CN117238793A - 压接装置以及压接方法 - Google Patents
压接装置以及压接方法 Download PDFInfo
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- CN117238793A CN117238793A CN202310465183.3A CN202310465183A CN117238793A CN 117238793 A CN117238793 A CN 117238793A CN 202310465183 A CN202310465183 A CN 202310465183A CN 117238793 A CN117238793 A CN 117238793A
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- 238000002788 crimping Methods 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 131
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000009826 distribution Methods 0.000 claims description 45
- 230000001419 dependent effect Effects 0.000 claims description 20
- 238000003860 storage Methods 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 16
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 10
- 238000001179 sorption measurement Methods 0.000 description 8
- 230000001276 controlling effect Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 239000000470 constituent Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000000875 corresponding effect Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022095653A JP2023182184A (ja) | 2022-06-14 | 2022-06-14 | 圧着装置、および、圧着方法 |
| JP2022-095653 | 2022-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117238793A true CN117238793A (zh) | 2023-12-15 |
Family
ID=89095479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310465183.3A Pending CN117238793A (zh) | 2022-06-14 | 2023-04-26 | 压接装置以及压接方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2023182184A (ja) |
| CN (1) | CN117238793A (ja) |
-
2022
- 2022-06-14 JP JP2022095653A patent/JP2023182184A/ja active Pending
-
2023
- 2023-04-26 CN CN202310465183.3A patent/CN117238793A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023182184A (ja) | 2023-12-26 |
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| PB01 | Publication | ||
| PB01 | Publication |