CN114479732A - Epoxy adhesive, polyimide cover film and printing screen - Google Patents
Epoxy adhesive, polyimide cover film and printing screen Download PDFInfo
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- CN114479732A CN114479732A CN202111627768.8A CN202111627768A CN114479732A CN 114479732 A CN114479732 A CN 114479732A CN 202111627768 A CN202111627768 A CN 202111627768A CN 114479732 A CN114479732 A CN 114479732A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides an epoxy adhesive, a polyimide cover film and a printing screen. The epoxy adhesive comprises 45-60% of epoxy resin, 15-30% of tackifying resin, 20-30% of film forming resin, 0.5-1.5% of ultraviolet absorbent and 0.2-1% of curing accelerator, wherein the tackifying resin at least comprises rosin resin and phenolic resin. When the polyimide cover film is used for carrying out laser engraving on the printing screen plate, the cutting gradient of the polyimide film and the bonding layer is small, a thinner circuit diagram is formed, the service life of the printing screen plate is effectively prolonged, the material cost is saved, and the replacement working hour of a production line is saved.
Description
Technical Field
The invention belongs to the field of adhesives, and particularly relates to an epoxy adhesive, a polyimide cover film and a printing screen.
Background
Photosensitive ink adopted by a traditional printing screen plate is coated on a steel mesh, and then a desired line is obtained in a film exposure and liquid medicine developing and removing mode. The traditional method has the disadvantages of large chemical pollution, short service life cycle of the obtained printing screen plate, influence on production efficiency due to the fact that the screen plate needs to be replaced ordinarily on a production line using the screen plate, and waste of ink, silver paste and the like on the production line.
In the previous research, in order to solve the above problems of the conventional printing screen, the inventor proposed an epoxy adhesive and a cover film, see patent CN112778937A for details, and with the intensive research, we hope to further improve the performance of the polyimide cover film, especially hope to form finer lines by reducing the cutting gradient of the polyimide film and the adhesive layer during laser processing, and for this reason, the inventor has further adjusted the formulation of the epoxy adhesive.
Disclosure of Invention
The invention aims to provide an epoxy adhesive, a polyimide cover film and a printing screen plate, which can further improve the printing times of the printing screen plate, prolong the service life of the printing screen plate, further improve the production efficiency and reduce the waste of raw materials such as printing ink or silver paste.
In order to solve the technical problems, the invention adopts the following technical scheme:
an epoxy adhesive comprises 45-60% of epoxy resin, 15-30% of tackifying resin, 20-30% of film forming resin, 0.5-1.5% of ultraviolet absorbent and 0.2-0.8% of curing accelerator, wherein the tackifying resin is two or more of rosin resin, rosin derivatives, terpene resin, petroleum resin, dicyclopentadiene resin, coumarone-indene resin and phenolic resin, and the tackifying resin at least comprises rosin resin and phenolic resin.
Preferably, the tackifying resin is composed of rosin resin and phenolic resin in a mass ratio of 1: 1-3.
Preferably, the epoxy resin is bisphenol a type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin, biphenyl type epoxy resin, phenol type epoxy resin, and one or more of rubber modified product, polyurethane modified product, and acrylic modified product of the above epoxy resin.
Further preferably, the epoxy resin is a mixture of any two of epoxy resin 128E, epoxy resin N740S, epoxy resin NPPN-272H, or epoxy resin NPES 901.
Still further preferably, the mass ratio of the two epoxy resins is 1: 1-3.
Preferably, the film-forming resin is one or more of nitrile rubber, acrylic rubber or phenoxy resin.
Further preferably, the film-forming resin nitrile rubber is 1072CG of the south Imperial chemical industry of Taiwan, XER-32 and EXR-91 of JSR of Japan, and X-740 of Lanxess of Germany; acrylic rubbers such as dupont G, GXF, Ultra HT; phenoxy resins such as YP50, YP50S, YP70, ZX-1356-2, Mitsubishi chemical 1256, 4250, 4275, which are available from Nippon Tekken do.
Preferably, the ultraviolet absorbent is one or more of benzophenone ultraviolet absorbent or benzotriazole ultraviolet absorbent.
Further preferably, the benzophenone-based ultraviolet absorber includes UV-531, UV-0, UV-9.
Further preferably, the benzotriazole ultraviolet absorbers include UV-P, UV-326, UVP-327, UVP-328, UV-366.
Preferably, the curing accelerator is one or more of amine accelerator, substituted urea accelerator, imidazole and salt accelerator thereof, boron trifluoride amine complex, phenol accelerator, metal organic salt accelerator or phosphine accelerator.
Further preferably, the curing accelerator is 2-ethyl-4-methylimidazole (2E4MZ), 1-cyanoethyl-2-ethyl-4-methylimidazole 2E4MZ-CN, 2, 4-diamino-6 [2 ' -ethyl-4 ' -methylimidazole- (1 ') ] ethyl-S-triazine 2E4MZ-A, 2-methylimidazole-isocyanurate 2 MZ-OK.
Preferably, the epoxy adhesive further comprises an organic solvent, and the total mass of the epoxy resin, the tackifying resin, the film-forming resin, the ultraviolet absorber and the curing accelerator is 1-1.5 times of the mass of the organic solvent.
Further preferably, the organic solvent is butanone.
According to some embodiments, the epoxy adhesive comprises the following components in percentage by mass:
the epoxy resin, the tackifying resin, the film-forming resin, the ultraviolet absorbent and the curing accelerator are 1-1.5 times of the organic solvent in total mass.
Further, the epoxy adhesive comprises the following components in percentage by mass:
the epoxy resin, the tackifying resin, the film-forming resin, the ultraviolet absorbent and the curing accelerator are 1-1.5 times of the organic solvent in total mass.
A polyimide cover film comprises a polyimide film layer and an adhesive layer formed on the polyimide film layer, wherein the adhesive layer is formed by the epoxy adhesive.
Preferably, the thickness of the polyimide film layer is 5-25 μm; the thickness of the bonding layer is 3-20 mu m.
According to the preparation method of the polyimide cover film, the polyimide film is subjected to corona treatment, then the epoxy adhesive is coated on the corona surface of the polyimide film, and then the polyimide cover film is prepared through drying and curing.
Preferably, the drying temperature is 70-120 ℃, and the drying time is 4-8 min.
Further preferably, the drying temperature is 70-180 ℃, and the drying time is 4-8 min.
Preferably, the curing temperature is 40-50 ℃, and the curing time is 20-28 h.
Further preferably, the curing temperature is 42-48 ℃, and the curing time is 20-26 h.
The utility model provides a printing screen, printing screen include the otter board body and set up the otter board body on the polyimide cover membrane, the polyimide cover membrane do the polyimide cover membrane, the polyimide cover membrane the tie coat with the otter board body contact, the polyimide cover membrane on have the fretwork that is used for forming required circuit.
The preparation method of the printing screen plate comprises the steps of attaching the adhesive layer of the polyimide covering film to one surface of the screen plate body, carrying out hot pressing at 160-180 ℃ and 0.5-1 MPa for 30-60 min, and carrying out hollow-out treatment on the polyimide covering film in a laser mode to obtain the printing screen plate.
Compared with the prior art, the invention has the following advantages:
according to the invention, through improvement of the formula of the epoxy adhesive, the polyimide covering film formed by using the epoxy adhesive has good adhesion with the printing screen, good chemical resistance, low glue overflow amount during hot pressing and good dimensional stability, meanwhile, the polyimide covering film has no touch adhesion, and when the printing screen is subjected to laser engraving, the cutting gradient of the polyimide covering film and the bonding layer is small, so that a thinner circuit diagram is formed, the printing frequency can be increased to 17 ten thousand times, the service life of the printing screen is effectively prolonged, the cost of materials such as printing ink or silver paste is saved, the replacement time of a production line is saved, and the use efficiency is improved.
Drawings
FIG. 1 is a schematic structural view of a polyimide cover film bonded to a screen body;
figure 2 is a schematic view of the laser processing of polyimide cover film of printing screen plate,
1. a polyimide film layer; 2. an adhesive layer; 3. a steel mesh; 4. and (6) screen frames.
Detailed Description
The present invention will be further described with reference to the following examples. However, the present invention is not limited to the following examples. The implementation conditions adopted in the embodiments can be further adjusted according to different requirements of specific use, and the implementation conditions not mentioned are conventional conditions in the industry. The technical features of the embodiments of the present invention may be combined with each other as long as they do not conflict with each other.
In the previous research, in order to solve the problems of short service life and the like of the conventional printing screen plate, the inventor proposes an epoxy adhesive and a cover film, see patent CN112778937A for details, with the intensive research, we want to further improve the performance of the polyimide cover film, especially want to be able to form finer lines by reducing the cutting gradient of the polyimide film and the adhesive layer during laser processing, and for this reason, the inventor adjusts the formulation of the epoxy adhesive.
According to the embodiment of the invention, the epoxy adhesive comprises the following components in percentage by mass:
the epoxy resin, the tackifying resin, the film-forming resin, the ultraviolet absorbent and the curing accelerator are 1-1.5 times of the organic solvent in total mass.
The tackifying resin is two or more of rosin resin, rosin derivative, terpene resin, petroleum resin, dicyclopentadiene resin, coumarone-indene resin and phenolic resin, and the tackifying resin at least comprises rosin resin and phenolic resin.
Preferably, the tackifying resin is composed of rosin resin and phenolic resin in a mass ratio of 1: 1-3.
The formula of the invention is added with the ultraviolet absorbent, curing agent is not used, thermosetting is selected, and the formula adjustment ensures that the polyimide film and the bonding layer have smaller cutting gradient during laser processing while other properties of the epoxy adhesive are maintained.
The technical scheme and technical effect of the invention are further illustrated by the following embodiments.
In the present invention, the raw materials and apparatuses used in the examples and comparative examples are commercially available unless otherwise specified.
In the invention, the screen body is a printing steel screen in the prior art.
In the following examples and comparative examples, epoxy resin 128E, epoxy resin NPPN-272, and epoxy resin NPES901 were all purchased from south Asia, Taiwan, China; epoxy resin N740S was purchased from southwestern star chemical; nitrile rubber 1072CG was purchased from taiwan, south emperor, china; nitrile rubber XER-32 was purchased from JSR; phenolic resin PF8020 was purchased from Shengquan; 4,4-DDS was purchased from Indian Argi; DICY was purchased from ningxia jiafeng chemical; 2E4MZ-CN was purchased from Sichuan chemical Japan; the rosin resins GA90A, GA100 and GB120 are Japanese crude Sichuan chemical products; the UV absorber UV-531 is available from Solvay chemical.
In the following examples and comparative examples, the thickness of the polyimide film layer in the polyimide coverlay film was 7.5 μm, and the thickness of the adhesive layer was 8 μm.
Example 1
The epoxy adhesive is prepared by dissolving or dispersing epoxy resin N740S/20 parts, epoxy resin NPPN-272H/40 parts, nitrile rubber 1072CG/30 parts, rosin resin GB120/10 parts, ultraviolet absorbent UV-531/1 parts, phenolic resin PF8020/16 parts and 2E4MZ-CN/0.5 part by using butanone solvent/100 parts.
The manufacturing method of the PI (polyimide) covering film comprises the following steps:
pre-corona treating a PI film, coating an epoxy adhesive solution on the corona surface of the PI film, drying a solvent at 80 ℃/5mins, compounding release paper, rolling, placing in an oven, and curing at 45 ℃/24H to obtain the PI cover film.
The manufacturing method of the printing screen plate comprises the following steps:
after the release paper is torn off from the PI covering film, the adhesive layer is attached to one surface of the steel mesh, and then hot pressing is carried out in a hot press under the hot pressing condition of 160-180 ℃/30-60 mins/0.5-1.0 Mpa. And (3) carrying out partial hollow-out treatment on the PI covering film on the screen plate after hot press molding in a laser mode to obtain the desired circuit.
Example 2
128 parts of epoxy resin E/20 parts, 40 parts of epoxy resin NPPN-272H, 78 parts of nitrile rubber XER-32/30 parts, 90 parts of rosin resin GA90A/10 parts, 56 parts of ultraviolet absorbent UV-531/1 parts, 8020 parts of phenolic resin PF 16 parts, and 0.5 part of 2E4MZ-CN, wherein butanone solvent is used for 100 parts, and the epoxy adhesive solution is prepared by dissolving or dispersing.
The PI (polyimide) cover film was produced in the same manner as in example 1.
The method of making the printing screen was the same as in example 1.
Example 3
Epoxy resin N740S/20 parts, epoxy resin NPES901/40 parts, nitrile rubber 1072CG/30 parts, rosin resin GB120/10 parts, ultraviolet absorbent UV-531/1 parts, phenolic resin PF8020/16 parts, 2E4MZ-CN/0.5 part, and butanone solvent/100 parts are used for dissolving or dispersing to prepare epoxy adhesive solution.
The PI (polyimide) cover film was produced in the same manner as in example 1.
The method of making the printing screen was the same as in example 1.
Comparative example 1
128 parts of epoxy resin E/20 parts, 40 parts of epoxy resin NPPN-272H, 90 parts of rosin resin GA90A/10 parts, XER-32/40 parts of nitrile rubber, 20/16 parts of phenolic resin PF 8020/5 parts and 0.5 part of 2E4MZ-CN, wherein butanone solvent is used for dissolving or dispersing 100 parts to prepare the epoxy adhesive solution.
The PI (polyimide) cover film was produced in the same manner as in example 1.
The method of making the printing screen was the same as in example 1.
Comparative example 2
128E/20 parts of epoxy resin, 40 parts of epoxy resin NPPN-272H, 90A/10 parts of rosin resin GA, 32/40 parts of nitrile rubber XER-32/40 parts, 56 parts of ultraviolet absorbent UV-531/2 parts, 8020/16 parts of PF, and 0.5 part of 2E4MZ-CN, wherein butanone solvent is used for 100 parts, and the epoxy adhesive solution is prepared by dissolving or dispersing.
The PI (polyimide) cover film was produced in the same manner as in example 1.
The method of making the printing screen was the same as in example 1.
Comparative example 3
128E/10 parts of epoxy resin, NPPN-272H/10 parts of epoxy resin, 90A/10 parts of rosin resin, XER-32/40 parts of nitrile rubber, UV-531/0.5 part of ultraviolet absorbent, 8020/16 parts of PF and 0.5 part of 2E4MZ-CN, and dissolving or dispersing 100 parts of butanone solvent to prepare the epoxy adhesive solution.
The PI (polyimide) cover film was produced in the same manner as in example 1.
The method of making the printing screen was the same as in example 1.
Comparative example 4
128 parts of epoxy resin E/20 parts, 40 parts of epoxy resin NPPN-272H, 90 parts of rosin resin GA90A/10 parts, 0.5 part of nitrile rubber XER-32/10 parts, 0.531 part of ultraviolet absorbent UV-5 parts, 20 parts of PF 8016 parts and 0.5 part of 2E4MZ-CN, wherein butanone solvent is used for dissolving or dispersing 100 parts to prepare the epoxy adhesive solution.
The PI (polyimide) cover film was produced in the same manner as in example 1.
The method of making the printing screen was the same as in example 1.
Comparative example 5
128 parts of epoxy resin E/20 parts, 40 parts of epoxy resin NPPN-272H, 90 parts of rosin resin GA90A/10 parts, 0.2 part of nitrile rubber XER-32/40 parts, 0.2 part of ultraviolet absorbent UV-531, 4,4-DDS/15 parts and 0.5 part of 2E4MZ-CN, wherein butanone solvent is used for 100 parts, and the epoxy adhesive solution is prepared by dissolving or dispersing.
The PI (polyimide) cover film was produced in the same manner as in example 1.
The method of making the printing screen was the same as in example 1.
The printing screens of the respective examples and comparative examples were subjected to performance tests, the results of which are shown in Table 1.
TABLE 1
Comprehensive evaluation
"excellent" represents excellent performance, "Δ" represents general performance, and "x" represents poor performance.
The evaluation method comprises the following steps:
1. bonding strength: after the PI covering film and the screen plate are hot-pressed, the PI covering film and the screen plate are cut into 1cm multiplied by 20cm, the PI film at the end part in the length direction is pulled out, and the PI film is peeled off at 180 degrees at the speed of 100 mm/min.
2. And (3) drying by touching with fingers: after the PI covering film is subjected to hot pressing, the rubber surface is touched by fingers, the touch viscosity is OK when the touch viscosity is not high, and the touch viscosity is NG when the touch viscosity is high.
3. Glue overflow amount: punching 5 holes on the PI cover film by using a puncher with the diameter of 10mm, carrying out hot pressing on the PI cover film and a screen plate according to the condition of 100 ℃/60mins/0.5Mpa, and measuring the glue flow overflowing from the round holes by using an electron microscope.
4. Drug resistance: the laser-cut screen plate is soaked in the slurry for 24H, then the slurry is wiped dry, whether the liquid medicine of the slurry seeps into the position between PI and the adhesive layer on the cover film or between the adhesive layer and the screen plate is observed through a microscope, the floating or layering phenomenon appears, if the liquid medicine of the slurry occurs, NG is observed, and OK is not occurred (the slurry comprises silver powder/80%, bisphenol A epoxy/10%, anhydride curing agent 2%, methylimidazole/0.5%, butyl acetate/5%, reactive diluent 692/1.5%, tetraethoxysilane/0.5% and polyamide wax/0.5%).
5. Dimensional stability: after the PI covering film is hot-pressed with 200mm × 200mm and a screen plate, ABCD is selected at 4 corners of the PI film, 4 points are selected, and an oil pen is used for making a dotted mark. The distances AB ', BC ', CD ', DA ' before 4 points were measured using a two-dimensional test AB, BC, CD, DA ', and the distances between these 4 points were measured again using 10000 strokes of the squeegee. The calculated shrinkage 1 ═ AB '- [ (AB)/AB + (CD' -CD)/CD ]/2, and the calculated shrinkage 2 ═ BC '-BC)/BC + (DA' -DA)/DA ]/2, the maximum of the shrinkages 1 and 2 was recorded as a value of the dimensional stability.
6. Cutting gradient: after the cover film is manufactured into a screen printing plate, after laser, the screen printing plate is placed into an optical microscope to measure the opening width L1 of the PI surface, the screen printing plate is turned over again and placed into the optical microscope to measure the opening width L2 of the glue surface, the width difference between the PI surface and the glue surface is calculated, and the width difference is the cutting gradient: L1-L2.
The present invention has been described in detail for the purpose of illustration and description, and it will be apparent to those skilled in the art that the invention can be practiced without limitation to such detail, and all changes and modifications that come within the spirit of the invention are desired to be protected.
Claims (10)
1. The epoxy adhesive is characterized by comprising 45-60% of epoxy resin, 15-30% of tackifying resin, 20-30% of film forming resin, 0.5-1.5% of ultraviolet absorbent and 0.2-1% of curing accelerator, wherein the tackifying resin is two or more of rosin resin, rosin derivatives, terpene resin, petroleum resin, dicyclopentadiene resin, coumarone-indene resin and phenolic resin, and the tackifying resin at least comprises the rosin resin and the phenolic resin.
2. The epoxy adhesive according to claim 1, wherein the tackifying resin is composed of rosin resin and phenolic resin in a mass ratio of 1: 1-3.
3. The epoxy adhesive according to claim 1, wherein the epoxy resin is one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin, biphenyl type epoxy resin, phenol type epoxy resin, and rubber-modified, urethane-modified, and acrylic-modified epoxy resins thereof;
and/or the film-forming resin is one or more of nitrile rubber, acrylic rubber or phenoxy resin;
and/or the ultraviolet absorbent is one or more of benzophenone ultraviolet absorbent or benzotriazole ultraviolet absorbent;
and/or the curing accelerator is one or more of amine accelerators, substituted urea accelerators, imidazole and salt accelerators thereof, boron trifluoride amine complexes, phenol accelerators, metal organic salt accelerators or phosphine accelerators.
4. The epoxy adhesive according to any one of claims 1 to 3, wherein the epoxy adhesive further comprises an organic solvent, and the total mass of the epoxy resin, the tackifying resin, the film-forming resin, the ultraviolet absorber and the curing accelerator is 1 to 1.5 times the mass of the organic solvent.
5. A polyimide coverlay comprising a polyimide film layer and an adhesive layer formed on the polyimide film layer, wherein the adhesive layer is formed from the epoxy adhesive of any one of claims 1 to 5.
6. The polyimide coverlay of claim 5, wherein the thickness of the polyimide film layer is 5-25 μm; the thickness of the bonding layer is 3-20 mu m.
7. A method for producing the polyimide coverlay according to claim 5 or 6, characterized in that: and carrying out corona treatment on the polyimide film, coating the epoxy adhesive on the corona surface of the polyimide film, and drying and curing to obtain the polyimide cover film.
8. The method for preparing the polyimide coverlay according to claim 7, wherein: the drying temperature is 70-120 ℃, and the drying time is 4-8 min; the curing temperature is 40-50 ℃, and the curing time is 20-28 h.
9. A printing screen, characterized by: the printing screen comprises a screen body and a polyimide cover film arranged on the screen body, wherein the polyimide cover film is the polyimide cover film in claim 5 or 6, a bonding layer of the polyimide cover film is in contact with the screen body, and the polyimide cover film is provided with hollows for forming required circuits.
10. A method of making a printing screen according to claim 9, characterized by: and (2) attaching the adhesive layer of the polyimide covering film to one surface of the screen plate body, then carrying out hot pressing for 30-60 min at 160-180 ℃ and 0.5-1 MPa, and then carrying out hollow-out treatment on the polyimide covering film in a laser mode to obtain the printing screen plate.
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| CN202111627768.8A CN114479732A (en) | 2021-12-28 | 2021-12-28 | Epoxy adhesive, polyimide cover film and printing screen |
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| CN202111627768.8A CN114479732A (en) | 2021-12-28 | 2021-12-28 | Epoxy adhesive, polyimide cover film and printing screen |
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| CN112778937A (en) * | 2020-12-30 | 2021-05-11 | 苏州赛伍应用技术股份有限公司 | Epoxy adhesive, cover film and printing screen |
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2021
- 2021-12-28 CN CN202111627768.8A patent/CN114479732A/en active Pending
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|---|---|---|---|---|
| CN101089110A (en) * | 2006-06-14 | 2007-12-19 | 新扬科技股份有限公司 | Main component of adhesive for insulating film |
| JP2009007424A (en) * | 2007-06-27 | 2009-01-15 | Shin Etsu Chem Co Ltd | Adhesive composition, and adhesive sheet and cover lay film using the same |
| JP2010150437A (en) * | 2008-12-26 | 2010-07-08 | Toagosei Co Ltd | Adhesive composition, and cover lay film and flexible copper-clad laminate, both prepared by using the composition |
| CN103694639A (en) * | 2013-12-19 | 2014-04-02 | 广东生益科技股份有限公司 | Halogen-free anti-aging epoxy resin composition and method for preparing cover film by using same |
| CN112778937A (en) * | 2020-12-30 | 2021-05-11 | 苏州赛伍应用技术股份有限公司 | Epoxy adhesive, cover film and printing screen |
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