CN117219519A - Wafer level packaging bump manufacturing equipment - Google Patents
Wafer level packaging bump manufacturing equipment Download PDFInfo
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- CN117219519A CN117219519A CN202311467239.5A CN202311467239A CN117219519A CN 117219519 A CN117219519 A CN 117219519A CN 202311467239 A CN202311467239 A CN 202311467239A CN 117219519 A CN117219519 A CN 117219519A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 104
- 238000000576 coating method Methods 0.000 claims abstract description 104
- 230000007246 mechanism Effects 0.000 claims abstract description 45
- 230000004907 flux Effects 0.000 claims abstract description 40
- 238000007790 scraping Methods 0.000 claims abstract description 32
- 238000012545 processing Methods 0.000 claims abstract description 31
- 238000005476 soldering Methods 0.000 claims abstract description 23
- 239000004744 fabric Substances 0.000 claims abstract description 10
- 230000001360 synchronised effect Effects 0.000 claims description 22
- 238000002513 implantation Methods 0.000 claims description 17
- 238000010345 tape casting Methods 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 11
- 239000010959 steel Substances 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 description 63
- 230000001681 protective effect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000009966 trimming Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The invention discloses wafer-level packaging salient point manufacturing equipment, which comprises a processing platform and a wafer platform; the processing platform is provided with a first linear module, and the driving end of the first linear module is connected with a coating mechanism for coating soldering flux; the cloth coating mechanism comprises a first scraping coating component, a second scraping coating component, a first driving component and a second driving component which are sequentially arranged along a first direction; the lower end face of the coating mechanism is provided with an infrared thermal sensor, the infrared thermal sensor is used for detecting the temperature information of the soldering flux on the surface of the wafer, and the thickness information of the soldering flux is identified according to the temperature information so as to adjust the space height of the second doctor blade assembly, so that the second doctor blade assembly acts on the surface of the wafer under the preset doctor blade pressure; the bump manufacturing equipment can more accurately control the coating thickness of the soldering flux on the surface of the wafer through the matching of the first blade coating assembly and the second blade coating assembly, ensure that the coating of the soldering flux is more uniform and accurate, and improve the processing quality of the wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to wafer-level packaging salient point manufacturing equipment.
Background
With the rapid development of chip technology, high-density and multifunctional semiconductor packaging technology has become a hot spot in current research; BUMP bumping of wafers is one of the key processes in semiconductor packaging, particularly in contemporary flip-chip technology. The BUMP is required to meet good electrical performance, mechanical stability and reliability as an interface for connection with another package or substrate.
In the traditional BUMP BUMP manufacturing process, after the wafer is preprocessed, FLUX scaling powder is uniformly coated on the wafer through a steel mesh scraper, and then implantation of the BUMP BUMPs is completed; wherein, the FLUX cloth Tu Tongchang uniformly coats the FLUX to the specific position of the wafer by the pressure and movement of the scraper; however, there are some inherent limitations and drawbacks to this single blade coating approach, which may result in uneven flux thickness of the coating, and for uneven coating, the single blade cannot be effectively adjusted or corrected in real time, thereby affecting the quality of subsequent bump fabrication.
In order to solve the above problems, the wafer processing technology in the prior art needs to be improved to solve the technical problem of uneven flux coating.
Disclosure of Invention
The invention aims to provide wafer-level packaging bump manufacturing equipment which solves the technical problems.
To achieve the purpose, the invention adopts the following technical scheme:
the wafer level packaging bump manufacturing equipment comprises a processing platform and a wafer platform arranged below the processing platform;
the processing platform is provided with a first linear module, and the driving end of the first linear module is connected with a coating mechanism for coating soldering flux; setting the driving direction of the first linear module as a first direction;
the cloth coating mechanism comprises a first scraping component and a second scraping component which are sequentially arranged along a first direction, the first scraping component is provided with a first driving component for driving the first scraping component to move along a straight line direction in the vertical direction, and the second scraping component is provided with a second driving component for driving the second scraping component to move along the straight line direction in the vertical direction;
the lower end face of the coating mechanism is provided with an infrared thermal sensor which is used for detecting soldering flux temperature information on the surface of the wafer.
Optionally, a group of first guide rails are respectively arranged at two sides of the processing platform;
the cloth coating mechanism further comprises a support beam, and two sides of the support beam are respectively connected to the first guide rail in a sliding manner;
the first linear module comprises a first motor arranged on the processing platform, a driving end of the first motor is connected with a first synchronous belt, and a driving end of the first synchronous belt is connected with the supporting beam and used for driving the supporting beam to move along the first direction.
Optionally, the supporting beam comprises a main body part and supporting arms respectively arranged at two side parts of the main body part;
the first driving assembly comprises a second motor arranged on the lower end face of the main body part, an output shaft of the second motor penetrates through the main body part and is connected with a second synchronous belt, one end of the second synchronous belt is connected with a first screw rod arranged along the vertical direction, a nut piece is connected to the first screw rod in a threaded manner, and the nut piece is connected with the first knife coating assembly;
the lower end face of the main body part is provided with a plurality of support columns, the lower end parts of the support columns are provided with first mounting plates, and the infrared thermal sensors are arranged on the lower end face of the first mounting plates;
an installation space is formed between two adjacent support columns, and the second motor is accommodated in the installation space.
Optionally, a hinge piece is arranged on one side wall of the supporting beam, the hinge piece is connected with a protective cover, and the hinge piece is opened or closed to drive the protective cover to rotate;
the protection cavity is formed in the protection cover, and the first synchronous belt is accommodated in the protection cavity.
Optionally, the first blade coating assembly includes a second mounting plate, and the second mounting plate is connected with the nut member;
a third mounting plate is arranged at the upper end of the second mounting plate, and a locking bolt is connected to the third mounting plate in a threaded manner;
the second mounting plates are provided with first scraping plates at intervals in parallel, and the upper ends of the first scraping plates are provided with fourth mounting plates;
the upper end of the fourth mounting plate is provided with a fifth mounting plate, the fifth mounting plate is provided with an adjusting hole, and the locking bolt is connected in the adjusting hole in a sliding way;
an adjusting bolt is rotationally connected to the fourth mounting plate, and one end of the adjusting bolt is connected to the second mounting plate through threads; the adjusting bolt is screwed to push the first blade to move relative to the second blade assembly.
Optionally, two sides of the fourth mounting plate are respectively provided with a connecting support part, and the connecting support parts are provided with notch grooves along the vertical direction;
a clamping groove is formed in the lower end face of the fourth mounting plate, a protruding portion is arranged on the upper end face of the first knife coating plate, and the protruding portion is clamped in the clamping groove;
and a fine tuning bolt is arranged in the notch groove, one end of the fine tuning bolt is abutted against the connecting support part, and the other end of the fine tuning bolt is in threaded connection with the first knife coating plate.
Optionally, the second blade coating assembly comprises a second blade coating plate, the first blade coating plate is provided with a first inclined plate, the second blade coating plate is provided with a second inclined plate, and the second inclined plate is arranged opposite to the first inclined plate;
the first knife coating plate comprises a knife coating plate body, a first inclined surface part is arranged at the lower end part of the knife coating plate body, the first inclined plate is attached to the first inclined surface part, and a connecting plate for fixing the first inclined plate is arranged on the first inclined plate.
Optionally, the processing platform is further provided with a camera mechanism;
the camera shooting mechanism comprises a second linear module arranged along the first direction, the driving end of the second linear module is connected with a mounting assembly, and a third linear module is arranged on the mounting assembly along the second direction; wherein the second direction is perpendicular to the first direction;
the driving end of the third linear module is provided with a camera component, and the camera component is used for shooting the position information of the wafer on the wafer platform.
Optionally, the wafer-level packaging bump manufacturing equipment further comprises a conveying module, and a coating mechanism and a bump implantation mechanism are sequentially arranged above the conveying module;
the driving end of the conveying module is connected with the wafer platform, and the conveying module is used for driving the wafer platform to move.
Optionally, the bump implantation mechanism comprises a steel mesh component, and an implantation component is arranged above the steel mesh component.
Compared with the prior art, the invention has the following beneficial effects: when the device works, the wafer platform is driven to move to the lower part of the processing platform, the first linear module drives the coating mechanism to move along the first direction, the first coating assembly firstly carries out first coating work of soldering flux through the wafer, meanwhile, the infrared thermal sensor detects temperature information of the soldering flux on the surface of the wafer, thickness information of the soldering flux is identified according to the temperature information, the operation of the second driving assembly is controlled according to the thickness information of the soldering flux so as to adjust the space height of the second coating assembly, the second coating assembly acts on the surface of the wafer under the preset coating pressure, and the second coating work is carried out, so that the compensation effect on the first coating work is achieved; the bump manufacturing equipment can more accurately control the coating thickness of the soldering flux on the surface of the wafer through the matching of the first scraping and coating assembly and the second scraping and coating assembly; the setting of infrared thermal sensor further provides the real-time supervision to scaling powder temperature and thickness to make equipment can adjust the position of second knife coating subassembly in real time according to actual conditions, ensure that the cloth of scaling powder scribbles more evenly and accurately, improve the processingquality of wafer.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and are not intended to limit the scope of the invention, since any modification, variation in proportions, or adjustment of the size, etc. of the structures, proportions, etc. should be considered as falling within the spirit and scope of the invention, without affecting the effect or achievement of the objective.
Fig. 1 is a schematic diagram of the overall structure of a wafer level package bump manufacturing apparatus according to the present embodiment;
fig. 2 is a schematic structural diagram of a coating mechanism and a processing platform of the wafer level packaging bump manufacturing apparatus according to the present embodiment;
FIG. 3 is a second schematic diagram of the coating mechanism and the processing platform of the wafer level packaging bump manufacturing apparatus according to the present embodiment;
fig. 4 is a schematic diagram of the overall structure of a coating mechanism of the wafer level packaging bump manufacturing apparatus according to the present embodiment;
fig. 5 is a schematic front view of the coating mechanism of the wafer level packaging bump manufacturing apparatus according to the present embodiment;
fig. 6 is a schematic structural diagram of a first blade coating component of the wafer level package bump manufacturing apparatus according to the present embodiment;
fig. 7 is a schematic structural diagram of a first blade of the wafer level packaging bump manufacturing apparatus according to the present embodiment;
fig. 8 is a schematic structural view of a first blade and a second blade of the wafer level package bump manufacturing apparatus according to the present embodiment;
fig. 9 is a second schematic structural view of the first blade and the second blade of the wafer level package bump manufacturing apparatus according to the present embodiment.
Illustration of: 100. a processing platform; 110. a first linear module; 120. a first guide rail; 111. a first motor; 112. a first synchronization belt;
200. a wafer stage;
300. a cloth coating mechanism;
310. a first blade coating assembly; 311. a second mounting plate; 312. a third mounting plate; 313. a locking bolt; 314. a fourth mounting plate; 315. a fifth mounting plate; 316. an adjustment aperture; 317. an adjusting bolt; 3141. a connecting support; 3142. a notch groove; 3143. a clamping groove;
320. a second blade coating assembly;
330. a first drive assembly; 331. a second motor; 332. a second timing belt; 333. a first screw rod; 334. a nut member;
340. a second drive assembly;
350. an infrared thermal sensor;
360. a support beam; 361. a main body portion; 362. a support arm; 363. a support column; 364. a first mounting plate; 365. a protective cover; 366. a hinge member;
370. a first blade; 371. a boss; 372. a first swash plate; 373. a blade-coating plate body; 374. a first inclined surface portion; 375. a connecting plate;
380. fine tuning the bolt; 390. a second blade; 391. a second swash plate;
400. an image pickup mechanism; 410. a second linear module; 420. a mounting assembly; 430. a third linear module; 440. a camera assembly;
500. a conveying module;
600. a bump implantation mechanism; 610. a steel mesh assembly; 620. an implant assembly.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. It is noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
The embodiment of the invention provides wafer-level packaging bump manufacturing equipment, which comprises a processing platform 100 and a wafer platform 200 arranged below the processing platform 100; the processing platform 100 is provided with a first linear module 110, and the driving end of the first linear module 110 is connected with a coating mechanism 300 for coating soldering flux; the driving direction of the first linear module 110 is set as the first direction. The soldering FLUX adopted in the scheme is FLUX soldering FLUX.
The cloth coating mechanism 300 comprises a first scraping and coating assembly 310 and a second scraping and coating assembly 320 which are sequentially arranged along a first direction, wherein the first scraping and coating assembly 310 is provided with a first driving assembly 330 for driving the first scraping and coating assembly 310 to move along a straight line direction in the vertical direction, and the second scraping and coating assembly 320 is provided with a second driving assembly 340 for driving the second scraping and coating assembly 320 to move along the straight line direction in the vertical direction; the lower end surface of the dispensing mechanism 300 is provided with an infrared thermal sensor 350, and the infrared thermal sensor 350 is used for detecting flux temperature information on the wafer surface.
It should be noted that, the infrared thermal sensor 350 can detect the temperature information of the flux on the surface of the wafer in real time, so as to identify the thickness information of the flux. This allows the apparatus to adjust the position of the second blade coating assembly 320 in real time during processing, ensuring that it remains operating at a preset blade coating pressure. This real-time feedback and adjustment mechanism provides greater flexibility for the device to cope with a variety of actual operating condition changes.
Further illustratively, in this embodiment, the infrared thermal sensor 350 monitors the flux temperature information on the wafer surface in real time during the flux dispensing process. If the flux is applied thicker, the temperature detected by the infrared thermal sensor 350 will be relatively lower due to the longer time it takes for heat to transfer; conversely, if the flux coating is thinner, the temperature detected by the infrared thermal sensor 350 will be relatively higher. Thus, the thickness information of the flux can be deduced by detecting the temperature information. This derivation process needs to be implemented by means of a certain algorithm model to increase the accuracy of the operation.
The working principle of the invention is as follows: when the device works, the wafer platform 200 is driven to move below the processing platform 100, the first linear module 110 drives the coating mechanism 300 to move along the first direction, the first blade coating assembly 310 firstly carries out first coating work of soldering flux through a wafer, meanwhile, the infrared thermal sensor 350 detects soldering flux temperature information on the surface of the wafer, thickness information of the soldering flux is identified according to the temperature information, the operation of the second driving assembly 340 is controlled according to the thickness information of the soldering flux so as to adjust the space height of the second blade coating assembly 320, the second blade coating assembly 320 acts on the surface of the wafer in a preset blade coating pressure to carry out second coating work, and the compensation effect on the first coating work is achieved; compared with the wafer processing technology in the prior art, the bump manufacturing equipment can more accurately control the coating thickness of the soldering flux on the surface of the wafer through the matching of the first scraping and coating component 310 and the second scraping and coating component 320; the arrangement of the infrared thermal sensor 350 further provides real-time monitoring of the temperature and thickness of the flux, so that the device can adjust the position of the second blade coating assembly 320 in real time according to actual conditions, ensure more uniform and accurate coating of the flux, and improve the processing quality of the wafer.
In the present embodiment, two sides of the processing platform 100 are respectively provided with a set of first guide rails 120; the coating mechanism 300 further comprises a supporting beam 360, and two sides of the supporting beam 360 are respectively and slidably connected to the first guide rail 120; the two groups of first guide rail 120 components jointly support the movement of the coating mechanism 300, so that the stability of the movement is improved; to ensure smoother movement of the dispensing mechanism 300 in the first direction and to reduce blade coating irregularities due to equipment vibration.
The first linear module 110 includes a first motor 111 disposed on the processing platform 100, a driving end of the first motor 111 is connected with a first synchronous belt 112, and a driving end of the first synchronous belt 112 is connected with a supporting beam 360 for driving the supporting beam 360 to move along a first direction. The first motor 111 operates to drive the first synchronous belt 112 to rotate, so as to drive the supporting beam 360 to move along the first direction, so as to drive the whole coating mechanism 300 to move along the first direction, and perform the coating operation of the soldering flux.
Further, the support beam 360 includes a main body 361, and support arms 362 provided on both sides of the main body 361; the first driving assembly 330 includes a second motor 331 disposed on a lower end surface of the main body 361, an output shaft of the second motor 331 penetrates through the main body 361 and is connected with a second synchronous belt 332, one end of the second synchronous belt 332 is connected with a first screw 333 disposed along a vertical direction, a nut member 334 is screwed on the first screw 333, and the nut member 334 is connected with the first blade coating assembly 310. During operation, the second motor 331 operates to drive the second synchronous belt 332 to rotate, and the second synchronous belt 332 drives the first screw rod 333 to rotate, so as to drive the first blade coating assembly 310 positioned on the nut member 334 to move along the vertical direction, thereby playing a role in adjusting the space height of the first blade coating assembly 310, and further playing a role in adjusting the blade coating force of the first blade coating assembly 310.
Similarly, the second driving assembly 340 in this embodiment includes a third motor, a third synchronous belt and a second screw rod, where the second screw rod is provided with a nut member 334; the operation principle is the same as that of the first driving assembly 330; and the second synchronous belt 332 and the third synchronous belt are respectively staggered on the upper end face of the first mounting plate 364, which saves the mounting space and improves the space utilization.
The lower end face of the main body 361 is provided with a plurality of support columns 363, the lower end part of the support columns 363 is provided with a first mounting plate 364, and the infrared thermal sensor 350 is arranged on the lower end face of the first mounting plate 364; an installation space is formed between two adjacent support columns 363, and the second motor 331 is accommodated in the installation space; the installation space can play the effect of protection second motor 331 on the one hand, and on the other hand can reduce the whole height of cloth coating mechanism 300, improves space utilization.
Further, a hinge member 366 is disposed on a side wall of the supporting beam 360, the hinge member 366 is connected to the protective cover 365, and the hinge member 366 is opened or closed to drive the protective cover 365 to rotate; the protective cover 365 defines a protective cavity in which the first timing belt 112 is received. The protective cover 365 is connected through the hinge assembly, and the protective cover 365 can play a role in protecting the first driving assembly 330 and the second driving assembly 340, so that external impurities are prevented from entering the synchronous belt to influence the operation of the synchronous belt; in addition, a magnetic assembly may be provided on the other side of the protective cover 365 for detachable connection with the support beam 360.
Specifically, the first blade coating assembly 310 includes a second mounting plate 311, the second mounting plate 311 being coupled to the nut member 334; the upper end of the second mounting plate 311 is provided with a third mounting plate 312, and the third mounting plate 312 is connected with a locking bolt 313 in a threaded manner; the second mounting plates 311 are provided with first scraping plates 370 at intervals and in parallel, and the upper ends of the first scraping plates 370 are provided with fourth mounting plates 314; referring to fig. 4, the second mounting plate 311 in this embodiment is used as a connecting medium between the first driving assembly 330 and the first doctor blade assembly 310, and the first doctor blade 370 and the fourth mounting plate 314 are arranged in parallel, so that the distance between the two groups of doctor blade assemblies can be adjusted by adjusting the position of the first doctor blade 370, so as to adapt to different doctor blade requirements.
The upper end of the fourth mounting plate 314 is provided with a fifth mounting plate 315, the fifth mounting plate 315 is provided with an adjusting hole 316, and the locking bolt 313 is slidably connected in the adjusting hole 316; in operation, after adjusting the position of the first blade 370, the position of the first blade 370 is fixed by tightening the locking bolt 313, and the adjustment hole 316 also serves as a guide for the movement of the first blade 370.
An adjusting bolt 317 is rotatably connected to the fourth mounting plate 314, and one end of the adjusting bolt 317 is screwed to the second mounting plate 311; the adjusting bolt 317 is screwed to push the first blade 370 to move relative to the second blade assembly 320, thereby adjusting the distance between the first blade assembly 310 and the second blade assembly 320 to adapt to different blade requirements; particularly when a more spaced blade coating operation is desired, the first blade coating plate 370 may be adjusted to move away from the second blade coating assembly 320.
Specifically, the two sides of the fourth mounting plate 314 are respectively provided with a connection branch 3141, and the connection branch 3141 is provided with a notch 3142 along the vertical direction; the lower end surface of the fourth mounting plate 314 is provided with a clamping groove 3143, the upper end surface of the first blade coating plate 370 is provided with a protruding part 371, and the protruding part 371 is clamped in the clamping groove 3143; the protrusion 371 and the clamping groove 3143 cooperate to guide and limit the first blade coating plate 370, so that position errors during installation are reduced, and the installation accuracy of the first blade coating plate 370 is improved.
A trimming bolt 380 is arranged in the notch 3142, one end of the trimming bolt 380 is abutted against the connecting branch 3141, and the other end is in threaded connection with the first scraping plate 370; as shown in connection with fig. 4 and 5, the present solution may be to fine tune the position of the first blade 370 by screwing the fine tuning bolt 380; for example, if a side portion of the first blade 370 is located higher, the trimming bolts 380 on the corresponding side portion may be screwed to drive the trimming bolts to move upwards a small distance, so as to maintain the horizontal mounting accuracy of the first blade 370, which is beneficial to ensuring the accuracy of processing the wafer and avoiding damaging the wafer.
Further, the second blade assembly 320 includes a second blade 390, the first blade 370 is provided with a first inclined plate 372, the second blade 390 is provided with a second inclined plate 391, and the second inclined plate 391 is disposed opposite to the first inclined plate 372; that is, the first blade coating assembly 310 and the second blade coating assembly 320 respectively carry out the blade coating operation of the scaling powder on the wafer from different directions, which is beneficial to playing a complementary role and improving the uniformity of blade coating.
The first blade 370 includes a blade body 373, a first inclined surface portion 374 is provided at a lower end portion of the blade body 373, the first inclined surface portion 374 is provided by attaching the first inclined surface 372 to the first inclined surface portion 374, and a connection plate 375 for fixing the first inclined surface 372 is provided on the first inclined surface 372.
In the present embodiment, the processing platform 100 is further provided with an image pickup mechanism 400; the camera shooting mechanism 400 comprises a second linear module 410 arranged along the first direction, a driving end of the second linear module 410 is connected with a mounting assembly 420, and a third linear module 430 is arranged on the mounting assembly 420 along the second direction; wherein the second direction is perpendicular to the first direction; the driving end of the third linear module 430 is provided with a camera assembly 440, and the camera assembly 440 is used for shooting the position information of the wafer on the wafer platform 200.
Referring to fig. 1 and 7, the camera assembly 440 in this embodiment can change the plane position of the camera assembly 440 through the actions of the second linear module 410 and the third linear module 430, and the camera assembly 440 is used for photographing the position information of the wafer on the wafer platform 200, so as to facilitate the alignment of the steel mesh and the wafer, and facilitate the flux coating work.
In this embodiment, the wafer level packaging bump manufacturing apparatus further includes a conveying module 500, and a coating mechanism 300 and a bump implanting mechanism 600 are sequentially disposed above the conveying module 500; the driving end of the conveying module 500 is connected with the wafer platform 200, the conveying module 500 is used for driving the wafer platform 200 to move, the wafer loading, the scaling powder scraping and the bump implantation work processes are sequentially carried out, and after the bump implantation is completed, the conveying module 500 drives the wafer platform 200 to return to an initial station for wafer unloading work.
Further illustratively, the bump implantation mechanism 600 includes a steel mesh assembly 610 with an implantation assembly 620 disposed above the steel mesh assembly 610. Wherein, BUMP implantation in this scheme is BUMP BUMP implantation; buMP BUMP implantation alignment camera shoots the relative positions of the wafer and the steel mesh, the wafer platform 200 corrects, alignment of the wafer and the BuMP BUMP implantation steel mesh is completed, and BuMP BUMP implantation mechanism 600 completes BuMP BUMP implantation on the wafer. The transfer module 500 returns the wafer stage 200 to the start point and the BUMP fabrication is completed.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The wafer level packaging bump manufacturing equipment is characterized by comprising a processing platform and a wafer platform arranged below the processing platform;
the processing platform is provided with a first linear module, and the driving end of the first linear module is connected with a coating mechanism for coating soldering flux; setting the driving direction of the first linear module as a first direction;
the cloth coating mechanism comprises a first scraping component and a second scraping component which are sequentially arranged along a first direction, the first scraping component is provided with a first driving component for driving the first scraping component to move along a straight line direction in the vertical direction, and the second scraping component is provided with a second driving component for driving the second scraping component to move along the straight line direction in the vertical direction;
the lower end face of the coating mechanism is provided with an infrared thermal sensor which is used for detecting soldering flux temperature information on the surface of the wafer.
2. The wafer level package bump manufacturing apparatus according to claim 1, wherein a set of first guide rails are respectively provided on both sides of the processing platform;
the cloth coating mechanism further comprises a support beam, and two sides of the support beam are respectively connected to the first guide rail in a sliding manner;
the first linear module comprises a first motor arranged on the processing platform, a driving end of the first motor is connected with a first synchronous belt, and a driving end of the first synchronous belt is connected with the supporting beam and used for driving the supporting beam to move along the first direction.
3. The wafer level package bump manufacturing apparatus according to claim 2, wherein the support beam comprises a main body portion, and support arms respectively provided at both side portions of the main body portion;
the first driving assembly comprises a second motor arranged on the lower end face of the main body part, an output shaft of the second motor penetrates through the main body part and is connected with a second synchronous belt, one end of the second synchronous belt is connected with a first screw rod arranged along the vertical direction, a nut piece is connected to the first screw rod in a threaded manner, and the nut piece is connected with the first knife coating assembly;
the lower end face of the main body part is provided with a plurality of support columns, the lower end parts of the support columns are provided with first mounting plates, and the infrared thermal sensors are arranged on the lower end face of the first mounting plates;
an installation space is formed between two adjacent support columns, and the second motor is accommodated in the installation space.
4. The wafer level package bump manufacturing apparatus according to claim 3, wherein a hinge member is provided on a side wall of the support beam, the hinge member is connected to a protection cover, and the hinge member is opened or closed to drive the protection cover to rotate;
the protection cavity is formed in the protection cover, and the first synchronous belt is accommodated in the protection cavity.
5. The wafer level package bumping apparatus of claim 4, wherein said first blade assembly comprises a second mounting plate, said second mounting plate being coupled to said nut member;
a third mounting plate is arranged at the upper end of the second mounting plate, and a locking bolt is connected to the third mounting plate in a threaded manner;
the second mounting plates are provided with first scraping plates at intervals in parallel, and the upper ends of the first scraping plates are provided with fourth mounting plates;
the upper end of the fourth mounting plate is provided with a fifth mounting plate, the fifth mounting plate is provided with an adjusting hole, and the locking bolt is connected in the adjusting hole in a sliding way;
an adjusting bolt is rotationally connected to the fourth mounting plate, and one end of the adjusting bolt is connected to the second mounting plate through threads; the adjusting bolt is screwed to push the first blade to move relative to the second blade assembly.
6. The wafer level package bump manufacturing apparatus according to claim 5, wherein the fourth mounting board is provided with connection branches at both sides thereof, respectively, and the connection branches are provided with notch grooves along a vertical direction;
a clamping groove is formed in the lower end face of the fourth mounting plate, a protruding portion is arranged on the upper end face of the first knife coating plate, and the protruding portion is clamped in the clamping groove;
and a fine tuning bolt is arranged in the notch groove, one end of the fine tuning bolt is abutted against the connecting support part, and the other end of the fine tuning bolt is in threaded connection with the first knife coating plate.
7. The wafer level package bump manufacturing apparatus according to claim 6, wherein the second blade coating assembly includes a second blade coating plate, the first blade coating plate is provided with a first inclined plate, the second blade coating plate is provided with a second inclined plate, and the second inclined plate is disposed opposite to the first inclined plate;
the first knife coating plate comprises a knife coating plate body, a first inclined surface part is arranged at the lower end part of the knife coating plate body, the first inclined plate is attached to the first inclined surface part, and a connecting plate for fixing the first inclined plate is arranged on the first inclined plate.
8. The wafer level package bump fabrication apparatus of claim 1, wherein the processing platform is further provided with a camera mechanism;
the camera shooting mechanism comprises a second linear module arranged along the first direction, the driving end of the second linear module is connected with a mounting assembly, and a third linear module is arranged on the mounting assembly along the second direction; wherein the second direction is perpendicular to the first direction;
the driving end of the third linear module is provided with a camera component, and the camera component is used for shooting the position information of the wafer on the wafer platform.
9. The wafer level packaging bump manufacturing device according to claim 1, further comprising a conveying module, wherein a coating mechanism and a bump implanting mechanism are sequentially arranged above the conveying module;
the driving end of the conveying module is connected with the wafer platform, and the conveying module is used for driving the wafer platform to move.
10. The wafer level package bumping apparatus of claim 9, wherein the bump implantation mechanism comprises a steel mesh assembly with an implantation assembly disposed above the steel mesh assembly.
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| CN117219519B (en) | 2024-02-06 |
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