CN117238821A - Mechanical finger for transferring wafers and finger connecting piece - Google Patents
Mechanical finger for transferring wafers and finger connecting piece Download PDFInfo
- Publication number
- CN117238821A CN117238821A CN202311490693.2A CN202311490693A CN117238821A CN 117238821 A CN117238821 A CN 117238821A CN 202311490693 A CN202311490693 A CN 202311490693A CN 117238821 A CN117238821 A CN 117238821A
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- CN
- China
- Prior art keywords
- finger
- wafer
- sweeping
- piece
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 235000012431 wafers Nutrition 0.000 title claims abstract description 72
- 238000010408 sweeping Methods 0.000 claims abstract description 44
- 238000003475 lamination Methods 0.000 claims abstract description 10
- 210000004907 gland Anatomy 0.000 claims description 18
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 210000001145 finger joint Anatomy 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000012544 monitoring process Methods 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to the field of semiconductor manufacturing equipment, in particular to a mechanical finger for transferring wafers and a finger connecting piece; the mechanical finger comprises a finger body and at least one sweeping piece element for detecting whether a lamination leaking piece exists on a wafer or not, the sweeping piece element is detachably connected to the front end of the finger body, and the finger body is further provided with a wiring structure for facilitating disassembly and assembly of a sweeping piece element connecting wire. According to the mechanical finger and the finger connecting piece for transferring the wafers, the front end of the mechanical finger is detachably connected with the wafer sweeping element, so that when the mechanical arm stretches out, the wafer box can be swept by the wafer sweeping element, and if the wafer in the wafer box does not have the condition of wafer lamination leakage, the wafer can be taken away by the mechanical arm, and the purpose of monitoring the state of the wafer before transferring can be realized; meanwhile, the sweeping piece element is detachably connected to the front end of the finger body, so that the sweeping piece is convenient to detach, mount and replace in the later period, convenient to use and flexible to operate.
Description
Technical Field
The application relates to the field of semiconductor manufacturing equipment, in particular to a mechanical finger for transferring wafers and a finger connecting piece.
Background
In semiconductor manufacturing processes, transfer of wafers between chambers or stations is typically accomplished using robots. The mechanical finger is arranged on the moving unit of the transmission cavity or the front end module and rotates, stretches, lifts and the like along with the moving unit. The wafer is placed on the robot finger and transferred between the chambers with the motion of the robot finger.
The prior wafer transfer manipulator, for example, chinese patent publication No. CN217822727U discloses a wafer manipulator, its structure includes control base, supporting disk, two first linking arms, two second linking arms, two third linking arms, upper arm lock, lower arm lock, the supporting disk sets up on control base, the one end of two first linking arms sets up on the supporting disk, the one end of a second linking arm is respectively connected to the other end of two first linking arms, the one end of two third linking arms is respectively connected to the other end of two second linking arms, one of them third linking arm connects the upper arm lock, another third linking arm connects the lower arm lock, upper arm lock is relative from top to bottom with lower arm lock sets up for press from both sides and get the wafer, the one end of upper arm lock and lower arm lock is convex structure. After the technical scheme is adopted, the wafer can be prevented from being damaged, and the flexibility is high. But this wafer shifts manipulator is in the use, lacks the discernment to the condition such as wafer lamination hourglass piece to this structural style stretches out the distance less, makes the transfer scope less, simultaneously, lacks anti-shake structure between manipulator and the finger, when shifting the wafer, if the manipulator stretches out the distance longer, leads to the finger shake easily, and then influences the performance of equipment.
Therefore, the application provides a mechanical finger for transferring wafers and a finger connecting piece.
Disclosure of Invention
Accordingly, it is desirable to provide a robot finger and a finger connector for transferring wafers.
In order to solve the technical problems, the application adopts a technical scheme that: the utility model provides a mechanical finger of transporting wafer, this mechanical finger include the finger body, still include at least one and be used for detecting whether the wafer exists the piece component of sweeping of lamination hourglass piece, sweep the piece component and can dismantle the finger front end of connecting in the finger body, still offer the line structure that walks that is used for making things convenient for dismouting to sweep piece component connecting wire on the finger body, walk line structure including first line chamber and second line chamber, a plurality of first line chambers and a plurality of second line chambers are walked respectively to surface lower extreme and the upper end of finger body along finger body length extending direction, first line chamber and second walk and stagger each other between the line chamber and lay, and adjacent two first line chamber and second line chamber are walked and are linked together between the line chamber.
Preferably, the blade sweeping element comprises a support, a gland and a blade sweeping sensor, the support and the gland are arranged up and down relatively, the opposite side surfaces of the support and the gland are provided with mounting grooves, the two mounting grooves form a mounting cavity for clamping the blade sweeping sensor, the support and the gland are fixedly mounted through a detachable connecting piece, and the gland is fixedly mounted at the front end of a finger of the finger body through the detachable connecting piece.
Preferably, the front end of the finger body is provided with at least one vacuum adsorption port, and the inside of the finger body is provided with an air passage communicated with the vacuum adsorption port.
In order to solve the technical problems, the application adopts another technical scheme that: the utility model provides a finger connecting piece of transportation wafer, this finger connecting piece are used for assembling foretell mechanical finger, and it includes the link, link's upper end is still through dismantling connecting piece fixed mounting and has the end cover, set up the installation on the link and lead to the groove, installation is led to inslot fixed mounting has a plurality of anti-shake structures, through dismantling connecting piece fixed mounting between link and the finger body.
Preferably, the anti-shake structure comprises a first support arm, a second support arm and a fixed arm, wherein two ends of the fixed arm are fixedly connected with the side wall of the installation through groove respectively, the first support arm and the second support arm are symmetrically arranged on two sides of the fixed arm, the first support arm and the second support arm are arranged in a splayed shape, one ends of the first support arm and the second support arm are fixedly connected through the fixed arm, and the other ends of the first support arm and the second support arm are fixedly connected with the side wall of the installation through groove.
Preferably, the side wall of the installation through groove is provided with a wiring groove for penetrating the connecting wire and an air guide groove for penetrating the air guide pipe, and the air guide pipe penetrates through the air guide groove and is communicated with the air passage.
In order to solve the technical problems, the application adopts another technical scheme that: a manipulator for transferring wafers is provided, and comprises a manipulator body and the finger connecting piece.
Preferably, the manipulator body comprises a control base, a supporting disc, a first connecting arm and a second connecting arm, wherein the supporting disc is arranged on the control base, one end of the first connecting arm is rotationally connected to the supporting disc, one end of the second connecting arm is rotationally connected with one end, far away from the supporting disc, of the first connecting arm, and one end, far away from the first connecting arm, of the second connecting arm is rotationally connected with the finger connecting piece.
Preferably, when the manipulator performs a wafer box sweeping operation, the distance of the extending sweeping surface of the manipulator is 1130mm at most.
The application has the advantages that:
(1) According to the mechanical finger and the finger connecting piece for transferring the wafers, the front end of the mechanical finger is detachably connected with the wafer sweeping element, so that when the mechanical arm stretches out, the wafer box can be swept by the wafer sweeping element, and if the wafer in the wafer box does not have the condition of wafer lamination leakage, the wafer can be taken away by the mechanical arm, and the purpose of monitoring the state of the wafer before transferring can be realized; meanwhile, the sweeping piece element is detachably connected to the front end of the finger body, so that the sweeping piece element is convenient to detach, mount and replace in later period, convenient to use and flexible to operate;
(2) According to the mechanical finger and the finger connecting piece for transferring the wafer, the wiring structure is further arranged on the finger body, so that the wiring structure is arranged, the connecting wires of the sweeping sheet elements are convenient to lay, disassemble and assemble, the processing of the mechanical finger and the installation of the sweeping sheet elements are convenient on the premise of not affecting an air passage, the sweeping sheet elements are convenient to adjust and replace, and the use is flexible;
(3) According to the mechanical finger and the finger connecting piece for transferring the wafer, which are provided by the application, the finger connecting piece is of a hollow structure, so that the whole structure is lighter, meanwhile, through the anti-shake structure, the anti-deformation capacity of the whole structure of the finger connecting piece can be effectively improved, the mechanical finger has higher rigidity, the shaking condition of the mechanical finger when the extending distance of the mechanical hand is longer can be avoided, and the rotational inertia of the finger connecting piece is lower, so that the mechanical finger is suitable for a mechanical hand with sensitive rotational inertia;
(4) According to the mechanical finger and the finger connecting piece for transferring the wafer, when the mechanical finger is used for scanning the wafer box, the maximum extending scanning distance of the mechanical finger can reach 1130mm, and the mechanical finger and the finger connecting piece have the advantages of being large in scanning range, long in extending distance and large in transferring range, and are convenient for station layout.
Drawings
FIG. 1 is a top view of a robot finger according to an embodiment of the present application;
FIG. 2 is a bottom view of a robot finger according to an embodiment of the present application;
FIG. 3 is a schematic view of the structure of the interior of a mechanical finger according to an embodiment of the present application;
FIG. 4 is a schematic view of a sweeping blade according to an embodiment of the present application;
FIG. 5 is a schematic view of a finger attachment according to an embodiment of the present application;
FIG. 6 is a schematic structural diagram of a connecting frame according to an embodiment of the present application;
fig. 7 is a schematic diagram of a manipulator in operation according to an embodiment of the present application.
Reference numerals: finger body 1, vacuum adsorption port 2, first wiring chamber 3, second wiring chamber 4, support 5, gland 6, sweep piece sensor 7, air flue 8, connecting wire 9, end cover 10, link 11, installation logical groove 12, fixed arm 13, first support arm 14, second support arm 15, supporting disk 16, first connecting arm 17, second connecting arm 18, finger connecting piece 19, control base 20, wafer 21, wafer box 22, wiring groove 23, air guide groove 24.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail by the following detailed description with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
Referring to fig. 1-3, a schematic structural diagram of one embodiment of a mechanical finger is provided.
The mechanical finger is used for transferring wafers 21, and structurally comprises a finger body 1 and at least one sweeping piece element for detecting whether the wafers 21 have lamination leakage pieces or not, wherein the sweeping piece element is detachably connected to the front end of the finger body 1, and the finger body 1 is further provided with a wiring structure for facilitating disassembly and assembly of the sweeping piece element connecting wires 9.
In one embodiment, in order to facilitate the lamination and leakage detection of stacked wafers 21 in the wafer cassette 22 before transferring the wafers 21, if the lamination leakage condition does not exist in the wafers 21 in the wafer cassette 22, the transfer operation may be performed, the lamination and leakage detection device uses a piece sweeping element, referring to fig. 4, the piece sweeping element includes a support 5, a gland 6 and a piece sweeping sensor 7, the support 5 and the gland 6 are disposed up and down relatively, and opposite sides of the support 5 and the gland 6 are respectively provided with a mounting groove, the two mounting grooves are respectively provided with a mounting cavity for clamping the piece sweeping sensor 7, the support 5 and the gland 6 are fixedly mounted through a detachable connector, the gland 6 is fixedly mounted at the front end of the finger body 1, wherein when the piece sweeping element needs to be mounted, the piece sweeping sensor 7 is clamped and mounted in the mounting cavities formed by the two mounting grooves opposite to the support 5 and the gland 6, and then the mounting grooves are fixedly mounted between the support 5 and the gland 6 by using the detachable connector (for example, a bolt) so that the mounting groove is completed, the piece sweeping element is assembled, and then the finger body is detached and the finger body is detached (for example, the finger body is detached) after the mounting is detached, and the finger body is replaced, and the finger body is required to be detached, and the finger is detached.
In one embodiment, in order to facilitate the arrangement and installation of the connecting wires 9 of the sweeping sheet element and the adjustment and replacement of the sweeping sheet element, the application is further provided with a wire structure, the wire structure comprises a first wire cavity 3 and a second wire cavity 4, the lower end and the upper end of the outer surface of the finger body 1 are respectively provided with a plurality of first wire cavities 3 and a plurality of second wire cavities 4 along the length extension direction of the finger body 1, the first wire cavities 3 and the second wire cavities 4 are mutually staggered, and the two adjacent first wire cavities 3 and the second wire cavities 4 are communicated, wherein the connecting wires 9 sequentially pass through the first wire cavity 3 and the second wire cavity 4 in the subsequent threading process, and then pass through the first wire cavity 3 until the last second wire cavity 4 is penetrated, the wire structure is similar to the wave structure, and the mechanical processing difficulty of the finger is reduced on the premise that the sweeping sheet element is not influenced by the wave structure, and the mechanical processing difficulty of the finger is high.
In one embodiment, in order to cooperate with the operation of the wafer sweeping element, the application is also externally connected with an upper computer, wherein the wafer 21 condition can be detected in real time in the wafer sweeping process by utilizing the wafer sweeping sensor 7, corresponding output signals are generated and fed to the upper computer, and meanwhile, the upper computer prompts an operator to check and process the wafer 21 condition in time through an externally connected alarm device (such as an audible and visual alarm).
In one embodiment, the front end of the finger body 1 is provided with at least one vacuum adsorption port 2, and the interior of the finger body 1 is provided with an air passage 8 communicated with the vacuum adsorption port 2; as shown in fig. 1, the number of vacuum suction ports 2 provided in this embodiment is 3, and the wafer 21 to be transferred can be sucked and fixed by using the vacuum suction ports 2, so that the transfer process is facilitated.
Referring to fig. 5-6, the present application provides a schematic structural view of one embodiment of a finger attachment 19.
The finger connecting piece 19 is used for assembling the mechanical finger in the embodiment, and the specific structure comprises a connecting frame 11, wherein the upper end of the connecting frame 11 is fixedly provided with an end cover 10 through a detachable connecting piece (such as a bolt), the connecting frame 11 is provided with a mounting through groove 12, a plurality of anti-shake structures are fixedly arranged in the mounting through groove 12, and the connecting frame 11 and the finger body 1 are fixedly arranged through the detachable connecting piece; the connecting frame 11 and the finger body 1 are fixed through a detachable connecting piece (such as a bolt), so that the finger body 1 is convenient to assemble, convenient to disassemble and high in flexibility, meanwhile, the connecting frame 11 is in a hollow structure through the arrangement of the mounting through groove 12, the whole structure of the connecting frame is lighter and only 0.73kg, but in order to improve the strength of the structure, the shaking condition of a mechanical finger when the extending distance of the mechanical arm is long is avoided, the structure further comprises a first supporting arm 14, a second supporting arm 15 and a fixing arm 13, two ends of the fixing arm 13 are fixedly connected with the side wall of the mounting through groove 12 respectively, the first supporting arm 14 and the second supporting arm 15 are symmetrically arranged on two sides of the fixing arm 13, the first supporting arm 14 and the second supporting arm 15 are arranged in a splayed shape, one ends of the first supporting arm 14 and the second supporting arm 15 are fixedly connected through the fixing arm 13, and the other ends of the first supporting arm 14 and the second supporting arm 15 are fixedly connected with the side wall of the mounting through groove 12; through the anti-shake structure that sets up, can make manipulator overall structure have higher rigidity and anti-deformation ability, simultaneously, this finger connecting piece 19's rotational inertia is lower, is applicable to the sensitive manipulator of rotational inertia.
In one embodiment, the side wall of the installation through groove 12 is provided with a wiring groove 23 for penetrating the connecting wire 9 and an air guide groove 24 for penetrating the air guide pipe, the air guide pipe penetrates through the air guide groove 24 to be communicated with the air channel 8, wherein the connecting wire 9 of the sweeping piece element can be penetrated in the wiring groove 23 after passing through the wiring structure by utilizing the wiring groove 23, the wiring layout of the connecting wire 9 is facilitated, and meanwhile, the air guide pipe can be communicated with the air channel 8 through the air guide groove 24 by utilizing the air guide groove 24, so that the conduit layout of the air guide pipe is facilitated.
Referring to fig. 7, a schematic structural diagram of an embodiment of a manipulator is provided.
The manipulator comprises a manipulator body and a finger connecting piece 19 in the embodiment, the specific structure comprises a control base 20, a supporting disc 16, a first connecting arm 17 and a second connecting arm 18, the supporting disc 16 is arranged on the control base 20, one end of the first connecting arm 17 is rotatably connected to the supporting disc 16, one end of the second connecting arm 18 is rotatably connected with one end of the first connecting arm 17 away from the supporting disc 16, one end of the second connecting arm 18 away from the first connecting arm 17 is rotatably connected with the finger connecting piece 19, wherein a control component is arranged in the control base 20, the manipulator can be controlled by the control component, the wafer 21 can be clamped to a proper position by the manipulator, the control component, the control base 20, the supporting disc 16, the first connecting arm 17 and the second connecting arm 18 are all in the prior art, and the principles of the manipulator are that the trend of the control base is controlled by the control component, the control base, the supporting disc, the first connecting arm and the second connecting arm are rotatably connected with the finger connecting piece 19, the manipulator can be clamped to a proper position by the manipulator, the wafer 21 can be clamped by the control component, the control base 20, the supporting disc 16, the first connecting arm 17 and the second connecting arm are more flexible and the wafer 21 can be clamped by the rotation mode, and the manipulator can not be stretched by the stretching the manipulator; meanwhile, when the manipulator performs the operation of sweeping the wafer box 22, the extending sweeping distance of the manipulator is 1130mm at the longest, so that the manipulator has the advantages of large scanning range, long extending distance and large transferring range, and is convenient for station layout.
The foregoing is a further detailed description of the application in connection with specific embodiments, and is not intended to limit the practice of the application to such descriptions. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the application, and these should be considered to be within the scope of the application.
Claims (6)
1. The utility model provides a mechanical finger of transporting wafer, includes the finger body, its characterized in that still includes at least one and is used for detecting whether the wafer exists the piece component of sweeping of lamination hourglass piece, sweep the piece component and can dismantle the finger front end of connecting in the finger body, still offer the line structure that walks that is used for making things convenient for dismouting to sweep piece component connecting wire on the finger body, walk line structure including first line chamber and second line chamber, a plurality of first line chambers and a plurality of second line chambers are walked respectively to surface lower extreme and the upper end of finger body along finger body length extending direction, first line chamber and second walk and stagger each other between the line chamber and lay, and adjacent two be linked together between first line chamber and the second line chamber.
2. The mechanical finger for transferring wafers according to claim 1, wherein the wafer sweeping element comprises a support, a gland and a wafer sweeping sensor, the support and the gland are arranged up and down oppositely, mounting grooves are formed in opposite side surfaces of the support and the gland, two mounting grooves form a mounting cavity for clamping the wafer sweeping sensor, the support and the gland are fixedly mounted through a detachable connecting piece, and the gland is fixedly mounted at the front end of the finger body through the detachable connecting piece.
3. The mechanical finger for transferring wafers according to claim 1, wherein the front end of the finger body is provided with at least one vacuum adsorption port, and an air passage communicated with the vacuum adsorption port is arranged in the finger body.
4. A finger connecting piece for transferring wafers, which is characterized by being used for assembling the mechanical finger according to any one of claims 1-3, and comprising a connecting frame, wherein an end cover is fixedly arranged at the upper end of the connecting frame through a detachable connecting piece, a mounting through groove is formed in the connecting frame, a plurality of anti-shake structures are fixedly arranged in the mounting through groove, and the connecting frame and the finger body are fixedly arranged through the detachable connecting piece.
5. The finger attachment for transferring wafers according to claim 4, wherein the anti-shake structure comprises a first support arm, a second support arm and a fixing arm, two ends of the fixing arm are fixedly connected with the side wall of the mounting through groove respectively, the first support arm and the second support arm are symmetrically arranged on two sides of the fixing arm, the first support arm and the second support arm are arranged in a splayed shape, one ends of the first support arm and the second support arm are fixedly connected through the fixing arm, and the other ends of the first support arm and the second support arm are fixedly connected with the side wall of the mounting through groove.
6. The finger joint for transferring wafers according to claim 4, wherein the sidewall of the mounting through groove is provided with a wiring groove for penetrating the connecting wire and an air guide groove for penetrating the air guide pipe, and the air guide pipe is communicated with the air passage through the air guide groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311490693.2A CN117238821B (en) | 2023-11-10 | 2023-11-10 | Mechanical finger for transferring wafers and finger connecting piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311490693.2A CN117238821B (en) | 2023-11-10 | 2023-11-10 | Mechanical finger for transferring wafers and finger connecting piece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117238821A true CN117238821A (en) | 2023-12-15 |
| CN117238821B CN117238821B (en) | 2024-01-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311490693.2A Active CN117238821B (en) | 2023-11-10 | 2023-11-10 | Mechanical finger for transferring wafers and finger connecting piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117238821B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117438368A (en) * | 2023-12-18 | 2024-01-23 | 上海谙邦半导体设备有限公司 | Mechanical arm for conveying wafers and wafer conveying system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070087620A1 (en) * | 2005-10-13 | 2007-04-19 | Yazaki Corporation | Flat cable bending holder |
| CN104916573A (en) * | 2015-06-17 | 2015-09-16 | 北京七星华创电子股份有限公司 | Combined detection method and device for silicon wafer distributed state on load bearing region of semiconductor device |
| WO2016201716A1 (en) * | 2015-06-17 | 2016-12-22 | 北京七星华创电子股份有限公司 | Silicon wafer distribution state image combination detection method and device |
| CN215644426U (en) * | 2021-07-19 | 2022-01-25 | 天津龙创恒盛实业有限公司 | Transport tool matched on single-shaft robot |
| CN215896349U (en) * | 2021-09-12 | 2022-02-22 | 釜川(无锡)智能科技有限公司 | Cantilever device of manipulator of 210 silicon wafer groove type machine |
| CN114664679A (en) * | 2020-12-24 | 2022-06-24 | 深圳中科飞测科技股份有限公司 | Wafer detection device |
-
2023
- 2023-11-10 CN CN202311490693.2A patent/CN117238821B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070087620A1 (en) * | 2005-10-13 | 2007-04-19 | Yazaki Corporation | Flat cable bending holder |
| CN104916573A (en) * | 2015-06-17 | 2015-09-16 | 北京七星华创电子股份有限公司 | Combined detection method and device for silicon wafer distributed state on load bearing region of semiconductor device |
| WO2016201716A1 (en) * | 2015-06-17 | 2016-12-22 | 北京七星华创电子股份有限公司 | Silicon wafer distribution state image combination detection method and device |
| CN114664679A (en) * | 2020-12-24 | 2022-06-24 | 深圳中科飞测科技股份有限公司 | Wafer detection device |
| CN215644426U (en) * | 2021-07-19 | 2022-01-25 | 天津龙创恒盛实业有限公司 | Transport tool matched on single-shaft robot |
| CN215896349U (en) * | 2021-09-12 | 2022-02-22 | 釜川(无锡)智能科技有限公司 | Cantilever device of manipulator of 210 silicon wafer groove type machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117438368A (en) * | 2023-12-18 | 2024-01-23 | 上海谙邦半导体设备有限公司 | Mechanical arm for conveying wafers and wafer conveying system |
| CN117438368B (en) * | 2023-12-18 | 2024-03-15 | 上海谙邦半导体设备有限公司 | Mechanical arm for conveying wafers and wafer conveying system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117238821B (en) | 2024-01-23 |
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