CN117202520A - Method for manufacturing printed circuit board with circuit at bottom of blind groove - Google Patents
Method for manufacturing printed circuit board with circuit at bottom of blind groove Download PDFInfo
- Publication number
- CN117202520A CN117202520A CN202311382171.0A CN202311382171A CN117202520A CN 117202520 A CN117202520 A CN 117202520A CN 202311382171 A CN202311382171 A CN 202311382171A CN 117202520 A CN117202520 A CN 117202520A
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- Prior art keywords
- layer
- circuit
- copper
- copper layer
- dry film
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229910052802 copper Inorganic materials 0.000 claims abstract description 74
- 239000010949 copper Substances 0.000 claims abstract description 74
- 238000005530 etching Methods 0.000 claims abstract description 27
- 239000011162 core material Substances 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 134
- 238000010586 diagram Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a printed circuit board with a circuit at the bottom of a blind groove; the invention uses a semi-addition method to plate a plating layer of a required circuit outline on a first copper layer, removes a second dry film, protects the bottom of a blind groove by using the first dry film, then performs flash etching to manufacture a circuit layer, presses the circuit layer, a PP layer and the second copper layer, and opens windows to form the blind groove, wherein the circuit layer is positioned in the blind groove, and then removes redundant bottom copper at the bottom of the blind groove to form a circuit by flash etching; the problems of traditional layer deflection, gumming and layering can be effectively solved, and the core material layer is prevented from being damaged.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a printed circuit board with a circuit at the bottom of a blind groove.
Background
The printed circuit board is developed from a single layer to a double-sided board, a multi-layer board and a flexible board, and is continuously developed towards high precision, high density and high reliability, the volume is continuously reduced, the cost is reduced, the performance is improved, so that the printed circuit board still keeps strong vitality in the development process of future electronic products, and the development trend of the production and manufacturing technology of the printed circuit board in the future is the development towards the performance towards the directions of high density, high precision, fine pore diameter, fine wires, small spacing, high reliability, multilayering, high-speed transmission, light weight and thin type.
For printed circuit board products with circuits at the bottom of the blind groove, the industry generally adopts a processing mode of respectively processing the circuit layer and the cavity layer and then laminating the circuit layer and the cavity layer together. However, the processing method has the defects of large layer, difficult control and layering of gummosis and the like.
The groove body processed by the equal window laser groove burning method can solve the problems of layer deviation, gummosis and layering, but the groove depth cannot be limited and the bottom substrate cannot be protected from being damaged by laser because the bottom of the groove body is a circuit and is not a complete copper sheet.
Disclosure of Invention
The invention aims at overcoming the defects in the prior art, and provides a method for manufacturing a printed wiring board with a circuit at the bottom of a blind groove, which can effectively solve the problems of layer deviation, gummosis and layering and prevent a core material layer from being damaged.
The aim of the invention is achieved by the following technical scheme: a method of making a printed wiring board with circuitry at the bottom of a blind slot, comprising the steps of:
s1, providing a copper-clad plate; the copper-clad plate comprises a core material layer and a first copper layer arranged on the core material layer;
s2, electroplating on the first copper layer to form an electroplated layer;
s3, pressing a first dry film on the surface of the first copper layer and the surface of the electroplated layer;
s4, exposing and developing the first dry film, and covering the electroplated layer and the first copper layer at the bottom of the electroplated layer by the residual first dry film;
s5, etching the first copper layer which is not covered by the first dry film; the electroplated layer and the first copper layer at the bottom of the electroplated layer form a circuit layer;
s6, laminating a PP layer on the top of the circuit layer and the top of the core material layer;
s7, pressing a second copper layer on the top of the PP layer;
s8, etching the second copper layer on the top of the circuit layer;
s9, carrying out groove burning treatment on the PP layer on the top of the circuit layer, thereby forming a blind groove.
The invention is further arranged to further comprise a step S10 of etching the first copper layer between adjacent electroplated layers in the line layer in the blind trench.
The invention is further arranged in that in step S10 the first copper layer between adjacent electroplated layers is etched by means of flash etching.
The invention further provides that in step S2, the method for forming the electroplated layer by electroplating the first copper layer comprises the following steps:
a1, pressing a second dry film on the surface of the first copper layer;
a2, exposing and developing the second dry film to expose part of the first copper layer;
a3, electroplating the exposed first copper layer to form an electroplated layer.
The invention further provides that in step S8, the method for etching the second copper layer on top of the circuit layer comprises the following steps:
b1, pressing a third dry film on the surface of the second copper layer;
b2, exposing and developing the third dry film to expose the second copper layer on the top of the circuit layer;
and B3, etching the second copper layer on the top of the circuit layer.
The invention further provides that in step S9, the PP layer on top of the circuit layer is subjected to the groove burning treatment by using a laser device.
The invention has the beneficial effects that: the invention uses a semi-addition method to plate a plating layer of a required circuit outline on a first copper layer, removes a second dry film, protects the bottom of a blind groove by using the first dry film, then performs flash etching to manufacture a circuit layer, presses the circuit layer, a PP layer and the second copper layer, and opens windows to form the blind groove, wherein the circuit layer is positioned in the blind groove, and then removes redundant bottom copper at the bottom of the blind groove to form a circuit by flash etching; the problems of traditional layer deflection, gumming and layering can be effectively solved, and the core material layer is prevented from being damaged.
Drawings
The invention will be further described with reference to the accompanying drawings, in which embodiments do not constitute any limitation of the invention, and other drawings can be obtained by one of ordinary skill in the art without inventive effort from the following drawings.
FIG. 1 is a schematic view of the structure of a copper-clad plate of the present invention;
FIG. 2 is a schematic diagram of the structure of the present invention after pressing a second dry film;
FIG. 3 is a schematic diagram of the structure of the second dry film of the present invention after development;
FIG. 4 is a schematic view of the structure of the invention after electroplating;
FIG. 5 is a schematic view of the structure of the present invention after pressing the first dry film;
FIG. 6 is a schematic view of the structure of the first dry film of the present invention after development;
FIG. 7 is a schematic diagram of the structure of the present invention after etching the first copper layer;
FIG. 8 is a schematic diagram of the structure of the present invention after pressing the second copper layer;
FIG. 9 is a schematic diagram of the structure of the present invention after pressing the third dry film;
FIG. 10 is a schematic view of the structure of the third dry film of the present invention after development;
FIG. 11 is a schematic diagram of the structure of the present invention after etching the second copper layer;
FIG. 12 is a schematic view of the structure of the PP layer after burning grooves according to the present invention;
FIG. 13 is a schematic diagram of the structure of the invention after etching the redundant bottom copper in the blind trench;
wherein: 1. a core material layer; 11. a first copper layer; 2. plating layers; 3. a first dry film; 4. a PP layer; 5. a second copper layer; 6. a blind groove; 7. a second dry film; 8. and a third dry film.
Detailed Description
The invention will be further described with reference to the following examples.
As can be seen from fig. 1 to 13, the method for manufacturing a printed circuit board with a circuit at the bottom of a blind via 6 according to the present embodiment includes the following steps:
s1, providing a copper-clad plate; the copper-clad plate comprises a core material layer 1 and a first copper layer 11 arranged on the core material layer 1;
s2, electroplating on the first copper layer 11 to form an electroplated layer 2; forming a state as shown in fig. 4;
s3, pressing a first dry film 3 on the surface of the first copper layer 11 and the surface of the electroplated layer 2; forming a state as shown in fig. 5;
s4, exposing and developing the first dry film 3, and covering the electroplated layer 2 and the first copper layer 11 at the bottom of the electroplated layer 2 by the residual first dry film 3; forming a state as shown in fig. 6;
s5, etching the first copper layer 11 which is not covered by the first dry film 3; the electroplated layer 2 and the first copper layer 11 at the bottom of the electroplated layer 2 form a circuit layer; forming a state as shown in fig. 7;
s6, pressing the PP layer 4 on the top of the circuit layer and the top of the core material layer 1;
s7, pressing a second copper layer 5 on the top of the PP layer 4; forming a state as shown in fig. 8;
s8, etching the second copper layer 5 on the top of the circuit layer; forming a state as shown in fig. 11;
s9, carrying out groove burning treatment on the PP layer 4 at the top of the circuit layer, so as to form a blind groove 6; a state as shown in fig. 12 is formed.
In the embodiment, firstly, a half addition method is used for pattern plating on a first copper layer 11 to form a plating layer 2 with a required circuit outline, after a second dry film 7 is removed, the bottom of a blind groove 6 is protected by a first dry film 3, then a circuit layer is manufactured by flash etching, the circuit layer, a PP layer 4 and the second copper layer 5 are pressed together, window opening is carried out to form the blind groove 6, at the moment, the circuit layer is positioned in the blind groove 6, and then the redundant bottom copper at the bottom of the blind groove 6 is removed by flash etching to form a circuit; the problems of traditional layer deflection, gumming and layering can be effectively solved, and the core material layer 1 is prevented from being damaged.
The method for manufacturing a printed circuit board with a circuit at the bottom of a blind groove 6 according to the embodiment further includes step S10 of etching a first copper layer 11 between adjacent electroplated layers 2 in a circuit layer in the blind groove 6; a state as shown in fig. 13 is formed. Specifically, after steps S1-S9, the first copper layer 11 of the circuit layer can be laid on the bottom of the whole blind trench 6, so that the core material layer 1 can be effectively prevented from being damaged in the process of trench burning and windowing of the PP layer 4.
In the method for manufacturing the printed wiring board with the circuit at the bottom of the blind via 6 according to the embodiment, in step S10, the first copper layer 11 between the adjacent plating layers 2 is etched by means of flash etching. By the arrangement, the redundant bottom copper at the bottom of the blind groove 6 can be effectively removed.
In the method for manufacturing the printed wiring board with the circuit at the bottom of the blind trench 6 in the embodiment, in step S2, the method for forming the electroplated layer 2 by electroplating on the first copper layer 11 includes:
a1, pressing a second dry film 7 on the surface of the first copper layer 11; forming a state as shown in fig. 2;
a2, exposing and developing the second dry film 7 to expose part of the first copper layer 11; forming a state as shown in fig. 3;
a3, electroplating the exposed first copper layer 11 to form an electroplated layer 2; forming the state shown in fig. 4. The second dry film 7 is an anti-plating film, so that corresponding circuits can be plated according to the requirements of users.
In the method for manufacturing the printed circuit board with the circuit at the bottom of the blind groove 6 in this embodiment, in step S8, the method for etching the second copper layer 5 at the top of the circuit layer is as follows:
b1, pressing a third dry film 8 on the surface of the second copper layer 5; forming a state as shown in fig. 9;
b2, exposing and developing the third dry film 8 to expose the second copper layer 5 on the top of the circuit layer; forming a state as shown in fig. 10;
b3, etching the second copper layer 5 on the top of the circuit layer; a state as shown in fig. 11 is formed. The second copper layer 5 on top of the wiring layer can be etched out efficiently by the above arrangement.
In the method for manufacturing the printed circuit board with the circuit at the bottom of the blind groove 6 in the embodiment, in step S9, the laser device is used to burn the PP layer 4 at the top of the circuit layer. Specifically, after steps S1-S9, the first copper layer 11 of the circuit layer can be laid on the bottom of the whole blind trench 6, so that damage to the core material layer 1 can be effectively prevented and the trench can be effectively opened in the process of opening the trench by the PP layer 4 through the laser device.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (6)
1. A method for manufacturing a printed wiring board with a circuit at the bottom of a blind groove, which is characterized in that: the method comprises the following steps:
s1, providing a copper-clad plate; the copper-clad plate comprises a core material layer (1) and a first copper layer (11) arranged on the core material layer (1);
s2, electroplating on the first copper layer (11) to form an electroplated layer (2);
s3, pressing a first dry film (3) on the surface of the first copper layer (11) and the surface of the electroplated layer (2);
s4, exposing and developing the first dry film (3), and covering the electroplated layer (2) and a first copper layer (11) at the bottom of the electroplated layer (2) by the residual first dry film (3);
s5, etching the first copper layer (11) which is not covered by the first dry film (3); the electroplated layer (2) and a first copper layer (11) at the bottom of the electroplated layer (2) form a circuit layer;
s6, laminating a PP layer (4) on the top of the circuit layer and the top of the core material layer (1);
s7, laminating a second copper layer (5) on the top of the PP layer (4);
s8, etching the second copper layer (5) on the top of the circuit layer;
s9, carrying out groove burning treatment on the PP layer (4) on the top of the circuit layer, thereby forming a blind groove (6).
2. A method of making a printed wiring board with circuitry on the bottom of a blind slot as in claim 1, wherein: the method further comprises a step S10 of etching the first copper layer (11) between the adjacent electroplated layers (2) in the circuit layer in the blind groove (6).
3. A method of making a printed wiring board with circuitry on the bottom of a blind slot as in claim 2, wherein: in step S10, the first copper layer (11) between adjacent plating layers (2) is etched by means of flash etching.
4. A method of making a printed wiring board with circuitry on the bottom of a blind slot as in claim 1, wherein: in step S2, the method for forming the electroplated layer (2) by electroplating the first copper layer (11) comprises the following steps:
a1, pressing a second dry film (7) on the surface of the first copper layer (11);
a2, exposing and developing the second dry film (7) to expose part of the first copper layer (11);
a3, electroplating the exposed first copper layer (11) to form an electroplated layer (2).
5. A method of making a printed wiring board with circuitry on the bottom of a blind slot as in claim 1, wherein: in step S8, the method for etching the second copper layer (5) on top of the circuit layer includes:
b1, pressing a third dry film (8) on the surface of the second copper layer (5);
b2, exposing and developing the third dry film (8) to expose the second copper layer (5) at the top of the circuit layer;
and B3, etching the second copper layer (5) on the top of the circuit layer.
6. A method of making a printed wiring board with circuitry on the bottom of a blind slot as in claim 1, wherein: in step S9, the PP layer (4) on top of the circuit layer is subjected to a groove burning treatment by using a laser device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311382171.0A CN117202520A (en) | 2023-10-23 | 2023-10-23 | Method for manufacturing printed circuit board with circuit at bottom of blind groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311382171.0A CN117202520A (en) | 2023-10-23 | 2023-10-23 | Method for manufacturing printed circuit board with circuit at bottom of blind groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117202520A true CN117202520A (en) | 2023-12-08 |
Family
ID=88983627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311382171.0A Pending CN117202520A (en) | 2023-10-23 | 2023-10-23 | Method for manufacturing printed circuit board with circuit at bottom of blind groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117202520A (en) |
-
2023
- 2023-10-23 CN CN202311382171.0A patent/CN117202520A/en active Pending
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