CN110105867A - A kind of formula and preparation method thereof of ceramic copper-clad plate high-temperature resistant welding resistance - Google Patents
A kind of formula and preparation method thereof of ceramic copper-clad plate high-temperature resistant welding resistance Download PDFInfo
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- CN110105867A CN110105867A CN201910320499.7A CN201910320499A CN110105867A CN 110105867 A CN110105867 A CN 110105867A CN 201910320499 A CN201910320499 A CN 201910320499A CN 110105867 A CN110105867 A CN 110105867A
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- welding resistance
- clad plate
- temperature resistant
- ceramic copper
- resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/16—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Wood Science & Technology (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Ceramic Products (AREA)
Abstract
The invention discloses a kind of formula of ceramic copper-clad plate high-temperature resistant welding resistance, the major ingredient including following weight percent: the inorganic filler of resin, 0.5%-5% of 30%-60%, the mixed solvent of 35%-70% and 0.1%-1% defoaming agent；Include the following steps；Step 1: being sufficiently stirred in the environment of 60-80 DEG C after resin, mixed solvent and defoaming agent are mixed, and after resin dispersion is uniform, is put into inorganic filler and continues to stir 1h, be prepared into welding resistance glue；Step 2: after welding resistance glue natural cooling, then carry out vacuum defoamation；Step 3: by silk-screen printing, by solder mask silk-screen in product surface；Step 4: the product for being printed on welding resistance is put into 100 DEG C of baking oven 15 minutes, preliminary surface drying is carried out；Step 5: the product of preliminary surface drying to be put into 150 DEG C of vacuum drying oven, heat preservation 2h is solidified；Solder mask produced by the invention has good high temperature tolerance energy, ensure that the availability, reliability and durability issues of ceramic copper-clad plate subsequent product, it is ensured that the quality of workpiece.
Description
Technical field
The present invention relates to ceramic copper-clad plate technical field, the formula of specially a kind of ceramic copper-clad plate high-temperature resistant welding resistance and its
Preparation method.
Background technique
Ceramic copper-clad plate solder mask is the permanent resist coated in printing board surface, it selectively protects printed board
Surface prevents from that short circuit, bridge joint occurs when welding component between conducting wire and pad, in addition, it also has moisture-proof, mould proof, salt spray proof
Effect, therefore, the quality of welding resistance film quality not only influences the appearance of printed board, but also will affect the service life of printed board；
The heatproof of solder mask is usually at 280 DEG C or so, but with the continuous utilization of carbonization silicon chip, but its higher heat condition
To the heatproof situation of solder mask more stringent requirements are proposed therefore, high-temperature resistant quality conditions are not only related to ceramic copper-clad plate
The problem of finished product, and directly influence the availability, reliability and durability issues of ceramic copper-clad plate subsequent product.
Summary of the invention
The purpose of the present invention is to provide a kind of formulas and preparation method thereof of ceramic copper-clad plate high-temperature resistant welding resistance, to solve
The problems mentioned above in the background art.
To achieve the above object, the invention provides the following technical scheme: a kind of formula of ceramic copper-clad plate high-temperature resistant welding resistance,
Major ingredient including following weight percent: the inorganic filler of resin, 0.5%-5% of 30%-60%, the mixed solvent of 35%-70% and
The defoaming agent of 0.1%-1%.
Preferably, the resin is in organosilicon polysilazane, Perhydropolysilazane, polyimides or cyanate resin
It is a kind of.
Preferably, the inorganic filler is one or more of carbon black, gas silica or titanium dioxide.
Preferably, the mixed solvent is isophorone, two formicester of succinic acid, n-butyl ether, butyl acetate, diethylene glycol two
The one or more of butyl ether.
Preferably, the mixed solvent is two formicester of two formicester of adipic acid and glutaric acid, and ratio is classified as 3:2.
Preferably, the defoaming agent is silicone emulsion, the fatty acid ester compounded object of higher alcohols, polyoxyethylene polyoxypropylene season penta
Four alcohol ethers, polyoxyethylene polyoxy propyl alcohol amidogen ether, polypropylene glycerol aether, polyoxyethylene polyoxypropylene glycerin ether or poly dimethyl silicon
The one or more of oxygen alkane.
A kind of preparation method of ceramic copper-clad plate high-temperature resistant welding resistance, includes the following steps；
Step 1: it is sufficiently stirred in the environment of 60-80 DEG C after resin, mixed solvent and defoaming agent are mixed, to resin dispersion
After uniformly, it is put into inorganic filler and continues to stir 1h, be prepared into welding resistance glue；
Step 2: after welding resistance glue natural cooling, then carry out vacuum defoamation；
Step 3: by silk-screen printing, by solder mask silk-screen in product surface；
Step 4: the product for being printed on welding resistance is put into 100 DEG C of baking oven 15 minutes, preliminary surface drying is carried out；
Step 5: the product of preliminary surface drying to be put into 150 DEG C of vacuum drying oven, heat preservation 2h is solidified.
Preferably, in step 1, major ingredient by weight percentage is dispersing than weighing resin, mixed solvent and defoaming agent
After high speed dispersion is uniform on machine, refilters and remove mechanical admixture and coarse grain, stirred under 800-1000RPM revolving speed with high speed disperser
It mixes to 2-3h, the inorganic filler that weight percent is added stirs evenly 1h in revolving speed 600-800RPM with high speed disperser.
A kind of formula and preparation method thereof of ceramic copper-clad plate high-temperature resistant welding resistance proposed by the present invention, beneficial effect is:
1, welding resistance formula of the invention has the characteristics that low solidification temperature, excellent heat resistance, soldering resistance, yellowing resistance, and
And curing rate is fast, the protection especially suitable for ceramic copper-clad plate；
2, preparation method of the present invention is simple to operation, environmentally friendly, is suitble to industrialization, and the solder mask of production has good height
Heat resistance ensure that the availability, reliability and durability issues of ceramic copper-clad plate subsequent product, it is ensured that the matter of workpiece
Amount.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical solution in the embodiment of the present invention is clearly and completely retouched
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Embodiment 1, the present invention provide a kind of technical solution: a kind of formula of ceramic copper-clad plate high-temperature resistant welding resistance, including with
The major ingredient of lower weight percent: 50% resin, 3% inorganic filler, 46% mixed solvent and 1% defoaming agent；
The resin is cyanate resin；
The inorganic filler is carbon black and gas silica；
The mixed solvent is two formicester of two formicester of adipic acid and glutaric acid, and ratio is classified as 3:2；
The defoaming agent is silicone emulsion, the fatty acid ester compounded object of higher alcohols, polyoxyethylene polyoxypropylene pentaerythrite ether and gathers
Ethylene oxide polyoxy propyl alcohol amidogen ether；
A kind of preparation method of ceramic copper-clad plate high-temperature resistant welding resistance, includes the following steps；
Step 1: being sufficiently stirred in the environment of 75 DEG C after resin, mixed solvent and defoaming agent are mixed, uniform to resin dispersion
Afterwards, it is put into inorganic filler and continues to stir 1h, be prepared into welding resistance glue；
Major ingredient by weight percentage is than weighing resin, mixed solvent and defoaming agent, after high speed dispersion is uniform on dispersion machine, then
It is filtered to remove mechanical admixture and coarse grain, is stirred under 900RPM revolving speed to 2.5h with high speed disperser, weight percent is added
Inorganic filler stir evenly 1h in revolving speed 750RPM with high speed disperser；
Step 2: after welding resistance glue natural cooling, then carry out vacuum defoamation；
Step 3: by silk-screen printing, by solder mask silk-screen in product surface；
Step 4: the product for being printed on welding resistance is put into 100 DEG C of baking oven 15 minutes, preliminary surface drying is carried out；
Step 5: the product of preliminary surface drying to be put into 150 DEG C of vacuum drying oven, heat preservation 2h is solidified.
Embodiment 2, the present invention provide a kind of technical solution: a kind of formula of ceramic copper-clad plate high-temperature resistant welding resistance, including with
The major ingredient of lower weight percent: 55% resin, 3% inorganic filler, 41.5% mixed solvent and 0.5% defoaming agent；
The resin is organosilicon polysilazane；
The inorganic filler is carbon black and titanium dioxide；
The mixed solvent is two formicester of two formicester of adipic acid and glutaric acid, and ratio is classified as 3:2；
The defoaming agent is silicone emulsion, the fatty acid ester compounded object of higher alcohols and polyoxyethylene polyoxypropylene pentaerythrite ether；
A kind of preparation method of ceramic copper-clad plate high-temperature resistant welding resistance, includes the following steps；
Step 1: being sufficiently stirred in the environment of 80 DEG C after resin, mixed solvent and defoaming agent are mixed, uniform to resin dispersion
Afterwards, it is put into inorganic filler and continues to stir 1h, be prepared into welding resistance glue；
Major ingredient by weight percentage is than weighing resin, mixed solvent and defoaming agent, after high speed dispersion is uniform on dispersion machine, then
It is filtered to remove mechanical admixture and coarse grain, is stirred under 1000RPM revolving speed to after 3 with high speed disperser, weight percent is added
Inorganic filler stirs evenly 1h in revolving speed 650RPM with high speed disperser；
Step 2: after welding resistance glue natural cooling, then carry out vacuum defoamation；
Step 3: by silk-screen printing, by solder mask silk-screen in product surface；
Step 4: the product for being printed on welding resistance is put into 100 DEG C of baking oven 15 minutes, preliminary surface drying is carried out；
Step 5: the product of preliminary surface drying to be put into 150 DEG C of vacuum drying oven, heat preservation 2h is solidified.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (8)
1. a kind of formula of ceramic copper-clad plate high-temperature resistant welding resistance, it is characterised in that: the major ingredient including following weight percent: 30%-
60% inorganic filler of resin, 0.5%-5%, the mixed solvent of 35%-70% and 0.1%-1% defoaming agent.
2. a kind of formula of ceramic copper-clad plate high-temperature resistant welding resistance according to claim 1, it is characterised in that: the resin is
One of organosilicon polysilazane, Perhydropolysilazane, polyimides or cyanate resin.
3. a kind of formula of ceramic copper-clad plate high-temperature resistant welding resistance according to claim 1, it is characterised in that: described inorganic to fill out
Material is one or more of carbon black, gas silica or titanium dioxide.
4. a kind of formula of ceramic copper-clad plate high-temperature resistant welding resistance according to claim 1, it is characterised in that: the mixing is molten
Agent is isophorone, two formicester of succinic acid, the one or more of n-butyl ether, butyl acetate, dibutyl ethylene glycol ether.
5. a kind of formula of ceramic copper-clad plate high-temperature resistant welding resistance according to claim 4, it is characterised in that: the mixing is molten
Agent is two formicester of two formicester of adipic acid and glutaric acid, and ratio is classified as 3:2.
6. a kind of formula of ceramic copper-clad plate high-temperature resistant welding resistance according to claim 1, it is characterised in that: the defoaming agent
For silicone emulsion, the fatty acid ester compounded object of higher alcohols, polyoxyethylene polyoxypropylene pentaerythrite ether, polyoxyethylene polyoxy Propanolamine
The one or more of ether, polypropylene glycerol aether, polyoxyethylene polyoxypropylene glycerin ether or dimethyl silicone polymer.
7. a kind of preparation method of ceramic copper-clad plate high-temperature resistant welding resistance, it is characterised in that: include the following steps；
Step 1: it is sufficiently stirred in the environment of 60-80 DEG C after resin, mixed solvent and defoaming agent are mixed, to resin dispersion
After uniformly, it is put into inorganic filler and continues to stir 1h, be prepared into welding resistance glue；
Step 2: after welding resistance glue natural cooling, then carry out vacuum defoamation；
Step 3: by silk-screen printing, by solder mask silk-screen in product surface；
Step 4: the product for being printed on welding resistance is put into 100 DEG C of baking oven 15 minutes, preliminary surface drying is carried out；
Step 5: the product of preliminary surface drying to be put into 150 DEG C of vacuum drying oven, heat preservation 2h is solidified.
8. a kind of preparation method of ceramic copper-clad plate high-temperature resistant welding resistance according to claim 1, it is characterised in that: step 1
In, major ingredient by weight percentage is than weighing resin, mixed solvent and defoaming agent, after high speed dispersion is uniform on dispersion machine, then
It is filtered to remove mechanical admixture and coarse grain, is stirred under 800-1000RPM revolving speed to 2-3h with high speed disperser, weight hundred is added
The inorganic filler of ratio is divided to stir evenly 1h in revolving speed 600-800RPM with high speed disperser.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910320499.7A CN110105867A (en) | 2019-04-20 | 2019-04-20 | A kind of formula and preparation method thereof of ceramic copper-clad plate high-temperature resistant welding resistance |
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| CN201910320499.7A CN110105867A (en) | 2019-04-20 | 2019-04-20 | A kind of formula and preparation method thereof of ceramic copper-clad plate high-temperature resistant welding resistance |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111009713A (en) * | 2019-12-10 | 2020-04-14 | 深圳顺络电子股份有限公司 | Surface treatment method of microwave dielectric ceramic filter |
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| CN101945952A (en) * | 2008-03-21 | 2011-01-12 | 昭和电工株式会社 | Resin composition and cured film thereof |
| CN102020830A (en) * | 2010-12-23 | 2011-04-20 | 广东生益科技股份有限公司 | Halogen-free fire resistance resin composite and application thereof |
| CN102585607A (en) * | 2012-03-28 | 2012-07-18 | 成都多吉昌新材料有限公司 | Solder mask ink composite and method for manufacturing solder mask layer of light-emitting diode (LED) circuit board |
| CN103881473A (en) * | 2014-04-01 | 2014-06-25 | 恒昌涂料（惠阳）有限公司 | Yellowing-resistant photosensitive solder resist ink and preparation method thereof |
| CN108219585A (en) * | 2018-02-11 | 2018-06-29 | 广州森川合成材料有限公司 | A kind of PCB aqueous sensitizings solder mask and preparation method thereof |
| CN108668455A (en) * | 2018-05-02 | 2018-10-16 | 西安工程大学 | A kind of preparation method increasing material circuit for aluminum substrate LED |
-
2019
- 2019-04-20 CN CN201910320499.7A patent/CN110105867A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1544550A (en) * | 2003-11-21 | 2004-11-10 | 大化集团有限责任公司 | Hot curing solder resistant printing-ink composition |
| CN101945952A (en) * | 2008-03-21 | 2011-01-12 | 昭和电工株式会社 | Resin composition and cured film thereof |
| CN102020830A (en) * | 2010-12-23 | 2011-04-20 | 广东生益科技股份有限公司 | Halogen-free fire resistance resin composite and application thereof |
| CN102585607A (en) * | 2012-03-28 | 2012-07-18 | 成都多吉昌新材料有限公司 | Solder mask ink composite and method for manufacturing solder mask layer of light-emitting diode (LED) circuit board |
| CN103881473A (en) * | 2014-04-01 | 2014-06-25 | 恒昌涂料（惠阳）有限公司 | Yellowing-resistant photosensitive solder resist ink and preparation method thereof |
| CN108219585A (en) * | 2018-02-11 | 2018-06-29 | 广州森川合成材料有限公司 | A kind of PCB aqueous sensitizings solder mask and preparation method thereof |
| CN108668455A (en) * | 2018-05-02 | 2018-10-16 | 西安工程大学 | A kind of preparation method increasing material circuit for aluminum substrate LED |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111009713A (en) * | 2019-12-10 | 2020-04-14 | 深圳顺络电子股份有限公司 | Surface treatment method of microwave dielectric ceramic filter |
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Application publication date: 20190809 |