CN108668455A - A kind of preparation method increasing material circuit for aluminum substrate LED - Google Patents
A kind of preparation method increasing material circuit for aluminum substrate LED Download PDFInfo
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- CN108668455A CN108668455A CN201810410002.6A CN201810410002A CN108668455A CN 108668455 A CN108668455 A CN 108668455A CN 201810410002 A CN201810410002 A CN 201810410002A CN 108668455 A CN108668455 A CN 108668455A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Microelectronics & Electronic Packaging (AREA)
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- Wood Science & Technology (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
A kind of preparation method increasing material circuit for aluminum substrate LED of disclosure of the invention, prepares conducting resinl, secondly coats insulating cement by the way of silk-screen printing either spraying on aluminum substrate and cured with the mode of heat cure or UV photocurings first；It is designed according to circuit, by the conducting resinl 3D printing of configuration or the mode of silk-screen printing, is printed on the aluminum substrate of coating insulating cement, heat cure or the mode of UV photocurings is used in combination to be cured；The aluminum substrate for printing conducting resinl is coated into solder mask, heat cure or the mode of UV photocurings is used in combination to be cured；Coating solder(ing) paste at the reserved pad of the aluminum substrate of solder mask will be coated, and carries out LED lamp bead patch, soldering is carried out to get LED circuit board using continuous tunnel furnace.This preparation method eliminates the corrosion link of copper foil, without using the acidic liquid of the environmental pollutions such as hydrochloric acid, sulfuric acid, non-pollutant discharge compared with the preparation process of traditional LED lamp.
Description
Technical field
The invention belongs to increases material manufacturing technology fields, and in particular to a kind of preparation side increasing material circuit for aluminum substrate LED
Method.
Background technology
Manufacturing Technology for PCB is an extremely complex, comprehensive very high processing technology.Especially in wet method
In process, a large amount of water need to be used, thus is discharged there are many heavy metal wastewater thereby and organic wastewater, complicated component, processing is difficult
It spends larger.It is calculated for 30%~40% by the utilization rate of printed circuit board copper foil, then the copper content in waste liquid, waste water
With regard to considerable.(being 35 microns per face copper thickness) is calculated by 10,000 square metres of dual platens, then the cupric in waste liquid, waste water
Amount just has 4500 kilograms or so, and also has many other heavy metals and noble metal.These are present in the metal in waste liquid, waste water
It is discharged if without processing, not only cause waste but also polluted environment.Therefore, finding one kind can reduce environmental pollution, produce
Preparation method simple for process, production cost is low improves enterprise so as to reduce the production cost of LED industry Lian Zhongge producers
The market competitiveness of industry.
Invention content
The object of the present invention is to provide a kind of preparation methods increasing material circuit for aluminum substrate LED, solve traditional LED and dissipate
There is a problem of that environmental pollution, cost are higher, technological process is complicated in the printed circuit preparation process of hot aluminum substrate.
The technical solution adopted in the present invention is a kind of preparation method increasing material circuit for aluminum substrate LED, specific steps
For：
Step 1, conducting resinl is prepared；
Step 2, insulating cement is coated by the way of silk-screen printing or spraying on aluminum substrate, and is cured；
Step 3, it is designed, the mode of conducting resinl 3D printing or silk-screen printing that step 1 is configured, is printed according to circuit
On the aluminum substrate for coating insulating cement in step 2, and cure；
Step 4, the aluminum substrate that conducting resinl is printed in step 3 is coated into solder mask, and cured；
Step 5, solder(ing) paste is coated at the reserved pad of the aluminum substrate of coating solder mask in step 4, and carries out LED
Lamp bead patch carries out soldering to get LED circuit board using continuous tunnel furnace.
The features of the present invention also characterized in that
Conductive filler used in conducting resinl is one kind in the powders such as copper powder, nickel powder, silver-coated copper powder, silver powder in step 1
Or several mixtures, grain size are 10nm~15 μm, shape is using a kind of or several in dendroid, sheet or the shapes such as spherical
Kind mixing；Organic carrier used be epoxy resin, phenolic resin, acrylic resin, polyimide resin, polyurethane resin,
One or more of resins such as epoxy acrylic resin；The mass ratio of conductive filler and organic carrier is 40~90：60~
10。
Filler in step 2 in edge glue used be white carbon, alundum (Al2O3) powder, beta-silicon nitride powder, aluminium nitride powder,
One or more of the powders such as boron nitride powder, titanium dioxide powder, barium sulfate powder mixture, grain size are the μ of 10nm~15
M, shape is using one or several kinds of mixing in dendroid, sheet or the shapes such as spherical；Organic carrier used is asphalt mixtures modified by epoxy resin
One kind in the resins such as fat, phenolic resin, acrylic resin, polyimide resin, polyurethane resin, epoxy acrylic resin or
It is several；The mass ratio of filler and organic carrier is 30~50：70~50；The curing mode used is solid for heat cure or UV light
Change, wherein the temperature of heat cure is 100 DEG C~150 DEG C, and hardening time is 0.5 hour~1 hour, the UV photocurings of UV photocurings
The power of machine is 1KW~5KW, and the transfer rate of conveyer belt is 1 m/min~10 ms/min, distance of the aluminum substrate apart from UV lamp
It is 3 centimetres~20 centimetres.
Curing mode is heat cure or UV photocurings in step 3, and the wherein temperature of heat cure is 80 DEG C~150 DEG C, Gu
It is 0.5 hour~2 hours to change the time, and the power of the UV photo solidification machines of UV photocurings is 1KW~20KW, the transfer rate of conveyer belt
It it is 1 m/min~10 ms/min, distance of the aluminum substrate apart from UV lamp is 3 centimetres~20 centimetres.
Filler is the powder such as white carbon, titanium dioxide powder, barium sulfate powder, talcum powder in solder mask used in step 4
One or more of body mixture, grain size are 10nm~50nm, and shape is using in dendroid, sheet or the shapes such as spherical
One or several kinds mixing；Organic carrier used is epoxy resin, phenolic resin, acrylic resin, polyimide resin, gathers
One or more of resins such as urethane resin, epoxy acrylic resin；The mass ratio of filler and organic carrier is 30~50：
70~50；The curing mode used can be heat cure or UV photocurings, and the wherein temperature of heat cure is 80 DEG C~150 DEG C, Gu
It is 0.5 hour~1 hour to change the time, and the power of the UV photo solidification machines of UV photocurings is 1KW~20KW, the transfer rate of conveyer belt
It it is 1 m/min~10 ms/min, distance of the aluminum substrate apart from UV lamp is 3 centimetres~20 centimetres.
The painting method of tin cream is method for printing screen in step 5, and the patch of LED uses LED chip mounter, soldering in tunnel
Maximum temperature be 250 degree~260 degree, the time be 3 minutes~5 minutes.
The invention has the advantages that
1. the present invention increases the preparation method of material circuit for aluminum substrate LED, by preparing conducting resinl, used on aluminum substrate
The mode of silk-screen printing or spraying coats insulating cement, and cures, and is designed according to circuit, the conducting resinl 3D that step 1 is configured
The mode of printing or silk-screen printing is printed on the aluminum substrate for coating insulating cement in step 2, and cures, and coats solder mask,
And cure, solder(ing) paste is coated at the reserved pad of aluminum substrate, and carry out LED lamp bead patch, soldering is carried out using continuous tunnel furnace,
Up to LED circuit board.
2. the present invention increases the preparation method of material circuit, compared with traditional printing circuit board technique, technique for aluminum substrate LED
Simply, efficient, it can be completed in a workshop, reduce the production process of traditional LED circuit board industry, reduce cost.
3. the present invention increases the preparation method of material circuit for aluminum substrate LED, intermediate compared with traditional printing circuit board technique
The etching process link for eliminating copper foil, has using water wisely, do not generate waste water, it is environmentally safe the advantages that.
Specific implementation mode
The present invention is described in detail With reference to embodiment.
The present invention provides a kind of preparation method increasing material circuit for aluminum substrate LED, is specifically implemented according to the following steps：
Step 1, conducting resinl is prepared；
Conductive filler used in conducting resinl is that the one or several kinds in copper powder, nickel powder, silver-coated copper powder, silver powder powder are mixed
Object is closed, grain size is 10nm~15 μm, and shape is using one or several kinds of mixing in dendroid, sheet or the shapes such as spherical；Institute
Organic carrier is epoxy resin, phenolic resin, acrylic resin, polyimide resin, polyurethane resin, epoxy acrylic
One or more of resins such as resin；The mass ratio of conductive filler and organic carrier is 40~90：60~10.
Step 2, insulating cement is coated by the way of silk-screen printing or spraying on aluminum substrate, and is cured；
Filler in edge glue used is white carbon, alundum (Al2O3) powder, beta-silicon nitride powder, aluminium nitride powder, boron nitride
One or more of the powders such as powder, titanium dioxide powder, barium sulfate powder mixture, grain size are 10nm~15 μm, shape
Using one or several kinds of mixing in dendroid, sheet or the shapes such as spherical；Organic carrier used is epoxy resin, phenolic aldehyde
One or more of resins such as resin, acrylic resin, polyimide resin, polyurethane resin, epoxy acrylic resin；It fills out
The mass ratio of material and organic carrier is 30~50：70~50；The curing mode used can be heat cure or UV photocurings,
The temperature of middle heat cure is 100 DEG C~150 DEG C, and hardening time is 0.5 hour~1 hour, the UV photo solidification machines of UV photocurings
Power is 1KW~5KW, and the transfer rate of conveyer belt is 1 m/min~10 ms/min, and distance of the aluminum substrate apart from UV lamp is 3
Centimetre~20 centimetres.
Step 3, it is designed, the mode of conducting resinl 3D printing or silk-screen printing that step 1 is configured, is printed according to circuit
On the aluminum substrate for coating insulating cement in step 2, and cure；
Curing mode can be heat cure or UV photocurings, and the wherein temperature of heat cure is 80 DEG C~150 DEG C, hardening time
It is 0.5 hour~2 hours, the power of the UV photo solidification machines of UV photocurings is 1KW~20KW, the transfer rate of conveyer belt is 1 meter/
Minute~10 ms/min, distance of the aluminum substrate apart from UV lamp is 3 centimetres~20 centimetres.
Step 4, the aluminum substrate that conducting resinl is printed in step 3 is coated into solder mask, and cured；
In solder mask filler be one kind in the powders such as white carbon, titanium dioxide powder, barium sulfate powder, talcum powder or
Several mixtures, grain size are 10nm~50nm, and shape is using the one or several kinds in dendroid, sheet or the shapes such as spherical
Mixing；Organic carrier used is epoxy resin, phenolic resin, acrylic resin, polyimide resin, polyurethane resin, ring
One or more of resins such as oxypropylene acid resin；The mass ratio of filler and organic carrier is 30~50：70~50；Using
Curing mode can be heat cure or UV photocurings, wherein the temperature of heat cure be 80 DEG C~150 DEG C, hardening time 0.5
Hour~1 hour, the power of the UV photo solidification machines of UV photocurings is 1KW~20KW, and the transfer rate of conveyer belt is 1 m/min
~10 ms/min, distance of the aluminum substrate apart from UV lamp is 3 centimetres~20 centimetres.
Step 5, solder(ing) paste is coated at the reserved pad of the aluminum substrate of coating solder mask in step 4, and carries out LED
Lamp bead patch carries out soldering to get LED circuit board using continuous tunnel furnace.
The painting method of tin cream is method for printing screen, and the patch of LED uses LED chip mounter, the highest of soldering in tunnel
Temperature is 250 degree~260 degree, and the time is 3 minutes~5 minutes.
The present invention increases the preparation method of material circuit for aluminum substrate LED, compared with traditional printing circuit board technique, technique letter
It is single, it is efficient, it can be completed in a workshop, reduce the production process of traditional LED circuit board industry, reduce cost.
The present invention increases the preparation method of material circuit for aluminum substrate LED, and compared with traditional printing circuit board technique, centre saves
The etching process link for having removed copper foil, has using water wisely, do not generate waste water, it is environmentally safe the advantages that.
Embodiment 1
Step 1, conducting resinl is prepared：Conductive filler used in conducting resinl is copper powder, and grain size is 15 μm, and shape uses branch
Shape；Organic carrier used is epoxy resin, phenolic resin and acrylic resin；Conductive filler (copper powder)：The matter of organic carrier
Amount ratio is 90：10, wherein in organic carrier, epoxy resin：Phenolic resin：The mass ratio of acrylic resin is 8：1：1.
Step 2, insulating cement is coated by the way of silk-screen printing or spraying on aluminum substrate, and is cured：Edge glue used
In filler be white carbon and alundum (Al2O3) powder, grain size 10nm, shape use sheet；Organic carrier used is epoxy
Resin, phenolic resin, acrylic resin and epoxy acrylic resin；Filler：The mass ratio of organic carrier is 30：70, wherein
White carbon in filler：The mass ratio of alundum (Al2O3) is 10：20, organic carrier epoxy resin：Phenolic resin：Acrylic acid tree
Fat：The mass ratio of epoxy acrylic resin is 30：10：10：20.The curing mode used is heat cure, wherein heat cure
Temperature is 150 DEG C, and hardening time is 0.5 hour.
Step 3, it is designed, the mode of conducting resinl 3D printing or silk-screen printing that step 1 is configured, is printed according to circuit
On the aluminum substrate for coating insulating cement in step 2, and cure：Curing mode can be heat cure, and the temperature of heat cure is 150 DEG C,
Hardening time is 0.5 hour.
Step 4, the aluminum substrate that conducting resinl is printed in step 3 is coated into solder mask, and cured：Filler is in solder mask
Talcum powder, grain size 10nm, shape is using spherical；Organic carrier used is epoxy resin；Filler (talcum powder)：Asphalt mixtures modified by epoxy resin
The mass ratio of fat is 30：70；The curing mode used can be heat cure, and wherein the temperature of heat cure is 150 DEG C, hardening time
It is 0.5 hour.
Step 5, solder(ing) paste is coated at the reserved pad of the aluminum substrate of coating solder mask in step 4, and carries out LED
Lamp bead patch carries out soldering to get LED circuit board using continuous tunnel furnace：The painting method of tin cream is method for printing screen, LED's
Patch uses dedicated LED chip mounter, and the maximum temperature of soldering is 255 degree in tunnel, and the time is 5 minutes.
Embodiment 2
Step 1, conducting resinl is prepared：Conductive filler used in conducting resinl is nickel powder, and grain size is 10 μm, and shape uses branch
Shape；Organic carrier used is epoxy resin, phenolic resin and acrylic resin；Conductive filler (nickel powder)：The matter of organic carrier
Amount ratio is 40：60, wherein organic carrier epoxy resin：Phenolic resin：The mass ratio of acrylic resin is 30：10：
20。
Step 2, insulating cement is coated by the way of silk-screen printing or spraying on aluminum substrate, and is cured：Edge glue used
In filler be white carbon and alundum (Al2O3) powder, grain size be 10 μm, shape use sheet；Organic carrier used is epoxy
Resin, phenolic resin, acrylic resin and epoxy acrylic resin；Filler：The mass ratio of organic carrier is 40：60, wherein
White carbon in filler：The mass ratio of alundum (Al2O3) is 20：20, organic carrier epoxy resin：Phenolic resin：Acrylic acid tree
Fat：The mass ratio of epoxy acrylic resin is 30：10：10：10；The curing mode used can be UV photocurings, wherein UV light
The power of cured UV photo solidification machines is 5KW, and the transfer rate of conveyer belt is 4 ms/min, and distance of the aluminum substrate apart from UV lamp is
10 centimetres.
Step 3, it is designed, the mode of conducting resinl 3D printing or silk-screen printing that step 1 is configured, is printed according to circuit
On the aluminum substrate for coating insulating cement in step 2, and cure：Curing mode can be heat cure, and the temperature of heat cure is 150 DEG C,
Hardening time is 0.5 hour.
Step 4, the aluminum substrate that conducting resinl is printed in step 3 is coated into solder mask, and cured：Filler is in solder mask
Talcum powder, grain size 50nm, shape is using spherical；Organic carrier used is epoxy acrylic resin；Talcum powder：Epoxy third
The mass ratio of olefin(e) acid resin is 50：50；The curing mode used can be UV photocurings, wherein the UV photo solidification machines of UV photocurings
Power be 10KW, the transfer rate of conveyer belt is 4 ms/min, and distance of the aluminum substrate apart from UV lamp is 10 centimetres.
Step 5, solder(ing) paste is coated at the reserved pad of the aluminum substrate of coating solder mask in step 4, and carries out LED
Lamp bead patch carries out soldering to get LED circuit board using continuous tunnel furnace：The painting method of tin cream is method for printing screen, LED's
Patch uses dedicated LED chip mounter, and the maximum temperature of soldering is 260 degree in tunnel, and the time is 3 minutes.
Embodiment 3
Step 1, conducting resinl is prepared：Conductive filler used in conducting resinl is silver-coated copper powder, grain size 10nm, shape use
It is spherical；Organic carrier used is epoxy resin, phenolic resin and acrylic resin；Conductive filler (silver-coated copper powder)：Have airborne
The mass ratio of body is 70：30, wherein organic carrier epoxy resin：Phenolic resin：The mass ratio of acrylic resin is
20：5：5.
Step 2, insulating cement is coated by the way of silk-screen printing or spraying on aluminum substrate, and is cured：Edge glue used
In filler be white carbon and alundum (Al2O3) powder, grain size be 10 μm, shape use sheet；Organic carrier used is epoxy
Resin, phenolic resin, acrylic resin and epoxy acrylic resin；Filler：The mass ratio of organic carrier is 30：70, wherein
White carbon in filler：The mass ratio of alundum (Al2O3) is 10：20, organic carrier epoxy resin：Phenolic resin：Acrylic acid tree
Fat：The mass ratio of epoxy acrylic resin is 30：10：10：20；The curing mode used can be heat cure, wherein heat cure
Temperature be 120 DEG C, hardening time be 0.75 hour.
Step 3, it is designed, the mode of conducting resinl 3D printing or silk-screen printing that step 1 is configured, is printed according to circuit
On the aluminum substrate for coating insulating cement in step 2, and cure：Curing mode can be heat cure, and the temperature of heat cure is 100 DEG C,
Hardening time is 1 hour.
Step 4, the aluminum substrate that conducting resinl is printed in step 3 is coated into solder mask, and cured：Filler is in solder mask
Talcum powder, grain size 30nm, shape is using spherical；Organic carrier used is epoxy resin；Talcum powder：Epoxy acrylic tree
The mass ratio of fat is 40：60；The curing mode used can be UV photocurings, wherein the power of the UV photo solidification machines of UV photocurings
Transfer rate for 10KW, conveyer belt is 4 ms/min, and distance of the aluminum substrate apart from UV lamp is 10 centimetres.
Step 5, solder(ing) paste is coated at the reserved pad of the aluminum substrate of coating solder mask in step 4, and carries out LED
Lamp bead patch carries out soldering to get LED circuit board using continuous tunnel furnace：The painting method of tin cream is method for printing screen, LED's
Patch uses dedicated LED chip mounter, and the maximum temperature of soldering is 260 degree in tunnel, and the time is 5 minutes.
Embodiment 4
Step 1, conducting resinl is prepared：Conductive filler used in conducting resinl is silver-coated copper powder, and grain size is 15 μm, and shape uses
Sheet；Organic carrier used is epoxy acrylic resin；Silver-coated copper powder：The mass ratio of epoxy acrylic resin is 65：35.
Step 2, insulating cement is coated by the way of silk-screen printing or spraying on aluminum substrate, and is cured：Edge glue used
In filler be white carbon and alundum (Al2O3) powder, grain size 10nm, shape use sheet；Organic carrier used is epoxy
Resin, phenolic resin, acrylic resin and epoxy acrylic resin；Filler：The mass ratio of organic carrier is 30：70, wherein
White carbon in filler：The mass ratio of alundum (Al2O3) is 10：20, organic carrier epoxy resin：Phenolic resin：Acrylic acid tree
Fat：The mass ratio of epoxy acrylic resin is 30：10：10：20；The curing mode used can be heat cure, wherein heat cure
Temperature be 100 DEG C, hardening time be 1 hour.
Step 3, it is designed, the mode of conducting resinl 3D printing or silk-screen printing that step 1 is configured, is printed according to circuit
On the aluminum substrate for coating insulating cement in step 2, and cure：Curing mode can be heat cure, and the temperature of heat cure is 80 DEG C, Gu
It is 2 hours to change the time.
Step 4, the aluminum substrate that conducting resinl is printed in step 3 is coated into solder mask, and cured：Filler is in solder mask
Talcum powder, grain size 10nm, shape is using spherical；Organic carrier used is epoxy resin；Talcum powder：Epoxy acrylic tree
The mass ratio of fat is 30：70；The curing mode used can be UV photocurings, wherein the power of the UV photo solidification machines of UV photocurings
Transfer rate for 1KW, conveyer belt is 1 m/min, and distance of the aluminum substrate apart from UV lamp is 3 centimetres.
Step 5, solder(ing) paste is coated at the reserved pad of the aluminum substrate of coating solder mask in step 4, and carries out LED
Lamp bead patch carries out soldering to get LED circuit board using continuous tunnel furnace：The painting method of tin cream is method for printing screen, LED's
Patch uses dedicated LED chip mounter, and the maximum temperature of soldering is 250 degree in tunnel, and the time is 5 minutes.
Embodiment 5
Step 1, conducting resinl is prepared：Conductive filler used in conducting resinl is silver-coated copper powder and nickel powder, and grain size is 15 μm, shape
Shape uses sheet；Organic carrier used is epoxy acrylic resin；Silver-coated copper powder：Nickel powder：The quality of epoxy acrylic resin
Ratio is 35：：30：35.
Step 2, insulating cement is coated by the way of silk-screen printing or spraying on aluminum substrate, and is cured：Edge glue used
In filler be white carbon and alundum (Al2O3) powder, grain size be 15 μm, shape use sheet；Organic carrier used is epoxy
Resin, phenolic resin, acrylic resin and epoxy acrylic resin；Filler：The mass ratio of organic carrier is 50：50, wherein
White carbon in filler：The mass ratio of alundum (Al2O3) is 30：20, organic carrier epoxy resin：Phenolic resin：Acrylic acid tree
Fat：The mass ratio of epoxy acrylic resin is 10：10：10：20；The curing mode used can be heat cure, wherein heat cure
Temperature be 150 DEG C, hardening time be 0.5 hour.
Step 3, it is designed, the mode of conducting resinl 3D printing or silk-screen printing that step 1 is configured, is printed according to circuit
On the aluminum substrate for coating insulating cement in step 2, and cure：Curing mode can be heat cure, and the temperature of heat cure is 150 DEG C,
Hardening time is 0.5 hour.
Step 4, the aluminum substrate that conducting resinl is printed in step 3 is coated into solder mask, and cured：Filler is in solder mask
Talcum powder, grain size 10nm, shape is using spherical；Organic carrier used is epoxy resin；Talcum powder：Epoxy acrylic tree
The mass ratio of fat is 50：50；The curing mode used can be UV photocurings, wherein the power of the UV photo solidification machines of UV photocurings
Transfer rate for 20KW, conveyer belt is 10 ms/min, and distance of the aluminum substrate apart from UV lamp is 20 centimetres.
Step 5, solder(ing) paste is coated at the reserved pad of the aluminum substrate of coating solder mask in step 4, and carries out LED
Lamp bead patch carries out soldering to get LED circuit board using continuous tunnel furnace：The painting method of tin cream is method for printing screen, LED's
Patch uses dedicated LED chip mounter, and the maximum temperature of soldering is 260 degree in tunnel, and the time is 3 minutes.
Claims (6)
1. a kind of preparation method increasing material circuit for aluminum substrate LED, which is characterized in that the specific steps are：
Step 1, conducting resinl is prepared；
Step 2, insulating cement is coated by the way of silk-screen printing or spraying on aluminum substrate, and is cured；
Step 3, it is designed according to circuit, the mode of conducting resinl 3D printing or silk-screen printing that step 1 is configured is printed in step
On the aluminum substrate for coating insulating cement in rapid 2, and cure；
Step 4, the aluminum substrate that conducting resinl is printed in step 3 is coated into solder mask, and cured；
Step 5, solder(ing) paste is coated at the reserved pad of the aluminum substrate of coating solder mask in step 4, and carries out LED lamp bead
Patch carries out soldering to get LED circuit board using continuous tunnel furnace.
2. a kind of preparation method increasing material circuit for aluminum substrate LED according to claim 1, which is characterized in that step 1
Conductive filler used in middle conducting resinl is one or several kinds of mixing in the powders such as copper powder, nickel powder, silver-coated copper powder, silver powder
Object, grain size are 10nm~15 μm, and shape is using one or several kinds of mixing in dendroid, sheet or the shapes such as spherical；It is used
Organic carrier be epoxy resin, phenolic resin, acrylic resin, polyimide resin, polyurethane resin, epoxy acrylic tree
One or more of resins such as fat；The mass ratio of conductive filler and organic carrier is 40~90：60~10.
3. a kind of preparation method increasing material circuit for aluminum substrate LED according to claim 1, which is characterized in that step 2
In filler in edge glue used be white carbon, alundum (Al2O3) powder, beta-silicon nitride powder, aluminium nitride powder, boron nitride powder, two
One or more of the powders such as titanium oxide powder, barium sulfate powder mixture, grain size are 10nm~15 μm, and shape uses branch
One or several kinds of mixing in shape, sheet or the shapes such as spherical；Organic carrier used is epoxy resin, phenolic resin, third
One or more of resins such as olefin(e) acid resin, polyimide resin, polyurethane resin, epoxy acrylic resin；Filler with have
The mass ratio of airborne body is 30~50：70~50；The curing mode used is heat cure or UV photocurings, wherein heat cure
Temperature be 100 DEG C~150 DEG C, hardening time is 0.5 hour~1 hour, and the power of the UV photo solidification machines of UV photocurings is 1KW
The transfer rate of~5KW, conveyer belt are 1 m/min~10 ms/min, and distance of the aluminum substrate apart from UV lamp is 3 centimetres~20 lis
Rice.
4. a kind of preparation method increasing material circuit for aluminum substrate LED according to claim 1, which is characterized in that step 3
Middle curing mode is heat cure or UV photocurings, and the wherein temperature of heat cure is 80 DEG C~150 DEG C, and hardening time is 0.5 small
When~2 hours, the power of the UV photo solidification machines of UV photocurings is 1KW~20KW, the transfer rate of conveyer belt is 1 m/min~
10 ms/min, distance of the aluminum substrate apart from UV lamp is 3 centimetres~20 centimetres.
5. a kind of preparation method increasing material circuit for aluminum substrate LED according to claim 1, which is characterized in that step 4
In in solder mask used filler be one kind or several in the powders such as white carbon, titanium dioxide powder, barium sulfate powder, talcum powder
Kind of mixture, grain size are 10nm~50nm, and shape is mixed using the one or several kinds in dendroid, sheet or the shapes such as spherical
It closes；Organic carrier used is epoxy resin, phenolic resin, acrylic resin, polyimide resin, polyurethane resin, epoxy
One or more of resins such as acrylic resin；The mass ratio of filler and organic carrier is 30~50：70~50；It uses
Curing mode can be heat cure or UV photocurings, and the wherein temperature of heat cure is 80 DEG C~150 DEG C, and hardening time is 0.5 small
When~1 hour, the power of the UV photo solidification machines of UV photocurings is 1KW~20KW, the transfer rate of conveyer belt is 1 m/min~
10 ms/min, distance of the aluminum substrate apart from UV lamp is 3 centimetres~20 centimetres.
6. a kind of preparation method increasing material circuit for aluminum substrate LED according to claim 1, which is characterized in that step 5
The painting method of middle tin cream is method for printing screen, and the patch of LED uses LED chip mounter, and the maximum temperature of soldering is in tunnel
250 degree~260 degree, the time is 3 minutes~5 minutes.
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| CN110105867A (en) * | 2019-04-20 | 2019-08-09 | 无锡天杨电子有限公司 | A kind of formula and preparation method thereof of ceramic copper-clad plate high-temperature resistant welding resistance |
| CN110819166A (en) * | 2019-11-25 | 2020-02-21 | 武汉绿之美铸造材料有限公司 | Enhanced special ink for 3D printing |
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Application publication date: 20181016 |