CN117174602A - Semiconductor packaging structure and process - Google Patents
Semiconductor packaging structure and process Download PDFInfo
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- CN117174602A CN117174602A CN202210204766.6A CN202210204766A CN117174602A CN 117174602 A CN117174602 A CN 117174602A CN 202210204766 A CN202210204766 A CN 202210204766A CN 117174602 A CN117174602 A CN 117174602A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 253
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 85
- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000008569 process Effects 0.000 title abstract description 14
- 239000003990 capacitor Substances 0.000 claims description 13
- 239000007779 soft material Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 6
- 238000012858 packaging process Methods 0.000 claims description 6
- 238000013459 approach Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 28
- 230000009471 action Effects 0.000 abstract description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 12
- 238000005452 bending Methods 0.000 description 4
- 239000000872 buffer Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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Abstract
The invention relates to the technical field of semiconductors, in particular to a semiconductor packaging structure and a process; comprises an upper clamping plate, a lower clamping plate, a mounting hole, a lead wire and a surrounding block; a first groove is formed in the enclosing block; the number of the first grooves is at least four, the cross section of the first grooves is partially circular, the first grooves are uniformly distributed on the enclosing block, and the first grooves face the center of the enclosing block; a fastening spring is arranged in the first groove; one end, away from the corresponding first groove, of the fastening spring is fixedly connected with a fixed block; the semiconductor packaging structure disclosed by the invention has the advantages that the fixing block is pushed by a worker and then is matched with the fixing block to clamp the semiconductor chip under the action of the fastening spring, so that the purpose that the semiconductor packaging structure can be suitable for semiconductor chips with different specifications is achieved, the application range of the semiconductor packaging structure is improved, meanwhile, the semiconductor packaging structure is convenient to install by matching the upper clamping plate and the lower clamping plate, and the use effect of the semiconductor packaging structure is improved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a semiconductor packaging structure and a semiconductor packaging process.
Background
In the semiconductor production process, the semiconductor packaging structure is used for protecting the IC chip and providing external electrical connection so as to prevent damage of external force or environmental factors in the processes of transportation, installation and use, in addition, the integrated circuit component is also required to be combined with passive components such as resistors, capacitors and the like into a system so as to play a given function, and the electronic packaging is used for establishing a protection and organization framework of the integrated circuit component; the semiconductor packaging structure in the current market can only be used for packaging semiconductors with one specification, and when packaging semiconductor chips with different specifications, different semiconductor packaging structures are needed, so that different semiconductor packaging structures are needed to be designed and manufactured, and the production cost is increased.
The utility model discloses a semiconductor packaging structure as in a chinese patent of application No. cn201821050140.X, including protective housing, plastic lens and heating panel, the surface inside of protective housing is provided with the handle, the inside upper end of protective housing is provided with the punch holder, the punch holder surface is provided with the mounting hole, and is provided with the enclosing board in the middle of the upper surface of punch holder, the inside of enclosing board is provided with the chip, and the top of chip is provided with the filler, plastic lens is located the top of filler, the upper surface side of chip is connected with the lead wire, and is connected with the pin strip on the lead wire, the lower extreme inside of pin strip is provided with the draw-in hole, be provided with the mounting groove in the middle of the punch holder, and the inboard surface of mounting groove is provided with the resin layer, the heating panel is located the surface inside of lower plate; the buffer protection device is convenient to transport, simple in structure, convenient to disassemble and assemble, good in heat dissipation effect and dustproof; however, this solution cannot package semiconductor chips of different specifications, and thus causes limitations of the solution.
In view of the above, the present invention provides a semiconductor package structure and process for overcoming the above technical problems.
Disclosure of Invention
In order to make up for the defects of the prior art, the semiconductor packaging structure provided by the invention has the advantages that the fixing block is pushed by a worker and then is matched with the fixing block to clamp the semiconductor chip under the action of the fastening spring, so that the purpose that the semiconductor packaging structure can be suitable for semiconductor chips with different specifications is achieved, the application range of the semiconductor packaging structure is improved, meanwhile, the semiconductor packaging structure is convenient to install through the matching of the upper clamping plate and the lower clamping plate, and the use effect of the semiconductor packaging structure is improved.
The technical scheme adopted for solving the technical problems is as follows: the invention relates to a semiconductor packaging structure, which comprises an upper clamping plate, a lower clamping plate, a mounting hole, a lead and a surrounding block; a first groove is formed in the enclosing block; the number of the first grooves is at least four, the cross section of the first grooves is partially circular, the first grooves are uniformly distributed on the enclosing block, and the first grooves face the center of the enclosing block; a fastening spring is arranged in the first groove; one end, away from the corresponding first groove, of the fastening spring is fixedly connected with a fixed block;
when the semiconductor packaging structure works, the semiconductor packaging structure in the current market can only package semiconductors with one specification, and when packaging semiconductor chips with different specifications, different semiconductor packaging structures are needed, so that different semiconductor packaging structures are needed to be designed and manufactured, and the production cost is increased;
therefore, when the invention is used, the staff pushes all the fixing blocks towards the direction approaching to the corresponding first groove, and the fastening springs in the first groove are pressed; the worker then puts the semiconductor chip into the enclosing block, when the semiconductor chip is put into the enclosing block, the worker connects the edge of the semiconductor chip with the lead, and then the worker releases the fixing block, so that the fixing block moves towards the direction close to the semiconductor chip under the action of the pushing force of the fastening spring until the fixing block contacts with the semiconductor chip and clamps the semiconductor chip, and the semiconductor chip is prevented from loosening; according to the invention, the fixing block is connected through the fastening spring, so that the fixing block can clamp semiconductor chips with different specifications, and further, when the semiconductor chips with different specifications are packaged, packaging elements with different specifications are not required to be used; filling filler into the enclosing block by a worker, closing the upper clamping plate and the lower clamping plate, installing the upper clamping plate and the lower clamping plate on the capacitor plate by the worker through installing holes on the upper clamping plate and the lower clamping plate, and finally, exposing one ends of the upper clamping plate and the lower clamping plate by the worker and welding the ends of the leads on the capacitor plate;
the semiconductor packaging structure pushes the fixing block by a worker and then clamps the semiconductor chip to be matched with the fixing block under the action of the fastening spring, so that the purpose that the semiconductor packaging structure can be suitable for semiconductor chips with different specifications is achieved, the application range of the semiconductor packaging structure is improved, meanwhile, the semiconductor packaging structure is convenient to install by matching the upper clamping plate and the lower clamping plate, and the use effect of the semiconductor packaging structure is improved.
Preferably, the cross section of the fixing block is in an inverted L shape, and the fixing block is made of soft materials, such as rubber;
when the semiconductor chip limiting device works, a worker puts the semiconductor chip into the enclosing block, the fixing block clamps the semiconductor chip, and meanwhile, the upper end of the fixing block clamps the semiconductor chip, so that the semiconductor chip is limited; when the semiconductor packaging structure is transported, the semiconductor packaging structure moves and shakes along with a transport tool, the fixing block limits the semiconductor chip so that the semiconductor chip cannot shake up and down in the enclosing block, and meanwhile, under the action of the fastening spring, the fastening spring buffers the semiconductor chip when shaking; the fixing block is made of soft materials, so that the fixing block cannot hurt or damage the semiconductor chip when clamping the semiconductor chip, the semiconductor chip is further protected, and the semiconductor chip is further protected in the transportation process;
the semiconductor packaging structure limits the semiconductor chip through the fixing block and is matched with the fixing block by adopting soft materials, so that the purposes of buffering and protecting the semiconductor chip in the transportation process are achieved, the probability of damaging the semiconductor chip in the transportation process along with the semiconductor packaging structure is reduced, the yield of the semiconductor packaging structure when the semiconductor packaging structure is installed on a capacitor plate is improved, and the use effect of the semiconductor packaging structure is further improved.
Preferably, one end of the fastening spring far away from the fixed block is fixedly connected with a sliding block; one end of the sliding block, which is far away from the fastening spring, is rotationally connected with a rotating block; the section of the rotating block is circular, the rotating block is connected with the first groove in a sliding way, and the rotating block can rotate in the first groove; a twisting block is fixedly connected to one side, away from the lower clamping plate, of the rotating block; the end face of the enclosing block, which is far away from the lower clamping plate, is provided with a second groove; the number of the second grooves is at least two, the second grooves are positioned on the same side of the first groove, and the second grooves are uniformly arranged close to the first groove; the twisting block can be clamped into the second groove;
when the rotary block is slid to a proper position, the rotary block is rotated, and the rotary block is clamped into the corresponding second groove; when the position of the rotating block is changed, the position of the fixed block is also changed, so that the force and the range of the fixed block for clamping the semiconductor chip are also changed, the force of the fixed block for clamping the semiconductor chip is always in a proper size, the semiconductor chip cannot be damaged by the fixed block due to overlarge clamping force, and the clamping effect cannot be achieved due to overlarge clamping force;
according to the semiconductor packaging structure, the twisting block is clamped into the corresponding second groove and then is matched with the fixing block in a position changing way along with the rotating block, so that the purpose that the force of the fixing block for clamping the semiconductor chip is controlled in a proper range is achieved, the semiconductor chip cannot be damaged by the fixing block due to overlarge clamping force, meanwhile, the clamping effect cannot be achieved due to overlarge clamping force, and the situation that the service life of the semiconductor chip is reduced due to overlarge or overlarge clamping force in use is prevented; the practical application effect of the invention is improved, and the service life of the invention and the semiconductor chip is prolonged.
Preferably, the end face, close to the fixed block, of the sliding block is provided with a fourth groove; a connecting rod is arranged in the first groove; one end of the connecting rod is fixedly connected with the fixing block, the other end of the connecting rod is positioned in the fourth groove, the section shape of the connecting rod is consistent with that of the fourth groove, and the connecting rod is in sliding connection with the fourth groove;
when the spring compression device works, a worker pushes the fixed block away, and the connecting rod moves along with the fixed block, so that one end of the connecting rod, which is far away from the fixed block, slides in the fourth groove, the connecting rod plays a role in guiding the spring, and the spring is prevented from being bent after being compressed; the staff puts the semiconductor chip into the enclosing block, and then releases the fixing block, so that the fixing block clamps the semiconductor chip under the action of the elastic force of the fastening spring, at the moment, one end of the connecting piece, which is far away from the fixing block, is still positioned in the fourth groove, and the connecting piece can prevent the fastening spring from bending when the fastening spring applies force to the fixing block, so that the clamping effect of the fixing block on the semiconductor chip is ensured, and the using effect of the semiconductor packaging structure is improved.
Preferably, the length of the fixing block in the direction vertical to the lower clamping plate is the same as the length of the enclosing block, and a third groove is formed in the end face, close to the lower clamping plate, of the fixing block; the number of the third grooves is the same as that of the leads, the cross-sectional shape of the third grooves is the same as that of the leads, and the third grooves penetrate through the two ends of the fixed block; one end of the lead penetrates through the third groove and is partially exposed out of the third groove, and the lead is fixedly connected with the fixing block at the third groove;
when the semiconductor chip fixing device works, a worker places the semiconductor chip above one end of the lead wire in the enclosing block, places the semiconductor chip in the enclosing block, the fixing block and the connecting rod enable the semiconductor chip to be tightly attached to the lower clamping plate, the edge of the semiconductor chip is communicated with the lead wire, the lead wire is fixedly connected in the third groove, the position of the fixing block is adjusted when the fixing block clamps the semiconductor chips with different specifications, the position of the lead wire also moves along with the fixing block, therefore, when the worker places the semiconductor chip in the enclosing block, the worker does not need to independently adjust the position of the lead wire, the step of adjusting the position of the lead wire is omitted, the difficulty of the worker in installing the semiconductor chip is reduced, and the practical use effect of the semiconductor chip fixing device is improved.
A semiconductor packaging process is suitable for the semiconductor packaging structure, and comprises the following steps:
s1: the staff separates the upper clamping plate from the lower clamping plate, and pushes the fixing block on the lower clamping plate away from the center of the enclosing block;
s2: the staff approaches the semiconductor chip to the enclosing block, places the semiconductor chip above one end of the lead wire in the enclosing block, places the semiconductor chip in the enclosing block, and the fixing block and the connecting rod enable the semiconductor chip to be tightly attached to the lower clamping plate, and at the moment, the edge of the semiconductor chip is communicated with the lead wire;
s3: the staff releases the fixed block, the fixed block moves towards the direction approaching to the semiconductor chip, and finally clamps the semiconductor chip;
s4: and finally, the staff connects the semiconductor packaging device to the capacitor plate through the mounting holes, thereby completing the packaging of the semiconductor.
The beneficial effects of the invention are as follows:
1. the semiconductor packaging structure pushes the fixing block by a worker and then clamps the semiconductor chip to be matched with the fixing block under the action of the fastening spring, so that the purpose that the semiconductor packaging structure can be suitable for semiconductor chips with different specifications is achieved, the application range of the semiconductor packaging structure is improved, meanwhile, the semiconductor packaging structure is convenient to install by matching the upper clamping plate and the lower clamping plate, and the use effect of the semiconductor packaging structure is improved.
2. The semiconductor packaging structure limits the semiconductor chip through the fixing block and is matched with the fixing block by adopting soft materials, so that the purposes of buffering and protecting the semiconductor chip in the transportation process are achieved, the probability of damaging the semiconductor chip in the transportation process along with the semiconductor packaging structure is reduced, the yield of the semiconductor packaging structure when the semiconductor packaging structure is installed on a capacitor plate is improved, and the use effect of the semiconductor packaging structure is further improved.
3. According to the semiconductor packaging structure, the twisting block is clamped into the corresponding second groove and then is matched with the fixing block in a position changing way along with the rotating block, so that the purpose that the force of the fixing block for clamping the semiconductor chip is controlled in a proper range is achieved, the semiconductor chip cannot be damaged by the fixing block due to overlarge clamping force, meanwhile, the clamping effect cannot be achieved due to overlarge clamping force, and the situation that the service life of the semiconductor chip is reduced due to overlarge or overlarge clamping force in use is prevented; the practical application effect of the invention is improved, and the service life of the invention and the semiconductor chip is prolonged.
Drawings
The invention is further described below with reference to the accompanying drawings.
Fig. 1 is an overall structural view of a semiconductor package structure in the present invention;
FIG. 2 is an enlarged view of area A of FIG. 1;
fig. 3 is a cross-sectional view of a semiconductor package structure in accordance with the present invention;
FIG. 4 is an enlarged view of area B of FIG. 3;
FIG. 5 is a flow chart of a packaging process of the semiconductor package structure of the present invention;
in the figure: 1. an upper clamping plate; 2. a lower clamping plate; 3. a mounting hole; 4. a lead wire; 5. enclosing blocks; 6. a first groove; 61. a fastening spring; 62. a fixed block; 63. a sliding block; 64. a rotating block; 65. twisting the block; 66. a second groove; 67. a connecting rod; 68. a third groove; 69. and a fourth groove.
Detailed Description
The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
As shown in fig. 1 to 5, a semiconductor package structure according to the present invention includes an upper clamping plate 1, a lower clamping plate 2, a mounting hole 3, a lead 4, and an enclosure block 5; a first groove 6 is formed in the enclosing block 5; the number of the first grooves 6 is at least four, the cross section of the first grooves 6 is partially circular, the first grooves 6 are uniformly distributed on the enclosing block 5, and the first grooves 6 face the center of the enclosing block 5; a fastening spring 61 is arranged in the first groove 6; one end of the fastening spring 61, which is far away from the corresponding first groove 6, is fixedly connected with a fixed block 62;
when the semiconductor packaging structure works, the semiconductor packaging structure in the current market can only package semiconductors with one specification, and when packaging semiconductor chips with different specifications, different semiconductor packaging structures are needed, so that different semiconductor packaging structures are needed to be designed and manufactured, and the production cost is increased;
therefore, when the worker uses the invention to push all the fixing blocks 62 towards the direction approaching the corresponding first grooves 6, the fastening springs 61 in the first grooves 6 are pressed; when the semiconductor chip is placed in the enclosing block 5, the edge of the semiconductor chip is connected with the lead 4 by the worker, and then the worker releases the fixing block 62, so that the fixing block 62 moves towards the direction close to the semiconductor chip under the action of the pushing force of the fastening spring 61 until the fixing block 62 contacts with the semiconductor chip and clamps the semiconductor chip, and the semiconductor chip is prevented from loosening; the invention connects the fixed block 62 through the fastening spring 61, so that the fixed block 62 can clamp semiconductor chips with different specifications, and further, when packaging the semiconductor chips with different specifications, packaging elements with different specifications are not needed; filling filler into the enclosing block 5 by a worker, closing the upper clamping plate 1 and the lower clamping plate 2, installing the upper clamping plate 1 and the lower clamping plate 2 on the capacitor plate by the worker through the installing holes 3 on the upper clamping plate 1 and the lower clamping plate 2, and finally welding one ends of the lead 4 exposed out of the upper clamping plate 1 and the lower clamping plate 2 on the capacitor plate by the worker;
the semiconductor packaging structure in the invention pushes the fixed block 62 by a worker and then clamps the semiconductor chip to be matched with the fixed block 62 under the action of the fastening spring 61, thereby achieving the aim of being applicable to semiconductor chips with different specifications, improving the application range of the invention, and simultaneously facilitating the installation and improving the use effect of the invention by the matching of the upper clamping plate 1 and the lower clamping plate 2.
As an embodiment of the present invention, the cross-section of the fixing block 62 is in an inverted L shape, and the fixing block 62 is made of a soft material, such as rubber;
when in operation, a worker puts the semiconductor chip into the enclosing block 5, the fixing block 62 clamps the semiconductor chip, and meanwhile, the upper end of the fixing block 62 clamps the semiconductor chip, so that the semiconductor chip is limited; when the semiconductor packaging structure in the invention is transported, the semiconductor packaging structure moves and shakes along with a transportation tool, the fixing block 62 limits the semiconductor chip so that the semiconductor chip cannot shake up and down in the enclosing block 5, and meanwhile, under the action of the fastening spring 61, the fastening spring 61 buffers the semiconductor chip when shaking; the fixing block 62 is made of soft materials, so that the fixing block 62 cannot hurt or damage the semiconductor chip when clamping the semiconductor chip, thereby protecting the semiconductor chip and further protecting the semiconductor chip in the transportation process;
the semiconductor packaging structure limits the semiconductor chip through the fixing block 62 and is matched with the fixing block 62 by adopting soft materials, so that the purposes of buffering and protecting the semiconductor chip in the transportation process are achieved, the probability of damaging the semiconductor chip in the transportation process along with the semiconductor packaging structure is reduced, the yield of the semiconductor packaging structure when the semiconductor packaging structure is installed on a capacitor plate is improved, and the use effect of the semiconductor packaging structure is further improved.
As an embodiment of the present invention, a sliding block 63 is fixedly connected to one end of the fastening spring 61 away from the fixed block 62; the end of the sliding block 63 far away from the fastening spring 61 is rotatably connected with a rotating block 64; the section of the rotating block 64 is circular, the rotating block 64 is slidably connected with the first groove 6, and the rotating block 64 can rotate in the first groove 6; a twisting block 65 is fixedly connected to one side of the rotating block 64 away from the lower clamping plate 2; the end surface of the enclosing block 5 far away from the lower clamping plate 2 is provided with a second groove 66; the number of the second grooves 66 is at least two, the second grooves 66 are positioned on the same side of the first groove 6, and the second grooves 66 are uniformly arranged close to the first groove 6; the twisting block 65 can be clamped into the second groove 66;
when the rotary block 64 is slid to a proper position by the rotary block 64, the rotary block 65 is rotated, and the rotary block 65 is clamped into the corresponding second groove 66; when the position of the rotating block 64 is changed, the position of the fixed block 62 is changed, so that the force and the range of clamping the semiconductor chip by the fixed block 62 are also changed, the force of clamping the semiconductor chip by the fixed block 62 is always in a proper size, the semiconductor chip cannot be damaged by the excessive clamping force of the fixed block 62, and the clamping effect cannot be achieved due to the excessively small clamping force;
according to the semiconductor packaging structure, the twisting block 65 is clamped into the corresponding second groove 66 and then is matched with the fixed block 62 in a position changing way along with the rotating block 64, so that the aim of controlling the force of the fixed block 62 for clamping a semiconductor chip in a proper range is fulfilled, the semiconductor chip is not damaged by overlarge clamping force of the fixed block 62, meanwhile, the clamping effect cannot be achieved due to overlarge clamping force, and the situation that the service life of the semiconductor chip is reduced due to overlarge or overlarge clamping force in use is prevented; the practical application effect of the invention is improved, and the service life of the invention and the semiconductor chip is prolonged.
As an embodiment of the present invention, the end surface of the sliding block 63 near the fixed block 62 is provided with a fourth groove 69; a connecting rod 67 is arranged in the first groove 6; one end of the connecting rod 67 is fixedly connected with the fixed block 62, the other end of the connecting rod 67 is positioned in the fourth groove 69, the section shape of the connecting rod 67 is consistent with that of the fourth groove 69, and the connecting rod 67 is in sliding connection with the fourth groove 69;
when the spring compression device works, a worker pushes the fixed block 62 away, the connecting rod 67 moves along with the fixed block 62, so that one end of the connecting rod 67 away from the fixed block 62 slides in the groove 69, the connecting rod 67 plays a role in guiding the spring, and the spring is prevented from being bent after being compressed; the staff puts the semiconductor chip into the enclosing block 5 and then releases the fixing block 62, so that the fixing block 62 clamps the semiconductor chip under the action of the elastic force of the fastening spring 61, at the moment, one end of the connecting piece, which is far away from the fixing block 62, is still positioned in the fourth groove 69, and the connecting piece can prevent the fastening spring 61 from bending when the fastening spring 61 applies force to the fixing block 62, thereby ensuring the clamping effect of the fixing block 62 on the semiconductor chip and improving the using effect of the semiconductor packaging structure.
As an embodiment of the present invention, the length of the fixing block 62 in the direction perpendicular to the lower clamping plate 2 is the same as the length of the enclosing block 5, and a third groove 68 is formed on the end surface of the fixing block 62 close to the lower clamping plate 2; the number of the third grooves 68 is the same as that of the leads 4, the cross-sectional shape of the third grooves 68 is the same as that of the leads 4, and the third grooves 68 penetrate through two ends of the fixing block 62; one end of the lead 4 passes through the third groove 68 and partially exposes the third groove 68, and the lead 4 is fixedly connected with the fixing block 62 at the third groove 68;
during operation, a worker places the semiconductor chip above one end of the lead 4 in the enclosing block 5, places the semiconductor chip in the enclosing block 5, the fixing block 62 and the connecting rod 67 enable the semiconductor chip to be tightly attached to the lower clamping plate 2, at the moment, the edge of the semiconductor chip is communicated with the lead 4, the lead 4 is fixedly connected in the third groove 68, the position of the fixing block 62 is adjusted when the fixing block 62 clamps the semiconductor chips with different specifications, the position of the lead 4 moves along with the movement, and therefore when the worker places the semiconductor chip in the enclosing block 5, the worker does not need to independently adjust the position of the lead 4, the step of adjusting the position of the lead 4 is omitted, and therefore the difficulty of the worker in installing the semiconductor chip is reduced, and the practical use effect of the semiconductor chip mounting device is improved.
A semiconductor packaging process is suitable for the semiconductor packaging structure, and comprises the following steps:
s1: the staff separates the upper clamping plate 1 from the lower clamping plate 2 and pushes the fixed block 62 on the lower clamping plate 2 away from the center of the enclosing block 5;
s2: the staff approaches the semiconductor chip to the enclosing block 5, puts the semiconductor chip above one end of the lead 4 in the enclosing block 5, puts the semiconductor chip into the enclosing block 5, and the fixing block 62 and the connecting rod 67 enable the semiconductor chip to be tightly attached to the lower clamping plate 2, and at the moment, the edge of the semiconductor chip is communicated with the lead 4;
s3: the worker releases the fixing block 62, the fixing block 62 moves toward the direction approaching the semiconductor chip, and finally the semiconductor chip is clamped;
s4: and finally, the staff connects the semiconductor packaging device to the capacitor plate through the mounting holes 3, thereby completing the packaging of the semiconductor.
The specific working procedure is as follows:
when a worker uses the invention to push all the fixing blocks 62 towards the direction approaching the corresponding first groove 6, the fastening springs 61 in the first groove 6 are pressed; when the semiconductor chip is placed in the enclosing block 5, the edge of the semiconductor chip is connected with the lead 4 by the worker, and then the worker releases the fixing block 62, so that the fixing block 62 moves towards the direction close to the semiconductor chip under the action of the pushing force of the fastening spring 61 until the fixing block 62 contacts with the semiconductor chip and clamps the semiconductor chip, and the semiconductor chip is prevented from loosening; the invention connects the fixed block 62 through the fastening spring 61, so that the fixed block 62 can clamp semiconductor chips with different specifications, and further, when packaging the semiconductor chips with different specifications, packaging elements with different specifications are not needed; filling filler into the enclosing block 5 by a worker, closing the upper clamping plate 1 and the lower clamping plate 2, installing the upper clamping plate 1 and the lower clamping plate 2 on the capacitor plate by the worker through the installing holes 3 on the upper clamping plate 1 and the lower clamping plate 2, and finally welding one ends of the lead 4 exposed out of the upper clamping plate 1 and the lower clamping plate 2 on the capacitor plate by the worker; the worker puts the semiconductor chip into the enclosing block 5, the fixing block 62 clamps the semiconductor chip, and the upper end of the fixing block 62 clamps the semiconductor chip to limit the semiconductor chip; when the semiconductor packaging structure in the invention is transported, the semiconductor packaging structure moves and shakes along with a transportation tool, the fixing block 62 limits the semiconductor chip so that the semiconductor chip cannot shake up and down in the enclosing block 5, and meanwhile, under the action of the fastening spring 61, the fastening spring 61 buffers the semiconductor chip when shaking; the fixing block 62 is made of soft materials, so that the fixing block 62 cannot hurt or damage the semiconductor chip when clamping the semiconductor chip, thereby protecting the semiconductor chip and further protecting the semiconductor chip in the transportation process; the worker slides the rotating block 64 through the twisting block 65, so that the rotating block 64 slides along the first groove 6, and when the rotating block 64 slides to a proper position, the twisting block 65 is rotated, and the twisting block 65 is clamped into the corresponding second groove 66; when the position of the rotating block 64 is changed, the position of the fixed block 62 is changed, so that the force and the range of clamping the semiconductor chip by the fixed block 62 are also changed, the force of clamping the semiconductor chip by the fixed block 62 is always in a proper size, the semiconductor chip cannot be damaged by the excessive clamping force of the fixed block 62, and the clamping effect cannot be achieved due to the excessively small clamping force; the staff pushes the fixed block 62 open, the connecting rod 67 moves along with the fixed block 62, so that one end of the connecting rod 67 far away from the fixed block 62 slides in the groove 69, the connecting rod 67 plays a role in guiding the spring, and the spring is prevented from bending after being compressed; the worker puts the semiconductor chip into the enclosing block 5 and releases the fixing block 62, so that the fixing block 62 clamps the semiconductor chip under the action of the elastic force of the fastening spring 61, at the moment, one end of the connecting piece, which is far away from the fixing block 62, is still positioned in the fourth groove 69, and the connecting piece can prevent the fastening spring 61 from bending when the fastening spring 61 applies force to the fixing block 62, so that the clamping effect of the fixing block 62 on the semiconductor chip is ensured, and the use effect of the semiconductor packaging structure is improved; the staff puts the semiconductor chip above the end of the lead 4 in the enclosing block 5, puts the semiconductor chip into the enclosing block 5, the fixing block 62 and the connecting rod 67 enable the semiconductor chip to be closely attached to the lower clamping plate 2, at the moment, the edge of the semiconductor chip is communicated with the lead 4, the lead 4 is fixedly connected in the third groove 68, the position of the fixing block 62 is adjusted when the fixing block 62 clamps the semiconductor chips with different specifications, the position of the lead 4 moves along with the movement, and therefore, when the staff puts the semiconductor chip into the enclosing block 5, the position of the lead 4 is not required to be independently adjusted, the step of adjusting the position of the lead 4 is omitted, and therefore the difficulty of the staff in installing the semiconductor chip is reduced, and the practical use effect of the invention is improved.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A semiconductor packaging structure comprises an upper clamping plate (1), a lower clamping plate (2), a mounting hole (3), a lead (4) and a surrounding block (5); the method is characterized in that: a first groove (6) is formed in the enclosing block (5); the number of the first grooves (6) is at least four, the cross section of the first grooves (6) is partially circular, the first grooves (6) are uniformly distributed on the enclosing block (5), and the first grooves (6) face to the center of the enclosing block (5); a fastening spring (61) is arranged in the first groove (6); one end of the fastening spring (61) far away from the corresponding first groove (6) is fixedly connected with a fixing block (62).
2. The semiconductor package according to claim 1, wherein: the section shape of the fixing block (62) is in an inverted L shape, and the fixing block (62) is made of soft materials.
3. The semiconductor package according to claim 2, wherein: one end of the fastening spring (61) far away from the fixed block (62) is fixedly connected with a sliding block (63); one end of the sliding block (63) far away from the fastening spring (61) is rotatably connected with a rotating block (64); the section of the rotating block (64) is circular, the rotating block (64) is connected with the first groove (6) in a sliding mode, and the rotating block (64) can rotate in the first groove (6); a twisting block (65) is fixedly connected to one side, away from the lower clamping plate (2), of the rotating block (64); the end face, far away from the lower clamping plate (2), of the enclosing block (5) is provided with a second groove (66); the number of the second grooves (66) is at least two, the second grooves (66) are positioned on the same side of the first groove (6), and the second grooves (66) are uniformly arranged close to the first groove (6); the twisting block (65) can be clamped into the second groove (66).
4. A semiconductor package according to claim 3, wherein: a fourth groove (69) is formed in the end face, close to the fixed block (62), of the sliding block (63); a connecting rod (67) is arranged in the first groove (6); one end of the connecting rod (67) is fixedly connected with the fixing block (62), the other end of the connecting rod is positioned in the fourth groove (69), the cross section shape of the connecting rod (67) is consistent with that of the fourth groove (69), and the connecting rod (67) is in sliding connection with the fourth groove (69).
5. The semiconductor package according to claim 4, wherein: the length of the fixing block (62) in the direction perpendicular to the lower clamping plate (2) is the same as the length of the enclosing block (5), and a third groove (68) is formed in the end face, close to the lower clamping plate (2), of the fixing block (62); the number of the third grooves (68) is the same as that of the leads (4), the cross section of the third grooves (68) is the same as that of the leads (4), and the third grooves (68) penetrate through the two ends of the fixing block (62); one end of the lead (4) penetrates through the third groove (68) and partially exposes the third groove (68), and the lead (4) is fixedly connected with the fixing block (62) at the third groove (68).
6. A semiconductor packaging process, which is applicable to the semiconductor packaging structure of any one of claims 1 to 5, characterized in that: the packaging process comprises the following steps:
s1: the staff separates the upper clamping plate (1) from the lower clamping plate (2), and pushes the fixed block (62) on the lower clamping plate (2) away from the center of the enclosing block (5);
s2: the staff approaches the semiconductor chip to the enclosing block (5), puts the semiconductor chip above one end of the lead (4) in the enclosing block (5), puts the semiconductor chip into the enclosing block (5), and the fixing block (62) and the connecting rod (67) enable the semiconductor chip to be tightly attached to the lower clamping plate (2), and at the moment, the edge of the semiconductor chip is communicated with the lead (4);
s3: the staff releases the fixed block (62), the fixed block (62) moves towards the direction close to the semiconductor chip, and finally the semiconductor chip is clamped;
s4: and the staff smears the filler above the semiconductor chip, then the upper clamping plate (1) is combined on the lower clamping plate (2) and is aligned through the mounting holes (3), and finally the staff connects the semiconductor packaging device to the capacitor plate through the mounting holes (3), so that the packaging of the semiconductor is completed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210204766.6A CN117174602A (en) | 2022-03-03 | 2022-03-03 | Semiconductor packaging structure and process |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4390220A (en) * | 1981-04-02 | 1983-06-28 | Burroughs Corporation | Electrical connector assembly for an integrated circuit package |
| CN209747454U (en) * | 2019-07-10 | 2019-12-06 | 江苏芝麻智能科技有限公司 | Flattening machine table for semiconductor packaging |
| CN213780492U (en) * | 2020-11-13 | 2021-07-23 | 秦山英 | Optical component packaging structure |
| CN214753706U (en) * | 2021-05-14 | 2021-11-16 | 铜陵中锐电子科技有限公司 | Semiconductor packaging structure |
-
2022
- 2022-03-03 CN CN202210204766.6A patent/CN117174602A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4390220A (en) * | 1981-04-02 | 1983-06-28 | Burroughs Corporation | Electrical connector assembly for an integrated circuit package |
| CN209747454U (en) * | 2019-07-10 | 2019-12-06 | 江苏芝麻智能科技有限公司 | Flattening machine table for semiconductor packaging |
| CN213780492U (en) * | 2020-11-13 | 2021-07-23 | 秦山英 | Optical component packaging structure |
| CN214753706U (en) * | 2021-05-14 | 2021-11-16 | 铜陵中锐电子科技有限公司 | Semiconductor packaging structure |
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