CN117198947B - Surface-mounted discrete device packaging equipment and process based on void ratio self-feedback adjustment - Google Patents
Surface-mounted discrete device packaging equipment and process based on void ratio self-feedback adjustment Download PDFInfo
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- CN117198947B CN117198947B CN202311442074.6A CN202311442074A CN117198947B CN 117198947 B CN117198947 B CN 117198947B CN 202311442074 A CN202311442074 A CN 202311442074A CN 117198947 B CN117198947 B CN 117198947B
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- 239000011800 void material Substances 0.000 title claims abstract description 38
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title description 9
- 230000008569 process Effects 0.000 title description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 238000006073 displacement reaction Methods 0.000 claims abstract description 18
- 238000012858 packaging process Methods 0.000 claims abstract description 5
- 238000005245 sintering Methods 0.000 claims description 24
- 238000001816 cooling Methods 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000006698 induction Effects 0.000 claims 3
- 230000005012 migration Effects 0.000 claims 1
- 238000013508 migration Methods 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 239000011159 matrix material Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000001960 triggered effect Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the field of chip-mounted discrete device packaging, in particular to chip-mounted discrete device packaging equipment based on void ratio self-feedback regulation, which comprises a transportation platform for moving a lower piece carrier and a placement platform for placing a die, wherein a mechanical arm is arranged at the placement platform, a suction plate is arranged at the working end of the mechanical arm, a fixed sleeve frame is fixedly sleeved at the lower half part of the transportation platform, a displacement regulating mechanism is arranged on the fixed sleeve frame, a movable sleeve frame is arranged on the displacement regulating mechanism, a push plate is arranged on the periphery of the inner wall of the movable sleeve frame, a jacking component is arranged on the fixed sleeve frame, and an inner pushing component is respectively arranged on the periphery of the movable sleeve frame. The invention also relates to a surface-mounted discrete device packaging process based on the void ratio self-feedback adjustment.
Description
Technical Field
The invention relates to the field of chip-type discrete device packaging, in particular to chip-type discrete device packaging equipment based on void rate self-feedback adjustment, and also relates to a chip-type discrete device packaging process based on void rate self-feedback adjustment.
Background
At present, discrete electronic components such as resistors, capacitors, inductors and the like are mainly in a chip packaging mode, in the packaging process of the discrete components, the surface of a lower chip carrier is coated with solder paste, then the solder paste is sent to a die bonding mounting position, a die bonding is accurately mounted on the surface of the lower chip carrier, whether leakage or mounting deviation exists is detected through an image, then the lower chip carrier is attached to an upper chip carrier, the attached upper chip carrier and lower chip carrier are sent to a vacuum sintering furnace for sintering, the sintering void ratio is detected through X-ray during sintering, and finally the die bonding is discharged and stored, however, in the die bonding mounting detection process, if the die bonding and the position correspondence of the lower chip carrier are inaccurate, the die bonding cannot be accurately mounted, and the efficiency is greatly reduced through manual adjustment.
The currently published chinese patent CN102866318B, entitled: the utility model provides a piece type encapsulation discrete device testing arrangement, including electrode bottom plate, perforation limiting plate and clamp plate, the electrode bottom plate is arranged in the bottom, perforation limiting plate is located electrode bottom plate upper surface, the clamp plate is located perforation limiting plate upper surface, four angle spacing holes of perforation limiting plate and clamp plate insert respectively the spacing fastening screw in four angles of electrode bottom plate, positive electrode and negative electrode have been arranged on the electrode bottom plate, there is the multi-needle socket on the bottom plate right side, there is perforation on the perforation limiting plate, perforation quantity is greater than one, matrix arrangement, the clamp plate is the bilayer structure, the upper strata is the metal sheet, the lower floor is elastic rubber, positive electrode and negative electrode on the electrode bottom plate constitute electrode pair, the number of electrode pair is greater than 1, matrix arrangement, every row positive electrode on the electrode bottom plate is connected on the first row contact pin of multi-needle socket, every row's negative electrode is connected on the second row contact pin of multi-needle socket on the electrode bottom plate, there is bellied hemispherical elastic rubber granule on the bottom plate lower floor elastic rubber, bellied hemispherical elastic rubber granule quantity is greater than one, matrix arrangement, all matrix arrangement's perforation, electrode and bellied hemispherical elastic rubber granule one-to one.
According to the above patent, the device to be tested is provided with electrodes, perforations and rubber protrusion particles which are arranged in a matrix, and the electrodes and the perforations correspond to each other, after passing through the limiting holes, the device to be tested falls on the electrode plate in order, then the pressing plate is pressed, the pad of the device to be tested is pressed against the device to be tested through the protrusion hemispherical rubber particles, so that the pad of the device to be tested is in full and reliable contact with the electrodes, the purpose of perforation is to enable the pad of the device to be tested to be inserted into the corresponding positive and negative electrodes accurately, and test equipment connected with the test device completes the test of the device to be tested one by one in a scanning manner after the device to be tested is inserted, so that small batch test of the chip-type packaged discrete devices is realized, however, after the patent detects, no mechanism for adjusting the setting deviation is needed, so that the packaging efficiency is reduced, and therefore, in order to improve the mounting efficiency, an equipment for performing deviation adjustment on the position of a carrier for a lower chip in a die bonding process is needed.
Disclosure of Invention
Aiming at the problems existing in the prior art, the invention provides the patch type discrete device packaging equipment based on the self-feedback adjustment of the void ratio, which moves upwards along the transportation platform through the movable sleeve frame, so that the edge of the lower piece carrier is limited on the surface of the transportation platform and does not exceed the edge of the transportation platform, and along with the pushing of the lower piece carrier by the push plate around the movable sleeve frame, the lower edge of the push plate is attached to the surface of the transportation platform to move, so that the lower piece carrier is promoted to move to the center of the transportation platform, the accurate alignment of the lower piece carrier and the die bonding is ensured, and the mounting efficiency is improved.
In order to solve the problems in the prior art, the invention provides a patch type discrete device packaging device based on void ratio self-feedback adjustment, which comprises a transportation platform for moving a lower piece carrier and a placement platform for placing solid crystals, wherein a mechanical arm is arranged at the placement platform and faces the transportation direction of the transportation platform, a suction plate is arranged at the working end of the mechanical arm, a fixed sleeve frame is fixedly sleeved at the lower half part of the transportation platform, a displacement adjusting mechanism for adjusting the position of the lower piece carrier on the transportation platform is arranged on the fixed sleeve frame, a movable sleeve frame is arranged on the displacement adjusting mechanism, the movable sleeve frame is sleeved on the transportation platform and is positioned above the fixed sleeve frame, the movable sleeve frame can vertically move on the fixed sleeve frame, a push plate is arranged on the periphery of the inner wall of the movable sleeve frame, each push plate can horizontally move, a jacking component for driving the movable sleeve frame to move is arranged on the fixed sleeve frame, and an inward pushing component for driving the corresponding push plate to move is respectively arranged on the periphery of the movable sleeve frame.
Preferably, both ends of the suction plate are provided with a trigger piece, the position of the movable sleeve frame corresponding to the sensor piece is provided with the sensor piece, and when the sensor piece is in contact with the trigger piece, the suction plate is in a state of aligning with the transport platform to accurately attach the die bonding on the surface of the lower carrier.
Preferably, the inner wall of activity cover frame all around with transport platform's side contact, the top four sides of activity cover frame all have from outside-in slope that extends, the embedded bar mouth of confession push pedal has been seted up to the perisporium of activity cover frame, the surface and the side contact of transport platform of push pedal, the corner all is equipped with the guide bar of vertical upwards extending around the fixed cover frame, the corner all is equipped with the uide bushing of slip cap on corresponding guide bar around the activity cover frame, the top of every guide bar all is equipped with an anticreep ring, when uide bushing contact anticreep ring, the lower limit of push pedal is in the state flush with transport platform's top surface.
Preferably, the sensing piece is provided with a hollow column fixedly connected to the periphery of the movable sleeve frame, and a touch switch is arranged in the hollow column.
Preferably, the trigger piece is provided with a pressing rod, the diameter of the pressing rod is equal to the inner diameter of the hollow column, a stand column is arranged on the suction plate and located at the position of the pressing rod, a supporting plate for fixing the pressing rod is arranged on the stand column, and when the suction plate is used for attaching a solid crystal on the surface of the lower piece carrier, the pressing rod is in a state of being inserted into the hollow column and extruded on the touch switch.
Preferably, the outside surface both sides of push pedal all are equipped with the outward inserted bar that extends of bar mouth on the movable sleeve frame, the outside all around of movable sleeve frame is fixed and is equipped with a strip shaped plate, the tip of inserted bar passes the outside extension of strip shaped plate, offer the socket that supplies the inserted bar to pass on the strip shaped plate, fixedly connected with cover is established the spring on every inserted bar between push pedal and the strip shaped plate, the tip of every inserted bar all outwards extends has the threaded rod that the diameter is less than the inserted bar diameter, equal threaded connection has the screw thread cover on every threaded rod, on the screw thread cover contact strip shaped plate, lower piece carrier is in the state of being pressed from both sides between two corresponding push pedals.
Preferably, the jacking component is provided with a first connecting rod and a second connecting rod, one end of the first connecting rod is hinged with the side edge of the fixed sleeve frame, one end of the second connecting rod is hinged with the side edge of the movable sleeve frame, the free end of the first connecting rod is connected with the free end of the second connecting rod in a shaft way, and a driving motor for driving the first connecting rod to swing is arranged on the fixed sleeve frame.
Preferably, the middle part of the push plate penetrates through the strip-shaped plate to extend outwards to be provided with an extension rod, the inner pushing assembly is provided with a swing rod, one end of the swing rod is hinged with the middle part of the side edge of the movable sleeve frame, the other end of the swing rod extends towards the direction of the extension rod, the end part of the extension rod is provided with a first shaft rod perpendicular to the extension rod, the hinged part of the swing rod and the movable sleeve frame is provided with a second shaft rod, a sliding port sleeved on the first shaft rod is formed in the swing rod along the edge direction of the swing rod, and the movable sleeve frame is provided with an electromagnetic driving piece for driving the second shaft rod to rotate.
Preferably, the electromagnetic driving member is provided with a first electromagnet and a second electromagnet, the first electromagnet is fixedly arranged on the second shaft rod, and the second electromagnet is fixedly arranged on the movable sleeve frame and corresponds to the position of the first electromagnet.
The invention also provides a surface-mounted discrete device packaging process based on void ratio self-feedback adjustment, which comprises the following steps:
s1, coating a layer of solder paste on the surface of a lower carrier, placing the lower carrier on a transportation platform, and conveying the lower carrier to a die bonding mounting position;
s2, adjusting the position of the lower sheet carrier on the conveying platform through a displacement adjusting mechanism, and keeping the lower sheet carrier at the center of the conveying platform;
s3, driving the suction plate to absorb a plurality of solid crystals to move towards the direction of the lower carrier through the mechanical arm;
s4, matching the trigger piece on the suction plate with the sensing piece on the movable sleeve frame to enable the die bonding on the suction plate to be aligned with the lower piece carrier, so that the die bonding is attached to the surface of the lower piece carrier under the driving of the mechanical arm;
s5, assembling the frame, and aligning and attaching the lower sheet carrier and the upper sheet carrier;
s6, after aligning and attaching the lower sheet carrier and the upper sheet carrier, feeding the lower sheet carrier and the upper sheet carrier into a tunnel sintering furnace for sintering, detecting sintering void ratio by utilizing X rays after cooling at a cooling section of a hearth outlet, transmitting detected results to a tunnel furnace control system, adjusting sintering temperature, changing a sintering temperature curve in the hearth, realizing temperature self-adjustment in the tunnel sintering furnace in the sintering process, and achieving the purpose of reducing the product void ratio.
Compared with the prior art, the beneficial effects of this application are:
1. according to the invention, the movable sleeve frame moves upwards along the conveying platform, so that the edge of the lower piece carrier is limited on the surface of the conveying platform and does not exceed the edge of the conveying platform, and along with the pushing of the lower piece carrier by the pushing plates around the movable sleeve frame, the lower edge of the pushing plate is attached to the surface of the conveying platform and moves, so that the lower piece carrier is promoted to move to the center of the conveying platform, the adjustment of the lower piece carrier on the surface of the conveying platform is realized, the accurate alignment of the lower piece carrier and the die bonding is ensured, and the mounting efficiency is improved;
2. according to the invention, through the matching between the sensing piece and the triggering piece, the position of the suction plate corresponding to the conveying platform is accurate, so that the position of the die bonding corresponding to the lower piece carrier is promoted to be accurate, the die bonding is accurately attached to the surface of the lower piece carrier, and the attaching accuracy is improved;
3. according to the invention, through the arrangement of the slope at the top edge of the movable sleeve frame, the lower piece carrier can be pushed towards the center of the conveying platform, so that the lower piece carrier is prevented from being jacked up, and the lower piece carrier is effectively pushed by the pushing plate as the lower edge of the pushing plate is attached to the surface of the conveying platform for moving, so that the adjustment of the lower piece carrier towards the center of the conveying platform is realized, and the accuracy of die bonding attachment of the lower piece carrier surface is improved.
Drawings
FIG. 1 is a schematic diagram of a three-dimensional structure of a patch type discrete device packaging apparatus based on void fraction self-feedback adjustment;
FIG. 2 is a schematic perspective view of a transport platform and a displacement adjustment mechanism of a chip discrete device package apparatus based on void fraction self-feedback adjustment;
FIG. 3 is a partial perspective structural cross-sectional view of a transport platform and a displacement adjustment mechanism of a patch type discrete device packaging apparatus based on void fraction self-feedback adjustment;
FIG. 4 is a cross-sectional view of a transport platform and a displacement adjustment mechanism of a chip discrete device package apparatus based on void fraction self-feedback adjustment;
FIG. 5 is a second cross-sectional view of a transport platform and a displacement adjustment mechanism of a chip discrete device package apparatus based on void fraction self-feedback adjustment;
FIG. 6 is a cross-sectional view III of a transport platform and a displacement adjustment mechanism of a chip discrete device package apparatus based on void fraction self-feedback adjustment;
FIG. 7 is an enlarged schematic view at A of FIG. 4;
FIG. 8 is an enlarged schematic view at B of FIG. 5;
FIG. 9 is an enlarged schematic view at C of FIG. 3;
FIG. 10 is an enlarged schematic view at D of FIG. 1;
FIG. 11 is an axial diode process flow diagram of a chip discrete device package apparatus based on void fraction self-feedback adjustment;
fig. 12 is a process flow diagram of a patch-type diode of a patch-type discrete device package apparatus based on void fraction self-feedback adjustment.
The reference numerals in the figures are: 1-a transportation platform; 11-a lower sheet carrier; 2-placing a platform; 21-solidifying the crystal; 3-a mechanical arm; 31-a suction plate; 311-stand columns; 4-fixing the sleeve frame; 41-a guide bar; 411-anti-slip ring; 42-a guide sleeve; 5-a displacement adjustment mechanism; 51-a movable sleeve frame; 511-ramp; 512-bar-shaped port; 5121-a strip plate; 52-pushing plate; 521-inserting rod; 5211-threaded rod; 5212-threaded sleeve; 522-a spring; 53-jacking assembly; 531-first link; 532-a second link; 533-drive motor; 54-push-in assembly; 541-extension bars; 5411-first shaft; 542-swinging rod; 5421-second shaft; 5422-slide; 543-electromagnetic drive; 5431-first electromagnet; 5432-a second electromagnet; 6-a sensing piece; 61-hollow column; 62-touch switch; 7-triggering piece; 71-a compression bar; 72-supporting plate.
Detailed Description
The invention will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the invention and the specific objects and functions achieved.
Referring to fig. 1-6, the chip discrete device packaging device based on the self-feedback adjustment of the void ratio comprises a transportation platform 1 for moving a lower chip carrier 11 and a placement platform 2 for placing a die-bonding chip 21, wherein a mechanical arm 3 is arranged at the placement platform 2 and faces the transportation direction of the transportation platform 1, a suction plate 31 is arranged at the working end of the mechanical arm 3, a fixed sleeve frame 4 is fixedly sleeved at the lower half part of the transportation platform 1, a displacement adjustment mechanism 5 for adjusting the position of the lower chip carrier 11 on the transportation platform 1 is arranged on the fixed sleeve frame 4, a movable sleeve frame 51 is arranged on the transportation platform 1 in a sleeved mode, the movable sleeve frame 51 is located above the fixed sleeve frame 4, the movable sleeve frame 51 can vertically move on the fixed sleeve frame 4, a push plate 52 is arranged on the periphery of the inner wall of the movable sleeve frame 51, each push plate 52 can horizontally move, a jacking component 53 for driving the movable sleeve frame 51 to move is arranged on the fixed sleeve frame 4, and an inward pushing component 54 for driving the corresponding push plate 52 to move is respectively arranged on the periphery of the movable sleeve frame 51.
According to the position of the lower sheet carrier 11 on the transportation platform 1, the lower sheet carrier 11 is kept at the center of the transportation platform 1 according to the displacement adjusting mechanism 5, when the die bonding 21 is caused to be pasted, a plurality of die bonding 21 are precisely pasted at the corresponding positions on the lower sheet carrier 11, so that the defect that the die bonding 21 cannot be pasted on the lower sheet carrier 11 due to the position deviation of the lower sheet carrier 11 is avoided, and the die bonding 21 is partially missed on the lower sheet carrier 11 is avoided, therefore, the paste deviation or the missing is avoided through adjusting the lower sheet carrier 11 with the position deviation, and the paste precision and the efficiency are improved; mounting process of die bonding 21: when the die bonding 21 is mounted on the surface of the lower carrier 11, firstly, the lower carrier 11 coated with solder paste is placed on the transportation platform 1, the transportation platform 1 moves the lower carrier 11 to the position of the placement platform 2, at the moment, whether the position of the lower carrier 11 on the transportation platform 1 is at the center is observed through an image detection mechanism (not shown), if the position of the lower carrier 11 is accurate, the die bonding 21 is directly mounted, otherwise, the position of the lower carrier 11 is adjusted through a displacement adjustment mechanism 5, a jacking component 53 is started to drive a movable sleeve frame 51 to move upwards until the movable sleeve frame 51 exceeds the surface of the transportation platform 1, because the movable sleeve frame 51 is sleeved on the transportation platform 1, the lower carrier 11 with the edge deviated from the transportation platform 1 is pushed back to the transportation platform 1 by the movable sleeve frame 51, the edge of the lower carrier 11 does not exceed the transportation platform 1, the situation that the lower chip carrier 11 is pressed down by the suction plate 31 to cause edge vibration and cannot be accurately mounted is avoided when the die bonding 21 is mounted, the lower edge of the push plate 52 is in a level state with the surface of the transportation platform 1 at the moment along with the moving of the movable sleeve frame 51 in place, the corresponding push plate 52 is synchronously driven to move towards the center of the transportation platform 1 along with each two opposite inner pushing assemblies 54 until the distance between the two push plates 52 reaches a specified distance, the push plates 52 stop moving, the lower chip carrier 11 is clamped in the surrounding push plates 52, the lower chip carrier 11 is kept in the center state of the transportation platform 1, then the suction plate 31 sucks a plurality of die bonding 21 which are arranged at equal intervals, the mechanical arm 3 drives the suction plate 31 to move to the upper side of the lower chip carrier 11, finally presses the suction plate 31 on the lower chip carrier 11, the die bonding 21 is accurately attached to the surface of the lower chip carrier 11 along with the moving, the die bonding 21 on the surface of the lower carrier 11 is completed.
Referring to fig. 1, two ends of the suction plate 31 are respectively provided with a trigger piece 7, the position of the movable sleeve frame 51 corresponding to the trigger piece 7 is provided with a sensing piece 6, and when the sensing piece 6 contacts with the trigger piece 7, the suction plate 31 is in a state of aligning with the transport platform 1 to accurately attach the die bonding 21 on the surface of the lower carrier 11.
After the suction plate 31 sucks the die-bonding 21 and moves to the upper side of the lower sheet carrier 11, the trigger piece 7 on the suction plate 31 corresponds to the sensing piece 6, at the moment, the position of the suction plate 31 corresponding to the lower sheet carrier 11 is accurate, the die-bonding 21 is ensured to be accurately attached to the surface of the lower sheet carrier 11, the die-bonding 21 is prevented from being attached to the surface of the lower sheet carrier, the width of the suction plate 31 is smaller than that of the transportation platform 1, therefore, the die-bonding 21 needs to be sucked and attached for multiple times, a plurality of sensing pieces 6 are arranged on the edge of the movable sleeve frame 51 at equal intervals along the edge direction of the movable sleeve frame, and each time when the trigger piece 7 corresponds to one sensing piece 6, the attached position of the die-bonding 21 is ensured to be accurate, and if the position of the suction plate 31 deviates from the position of the transportation platform 1, the mechanical arm 3 is used for adjustment until the position is accurate.
Referring to fig. 2-8, the periphery of the inner wall of the movable sleeve frame 51 is contacted with the side edge of the transport platform 1, the top four sides of the movable sleeve frame 51 are provided with slopes 511 extending from outside to inside, the periphery wall of the movable sleeve frame 51 is provided with strip-shaped openings 512 for embedding the push plates 52, the surface of the push plates 52 is contacted with the side edge of the transport platform 1, the periphery corners of the fixed sleeve frame 4 are provided with guide rods 41 extending vertically upwards, the periphery corners of the movable sleeve frame 51 are provided with guide sleeves 42 sleeved on the corresponding guide rods 41 in a sliding manner, the top end of each guide rod 41 is provided with an anti-drop ring 411, and when the guide sleeves 42 are contacted with the anti-drop rings 411, the lower edge of the push plates 52 is in a state of being flush with the top surface of the transport platform 1.
When the movable sleeve frame 51 moves upwards through the jacking component 53, the inner wall of the movable sleeve frame 51 is attached to the peripheral wall of the conveying platform 1, the top of the movable sleeve frame 51 gradually exceeds the top of the conveying platform 1, the slope 511 at the top edge of the movable sleeve frame 51 enables the lower piece carrier 11 to slide down to the center of the conveying platform 1 along the slope, the edge of the lower piece carrier 11 is enabled to not exceed the edge of the conveying platform 1, after the guide sleeve 42 on the movable sleeve frame 51 moves along the guide rod 41 to be in contact with the anti-drop ring 411, the lower edge of the push plate 52 is just flush with the surface of the conveying platform 1, and the lower edge of the push plate 52 is enabled to be attached to the surface of the conveying platform 1 along with the starting of the inner pushing component 54 until the push plate 52 moves to the center of the conveying platform 1.
Referring to fig. 1 and 9, the sensing member 6 is provided with a hollow column 61 fixedly connected to the periphery of the movable sleeve frame 51, and a touch switch 62 is provided in the hollow column 61.
When the sensing piece 6 is triggered by the triggering piece 7, the triggering piece 7 enters the hollow column 61, and after the suction plate 31 is pressed on the lower piece carrier 11, the touch switch 62 is simultaneously touched and pressed by the triggering piece 7, so that the position of the die bonding 21 corresponding to the lower piece carrier 11 is accurate.
Referring to fig. 1 and 10, the trigger 7 is provided with a pressing rod 71, the diameter of the pressing rod 71 is equal to the inner diameter of the hollow column 61, a column 311 is provided on the suction plate 31 at the position of the pressing rod 71, a support plate 72 for fixing the pressing rod 71 is provided on the column 311, and when the suction plate 31 mounts the die-bonding 21 on the surface of the lower carrier 11, the pressing rod 71 is in a state of being inserted into the hollow column 61 and pressed against the touch switch 62.
After the die-bonding 21 is attached to the surface of the lower sheet carrier 11 by the suction plate 31, if the position is accurate, the pressure bar 71 is inserted into the hollow column 61, the lower end of the pressure bar 71 presses the touch switch 62, so that the touch switch 62 is triggered, thereby indicating that the die-bonding 21 is attached to the surface of the lower sheet carrier 11 accurately, otherwise, the touch switch 62 is not triggered or the pressure bar 71 is contacted with the end of the hollow column 61, indicating that the die-bonding 21 is not accurate corresponding to the surface of the lower sheet carrier 11, therefore, the position of the suction plate 31 is adjusted by the mechanical arm 3 until the pressure bar 71 can trigger the touch switch 62, thereby ensuring that the die-bonding 21 is attached to the surface of the lower sheet carrier 11 accurately.
Referring to fig. 3-8, two sides of the outer surface of the push plate 52 are respectively provided with an inserting rod 521 extending outwards through a strip-shaped opening 512 on the movable sleeve frame 51, a strip-shaped plate 5121 is fixedly arranged on the outer side around the movable sleeve frame 51, the end of the inserting rod 521 extends outwards through the strip-shaped plate 5121, a socket for the inserting rod 521 to pass through is formed in the strip-shaped plate 5121, a spring 522 sleeved on each inserting rod 521 is fixedly connected between the push plate 52 and the strip-shaped plate 5121, a threaded rod 5211 with a diameter smaller than that of each inserting rod 521 extends outwards at the end of each inserting rod 521, a threaded sleeve 5212 is connected to each threaded rod 5211 in a threaded manner, and when the threaded sleeve 5212 contacts the strip-shaped plate 5121, the lower carrier 11 is in a state of being clamped between the two corresponding push plates 52.
When the push plate 52 is driven by the inner push assembly 54, the spring 522 is in a normal state when the push plate 52 is in an unmoved state, the surface of the push plate 52 is also attached to the peripheral wall of the conveying platform 1, and when the push plate 52 moves inwards, the spring 522 is gradually in a stretched state, the inserted rod 521 moves along the insertion opening on the strip 5121 until the distance between two corresponding push plates 52 is equal to the edge distance of the lower sheet carrier 11 after the threaded sleeve 5212 contacts the strip 5121, so that the lower sheet carrier 11 is ensured to be clamped between the two push plates 52, deformation caused by extrusion of the lower sheet carrier 11 by the two push plates 52 is avoided, and the distance between the threaded sleeve 5212 and the strip 5121 can be adjusted, so that the distance moved by the push plate 52 is adjusted by the rotating position of the threaded sleeve 5212 on the threaded rod 5211.
Referring to fig. 2-7, the jacking component 53 is provided with a first link 531 and a second link 532, one end of the first link 531 is hinged to a side edge of the fixed sleeve frame 4, one end of the second link 532 is hinged to a side edge of the movable sleeve frame 51, a free end of the first link 531 is connected to a free end of the second link 532 in a shaft manner, and a driving motor 533 for driving the first link 531 to swing is arranged on the fixed sleeve frame 4.
When the jacking component 53 is started, the driving motor 533 drives the first link 531 to swing, and as the included angle between the first link 531 and the second link 532 is an acute angle, the second link 532 pushes the movable sleeve frame 51 to move upwards along with the swing of the first link 531, and the included angle between the first link 531 and the second link 532 gradually approaches 180 ° until the guide sleeve 42 on the movable sleeve frame 51 contacts with the anti-drop ring 411.
Referring to fig. 2-7, the middle of the push plate 52 passes through the strip plate 5121 and extends outwards to be provided with an extension rod 541, the inner push assembly 54 is provided with a swing rod 542, one end of the swing rod 542 is hinged with the middle of the side edge of the movable sleeve frame 51, the other end of the swing rod 542 extends towards the direction of the extension rod 541, the end of the extension rod 541 is provided with a first shaft rod 5411 perpendicular to the extension rod 541, the hinge part of the swing rod 542 and the movable sleeve frame 51 is provided with a second shaft rod 5421, the swing rod 542 is provided with a sliding opening 5422 sleeved on the first shaft rod 5411 along the edge direction thereof, and the movable sleeve frame 51 is provided with an electromagnetic driving piece 543 for driving the second shaft rod 5421 to rotate.
When the inner pushing assembly 54 is started, the electromagnetic driving member 543 drives the second shaft 5421 to rotate, so as to drive the swing rod 542 to swing, and the swing rod 542 swings inwards, so that the first shaft 5411 is pushed by the sliding opening 5422 to drive the extension rod 541 to move inwards, and the push plate 52 is pushed to move inwards, so that the pushing of the lower sheet carrier 11 is completed, until the lower sheet carrier 11 moves to the central position of the transport platform 1.
Referring to fig. 2-7, the electromagnetic driving member 543 is provided with a first electromagnet 5431 and a second electromagnet 5432, the first electromagnet 5431 is fixedly disposed on the second shaft 5421, and the second electromagnet 5432 is fixedly disposed on the movable sleeve frame 51 and corresponds to the first electromagnet 5431.
When the electromagnetic driving member 543 is started, the first electromagnet 5431 and the second electromagnet 5432 are simultaneously energized, and according to the principle that like poles repel and unlike poles attract, the second electromagnet 5432 pushes the first electromagnet 5431 to be away from, so that the second shaft 5421 rotates to drive the swing rod 542 to swing inwards, when the first electromagnet 5431 and the second electromagnet 5432 are powered off, under the action of the spring 522 between the push plate 52 and the strip 5121, the push plate 52 returns to the strip-shaped opening 512 of the movable sleeve frame 51, the state that the surface of the push plate 52 is attached to the peripheral wall of the transport platform 1 is maintained, and the lower piece carrier 11 needs to be prevented from excessively pressing the lower piece carrier 11 due to the thinner thickness of the lower piece carrier 11, and along with the inward movement of the push plate 52 on the surface of the transport platform 1, the bottom surface of the push plate 52 is in a state tightly attached to the surface of the transport platform 1, so that no gap is generated between the push plate 52 and the transport platform 1, and the lower piece carrier 11 is effectively pushed.
The surface-mounted discrete device packaging technology based on the void rate self-feedback adjustment is applied to surface-mounted discrete device packaging equipment based on the void rate self-feedback adjustment, and comprises the following steps of:
s1, coating a layer of solder paste on the surface of a lower carrier 11, placing the lower carrier on a transport platform 1, and conveying the lower carrier to a mounting position of a die bonding 21;
s2, adjusting the position of the lower sheet carrier 11 on the transport platform 1 through the displacement adjusting mechanism 5, and keeping the lower sheet carrier 11 at the center of the transport platform 1;
s3, driving the suction plate 31 to suck a plurality of solid crystals 21 to move towards the direction of the lower carrier 11 through the mechanical arm 3;
s4, the trigger piece 7 on the suction plate 31 is matched with the sensing piece 6 on the movable sleeve frame 51, so that the die bonding 21 on the suction plate 31 is driven by the mechanical arm 3 to be aligned with the lower sheet carrier 11, and the die bonding 21 is attached to the surface of the lower sheet carrier 11;
s5, assembling the frame, and aligning and attaching the lower sheet carrier (11) and the upper sheet carrier;
s6, after aligning and attaching the lower sheet carrier (11) and the upper sheet carrier, feeding the lower sheet carrier and the upper sheet carrier into a tunnel sintering furnace for sintering, detecting sintering void ratio by utilizing X-rays after cooling at a cooling section of a hearth outlet, wherein the void ratio is adjustable within a range of 1% -10%, and transmitting a result after the X-rays detection to a tunnel sintering furnace temperature control system for adjusting sintering temperature, changing a sintering temperature curve in the hearth, realizing temperature self-adjustment in the tunnel sintering furnace in the sintering process, and achieving the purpose of reducing the void ratio of products.
According to the invention, the movable sleeve frame 51 moves upwards along the conveying platform 1, so that the edge of the lower piece carrier 11 is limited on the surface of the conveying platform 1 and does not exceed the edge of the conveying platform 1, and along with the pushing of the push plate 52 around the movable sleeve frame 51 to the lower piece carrier 11, the lower edge of the push plate 52 is attached to the surface of the conveying platform 1 to move, so that the lower piece carrier 11 is promoted to move to the center of the conveying platform 1, the alignment accuracy of the lower piece carrier 11 and the die bonding 21 is ensured, and the attaching efficiency is improved.
The foregoing examples merely illustrate one or more embodiments of the invention, which are described in greater detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. The utility model provides a paster type discrete device encapsulation equipment based on void ratio self-feedback is adjusted, including supply transport platform (1) that lower piece carrier (11) removed and supply platform (2) that solid brilliant (21) put, the transport direction of platform (2) department and orientation transport platform (1) is equipped with arm (3), the work end of arm (3) is equipped with suction plate (31), a serial communication port, the fixed cover of lower half of transport platform (1) is equipped with a fixed cover frame (4), be equipped with on fixed cover frame (4) and be used for adjusting displacement adjustment mechanism (5) of the position of lower piece carrier (11) on transport platform (1), displacement adjustment mechanism (5) are equipped with movable cover frame (51), movable cover frame (51) cover is established on transport platform (1) and is located the top of fixed cover frame (4), movable cover frame (51) can be at fixed cover frame (4) on vertical movement, the inner wall of movable cover frame (51) all is equipped with a push pedal (52) all around, every push pedal (52) all can horizontal migration, be equipped with on fixed cover frame (4) and drive movable cover (51) and be equipped with the movable cover (53) and be used for driving movable cover (52) respectively.
2. The surface mounted discrete device packaging equipment based on the void ratio self-feedback adjustment according to claim 1, wherein two ends of the suction plate (31) are respectively provided with a trigger piece (7), the position of the movable sleeve frame (51) corresponding to the trigger piece (7) is provided with an induction piece (6), and when the induction piece (6) is in contact with the trigger piece (7), the suction plate (31) is in a state of aligning with the transportation platform (1) to accurately mount the die bonding (21) on the surface of the lower piece carrier (11).
3. The paster type discrete device packaging equipment based on void ratio self-feedback adjustment according to claim 1, wherein the periphery of the inner wall of the movable sleeve frame (51) is contacted with the side edge of the transportation platform (1), the top four sides of the movable sleeve frame (51) are provided with slopes (511) extending from outside to inside, the periphery wall of the movable sleeve frame (51) is provided with strip-shaped openings (512) for embedding the push plate (52), the surface of the push plate (52) is contacted with the side edge of the transportation platform (1), the periphery corners of the fixed sleeve frame (4) are provided with guide rods (41) extending vertically upwards, the periphery corners of the movable sleeve frame (51) are provided with guide sleeves (42) sleeved on the corresponding guide rods (41) in a sliding mode, the top end of each guide rod (41) is provided with an anti-drop ring (411), and when the guide sleeve (42) is contacted with the anti-drop ring (411), the lower side of the push plate (52) is in a state of being flush with the top surface of the transportation platform (1).
4. The chip discrete device packaging device based on the void ratio self-feedback adjustment according to claim 2, wherein the sensing element (6) is provided with a hollow column (61) fixedly connected to the periphery of the movable sleeve frame (51), and a touch switch (62) is arranged in the hollow column (61).
5. The chip discrete device packaging apparatus based on the void ratio self-feedback adjustment according to claim 2, wherein the trigger member (7) is provided with a pressing rod (71), the diameter of the pressing rod (71) is equal to the inner diameter of the hollow column (61), a stand column (311) is provided on the suction plate (31) and at the position of the pressing rod (71), a support plate (72) for fixing the pressing rod (71) is provided on the stand column (311), and when the suction plate (31) attaches the die (21) to the surface of the lower carrier (11), the pressing rod (71) is in a state of being inserted in the hollow column (61) and pressed on the touch switch (62).
6. The chip-type discrete device packaging equipment based on the void ratio self-feedback adjustment according to claim 1, wherein two sides of the outer surface of the push plate (52) are respectively provided with an inserting rod (521) which penetrates through a strip-shaped opening (512) in the movable sleeve frame (51) and extends outwards, a strip-shaped plate (5121) is fixedly arranged on the outer periphery of the movable sleeve frame (51), the end part of the inserting rod (521) penetrates through the strip-shaped plate (5121) and extends outwards, a socket for the inserting rod (521) to penetrate through is formed in the strip-shaped plate (5121), a spring (522) sleeved on each inserting rod (521) is fixedly connected between the push plate (52) and the strip-shaped plate (5121), a threaded rod (5211) with the diameter smaller than that of each inserting rod (521) extends outwards, a threaded sleeve (5212) is connected to the end part of each threaded rod (5211) in a threaded mode, and when the threaded sleeve (5212) contacts the strip-shaped plate (5121), the lower piece carrier (11) is in a state of being clamped between the two corresponding push plates (52).
7. The surface mounted discrete device packaging equipment based on the void ratio self-feedback adjustment according to claim 1, wherein the jacking component (53) is provided with a first connecting rod (531) and a second connecting rod (532), one end of the first connecting rod (531) is hinged to the side edge of the fixed sleeve frame (4), one end of the second connecting rod (532) is hinged to the side edge of the movable sleeve frame (51), the free end of the first connecting rod (531) is connected with the free end of the second connecting rod (532) in a shaft mode, and a driving motor (533) for driving the first connecting rod (531) to swing is arranged on the fixed sleeve frame (4).
8. The surface-mounted discrete device packaging equipment based on the void ratio self-feedback adjustment according to claim 1, wherein the middle part of the push plate (52) penetrates through the strip-shaped plate (5121) to extend outwards to be provided with an extension rod (541), the inner pushing component (54) is provided with a swinging rod (542), one end of the swinging rod (542) is hinged with the middle part of the side edge of the movable sleeve frame (51), the other end of the swinging rod (542) extends towards the direction of the extension rod (541), the end part of the extension rod (541) is provided with a first shaft rod (5411) perpendicular to the extension rod (541), the hinge part of the swinging rod (542) and the movable sleeve frame (51) is provided with a second shaft rod (5421), a sliding port (5422) sleeved on the first shaft rod (5411) is formed in the edge direction of the swinging rod (542), and the movable sleeve frame (51) is provided with an electromagnetic driving piece (543) for driving the second shaft rod (5421) to rotate.
9. The surface-mounted discrete device packaging equipment based on the void ratio self-feedback adjustment according to claim 8, wherein the electromagnetic driving element (543) is provided with a first electromagnet (5431) and a second electromagnet (5432), the first electromagnet (5431) is fixedly arranged on the second shaft (5421), and the second electromagnet (5432) is fixedly arranged on the movable sleeve frame (51) and corresponds to the first electromagnet (5431).
10. The chip discrete device packaging process based on the void ratio self-feedback adjustment, which is applied to the chip discrete device packaging equipment based on the void ratio self-feedback adjustment as claimed in any one of claims 1 to 9, is characterized by comprising the following steps:
s1, coating a layer of solder paste on the surface of a lower carrier (11), then placing the lower carrier on a conveying platform (1) and conveying the lower carrier to a die bonding (21) mounting position;
s2, adjusting the position of the lower sheet carrier (11) on the conveying platform (1) through a displacement adjusting mechanism (5), and keeping the lower sheet carrier (11) at the center of the conveying platform (1);
s3, driving a suction plate (31) to suck a plurality of solid crystals (21) to move towards the direction of the lower sheet carrier (11) through a mechanical arm (3);
s4, matching a trigger piece (7) on the suction plate (31) with an induction piece (6) on the movable sleeve frame (51) to enable the die bonding (21) on the suction plate (31) to be aligned with the lower piece carrier (11), so that the die bonding (21) is attached to the surface of the lower piece carrier (11) under the driving of the mechanical arm (3);
s5, assembling the frame, and aligning and attaching the lower sheet carrier (11) and the upper sheet carrier;
s6, after aligning and attaching the lower sheet carrier (11) and the upper sheet carrier, feeding the lower sheet carrier and the upper sheet carrier into a tunnel sintering furnace for sintering, detecting sintering void ratio by utilizing X-rays after cooling at a cooling section of a hearth outlet, transmitting the detected result to a tunnel furnace control system, adjusting sintering temperature, and changing a sintering temperature curve in the hearth.
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| CN202311442074.6A CN117198947B (en) | 2023-11-01 | 2023-11-01 | Surface-mounted discrete device packaging equipment and process based on void ratio self-feedback adjustment |
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| CN109218483A (en) * | 2018-11-16 | 2019-01-15 | 东莞市沃德精密机械有限公司 | Automatic placement equipment |
| CN213560419U (en) * | 2020-08-06 | 2021-06-29 | 苏州杰林特电子科技有限公司 | Auxiliary welding jig for surface mount components |
| CN113410172A (en) * | 2021-07-02 | 2021-09-17 | 深圳市卓兴半导体科技有限公司 | Die bonder |
| CN114743910A (en) * | 2022-03-29 | 2022-07-12 | 深圳新益昌科技股份有限公司 | Die bonding conveying mechanism and die bonding machine |
| CN115132622A (en) * | 2022-06-17 | 2022-09-30 | 先之科半导体科技(东莞)有限公司 | Automatic dispensing, crystal taking and crystal fixing equipment for diode packaging |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10312112B2 (en) * | 2017-06-20 | 2019-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated fan-out package having multi-band antenna and method of forming the same |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109218483A (en) * | 2018-11-16 | 2019-01-15 | 东莞市沃德精密机械有限公司 | Automatic placement equipment |
| CN213560419U (en) * | 2020-08-06 | 2021-06-29 | 苏州杰林特电子科技有限公司 | Auxiliary welding jig for surface mount components |
| CN113410172A (en) * | 2021-07-02 | 2021-09-17 | 深圳市卓兴半导体科技有限公司 | Die bonder |
| CN114743910A (en) * | 2022-03-29 | 2022-07-12 | 深圳新益昌科技股份有限公司 | Die bonding conveying mechanism and die bonding machine |
| CN115132622A (en) * | 2022-06-17 | 2022-09-30 | 先之科半导体科技(东莞)有限公司 | Automatic dispensing, crystal taking and crystal fixing equipment for diode packaging |
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