CN117209162A - Glass with copper circuit and method for directly growing copper circuit on glass - Google Patents
Glass with copper circuit and method for directly growing copper circuit on glass Download PDFInfo
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- CN117209162A CN117209162A CN202311201835.9A CN202311201835A CN117209162A CN 117209162 A CN117209162 A CN 117209162A CN 202311201835 A CN202311201835 A CN 202311201835A CN 117209162 A CN117209162 A CN 117209162A
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- copper
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 239
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 213
- 239000010949 copper Substances 0.000 title claims abstract description 213
- 239000011521 glass Substances 0.000 title claims abstract description 197
- 238000000034 method Methods 0.000 title claims abstract description 83
- 238000007747 plating Methods 0.000 claims abstract description 76
- 239000011248 coating agent Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 230000001678 irradiating effect Effects 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims description 34
- 229920000142 Sodium polycarboxylate Polymers 0.000 claims description 25
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 24
- 238000002844 melting Methods 0.000 claims description 21
- 238000007639 printing Methods 0.000 claims description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 8
- 239000005751 Copper oxide Substances 0.000 claims description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 8
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 claims description 8
- 229940116318 copper carbonate Drugs 0.000 claims description 8
- 229910000431 copper oxide Inorganic materials 0.000 claims description 8
- ZKXWKVVCCTZOLD-UHFFFAOYSA-N copper;4-hydroxypent-3-en-2-one Chemical compound [Cu].CC(O)=CC(C)=O.CC(O)=CC(C)=O ZKXWKVVCCTZOLD-UHFFFAOYSA-N 0.000 claims description 8
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims description 8
- QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 claims description 8
- -1 polydimethylsiloxane Polymers 0.000 claims description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 7
- 238000007641 inkjet printing Methods 0.000 claims description 7
- 238000007650 screen-printing Methods 0.000 claims description 7
- 238000010023 transfer printing Methods 0.000 claims description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 6
- 229920002396 Polyurea Polymers 0.000 claims description 5
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 5
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 239000002270 dispersing agent Substances 0.000 claims description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 4
- 239000002562 thickening agent Substances 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 3
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 3
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 239000000020 Nitrocellulose Substances 0.000 claims description 3
- BCKXLBQYZLBQEK-KVVVOXFISA-M Sodium oleate Chemical compound [Na+].CCCCCCCC\C=C/CCCCCCCC([O-])=O BCKXLBQYZLBQEK-KVVVOXFISA-M 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229920002301 cellulose acetate Polymers 0.000 claims description 3
- 229920001220 nitrocellulos Polymers 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 239000006096 absorbing agent Substances 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 claims description 2
- 150000007942 carboxylates Chemical class 0.000 claims description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 2
- JYVHOGDBFNJNMR-UHFFFAOYSA-N hexane;hydrate Chemical compound O.CCCCCC JYVHOGDBFNJNMR-UHFFFAOYSA-N 0.000 claims description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract description 33
- 229910052751 metal Inorganic materials 0.000 abstract description 33
- 238000001259 photo etching Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 32
- 238000002360 preparation method Methods 0.000 description 32
- 238000000227 grinding Methods 0.000 description 30
- 238000002156 mixing Methods 0.000 description 30
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 22
- 150000003961 organosilicon compounds Chemical class 0.000 description 21
- 239000000843 powder Substances 0.000 description 20
- 229910002804 graphite Inorganic materials 0.000 description 19
- 239000010439 graphite Substances 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 7
- 239000006229 carbon black Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 150000003377 silicon compounds Chemical class 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- VNWKTOKETHGBQD-AKLPVKDBSA-N carbane Chemical group [15CH4] VNWKTOKETHGBQD-AKLPVKDBSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
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- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The application discloses glass with copper circuits and a method for directly growing the copper circuits on the glass, which comprises the following steps: and (3) graphically coating copper-containing ink on the surface of the glass, then scanning and irradiating the glass by a laser line light source, and then placing the treated substrate in a plating solution for electroless copper plating. The method does not need photoetching operation, has the advantages of simple operation flow, less metal copper waste and high copper grid line bonding strength, and can effectively solve the problems in the prior art.
Description
Technical Field
The application belongs to the technical field of circuit boards, and particularly relates to glass containing copper circuits and a method for directly growing the copper circuits on the glass.
Background
The glass is used as an insulating and extremely high-flatness cheap material, and is very suitable for being used as a substrate of a circuit board, in particular to the field of LED display backlight. The main current technology is that a seed layer is firstly evaporated on glass in a full screen manner, then a copper film with enough thickness is deposited on the glass in an electroless plating manner, and then unnecessary copper layers are removed through photoetching and etching, so that a final finished glass-based circuit board is obtained. The unnecessary copper layer is removed by etching, so that copper is wasted, and wastewater generated by acid etching needs to be treated in an environment-friendly way at huge cost, so that the production cost is increased, and the problem of influencing the environment exists.
Disclosure of Invention
Aiming at the defects in the prior art, the application provides glass with copper-containing circuits and a method for directly growing the copper circuits on the glass, and the method does not need photoetching operation, has the advantages of simple operation flow, less metal copper waste and high copper grid line bonding strength, and can effectively solve the problems in the prior art.
In order to achieve the above purpose, the technical scheme adopted by the application for solving the technical problems is as follows:
a method of directly growing copper wiring on glass comprising the steps of:
and (3) graphically coating copper-containing ink on the surface of the glass, then scanning and irradiating the glass by a laser line light source, heating the surface ink only to obtain a seed layer due to low absorptivity of the glass to infrared laser, and then placing the treated substrate in a plating solution for electroless copper plating.
Further, the copper-containing ink comprises the following components in parts by weight: 30-60 parts of copper-containing laser sensitizer, 5-24 parts of thickener, 3-15 parts of adhesive, 20-30 parts of dispersing agent and 3-15 parts of light absorber.
Further, the copper-containing laser sensitizer comprises at least one of basic copper phosphate, basic copper carbonate, copper acetylacetonate, copper oxalate and copper oxide.
Further, the thickener comprises one of polydimethylsiloxane, polyurea and polytetrafluoroethylene, and the dispersant comprises one of sodium oleate, carboxylate, sulfate, sulfonate, quaternary ammonium salt, glycol, sodium polycarboxylate, acrylate and polyurethane.
Further, the binder includes one of polyvinyl alcohol, urea-formaldehyde resin, phenol-formaldehyde resin, cellulose acetate, nitrocellulose, neoprene, nitrile rubber, polyacrylate, natural latex, and low melting glass frit.
Further, the solvent of the copper-containing ink includes at least one of water, ethanol, methanol, acetone, tetrahydrofuran, dichloromethane and cyclohexane, and the viscosity of the copper-containing ink is 0.5 to 30 Pa.s.
Further, the particle size of the copper-containing laser sensitizer is 10-200nm.
Further, the coating mode includes one of screen printing, ink printing, transfer printing and ink-jet printing.
Further, the laser source is double-flat square light spot laser, the wavelength of the laser is 1050-1090nm, the laser power is 1-200W, the laser can be continuous or nanosecond, and the scanning speed is 100-5000mm/s.
Further, the thickness of the copper plating layer is 3 to 10 μm.
The beneficial effects of the application are as follows:
the method for preparing the copper circuit comprises the steps of directly coating the printing ink taking the copper-containing sensitizer as a raw material on the surface of a substrate, then carrying out laser irradiation, utilizing the light absorption component contained in the printing ink to absorb the heat of laser, enabling the interior of the printing ink to be quickly heated, enabling the copper-containing laser sensitizer in the printing ink to undergo decomposition or reduction reaction at high temperature to form elemental copper particles, firmly fixing the formed elemental copper particles on the surface of the substrate by an adhesive to obtain an elemental copper seed layer, and carrying out electrochemical copper plating on the substrate containing the seed layer to prepare the copper circuit; the preparation process has the advantages of simple operation and no copper waste, and the prepared copper grid line is tightly combined with the base material, so that the preparation process has higher bonding strength, and the subsequent service life is prolonged. The laser activation parameters in the application are adopted for activation, so that the number of active species can be greatly increased, the compactness of the subsequent copper plating layer is further improved, and the conductivity of a circuit is improved.
Detailed Description
The present application will be described in further detail with reference to the following examples in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the particular embodiments described herein are illustrative only and are not intended to limit the application, i.e., the embodiments described are merely some, but not all, of the embodiments of the application.
Thus, the following detailed description of the embodiments of the application, as provided, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present application.
It is noted that relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
The features and capabilities of the present application are described in further detail below in connection with examples.
Example 1
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 10W, the scanning speed is 200mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire with the thickness of 12 mu m is obtained.
The copper-containing ink comprises the following components in parts by weight: 37 parts of basic copper phosphate with the particle size of 20nm, 30 parts of sodium polycarboxylate, 20 parts of organosilicon compound, 10 parts of graphite and 3 parts of low-melting glass powder.
The preparation method of the copper-containing ink comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 10 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 2
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1070nm, the laser power is 20W, the laser frequency is 50KHz, the scanning speed is 500mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 12 mu m.
Wherein the copper-containing ink comprises the following components in parts by weight: 35 parts of basic copper phosphate with the particle size of 80nm, 25 parts of sodium oleate, 22 parts of polyurea, 13 parts of graphite and 5 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 12 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 3
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in a screen printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 30W, the laser frequency is 50KHz, the scanning speed is 500mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 13 mu m.
The copper-containing ink comprises the following components in parts by weight: 33 parts of basic copper phosphate with the particle size of 150nm, 21 parts of sodium sulfonate, 24 parts of organosilicon compound, 15 parts of carbon black and 7 parts of urea-formaldehyde resin.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 14 Pa.s.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 4
A method of directly growing copper wiring on glass comprising the steps of: coating copper-containing ink on the surface of glass in a transfer printing mode, irradiating the glass by a laser light source with the wavelength of 1064nm, the laser power of 50W, the laser frequency of 50KHz and the scanning speed of 1000mm/s, and then placing the treated glass in a conventional plating solution for electroless copper plating to obtain the copper wire with the thickness of 13 mu m.
The copper-containing ink comprises the following components in parts by weight: 31 parts of basic copper phosphate with the particle size of 250nm, 30 parts of sodium polycarboxylate, 20 parts of polytetrafluoroethylene, 10 parts of graphite and 9 parts of low-melting glass powder.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 16 Pa.s.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 5
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink-jet printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 100W, the laser frequency is 50KHz, the scanning speed is 3000mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 14 mu m.
The copper-containing ink comprises the following components in parts by weight: 30 parts of basic copper phosphate with the particle size of 300nm, 25 parts of sodium polycarboxylate, 24 parts of organosilicon compound, 10 parts of graphene and 11 parts of phenolic resin.
The preparation method comprises the following steps: the materials and methanol are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 15 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 6
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 10W, the scanning speed is 200mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire with the thickness of 14 mu m is obtained.
The copper-containing ink comprises the following components in parts by weight: 30 parts of basic copper carbonate with the particle size of 100nm, 25 parts of sodium polycarboxylate, 24 parts of organosilicon compound, 8 parts of graphite and 13 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and methanol are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 16 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 7
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in a screen printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 20W, the laser frequency is 50KHz, the scanning speed is 500mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 15 mu m.
The copper-containing ink comprises the following components in parts by weight: 35 parts of basic copper carbonate with the particle size of 200nm, 20 parts of ethylene glycol, 24 parts of polytetrafluoroethylene, 6 parts of graphite and 15 parts of low-melting-point glass powder.
The preparation method comprises the following steps: and adding the materials and acetone into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 18 Pa.s.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 8
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in a transfer printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 30W, the laser frequency is 50KHz, the scanning speed is 500mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 12 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of basic copper carbonate with the particle size of 200nm, 30 parts of sodium polycarboxylate, 17 parts of organosilicon compound, 3 parts of carbon black and 10 parts of natural latex.
The preparation method comprises the following steps: the materials and tetrahydrofuran are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 20 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 9
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink-jet printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 50W, the laser frequency is 50KHz, the scanning speed is 1000mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 12 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of basic copper carbonate with the particle size of 300nm, 25 parts of sodium polycarboxylate, 15 parts of organosilicon compound, 5 parts of carbon nano tube and 15 parts of nitrile rubber.
The preparation method comprises the following steps: the materials and tetrahydrofuran are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 22 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 10
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 100W, the laser frequency is 50KHz, the scanning speed is 3000mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 13 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of basic copper carbonate with the particle size of 300nm, 30 parts of polyurethane, 13 parts of organosilicon compound, 7 parts of graphite and 10 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and cyclohexane are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 23 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 11
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 10W, the scanning speed is 200mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire with the thickness of 13 mu m is obtained.
The copper-containing ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with the particle size of 50nm, 30 parts of urea-formaldehyde resin, 11 parts of organic silicon compound, 9 parts of carbon black and 10 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 24 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 12
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in a screen printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 20W, the laser frequency is 50KHz, the scanning speed is 500mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 14 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with the particle size of 120nm, 30 parts of sodium polycarboxylate, 9 parts of organosilicon compound, 11 parts of graphite and 10 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 25 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 13
A method of directly growing copper wiring on glass comprising the steps of: coating copper-containing ink on the surface of glass in a transfer printing mode, irradiating the glass by a laser light source with the wavelength of 1064nm, the laser power of 30W, the laser frequency of 50KHz and the scanning speed of 500mm/s, and then placing the treated glass in a conventional plating solution for electroless copper plating to obtain the copper wire with the thickness of 14 mu m.
The copper-containing ink comprises the following components in parts by weight: 45 parts of copper acetylacetonate with the particle size of 180nm, 25 parts of sodium polycarboxylate, 7 parts of organosilicon compound, 13 parts of carbon black and 10 parts of low-melting glass powder.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 6 Pa.s.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 14
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink-jet printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 50W, the laser frequency is 50KHz, the scanning speed is 1000mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 15 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with the particle size of 240nm, 30 parts of sodium polycarboxylate, 5 parts of polyurea, 15 parts of graphite and 10 parts of chloroprene rubber.
The preparation method comprises the following steps: the materials and methanol are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 8 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 15
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 100W, the laser frequency is 50KHz, the scanning speed is 3000mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 14 mu m.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper acetylacetonate with the particle size of 280nm, 20 parts of sodium polycarboxylate, 17 parts of organosilicon compound, 10 parts of graphite and 3 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 10 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 16
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 10W, the scanning speed is 200mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire with the thickness of 12 mu m is obtained.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxalate with the particle size of 70nm, 20 parts of sodium polycarboxylate, 15 parts of organosilicon compound, 10 parts of graphite and 5 parts of nitrocellulose.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 12 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 17
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in a screen printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 20W, the laser frequency is 50KHz, the scanning speed is 500mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 12 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of copper oxalate with the particle size of 130nm, 25 parts of sodium polycarboxylate, 13 parts of organosilicon compound, 15 parts of graphite and 7 parts of low-melting glass powder.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 14 Pa.s.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 18
A method of directly growing copper wiring on glass comprising the steps of: coating copper-containing ink on the surface of glass in a transfer printing mode, irradiating the glass by a laser light source with the wavelength of 1064nm, the laser power of 30W, the laser frequency of 50KHz and the scanning speed of 500mm/s, and then placing the treated glass in a conventional plating solution for electroless copper plating to obtain the copper wire with the thickness of 13 mu m.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxalate with the particle size of 220nm, 20 parts of sodium polycarboxylate, 11 parts of polytetrafluoroethylene, 10 parts of graphite and 9 parts of low-melting glass powder.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 16 Pa.s.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 19
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink-jet printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 50W, the laser frequency is 50KHz, the scanning speed is 1000mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 13 mu m.
The copper-containing ink comprises the following components in parts by weight: 45 parts of copper oxalate with the particle size of 280nm, 20 parts of sodium carboxylate, 9 parts of organic silicon compound, 15 parts of graphite and 11 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and methanol are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 18 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 20
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 100W, the laser frequency is 50KHz, the scanning speed is 3000mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 14 mu m.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxalate with the particle size of 300nm, 20 parts of sodium polycarboxylate, 7 parts of organosilicon compound, 10 parts of carbon black and 13 parts of low-melting glass powder.
The preparation method comprises the following steps: and adding the materials and acetone into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 20 Pa.s.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 21
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 10W, the scanning speed is 200mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire with the thickness of 12 mu m is obtained.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxide with the particle size of 100nm, 20 parts of sodium polycarboxylate, 5 parts of organosilicon compound, 10 parts of graphite and 15 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 13 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 22
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 20W, the laser frequency is 50KHz, the scanning speed is 500mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 15 mu m.
The copper-containing ink comprises the following components in parts by weight: 60 parts of copper oxide with the particle size of 150nm, 20 parts of sodium polycarboxylate, 12 parts of polyurea, 5 parts of graphite and 3 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 15 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 23
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in a screen printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 30W, the laser frequency is 50KHz, the scanning speed is 500mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 12 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of copper oxide with the particle size of 200nm, 30 parts of sodium polycarboxylate, 15 parts of organosilicon compound, 10 parts of carbon nano tube and 5 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and methanol are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 16 Pa.s is prepared.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 24
A method of directly growing copper wiring on glass comprising the steps of: coating copper-containing ink on the surface of glass in a transfer printing mode, irradiating the glass by a laser light source with the wavelength of 1064nm, the laser power of 50W, the laser frequency of 50KHz and the scanning speed of 1000mm/s, and then placing the treated glass in a conventional plating solution for electroless copper plating to obtain the copper wire with the thickness of 14 mu m.
The copper-containing ink comprises the following components in parts by weight: 60 parts of copper oxide with the particle size of 250nm, 20 parts of sodium polycarboxylate, 8 parts of organosilicon compound, 5 parts of graphite and 7 parts of cellulose acetate.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 18 Pa.s.
The glass with the copper-containing circuit is prepared by adopting the method.
Example 25
A method of directly growing copper wiring on glass comprising the steps of: the copper-containing ink is coated on the surface of glass in an ink-jet printing mode, then the glass is irradiated by a laser light source, the wavelength of the laser light source is 1064nm, the laser power is 100W, the laser frequency is 50KHz, the scanning speed is 3000mm/s, and the treated glass is placed in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 13 mu m.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxide with the particle size of 300nm, 20 parts of sodium polycarboxylate, 6 parts of organosilicon compound, 5 parts of graphite and 9 parts of low-melting glass powder.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 14 Pa.s.
The glass with the copper-containing circuit is prepared by adopting the method.
Comparative example 1
A method of directly growing copper wiring on glass comprising the steps of: and (3) coating copper-containing ink on the surface of the glass in an ink printing mode, and then placing the treated glass in a conventional plating solution for electroless copper plating.
The copper-containing ink comprises the following components in parts by weight: 37 parts of basic copper phosphate with the particle size of 20nm, 30 parts of sodium polycarboxylate, 20 parts of organosilicon compound and 10 parts of graphite.
The preparation method of the copper-containing ink comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 10 Pa.s is prepared.
Comparative example 2
A method of directly growing copper wiring on glass comprising the steps of: and (3) coating copper-containing ink on the surface of the glass in an ink printing mode, and then placing the treated glass in a conventional plating solution for electroless copper plating.
The copper-containing ink comprises the following components in parts by weight: 30 parts of basic copper carbonate with the particle size of 100nm, 25 parts of sodium polycarboxylate, 24 parts of organosilicon compound and 13 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and methanol are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 16 Pa.s is prepared.
Comparative example 3
A method of directly growing copper wiring on glass comprising the steps of: and (3) coating copper-containing ink on the surface of the glass in an ink printing mode, and then placing the treated glass in a conventional plating solution for electroless copper plating.
The copper-containing ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with the particle size of 50nm, 30 parts of urea formaldehyde resin and 11 parts of organic silicon compound.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 24 Pa.s is prepared.
Comparative example 4
A method of directly growing copper wiring on glass comprising the steps of: and (3) coating copper-containing ink on the surface of the glass in an ink printing mode, and then placing the treated glass in a conventional plating solution for electroless copper plating.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxalate with the particle size of 70nm, 20 parts of sodium polycarboxylate, 15 parts of organosilicon compound and 10 parts of graphite.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 12 Pa.s is prepared.
Comparative example 5
A method of directly growing copper wiring on glass comprising the steps of: and (3) coating copper-containing ink on the surface of the glass in an ink printing mode, and then placing the treated glass in a conventional plating solution for electroless copper plating.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxide with the particle size of 100nm, 20 parts of sodium polycarboxylate, 5 parts of organosilicon compound and 15 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 13 Pa.s is prepared.
Experimental example
The electroless plating effect of the glasses in examples 1 to 25 and comparative examples 1 to 5 was evaluated by visual inspection, the thickness of the copper plating layer was tested according to ASTM B568 (2009), the adhesion effect between the copper plating layer and the glass was evaluated according to ASTM D3359, the peel strength of the electroless copper plating layer was tested according to IPC-TM-650.4.28, the plating conductivity was tested according to GB/T351-2019 method for measuring resistivity of metallic materials, and the test results are shown in Table 1.
Table 1: test results
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The copper circuit prepared on the glass has excellent conductivity, and the conductivity reaches 10 7 The adhesion between the metal copper layer and the silicon material reaches the ASTM D3359 4B standard, the peel strength of the plating layer is more than 1.0N/mm, and the bonding effect and the conductivity are higher. The method has simple operation flow and is very suitable for industrial production application. In comparative examples 1 to 5, no laser activation operation was performed, no active species were generated on the substrate, so that elemental copper could not be attached to the substrate surface during the plating process, becauseThis, no copper lines are generated.
Claims (10)
1. A method of directly growing copper wiring on glass comprising the steps of:
and (3) graphically coating copper-containing ink on the surface of the glass, then scanning and irradiating the glass by a laser line light source, and then placing the treated substrate in a plating solution for electroless copper plating.
2. The method of directly growing copper wiring on glass according to claim 1, wherein the copper-containing ink comprises the following components in parts by weight: 30-60 parts of copper-containing laser sensitizer, 5-24 parts of thickener, 3-15 parts of adhesive, 20-30 parts of dispersing agent and 3-15 parts of light absorber.
3. The method of directly growing copper wiring on glass according to claim 2, wherein the copper-containing laser sensitizer comprises at least one of basic copper phosphate, basic copper carbonate, copper acetylacetonate, copper oxalate and copper oxide, and the copper-containing laser sensitizer has a particle size of 10 to 200nm.
4. The method of growing copper wiring directly on glass according to claim 2, wherein the thickener comprises one of polydimethylsiloxane, polyurea, and polytetrafluoroethylene, and the dispersant comprises one of sodium oleate, carboxylate, sulfate, sulfonate, quaternary ammonium salt, glycol, sodium polycarboxylate, acrylate, and polyurethane.
5. The method of growing copper wire directly on glass of claim 2, wherein the binder comprises one of polyvinyl alcohol, urea formaldehyde resin, phenolic resin, cellulose acetate, cellulose nitrate, neoprene, nitrile rubber, polyacrylate, natural latex, and low melting glass frit.
6. The method of growing copper wiring directly on glass according to claim 2, wherein the solvent of the copper-containing ink comprises at least one of water, ethanol, methanol, acetone, tetrahydrofuran, dichloromethane, and cyclohexane, and the copper-containing ink has a viscosity of 0.5 to 30 Pa-s.
7. The method of growing copper wiring directly on glass according to claim 2, wherein the coating means comprises one of screen printing, ink printing, transfer printing, and ink jet printing.
8. The method for directly growing copper lines on glass according to claim 2, wherein the laser light source is a double-flat-top square-spot laser, the laser wavelength is 1050-1090nm of infrared laser, the laser power is 1-200W, and the laser scanning speed is 100-5000mm/s.
9. The method for directly growing copper wiring on glass according to claim 2, wherein the copper plating layer has a thickness of 3 to 10 μm.
10. A glass comprising copper wiring, characterized in that it is produced by the method according to any one of claims 1 to 9.
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| CN202311201835.9A CN117209162A (en) | 2023-09-18 | 2023-09-18 | Glass with copper circuit and method for directly growing copper circuit on glass |
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| CN202311201835.9A CN117209162A (en) | 2023-09-18 | 2023-09-18 | Glass with copper circuit and method for directly growing copper circuit on glass |
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