CN220389448U - Wafer taking assembly and wafer carrying manipulator - Google Patents

Abstract

The utility model provides a wafer taking assembly which comprises a servo motor, a support frame, a swing arm piece and a vacuum taking part, wherein the support frame is covered outside the servo motor, one end of the swing arm piece is rotatably sleeved at one end of the support frame and is connected with the servo motor, and the servo motor can drive the swing arm piece to rotate around the support frame so as to enable the swing arm piece to extend or retract; the vacuum taking part is arranged at one end of the swing arm part, which is away from the servo motor, and the vacuum taking part can take the wafer. The utility model further provides a wafer carrying manipulator. The utility model has high control precision and lower cost.

Description

Wafer taking assembly and wafer carrying manipulator

Technical Field

The utility model relates to the technical field of semiconductor electronic product production, in particular to a wafer taking assembly and a wafer carrying manipulator.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and various circuit element structures can be manufactured on the silicon wafer to form an IC product having a specific electrical function. In the manufacturing process of the wafer, the position of the wafer needs to be changed by a manipulator, and the specific operation of the manipulator comprises the following steps: and moving to a box body for storing the wafers, lifting to a proper height for taking the wafers, and taking the wafers out of the box body. In the prior art, a plurality of manipulators for achieving the functions of taking and carrying wafers exist, but most manipulators are devices for achieving operation of the manipulators by adopting a plurality of servo motors in a matching mode, and the control mode is complex, so that the control precision is low and the cost is high. Therefore, there is a need for a wafer handling robot with a simple control scheme and high precision.

Disclosure of Invention

The present utility model is directed to solving one of the above-mentioned problems, and provides a wafer picking assembly and a wafer handling manipulator, which have high control precision and low cost.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the wafer taking assembly comprises a servo motor, a support frame, a swing arm piece and a vacuum taking part, wherein the support frame is covered outside the servo motor, one end of the swing arm piece is rotatably sleeved at one end of the support frame and is connected with the servo motor, and the servo motor can drive the swing arm piece to rotate around the support frame so as to enable the swing arm piece to extend or retract; the vacuum taking part is arranged at one end of the swing arm part, which is away from the servo motor, and the vacuum taking part can take the wafer.

Further, the bottom of support frame with servo motor's body is fixed, the support frame cover in servo motor's the outside of output shaft, servo motor's output shaft is a driving shaft, the driving shaft is towards keeping away from servo motor's body direction extends, swing arm one end rotate cup joint in the support frame deviate from servo motor's one end and with driving shaft fixed connection.

Further, the swing arm piece comprises a first synchronous wheel, a first swing arm box, a first synchronous belt, a first joint piece, a second swing arm box, a second joint piece and a second synchronous belt, wherein the first synchronous wheel is fixedly arranged at one end of the support frame, which is away from the body of the servo motor, and the first synchronous wheel and the driving shaft are coaxially arranged; a first sleeve interface is arranged at one end of the first swing arm box, which faces the first synchronous wheel, the first swing arm box is sleeved outside the first synchronous wheel and the support frame through the first sleeve interface, and the driving shaft is fixedly connected with the top of the first swing arm box; the first joint piece is rotationally arranged at one end of the first swing arm box, which is far away from the first synchronous wheel, and the first synchronous belt is sleeved on the first synchronous wheel and the first joint piece; one end of the second swing arm box is fixedly connected with the first joint piece so as to swing along with the rotation of the first swing arm box; the second joint piece is rotationally arranged at one end of the second swing arm box, which is away from the first joint piece; the second synchronous belt is sleeved on the first joint piece and the second joint piece; the vacuum pick-up part is arranged on the second joint piece.

Further, the first joint piece comprises a second synchronizing wheel, an intermediate shaft and a third synchronizing wheel, the third synchronizing wheel is fixedly arranged at one end of the first swing arm box, which is away from the first synchronizing wheel, and is positioned outside the first swing arm box, and the second synchronizing wheel is positioned in the first swing arm box and is coaxially arranged with the third synchronizing wheel; one end of the intermediate shaft is fixedly connected with the second synchronous wheel, and the other end of the intermediate shaft is rotationally connected with the third synchronous wheel; the second swing arm box is sleeved outside the third synchronous wheel through the second sleeve joint, and the intermediate shaft is fixedly connected with the top of the second swing arm box; the first synchronous belt is sleeved on the first synchronous wheel and the second synchronous wheel, and the gear ratio of the first synchronous wheel to the second synchronous wheel is 2:1, a step of; the second synchronous belt is sleeved on the third synchronous wheel and the second joint piece.

Further, the second joint member includes a fourth synchronizing wheel and a tray shaft, the fourth synchronizing wheel is located in the second swing arm box and located at one end away from the third synchronizing wheel, the second synchronous belt is sleeved outside the third synchronizing wheel and the fourth synchronizing wheel, and the gear ratio of the third synchronizing wheel and the fourth synchronizing wheel is 1:2; one end of the tray shaft is fixedly connected with the fourth synchronous wheel; the vacuum taking part is fixedly arranged at one end of the tray shaft, which is away from the fourth synchronous wheel.

Further, the first swing arm box and the second swing arm box are internally provided with wire arranging blocks.

Further, the vacuum taking part comprises a wafer tray, a position sensor and a vacuum connecting pipe, one end of the wafer tray is arranged at one end of the swing arm piece, which is away from the servo motor, and a vacuum channel is formed in the wafer tray; the position sensor is arranged on the wafer tray, and the vacuum connecting pipe is communicated with the vacuum channel.

Further, the wafer tray comprises a mounting plate, a U-shaped plate and two side plates, wherein one end of the mounting plate is arranged at one end of the swing arm part, which is far away from the servo motor, one end of the U-shaped plate is connected with one end of the mounting plate, which is far away from the swing arm part, two adsorption ends extend from two opposite sides of one end of the U-shaped plate, two side plates are arranged at two opposite sides of one end of the mounting plate, which is far away from the U-shaped plate, and one side plate is provided with a position sensor; the vacuum channel extends from the mounting plate to both of the suction ends.

Further, the vacuum channel comprises a pressure collecting groove and two adsorption channels, the pressure collecting groove is arranged in the mounting plate, the two adsorption channels are arranged in the U-shaped plate, and one adsorption channel corresponds to one adsorption end; the vacuum connecting pipe is communicated with the pressure gathering groove.

The wafer carrying manipulator comprises a lifting assembly, a rotating assembly and the wafer taking assembly, wherein the rotating assembly is arranged on the lifting assembly, and the servo motor is arranged on the rotating assembly.

By adopting the technical scheme, the utility model has the following beneficial effects:

when the wafer taking assembly operates, the servo motor drives the swing arm piece to rotate around the supporting frame, the swing arm piece stretches or contracts to transfer the vacuum taking part to the box body for storing the wafers, and the vacuum taking part removes the vacuum taking part from the box body after taking the wafers, so that the wafers are carried. Therefore, the utility model can complete the carrying operation of the wafer by controlling one servo motor, not only has high control precision, but also has lower cost compared with a carrying device adopting a plurality of servo motors.

Drawings

Fig. 1 is a schematic structure diagram of a wafer picking assembly.

Fig. 2 is a cross-sectional view of a wafer handling assembly.

Fig. 3 is a schematic view of an internal structure of the wafer pick-up assembly.

Fig. 4 is a schematic view of the internal structure of the picking part.

Fig. 5 is a schematic structural view of a wafer handling robot.

In the drawings, a 100-wafer taking assembly, a 1-servo motor, a 2-support frame, a 3-swing arm piece, a 31-first synchronous wheel, a 32-first swing arm box, a 320-first set of interfaces, a 321-first tensioner, a 33-first synchronous belt, a 34-second swing arm box, a 341-second set of interfaces, a 35-second synchronous belt, a 351-second tensioner, a 36-second synchronous wheel, a 37-intermediate shaft, a 38-third synchronous wheel, a 39-fourth synchronous wheel, a 390-tray shaft, a 391-tray bearing, a 4-vacuum taking part, a 41-wafer tray, a 410-bearing groove, a 411-mounting plate, a 412-U-shaped plate, a 4121-adsorption end, a 413-side plate, a 415-pressure collecting groove, a 416-adsorption channel, a 42-position sensor, a 5-driving shaft, a 6-wire arranging block, a 200-lifting assembly, a 300-rotating assembly and a 400-wafer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1 to 4, a preferred embodiment of the present utility model provides a wafer picking assembly for carrying a wafer 400 with small displacement. The wafer taking assembly comprises a servo motor 1, a support frame 2, a swing arm piece 3 and a vacuum taking part 4, wherein the brand of the servo motor 1 is loose, and the model is MHMF042L1U2M. The support frame 2 is covered outside the servo motor 1, one end of the swing arm part 3 is rotatably sleeved at one end of the support frame 2, the swing arm part 3 is connected with the servo motor 1, and the servo motor 1 can drive the swing arm part 3 to rotate around the support frame 2 so as to enable the swing arm part 3 to extend or retract; the vacuum taking part 4 is arranged at one end of the swing arm part 3, which is away from the servo motor 1, and the vacuum taking part 4 can take the wafer 400.

When the wafer taking assembly is operated, the servo motor 1 drives the swing arm member 3 to rotate around the supporting frame 2, the swing arm member 3 stretches or contracts to transfer the vacuum taking part 4 to the box body for storing the wafer 400, and the vacuum taking part 4 is removed from the box body after the wafer 400 is taken by the vacuum taking part 4, so that the wafer 400 is carried. Therefore, the utility model can complete the carrying operation of the wafer 400 by controlling one servo motor, not only has high control precision, but also has lower cost compared with a carrying device adopting a plurality of servo motors.

In this embodiment, the bottom of the support frame 2 is fixed to the body of the servo motor 1, the support frame 2 is a cylindrical frame body, and the support frame 2 covers the outside of the output shaft of the servo motor 1. An output shaft of the servo motor 1 is connected with a driving shaft 5, the driving shaft 5 extends towards the direction away from the body of the servo motor 1, and one end of the swing arm part 3 is rotatably sleeved at one end of the support frame 2 away from the body of the servo motor 1 and is fixedly connected with the driving shaft 5. The servo motor 1 drives the swing arm part 3 to rotate around the support frame 2 through the driving shaft 5.

In the present embodiment, the swing arm 3 includes a first synchronizing wheel 31, a first swing arm box 32, a first timing belt 33, a first joint, a second swing arm box 34, a second joint, and a second timing belt 35.

The first synchronous wheel 31 is fixedly arranged at one end of the support frame 2, which is far away from the body of the servo motor 1, and the first synchronous wheel 31 and the driving shaft 5 are coaxially arranged, specifically, one end of the driving shaft 5, which is far away from the body of the servo motor 1, is sleeved with a bearing, the inner ring of the bearing is fixed with the driving shaft 5, and the first synchronous wheel 31 is sleeved outside the bearing and is fixed with the outer ring of the bearing; the bottom of the first synchronizing wheel 31 is fixedly connected with one end of the support frame 2, which is away from the body of the servo motor 1. When the servo motor 1 drives the driving shaft 5 to rotate, the driving shaft 5 rotates relative to the first synchronizing wheel 31.

The first swing arm box 32 has seted up first cover interface 320 towards the one end of first synchronizing wheel 31, first swing arm box 32 cup joints in the outside of first synchronizing wheel 31 and support frame 2 and driving shaft 5 and the top fixed connection of first swing arm box 32 through first cover interface 320, specifically, first swing arm box 32 inside is equipped with first installation space, first cover interface 320 is seted up in the bottom surface of the one end of first swing arm box 32 and is communicate with first installation space, first synchronizing wheel 31, driving shaft 5 and support frame 2 all are arranged in first installation space, the top of driving shaft 5 and first swing arm box 32 is through bolt fixed connection. When the servo motor 1 drives the driving shaft 5 to rotate, the driving shaft 5 drives the first swing arm box 32 to swing.

The first joint part is rotatably arranged at one end of the first swing arm box 32, which is far away from the first synchronizing wheel 31, the first synchronizing belt 33 is sleeved on the first synchronizing wheel 31 and the first joint part, one end of the second swing arm box 34 is fixedly connected with the first joint part so as to swing along with the rotation of the first swing arm box 32, the first joint part comprises a second synchronizing wheel 36, an intermediate shaft 37 and a third synchronizing wheel 38, the third synchronizing wheel 38 is fixedly arranged at one end of the first swing arm box 32, which is far away from the first synchronizing wheel 31, and is positioned outside the first swing arm box 32 through bolts, and the second synchronizing wheel 36 is positioned in the first swing arm box 32 and is coaxially arranged with the third synchronizing wheel 38; one end of the intermediate shaft 37 is fixedly connected with the second synchronizing wheel 36, the other end of the intermediate shaft 37 is rotatably connected with the third synchronizing wheel 38, and in detail, one end of the intermediate shaft 37, which is away from the second synchronizing wheel 36, is sleeved with a bearing, and the third synchronizing wheel 38 is sleeved outside the bearing; the second swing arm box 34 is provided with a second sleeve interface 341 corresponding to the third synchronizing wheel 38, the second swing arm box 34 is sleeved outside the third synchronizing wheel 38 through the second sleeve interface 341, the middle shaft 37 is fixedly connected with the top of the second swing arm box 34, in detail, a second installation space is arranged in the second swing arm box 34, the second sleeve interface 341 is arranged at the bottom of one end of the second swing arm box 34 corresponding to the third synchronizing wheel 38 and is communicated with the second installation space, and the third synchronizing wheel 38 and the second synchronous belt 35 are both positioned in the second installation space; the first synchronous belt 33 is sleeved on the first synchronous wheel 31 and the second synchronous wheel 36, and the gear ratio of the first synchronous wheel 31 to the second synchronous wheel 36 is 2:1.

the second joint member is rotatably mounted at one end of the second swing arm box 34 facing away from the first joint member; the second synchronous belt 35 is sleeved on the first joint member and the second joint member, specifically, the second joint member includes a fourth synchronous wheel 39 and a tray shaft 390, the fourth synchronous wheel 39 is located in the second installation space of the second swing arm box 34 and is located at one end away from the third synchronous wheel 38, the second synchronous belt 35 is sleeved outside the third synchronous wheel 38 and the fourth synchronous wheel 39, and the gear ratio of the third synchronous wheel 38 and the fourth synchronous wheel 39 is 1:2; one end of the tray shaft 390 is fixedly connected with the fourth synchronizing wheel 39, a tray bearing 391 coaxially arranged with the fourth synchronizing wheel 39 is arranged at the top of one end of the second swing arm box 34, which is far away from the third synchronizing wheel 38, the outer ring of the tray bearing 391 is fixed with the second swing arm box 34, and one end of the tray shaft 390, which is far away from the fourth synchronizing wheel 39, is fixedly connected with the inner ring of the tray bearing 391. The vacuum pick-up section 4 is fixedly mounted on an end of the tray shaft 390 facing away from the fourth synchronizing wheel 39. When the fourth synchronizing wheel 39 is driven to rotate by the second synchronizing belt 35, the tray shaft 390 rotates, thereby driving the vacuum pick-up section 4 to rotate.

When the servo motor 1 rotates to drive the first swing arm box 32 to rotate by an angular displacement θ relative to the support frame 2, the first synchronous belt 33 drives the second swing arm box 34 to rotate by an angular displacement-2θ relative to the first swing arm box 32, the second synchronous belt 35 drives the vacuum pick-up part 4 to rotate by an angular displacement θ relative to the second swing arm box 34, and the vacuum pick-up part 4 does not rotate by an angular displacement θ -2θ+θ=0 relative to the support frame 2, i.e. the vacuum pick-up part 4 does not rotate relative to the support frame 2, only generates linear displacement, and the displacement is equal to the product of the total length of the two swing arm boxes and sin θ, so that the rotation of the servo motor 1 is converted into linear motion of the vacuum pick-up part 4.

In the present embodiment, a first tensioner 321 is further provided in the first swing arm box 32, and the first tensioner 321 is in contact with the first timing belt 33; a second tensioner 351 is also provided in the second swing arm box 34, and the second tensioner 351 is in contact with the second timing belt 35. The first tensioner 321 and the second tensioner 351 are tensioners in the prior art, and their specific structures and installation methods are not described again. The first tensioner 321 and the second tensioner 351 are provided so as to be capable of putting the first timing belt 33 and the second timing belt 35 in a stretched state, respectively.

In the present embodiment, the vacuum pickup unit 4 includes a wafer tray 41, a position sensor 42, and a vacuum connection pipe. One end of the wafer tray 41 is mounted at the end of the swing arm member 3 facing away from the servo motor 1. Specifically, the wafer tray 41 includes a mounting plate 411, a U-shaped plate 412 and two side plates 413, one end of the mounting plate 411 is installed at one end of the swing arm member 3, which is away from the servo motor 1, in detail, one end of the mounting plate 411 is provided with a bearing slot 410, the mounting plate 411 is covered on a tray bearing 391 through the bearing slot 410, and the mounting plate 411 is fixedly connected with the tray shaft 390; one end of the U-shaped plate 412 is connected with one end of the mounting plate 411, which is away from the swing arm member 3, specifically, one end of the mounting plate 411, which is away from the tray shaft 390, is provided with a mounting step, and one end of the U-shaped plate 412 is adapted to the mounting step and is fixedly connected with the mounting step through a bolt. Two suction ends 4121 extend from opposite sides of one end of the U-shaped plate 412 facing away from the mounting plate 411. When the wafer 400 is sucked, only the two suction ends 4121 and the groove portion of the U-shaped plate 412 contact the wafer 400, so that the contact surface between the wafer tray 41 and the wafer 400 can be reduced, and the probability of wearing the wafer 400 can be reduced.

The wafer tray 41 is provided with a vacuum channel, specifically, the vacuum channel extends from the mounting plate 411 to two adsorption ends 4121, and a vacuum connection pipe is communicated with the vacuum channel and is used for connecting a negative pressure providing device.

The position sensor 42 is installed on the wafer tray 41, specifically, two side plates 413 are installed on two opposite sides of one end of the mounting plate 411, which is away from the U-shaped plate 412, a position sensor 42 is installed on one side plate 413, the detailed side plate 413 is inclined relative to the mounting plate 411, the position sensor 42 is installed on the side plate 413, the brand of the position sensor 42 is ohm, the model number is EE-SX674, and the installation mode is well known to those skilled in the art and will not be repeated herein. The sensing ranges of the two position sensors 42 intersect so that a specific position of the wafer 400 can be accurately sensed.

In this embodiment, the vacuum channel includes a pressure collecting groove 415 and two suction channels 416. The pressure collecting groove 415 is arranged in the mounting plate 411, two adsorption channels 416 are arranged in the U-shaped plate 412, and one adsorption channel 416 corresponds to one adsorption end 4121; the vacuum connection tube communicates with the pressure accumulation groove 415. When negative pressure is supplied to the vacuum pick-up section 4, the negative pressure is first concentrated in the pressure concentrating grooves 415 and then simultaneously adsorbed to the wafer 400 through the two adsorption passages 416. In the prior art, when the vacuum connection pipe at the suction end 4121 is loosened, the negative pressure of one suction end 4121 leaks, and the negative pressure leakage in the mode is difficult to detect, so that the wafer 400 is at a falling risk in the carrying process, when the vacuum connection pipe is connected in the mode of the pressure collecting groove 415, only one connection part is connected with the vacuum connection pipe, when the vacuum connection pipe is loosened, the negative pressures of the two suction ends 4121 are weakened simultaneously, the wafer 400 cannot be directly sucked, and an operator can timely find and overhaul the wafer.

In this embodiment, the wire arranging blocks 6 are disposed in the first swing arm box 32 and the second swing arm box 34, specifically, the wire arranging blocks 6 of the first swing arm box 32 are installed in the first installation space, the wire arranging blocks 6 of the second swing arm box 34 are installed in the second installation space, and through holes are formed in the wire arranging blocks 6 for the wires of the position sensor 42 to pass through. The arrangement of the wire arranging block 6 can arrange the circuits passing through the first swing arm box 32 and the second swing arm box 34, and effectively avoid the circuits from influencing the expansion and contraction of the swing arm piece 3.

As shown in fig. 1 to 5, the present embodiment also provides a wafer handling robot for handling the wafer 400 with a large displacement. The wafer handling robot includes a lifting assembly 200, a rotating assembly 300, and the wafer picking assembly 100. The rotating assembly 300 is mounted on the lifting assembly 200, and the servo motor 1 is mounted on the rotating assembly 300. The lifting assembly 200 is used for driving the whole wafer taking assembly 100 to vertically lift or descend, the rotating assembly 300 is used for driving the whole wafer taking assembly 100 to horizontally rotate, and the structures of the lifting assembly 200 and the rotating assembly 300 are all common technical means in the art, for example, a lifting shaft and a rotating shaft disclosed in a chinese patent application of the utility model, a wafer handling manipulator, with a common number CN108356804a, a Z1 lifting device and a rotating device disclosed in a chinese patent, a double Z-axis wafer handling robot, with a common number CN218385173U, and the like, so that the description thereof is omitted.

It will be appreciated that the servo motor 1 and the position sensor 42 are not limited to the brands and models provided in the present embodiment, and in other embodiments, the manufacturer may select other brands and models according to actual production needs.

The foregoing description is directed to the preferred embodiments of the present utility model, but the embodiments are not intended to limit the scope of the utility model, and all equivalent changes or modifications made under the technical spirit of the present utility model should be construed to fall within the scope of the present utility model.

Claims (10)

1. The wafer component of taking, its characterized in that: the device comprises a servo motor (1), a support frame (2), a swing arm part (3) and a vacuum taking part (4), wherein the support frame (2) is covered outside the servo motor (1), one end of the swing arm part (3) is rotatably sleeved at one end of the support frame (2) and the swing arm part (3) is connected with the servo motor (1), and the servo motor (1) can drive the swing arm part (3) to rotate around the support frame (2) so as to enable the swing arm part (3) to extend or retract; the vacuum taking part (4) is arranged at one end, deviating from the servo motor (1), of the swing arm piece (3), and the vacuum taking part (4) can take the wafer (400).

2. The wafer handling assembly of claim 1, wherein: the bottom of support frame (2) with the body of servo motor (1) is fixed, support frame (2) cover in the outside of the output shaft of servo motor (1), the output shaft of servo motor (1) is one driving shaft (5), driving shaft (5) are kept away from the body direction of servo motor (1) extends, swing arm one end of piece (3) rotate cup joint in support frame (2) deviate from the one end of the body of servo motor (1) and with driving shaft (5) fixed connection.

3. A wafer handling assembly according to claim 2, wherein: the swing arm part (3) comprises a first synchronous wheel (31), a first swing arm box (32), a first synchronous belt (33), a first joint part, a second swing arm box (34), a second joint part and a second synchronous belt (35), wherein the first synchronous wheel (31) is fixedly arranged at one end of the support frame (2) deviating from the body of the servo motor (1), and the first synchronous wheel (31) and the driving shaft (5) are coaxially arranged; a first sleeve interface (320) is formed at one end, facing the first synchronous wheel (31), of the first swing arm box (32), the first swing arm box (32) is sleeved outside the first synchronous wheel (31) and the support frame (2) through the first sleeve interface (320), and the driving shaft (5) is fixedly connected with the top of the first swing arm box (32); the first joint piece is rotatably arranged at one end of the first swing arm box (32) which is away from the first synchronous wheel (31), and the first synchronous belt (33) is sleeved on the first synchronous wheel (31) and the first joint piece; one end of the second swing arm box (34) is fixedly connected with the first joint piece so as to swing along with the rotation of the first swing arm box (32); the second joint piece is rotatably arranged at one end of the second swing arm box (34) which is away from the first joint piece; the second synchronous belt (35) is sleeved on the first joint piece and the second joint piece; the vacuum pick-up part (4) is arranged on the second joint piece.

4. A wafer handling assembly according to claim 3, wherein: the first joint part comprises a second synchronizing wheel (36), an intermediate shaft (37) and a third synchronizing wheel (38), the third synchronizing wheel (38) is fixedly arranged at one end of the first swing arm box (32) deviating from the first synchronizing wheel (31) and is positioned outside the first swing arm box (32), and the second synchronizing wheel (36) is positioned in the first swing arm box (32) and is coaxially arranged with the third synchronizing wheel (38); one end of the intermediate shaft (37) is fixedly connected with the second synchronizing wheel (36), and the other end of the intermediate shaft (37) is rotationally connected with the third synchronizing wheel (38); the second swing arm box (34) is provided with a second sleeve interface (341) corresponding to the third synchronous wheel (38), the second swing arm box (34) is sleeved outside the third synchronous wheel (38) through the second sleeve interface (341), and the intermediate shaft (37) is fixedly connected with the top of the second swing arm box (34); the first synchronous belt (33) is sleeved on the first synchronous wheel (31) and the second synchronous wheel (36) and the gear ratio of the first synchronous wheel (31) to the second synchronous wheel (36) is 2:1, a step of; the second synchronous belt (35) is sleeved on the third synchronous wheel (38) and the second joint piece.

5. The wafer handling assembly of claim 4, wherein: the second joint part comprises a fourth synchronizing wheel (39) and a tray shaft (390), the fourth synchronizing wheel (39) is positioned in the second swing arm box (34) and is positioned at one end deviating from the third synchronizing wheel (38), the second synchronizing belt (35) is sleeved outside the third synchronizing wheel (38) and the fourth synchronizing wheel (39), and the tooth ratio of the third synchronizing wheel (38) and the fourth synchronizing wheel (39) is 1:2; one end of the tray shaft (390) is fixedly connected with the fourth synchronous wheel (39); the vacuum taking part (4) is fixedly arranged at one end of the tray shaft (390) which is far away from the fourth synchronous wheel (39).

6. The wafer handling assembly of claim 4, wherein: wire arranging blocks (6) are arranged in the first swing arm box (32) and the second swing arm box (34).

7. The wafer handling assembly of claim 1, wherein: the vacuum taking part (4) comprises a wafer tray (41), a position sensor (42) and a vacuum connecting pipe, one end of the wafer tray (41) is arranged at one end of the swing arm part (3) deviating from the servo motor (1), and a vacuum channel is formed in the wafer tray (41); the position sensor (42) is arranged on the wafer tray (41), and the vacuum connecting pipe is communicated with the vacuum channel.

8. The wafer handling assembly of claim 7, wherein: the wafer tray (41) comprises a mounting plate (411), a U-shaped plate (412) and two side plates (413), wherein one end of the mounting plate (411) is arranged at one end of the swing arm piece (3) deviating from the servo motor (1), one end of the U-shaped plate (412) is connected with one end of the mounting plate (411) deviating from the swing arm piece (3), two adsorption ends (4121) extend from two opposite sides of one end of the U-shaped plate (412) deviating from the mounting plate (411), the two side plates (413) are arranged at two opposite sides of one end of the mounting plate (411) deviating from the U-shaped plate (412), and one position sensor (42) is arranged on one side plate (413); the vacuum channels extend from the mounting plate (411) to two of the suction ends (4121).

9. The wafer handling assembly of claim 8, wherein: the vacuum channel comprises a pressure collecting groove (415) and two adsorption channels (416), the pressure collecting groove (415) is arranged in the mounting plate (411), the two adsorption channels (416) are arranged in the U-shaped plate (412) and one adsorption channel (416) corresponds to one adsorption end (4121); the vacuum connecting pipe is communicated with the pressure gathering groove (415).

10. Wafer transport manipulator, its characterized in that: the wafer taking device comprises a lifting assembly (200), a rotating assembly (300) and the wafer taking assembly (100) according to claim 1, wherein the rotating assembly (300) is arranged on the lifting assembly (200), and the servo motor (1) is arranged on the rotating assembly (300).