CN117082753A - Metal patterning circuit and preparation method thereof - Google Patents
Metal patterning circuit and preparation method thereof Download PDFInfo
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- CN117082753A CN117082753A CN202311201831.0A CN202311201831A CN117082753A CN 117082753 A CN117082753 A CN 117082753A CN 202311201831 A CN202311201831 A CN 202311201831A CN 117082753 A CN117082753 A CN 117082753A
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- sensitizer
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- 239000002184 metal Substances 0.000 title claims abstract description 83
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 83
- 238000002360 preparation method Methods 0.000 title claims abstract description 70
- 238000000059 patterning Methods 0.000 title abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 117
- 229910052802 copper Inorganic materials 0.000 claims abstract description 99
- 239000010949 copper Substances 0.000 claims abstract description 99
- 238000007747 plating Methods 0.000 claims abstract description 76
- 238000007639 printing Methods 0.000 claims abstract description 39
- 239000011248 coating agent Substances 0.000 claims abstract description 33
- 238000000576 coating method Methods 0.000 claims abstract description 33
- 238000010586 diagram Methods 0.000 claims abstract description 33
- 230000001678 irradiating effect Effects 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000002245 particle Substances 0.000 claims description 34
- -1 polydimethylsiloxane Polymers 0.000 claims description 32
- 239000011521 glass Substances 0.000 claims description 26
- 229920000142 Sodium polycarboxylate Polymers 0.000 claims description 25
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 24
- 238000002844 melting Methods 0.000 claims description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 20
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 20
- 229920001721 polyimide Polymers 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 229920002379 silicone rubber Polymers 0.000 claims description 13
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 12
- 229920006289 polycarbonate film Polymers 0.000 claims description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 11
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 8
- 239000005751 Copper oxide Substances 0.000 claims description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 8
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 8
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 claims description 8
- 229940116318 copper carbonate Drugs 0.000 claims description 8
- 229910000431 copper oxide Inorganic materials 0.000 claims description 8
- ZKXWKVVCCTZOLD-UHFFFAOYSA-N copper;4-hydroxypent-3-en-2-one Chemical compound [Cu].CC(O)=CC(C)=O.CC(O)=CC(C)=O ZKXWKVVCCTZOLD-UHFFFAOYSA-N 0.000 claims description 8
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims description 8
- QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 claims description 8
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 8
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 5
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 229920002396 Polyurea Polymers 0.000 claims description 5
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 5
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 claims description 5
- 229920002223 polystyrene Polymers 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 4
- 239000002562 thickening agent Substances 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 3
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 3
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 239000000020 Nitrocellulose Substances 0.000 claims description 3
- BCKXLBQYZLBQEK-KVVVOXFISA-M Sodium oleate Chemical compound [Na+].CCCCCCCC\C=C/CCCCCCCC([O-])=O BCKXLBQYZLBQEK-KVVVOXFISA-M 0.000 claims description 3
- 229920002301 cellulose acetate Polymers 0.000 claims description 3
- 229920001220 nitrocellulos Polymers 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- 239000006096 absorbing agent Substances 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 claims description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 2
- JYVHOGDBFNJNMR-UHFFFAOYSA-N hexane;hydrate Chemical compound O.CCCCCC JYVHOGDBFNJNMR-UHFFFAOYSA-N 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 claims 1
- WPHGSKGZRAQSGP-UHFFFAOYSA-N methylenecyclohexane Natural products C1CCCC2CC21 WPHGSKGZRAQSGP-UHFFFAOYSA-N 0.000 claims 1
- 150000008054 sulfonate salts Chemical class 0.000 claims 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 claims 1
- 239000002699 waste material Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 35
- 238000000227 grinding Methods 0.000 description 30
- 238000002156 mixing Methods 0.000 description 30
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 22
- 150000003961 organosilicon compounds Chemical class 0.000 description 21
- 239000000843 powder Substances 0.000 description 20
- 229910002804 graphite Inorganic materials 0.000 description 19
- 239000010439 graphite Substances 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 7
- 230000004913 activation Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000006229 carbon black Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000003377 silicon compounds Chemical class 0.000 description 3
- 239000002023 wood Substances 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- VNWKTOKETHGBQD-AKLPVKDBSA-N carbane Chemical group [15CH4] VNWKTOKETHGBQD-AKLPVKDBSA-N 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000813 microcontact printing Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010875 treated wood Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The application discloses a metal patterning circuit and a preparation method thereof, comprising the following steps: coating the printing ink containing the laser sensitizer on the surface of a substrate according to a designed circuit diagram, irradiating the substrate by a laser light source, and then placing the treated substrate in a plating solution for electroless copper plating. The method of the application does not need to add the laser sensitizer into the substrate, and the laser sensitizer is directly coated on the surface of the substrate, and after laser irradiation, the laser sensitizer in the ink is fully activated, thereby effectively solving the problem of laser sensitizer waste existing in the prior method.
Description
Technical Field
The application belongs to the technical field of metal patterning, and particularly relates to a metal patterning circuit and a preparation method thereof.
Background
The surface selective metallization of the polymer material has the excellent properties of insulating materials and metals, and is widely applied to the field of electronic and electric appliances. Methods of selective metallization include photolithography, ink printing, screen printing, microcontact printing, laser-assisted fabrication, and the like. In recent years, a Laser Direct Structuring (LDS) technology is capable of performing an activation treatment on a polymer composite material to which a laser sensitizer is added, followed by electroless copper plating to obtain a desired metal layer by controlling a scanning trajectory of laser light by a computer. However, the LDS technology first requires adding a laser sensitizer to the polymer substrate, and only the laser sensitizer near the surface of the substrate acts after laser activation, which inevitably causes waste of the laser sensitizer and increases production cost.
Disclosure of Invention
Aiming at the defects in the prior art, the application provides a metal patterning circuit and a preparation method thereof, the method of the application does not need to add a laser sensitizer into a base material, the laser sensitizer is directly coated on the surface of the base material, and after laser irradiation, the laser sensitizer in the ink is fully activated, so that the problem of laser sensitizer waste in the existing method is effectively solved.
In order to achieve the above purpose, the technical scheme adopted by the application for solving the technical problems is as follows:
a preparation method of a metal patterned circuit comprises the following steps: coating the printing ink containing the laser sensitizer on the surface of a substrate according to a designed circuit diagram, then irradiating the substrate according to a pattern by a laser light source, and then placing the treated substrate in a plating solution for electroless copper plating.
Further, the copper-containing ink comprises the following components in parts by weight: 30-60 parts of copper-containing laser sensitizer, 5-24 parts of thickener, 3-15 parts of adhesive, 20-30 parts of dispersing agent and 3-15 parts of light absorber.
Further, the copper-containing laser sensitizer comprises at least one of basic copper phosphate, basic copper carbonate, copper acetylacetonate, copper oxalate and copper oxide.
Further, the thickener comprises one of polydimethylsiloxane, polyurea and polytetrafluoroethylene, and the dispersant comprises one of sodium oleate, carboxylate, sulfate, sulfonate, quaternary ammonium salt, glycol, sodium polycarboxylate, acrylate and polyurethane.
Further, the binder includes one of polyvinyl alcohol, urea-formaldehyde resin, phenol-formaldehyde resin, cellulose acetate, nitrocellulose, neoprene, nitrile rubber, polyacrylate, natural latex, and low melting glass frit.
Further, the solvent of the ink comprises at least one of water, ethanol, methanol, acetone, tetrahydrofuran, dichloromethane and cyclohexane, and the viscosity of the ink is 0.5-30 Pa.s.
Further, the particle size of the copper-containing laser sensitizer is 10-200nm.
Further, the substrate includes one of polyimide film, polyethylene terephthalate film, polybutylene terephthalate film, polycarbonate film, silicone rubber film, styrene-based thermoplastic elastomer film, polystyrene film, polyphenylene sulfide film, liquid crystal polymer film, silicon wafer, glass, wood, and paper.
Further, the laser light source is double flat square light spot pulse, the laser wavelength is 355nm, 532nm and 1064nm, the laser power is 1-300W, the laser frequency is 10-100KHz, and the laser scanning speed is 100-5000mm/s.
Further, the final thickness of the metal patterned line is 8-20 μm.
A metal patterned circuit is prepared by the method.
The beneficial effects of the application are as follows:
1. when the method is used for preparing the metal patterning circuit, the printing ink taking the copper-containing sensitizer as a raw material is directly coated on the surface of the substrate, then laser irradiation is carried out, the printing ink contains light absorption components, so that the heat of laser can be absorbed, the temperature in the printing ink is quickly increased, the copper-containing laser sensitizer in the printing ink is quickly increased in temperature, decomposition or reduction reaction is carried out to form elemental copper particles, the formed elemental copper particles are firmly fixed on the surface of the substrate by the adhesive to obtain an elemental copper seed layer, and then the substrate containing the seed layer is subjected to electrochemical copper plating to prepare the copper circuit; the preparation process has the advantages of simple operation and no copper waste, and the prepared copper circuit is tightly combined with the base material, so that the preparation process has higher bonding strength, and the subsequent service life is prolonged. The laser activation parameters in the application are adopted for activation, so that the number of active species can be greatly increased, the compactness of the subsequent copper plating layer is further improved, and the conductivity of a circuit is improved.
2. The copper circuit prepared by the method can be used for preparing a conductive circuit to be applied to the preparation process of an electrical device; can also be used for preparing beautified decorative products containing metallized patterns, thereby greatly widening the application field.
Detailed Description
The present application will be described in further detail with reference to the following examples in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the particular embodiments described herein are illustrative only and are not intended to limit the application, i.e., the embodiments described are merely some, but not all, of the embodiments of the application.
Thus, the following detailed description of the embodiments of the application, as provided, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present application.
It is noted that relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
The features and capabilities of the present application are described in further detail below in connection with examples.
Example 1
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the polyimide film according to a designed circuit diagram, then scanning and irradiating a printed circuit on the polyimide film by a laser light source, wherein the wavelength of the laser light source is 355nm, the laser power is 10W, the laser frequency is 50KHz, the scanning speed is 200mm/s, and then placing the treated polyimide film in a conventional plating solution for electroless copper plating, so that the copper circuit thickness is 12 mu m.
The copper-containing ink comprises the following components in parts by weight: 37 parts of basic copper phosphate with the particle size of 20nm, 30 parts of sodium polycarboxylate, 20 parts of organosilicon compound, 10 parts of graphite and 3 parts of low-melting glass powder.
The preparation method of the copper-containing ink comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the printing ink with the viscosity of 2 Pa.s is prepared.
Example 2
A preparation method of the metal patterned circuit comprises the following steps: coating the printing ink containing the laser sensitizer on the surface of the polyethylene terephthalate film according to a designed circuit diagram, then irradiating the polyethylene terephthalate film through a laser light source, wherein the wavelength of the laser light source is 532nm, the laser power is 20W, the laser frequency is 50KHz, the scanning speed is 500mm/s, and then placing the treated polyethylene terephthalate film in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 12 mu m.
Wherein the copper-containing ink comprises the following components in parts by weight: 35 parts of basic copper phosphate with the particle size of 80nm, 25 parts of sodium oleate, 22 parts of polyurea, 13 parts of graphite and 5 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 4 Pa.s is prepared.
Example 3
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the polybutylene terephthalate film according to a designed circuit diagram, then irradiating the polybutylene terephthalate film through a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 100W, the laser frequency is 50KHz, the laser scanning speed is 1000mm/s, and then placing the treated polybutylene terephthalate film in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 13 mu m.
The copper-containing ink comprises the following components in parts by weight: 33 parts of basic copper phosphate with the particle size of 150nm, 21 parts of sodium sulfonate, 24 parts of organosilicon compound, 15 parts of carbon black and 7 parts of urea-formaldehyde resin.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 6 Pa.s.
Example 4
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the polycarbonate film according to a designed circuit diagram, then irradiating the polycarbonate film by a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 150W, the laser frequency is 50KHz, the laser scanning speed is 2000mm/s, and then placing the treated polycarbonate film in a conventional plating solution for electroless copper plating, so that the copper wire with the thickness of 13 mu m is obtained.
The copper-containing ink comprises the following components in parts by weight: 31 parts of basic copper phosphate with the particle size of 250nm, 30 parts of sodium polycarboxylate, 20 parts of polytetrafluoroethylene, 10 parts of graphite and 9 parts of low-melting glass powder.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 8 Pa.s.
Example 5
A preparation method of the metal patterned circuit comprises the following steps: the method comprises the steps of coating the printing ink containing the laser sensitizer on the surface of a silicon rubber film according to a designed circuit diagram, irradiating the silicon rubber film through a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 200W, the laser frequency is 50KHz, the laser scanning speed is 2000mm/s, and then placing the treated silicon rubber film in a conventional plating solution for electroless copper plating, so that the copper wire with the thickness of 14 mu m is obtained.
The copper-containing ink comprises the following components in parts by weight: 30 parts of basic copper phosphate with the particle size of 300nm, 25 parts of sodium polycarboxylate, 24 parts of organosilicon compound, 10 parts of graphene and 11 parts of phenolic resin.
The preparation method comprises the following steps: the materials and methanol are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 10 Pa.s is prepared.
Example 6
A preparation method of the metal patterned circuit comprises the following steps: the method comprises the steps of coating the printing ink containing the laser sensitizer on the surface of a styrene thermoplastic elastomer film according to a designed circuit diagram, irradiating the styrene thermoplastic elastomer film through a laser light source, wherein the wavelength of the laser light source is 355nm, the laser power is 10W, the laser frequency is 50KHz, the laser scanning speed is 200mm/s, and then placing the treated styrene thermoplastic elastomer film in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 14 mu m.
The copper-containing ink comprises the following components in parts by weight: 30 parts of basic copper carbonate with the particle size of 100nm, 25 parts of sodium polycarboxylate, 24 parts of organosilicon compound, 8 parts of graphite and 13 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and methanol are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 12 Pa.s is prepared.
Example 7
A preparation method of the metal patterned circuit comprises the following steps: coating the printing ink containing the laser sensitizer on the surface of a polyimide film according to a designed circuit diagram, then irradiating the polyimide film through a laser light source, wherein the wavelength of the laser light source is 532nm, the laser power is 10W, the laser frequency is 50KHz, the laser scanning speed is 500mm/s, and then placing the treated polyimide film in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 15 mu m.
The copper-containing ink comprises the following components in parts by weight: 35 parts of basic copper carbonate with the particle size of 200nm, 20 parts of ethylene glycol, 24 parts of polytetrafluoroethylene, 6 parts of graphite and 15 parts of low-melting-point glass powder.
The preparation method comprises the following steps: and adding the materials and acetone into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 14 Pa.s.
Example 8
A preparation method of the metal patterned circuit comprises the following steps: coating the printing ink containing the laser sensitizer on the surface of the polyethylene terephthalate film according to a designed circuit diagram, then irradiating the polyethylene terephthalate film through a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 20W, the laser frequency is 50KHz, the laser scanning speed is 2000mm/s, and then placing the treated polyethylene terephthalate film in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 12 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of basic copper carbonate with the particle size of 200nm, 30 parts of sodium polycarboxylate, 17 parts of organosilicon compound, 3 parts of carbon black and 10 parts of natural latex.
The preparation method comprises the following steps: the materials and tetrahydrofuran are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 16 Pa.s is prepared.
Example 9
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the polybutylene terephthalate film according to a designed circuit diagram, then irradiating the polybutylene terephthalate film through a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 30W, the laser frequency is 50KHz, the laser scanning speed is 3000mm/s, and then placing the treated polybutylene terephthalate film in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 12 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of basic copper carbonate with the particle size of 300nm, 25 parts of sodium polycarboxylate, 15 parts of organosilicon compound, 5 parts of carbon nano tube and 15 parts of nitrile rubber.
The preparation method comprises the following steps: the materials and tetrahydrofuran are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 18 Pa.s is prepared.
Example 10
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the polycarbonate film according to a designed circuit diagram, irradiating the polycarbonate film by a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 50W, the laser frequency is 50KHz, the laser scanning speed is 4000mm/s, and then placing the treated polycarbonate film in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 13 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of basic copper carbonate with the particle size of 300nm, 30 parts of polyurethane, 13 parts of organosilicon compound, 7 parts of graphite and 10 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and cyclohexane are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 10 Pa.s is prepared.
Example 11
A preparation method of the metal patterned circuit comprises the following steps: coating the printing ink containing the laser sensitizer on the surface of a polyimide film according to a designed circuit diagram, then irradiating the polyimide film through a laser light source, wherein the wavelength of the laser light source is 355nm, the laser power is 10W, the laser frequency is 50KHz, the laser scanning speed is 200mm/s, and then placing the treated polyimide film in a conventional plating solution for electroless copper plating, so that the copper wire with the thickness of 13 mu m is obtained.
The copper-containing ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with the particle size of 50nm, 30 parts of urea-formaldehyde resin, 11 parts of organic silicon compound, 9 parts of carbon black and 10 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 14 Pa.s is prepared.
Example 12
A preparation method of the metal patterned circuit comprises the following steps: coating the printing ink containing the laser sensitizer on the surface of the polyethylene terephthalate film according to a designed circuit diagram, then irradiating the polyethylene terephthalate film through a laser light source, wherein the wavelength of the laser light source is 532nm, the laser power is 10W, the laser frequency is 50KHz, the laser scanning speed is 500mm/s, and then placing the treated polyethylene terephthalate film in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 14 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with the particle size of 120nm, 30 parts of sodium polycarboxylate, 9 parts of organosilicon compound, 11 parts of graphite and 10 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 16 Pa.s is prepared.
Example 13
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the polycarbonate film according to a designed circuit diagram, then irradiating the polycarbonate film by a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 10W, the laser frequency is 50KHz, the laser scanning speed is 1000mm/s, and then placing the treated polycarbonate film in a conventional plating solution for electroless copper plating, so that the copper wire with the thickness of 14 mu m is obtained.
The copper-containing ink comprises the following components in parts by weight: 45 parts of copper acetylacetonate with the particle size of 180nm, 25 parts of sodium polycarboxylate, 7 parts of organosilicon compound, 13 parts of carbon black and 10 parts of low-melting glass powder.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 12 Pa.s.
Example 14
A preparation method of the metal patterned circuit comprises the following steps: the method comprises the steps of coating printing ink containing a laser sensitizer on the surface of a silicon rubber film according to a designed circuit diagram, irradiating the silicon rubber film through a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 15W, the laser frequency is 50KHz, the laser scanning speed is 2000mm/s, and then placing the treated silicon rubber film in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 15 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with the particle size of 240nm, 30 parts of sodium polycarboxylate, 5 parts of polyurea, 15 parts of graphite and 10 parts of chloroprene rubber.
The preparation method comprises the following steps: the materials and methanol are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 10 Pa.s is prepared.
Example 15
A preparation method of the metal patterned circuit comprises the following steps: the method comprises the steps of coating the printing ink containing the laser sensitizer on the surface of a polystyrene film according to a designed circuit diagram, irradiating the polystyrene film through a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 20W, the laser frequency is 50KHz, the laser scanning speed is 3000mm/s, and then placing the treated polystyrene film in a conventional plating solution for electroless copper plating, so that the copper wire with the thickness of 14 mu m is obtained.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper acetylacetonate with the particle size of 280nm, 20 parts of sodium polycarboxylate, 17 parts of organosilicon compound, 10 parts of graphite and 3 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 12 Pa.s is prepared.
Implementation of the embodimentsExample 16
A preparation method of the metal patterned circuit comprises the following steps: coating the printing ink containing the laser sensitizer on the surface of a polyimide film according to a designed circuit diagram, then irradiating the polyimide film through a laser light source, wherein the wavelength of the laser light source is 355nm, the laser power is 10W, the laser frequency is 50KHz, the laser scanning speed is 200mm/s, and then placing the treated polyimide film in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 12 mu m.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxalate with the particle size of 70nm, 20 parts of sodium polycarboxylate, 15 parts of organosilicon compound, 10 parts of graphite and 5 parts of nitrocellulose.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 14 Pa.s is prepared.
Example 17
A preparation method of the metal patterned circuit comprises the following steps: coating the printing ink containing the laser sensitizer on the surface of the polybutylene terephthalate film according to a designed circuit diagram, then irradiating the polybutylene terephthalate film through a laser light source with the wavelength of 532nm, the laser power of 10W, the laser frequency of 50KHz and the laser scanning speed of 1000mm/s, and then placing the treated polybutylene terephthalate film in a conventional plating solution for electroless copper plating to obtain the polybutylene terephthalate film with the copper circuit thickness of 12 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of copper oxalate with the particle size of 130nm, 25 parts of sodium polycarboxylate, 13 parts of organosilicon compound, 15 parts of graphite and 7 parts of low-melting glass powder.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 15 Pa.s.
Example 18
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the polyphenylene sulfide film according to a designed circuit diagram, then irradiating the polyphenylene sulfide film through a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 15W, the laser frequency is 50KHz, the laser scanning speed is 2000mm/s, and then placing the treated polyphenylene sulfide film in a conventional plating solution for electroless copper plating, so that the copper wire with the thickness of 13 mu m is obtained.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxalate with the particle size of 220nm, 20 parts of sodium polycarboxylate, 11 parts of polytetrafluoroethylene, 10 parts of graphite and 9 parts of low-melting glass powder.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 16 Pa.s.
Example 19
A preparation method of the metal patterned circuit comprises the following steps: the method comprises the steps of coating ink containing a laser sensitizer on the surface of a liquid crystal polymer film according to a designed circuit diagram, irradiating the liquid crystal polymer film through a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 15W, the laser frequency is 50KHz, the laser scanning speed is 3000mm/s, and then placing the treated liquid crystal polymer film in a conventional plating solution for electroless copper plating, so that the copper line thickness is 13 mu m.
The copper-containing ink comprises the following components in parts by weight: 45 parts of copper oxalate with the particle size of 280nm, 20 parts of sodium carboxylate, 9 parts of organic silicon compound, 15 parts of graphite and 11 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and methanol are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 18 Pa.s is prepared.
Example 20
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the styrene thermoplastic elastomer film according to a designed circuit diagram, then irradiating the styrene thermoplastic elastomer film through a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 20W, the laser frequency is 50KHz, the laser scanning speed is 4000mm/s, and then placing the treated styrene thermoplastic elastomer film in a conventional plating solution for electroless copper plating, so that the copper circuit thickness is 14 mu m.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxalate with the particle size of 300nm, 20 parts of sodium polycarboxylate, 7 parts of organosilicon compound, 10 parts of carbon black and 13 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and acetone are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 16 Pa.s is prepared.
Example 21
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the silicon rubber film according to a designed circuit diagram, then irradiating the silicon rubber film through a laser light source, wherein the wavelength of the laser light source is 355nm, the laser power is 10W, the laser frequency is 50KHz, the laser scanning speed is 200mm/s, and then placing the treated silicon rubber film in a conventional plating solution for electroless copper plating, so that the copper wire with the thickness of 12 mu m is obtained.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxide with the particle size of 100nm, 20 parts of sodium polycarboxylate, 5 parts of organosilicon compound, 10 parts of graphite and 15 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 18 Pa.s is prepared.
Example 22
A preparation method of the metal patterned circuit comprises the following steps: the method comprises the steps of coating the printing ink containing the laser sensitizer on the surface of glass according to a designed circuit diagram, irradiating the glass by a laser light source, wherein the wavelength of the laser light source is 532nm, the laser power is 10W, the laser frequency is 60KHz, the laser scanning speed is 1000mm/s, and then placing the treated glass in a conventional plating solution for electroless copper plating, so that the copper circuit thickness is 15 mu m.
The copper-containing ink comprises the following components in parts by weight: 60 parts of copper oxide with the particle size of 150nm, 20 parts of sodium polycarboxylate, 12 parts of polyurea, 5 parts of graphite and 3 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 16 Pa.s is prepared.
Example 23
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the polyphenylene sulfide film according to a designed circuit diagram, then irradiating the polyphenylene sulfide film through a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 10W, the laser frequency is 50KHz, the laser scanning speed is 2000mm/s, and then placing the treated polyphenylene sulfide film in a conventional plating solution for electroless copper plating, so that the copper wire thickness is 12 mu m.
The copper-containing ink comprises the following components in parts by weight: 40 parts of copper oxide with the particle size of 200nm, 30 parts of sodium polycarboxylate, 15 parts of organosilicon compound, 10 parts of carbon nano tube and 5 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and methanol are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 15 Pa.s is prepared.
Example 24
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the silicon wafer according to a designed circuit diagram, irradiating the silicon wafer by a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 15W, the laser frequency is 50KHz, the laser scanning speed is 3000mm/s, and then placing the treated silicon wafer in a conventional plating solution for electroless copper plating, so that the copper circuit thickness is 14 mu m.
The copper-containing ink comprises the following components in parts by weight: 60 parts of copper oxide with the particle size of 250nm, 20 parts of sodium polycarboxylate, 8 parts of organosilicon compound, 5 parts of graphite and 7 parts of cellulose acetate.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 18 Pa.s.
Example 25
A preparation method of the metal patterned circuit comprises the following steps: the method comprises the steps of coating the printing ink containing the laser sensitizer on the surface of wood according to a designed circuit diagram, irradiating the wood by a laser light source, wherein the wavelength of the laser light source is 1064nm, the laser power is 20W, the laser frequency is 50KHz, the laser scanning speed is 4000mm/s, and then placing the treated wood in a conventional plating solution for electroless copper plating, so that the copper circuit thickness is 13 mu m.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxide with the particle size of 300nm, 20 parts of sodium polycarboxylate, 6 parts of organosilicon compound, 5 parts of graphite and 9 parts of low-melting glass powder.
The preparation method comprises the following steps: and adding the materials and ethanol into a ball mill for grinding, and uniformly mixing by adopting a three-roll machine to prepare the metal ink with the viscosity of 20 Pa.s.
Comparative example 1
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the polyimide film according to a designed circuit diagram, and then placing the treated polyimide film in a conventional plating solution for electroless copper plating.
The copper-containing ink comprises the following components in parts by weight: 37 parts of basic copper phosphate with the particle size of 20nm, 30 parts of sodium polycarboxylate, 20 parts of organosilicon compound and 10 parts of graphite.
The preparation method of the copper-containing ink comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the printing ink with the viscosity of 2 Pa.s is prepared.
Comparative example 2
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the styrene thermoplastic elastomer film according to a designed circuit diagram, and then placing the treated styrene thermoplastic elastomer film in a conventional plating solution for electroless copper plating.
The copper-containing ink comprises the following components in parts by weight: 30 parts of basic copper carbonate with the particle size of 100nm, 25 parts of sodium polycarboxylate, 24 parts of organosilicon compound and 13 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and methanol are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 12 Pa.s is prepared.
Comparative example 3
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the polyimide film according to a designed circuit diagram, and then placing the treated polyimide film in a conventional plating solution for electroless copper plating.
The copper-containing ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with the particle size of 50nm, 30 parts of urea formaldehyde resin and 11 parts of organic silicon compound.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 14 Pa.s is prepared.
Comparative example 4
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the polyimide film according to a designed circuit diagram, and then placing the treated polyimide film in a conventional plating solution for electroless copper plating.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxalate with the particle size of 70nm, 20 parts of sodium polycarboxylate, 15 parts of organosilicon compound and 10 parts of graphite.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 14 Pa.s is prepared.
Comparative example 5
A preparation method of the metal patterned circuit comprises the following steps: and (3) coating the printing ink containing the laser sensitizer on the surface of the silicon rubber film according to a designed circuit diagram, and then placing the treated silicon rubber film in a conventional plating solution for electroless copper plating.
The copper-containing ink comprises the following components in parts by weight: 50 parts of copper oxide with the particle size of 100nm, 20 parts of sodium polycarboxylate, 5 parts of organosilicon compound and 15 parts of low-melting glass powder.
The preparation method comprises the following steps: the materials and water are added into a ball mill for grinding, and a three-roll machine is adopted for uniform mixing, so that the metal ink with the viscosity of 18 Pa.s is prepared.
Experimental example
The electroless plating effect of the metal wiring in examples 1 to 25 and comparative examples 1 to 5 was evaluated by visual inspection, the thickness of the copper plating layer was tested according to ASTM B568 (2009), the adhesion effect between the copper plating layer and the silicon wafer was evaluated according to ASTM D3359, the peel strength of the electroless copper plating layer was tested according to IPC-TM-650.4.28, the plating conductivity was tested according to GB/T351-2019 "method for measuring resistivity of metallic materials", and the test results are shown in Table 1.
Table 1: test results
The result shows that the application prints the ink on different base materials, then carries out activation treatment on the printed ink pattern by a surface laser light source, and finally places the workpiece in electroless copper plating solution to obtain the solar cell current collector. The metal patterned circuit prepared by the application has excellent conductivity, and the conductivity reaches 10 7 S.m, the adhesion between the metallic copper layer and the base material reaches the ASTM D3359 4B standard, the peel strength of the plating layer is more than 1.0N/mm, and the adhesive hasHas high adhesion effect and high conductivity. The application has simple operation flow and is very suitable for industrial production application. In comparative examples 1 to 5, no laser activation operation was performed, no active species were generated on the substrate, and elemental copper could not be attached to the substrate surface during the plating process, and thus no copper line was generated.
Claims (10)
1. The preparation method of the metal patterned circuit is characterized by comprising the following steps of: and (3) coating the printing ink containing the laser sensitizer on the surface of the substrate according to a designed circuit diagram, irradiating the substrate by a laser light source, and then placing the treated substrate in a plating solution for electroless copper plating.
2. The method of producing a metal patterned circuit according to claim 1, wherein the copper-containing ink comprises the following components in parts by weight: 30-60 parts of copper-containing laser sensitizer, 5-24 parts of thickener, 3-15 parts of adhesive, 20-30 parts of dispersing agent and 3-15 parts of light absorber.
3. The method of making a metal patterned circuit according to claim 1, wherein the copper-containing laser sensitizer comprises at least one of basic copper phosphate, basic copper carbonate, copper acetylacetonate, copper oxalate, and copper oxide; the particle size of the copper-containing laser sensitizer is 10-200nm.
4. The method of making a metal patterned circuit of claim 1 wherein the thickener comprises one of polydimethylsiloxane, polyurea, and polytetrafluoroethylene and the dispersant comprises one of sodium oleate, carboxylate salts, sulfate salts, sulfonate salts, quaternary ammonium salts, ethylene glycol, sodium polycarboxylate, acrylate, and polyurethane.
5. The method of manufacturing a metal patterned circuit of claim 1 wherein the binder comprises one of polyvinyl alcohol, urea formaldehyde resin, phenolic resin, cellulose acetate, cellulose nitrate, neoprene, nitrile rubber, polyacrylate, natural latex, and low melting glass frit.
6. The method of manufacturing a metal pattern line according to claim 1, wherein the solvent of the ink includes at least one of water, ethanol, methanol, acetone, tetrahydrofuran, methylene chloride, and cyclohexane, and the viscosity of the ink is 0.5 to 30 Pa-s.
7. The method of manufacturing a metal patterned circuit according to claim 1, wherein the substrate comprises one of a polyimide film, a polyethylene terephthalate film, a polybutylene terephthalate film, a polycarbonate film, a silicone rubber film, a styrene-based thermoplastic elastomer film, a polystyrene film, a polyphenylene sulfide film, and a liquid crystal polymer film.
8. The method for manufacturing a metal patterned circuit according to claim 1, wherein the laser light source is a plane laser light source, the laser wavelengths are 355nm, 532nm and 1064nm, the laser power is 1-300W, the laser frequency is 10-100KHz, and the laser scanning speed is 100-5000mm/s.
9. The method of manufacturing a metal pattern line according to claim 1, wherein the thickness of the metal pattern line is 8-20 μm.
10. A metal patterned circuit produced by the method of any one of claims 1-9.
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