameter of 101.6mm and a thickness of 500. Mu.m.
After cleaning the surface of the brittle and hard member 5, the brittle and hard member 5 is placed on the bearing surface of the metal table 11.
Setting parameters of the pulse laser 21: the laser repetition frequency was 1MHz and the pulse width was 400fs.
The movement speed of the brittle and hard member 5 was set to 400mm/s, and the first path was in the shape of an "arch".
The modified layer 52 and the brittle member 5 were provided at a pitch of 250 μm at the end remote from the metal stage 11.
By focusing the laser beam 210 in a "bow" shape scan inside the brittle member 5, the void 51 formed inside the brittle member 5 has a thickness of less than 10 μm.
Under the control of a control program set by the controller 4, the first optical path 2 is closed, and the second optical path 3 is opened.
Setting parameters of the continuous laser 31: the laser wavelength is 1064nm, the laser power is 200W, the diameter of a light spot is 6mm, the scanning speed is 1500mm/s, and the second path is in an arc shape.
Thus, separation of the brittle and hard member 5 was achieved, and the brittle and hard member 5 after separation formed two 4H-SiC wafers each having a thickness of 250 μm.
In example two, yb-Lu 2 O 3 The ceramic crystal of (lutetium oxide) is exemplified as the brittle member 5, and the brittle member 5 has a diameter of 10mm and a thickness of 2mm.
After cleaning the surface of the brittle and hard member 5, the brittle and hard member 5 is placed on the bearing surface of the metal table 11.
Setting parameters of the pulse laser 21: the laser wavelength is 1060nm, the laser power is 5W, the repetition frequency is 200kHz, and the pulse width is 10ps.
The movement speed of the brittle and hard member 5 was set to 200mm/s, and the first path was in the shape of an "arch".
The modified layer 52 and the brittle member 5 were provided at a pitch of 500 μm at the end remote from the metal stage 11.
By focusing the laser beam 210 in a "bow" shape scan inside the brittle member 5, the void 51 formed inside the brittle member 5 has a thickness of less than 10 μm.
Under the control of a control program set by the controller 4, the first optical path 2 is closed, and the second optical path 3 is opened.
Setting parameters of the continuous laser 31: the laser wavelength is 1064nm, the laser power is 100W, the spot diameter is 6mm, the scanning speed is 500mm/s, and the second path is Z-shaped.
Thereby, separation of the brittle and hard member 5 was achieved, and the brittle and hard member 5 after separation formed two Yb: lu having a thickness of 500 μm and 1.5mm, respectively 2 O 3 Ceramic crystals. Wherein, the Yb to Lu thickness is 1.5mm 2 O 3 The ceramic crystals may be subjected to separation processing again.
It should be noted that in the description of the present disclosure, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Furthermore, in the description of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and further implementations are included within the scope of the preferred embodiment of the present disclosure in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the embodiments of the present disclosure.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present disclosure have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the present disclosure, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the present disclosure.
Claims (10)
1. A laser system for brittle component separation comprising:
a carrier for carrying the fragile components;
the first light path is used for emitting focused laser beams when the carrier moves along the first path so as to form a plurality of gaps which are positioned in the same plane and distributed at intervals in the brittle and hard component by utilizing the focused laser beams;
the second light path, the exit end of the second light path with the microscope carrier is relative setting, the second light path is used for following the second parallel laser beam of second route outgoing to utilize the second parallel laser beam expands the space, thereby make a plurality of the space intercommunication and form the modification layer.
2. The laser system for brittle component separation according to claim 1, wherein the stage further comprises:
the metal table is internally provided with a negative pressure passage, the air inlet end of the negative pressure passage is arranged on the bearing surface of the metal table, and the air outlet end of the negative pressure passage is used for discharging the air in the negative pressure passage;
the bearing surface of the metal table is used for bearing the brittle and hard component, and the bearing surface of the metal table is arranged opposite to the emergent end of the first optical path and the emergent end of the second optical path respectively.
3. The laser system for brittle component separation according to claim 2, characterized in that the stage further comprises:
the heat sink, the metal platform sets up on the heat sink, be provided with the heat dissipation passageway in the heat sink, the feed liquor end of heat dissipation passageway is used for letting in the endothermic fluid, the play liquid end of heat dissipation passageway is used for discharging the endothermic fluid.
4. The laser system for brittle component separation according to claim 3, characterized in that the stage further comprises:
the first moving device is used for driving the heat sink to move along a first direction;
the first moving device is arranged on the second moving device and is used for driving the first moving device to move along a second direction;
the first direction, the second direction and the thickness direction of the brittle and hard component are perpendicular to each other.
5. The laser system for brittle component separation of claim 1, wherein the first optical path comprises:
a pulse laser for emitting a first parallel laser beam;
the incidence end of the objective lens is opposite to the emergent end of the pulse laser, the emergent end of the objective lens is opposite to the carrying platform, and the objective lens is used for converting the first parallel laser beam into the focused laser beam.
6. The laser system for brittle component separation according to claim 5, wherein the first optical path further comprises:
the incident end of the polaroid is opposite to the emergent end of the pulse laser;
the incidence end of the half-wave plate and the emergent end of the polaroid are arranged oppositely;
the incidence end of the electronic shutter and the emergent end of the half-wave plate are arranged oppositely;
the incidence end of the beam expander is opposite to the emergent end of the electronic shutter;
the incidence end of the reflecting mirror is opposite to the emergent end of the beam expander, and the emergent end of the reflecting mirror is opposite to the incidence end of the objective lens;
the first parallel laser beam sequentially passes through the polaroid, the half-wave plate, the electronic shutter, the beam expander, the reflector and the objective lens and then is converted into the focused laser beam.
7. The laser system for brittle component separation according to claim 5, wherein the first optical path further comprises:
the third moving device is used for driving the objective lens to move along a third direction;
wherein the third direction and the thickness direction of the brittle and hard member are arranged in parallel.
8. The laser system for brittle component separation according to claim 1, characterized in that the second optical path comprises:
a continuous laser for emitting the second parallel laser beam;
the incident end of the two-dimensional vibrating mirror is opposite to the emergent end of the continuous laser, the emergent end of the two-dimensional vibrating mirror is opposite to the carrying platform, and the two-dimensional vibrating mirror is used for emergent the second parallel laser beam along the second path.
9. The laser system for brittle component separation of claim 1, further comprising:
the first output end of the controller is connected with the input end of the first light path, the second output end of the controller is connected with the input end of the second light path, the third output end of the controller is connected with the input end of the carrier, and the controller is used for controlling the first light path to emit the focused laser beam, controlling the second light path to emit the second parallel laser beam along the second path and controlling the carrier to move along the first path.
10. A method for separating a brittle component comprising:
moving the brittle member along a first path;
emitting a focused laser beam to the brittle and hard component so as to form a plurality of gaps which are positioned in the same plane and distributed at intervals in the brittle and hard component by utilizing the focused laser beam;
and emitting a second parallel laser beam to the brittle and hard member along a second path so as to expand the gaps by using the second parallel laser beam, thereby communicating a plurality of the gaps and forming a modified layer.
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| CN202311220823.0A CN117260027A (en) | 2023-09-20 | 2023-09-20 | Laser system and method for separating brittle and hard components |
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| CN202311220823.0A CN117260027A (en) | 2023-09-20 | 2023-09-20 | Laser system and method for separating brittle and hard components |
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| CN117260027A true CN117260027A (en) | 2023-12-22 |
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| CN202311220823.0A Pending CN117260027A (en) | 2023-09-20 | 2023-09-20 | Laser system and method for separating brittle and hard components |
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