CN117156662A - Metal substrate, preparation method and heat dissipation circuit board - Google Patents
Metal substrate, preparation method and heat dissipation circuit board Download PDFInfo
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- CN117156662A CN117156662A CN202311433202.0A CN202311433202A CN117156662A CN 117156662 A CN117156662 A CN 117156662A CN 202311433202 A CN202311433202 A CN 202311433202A CN 117156662 A CN117156662 A CN 117156662A
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- heat pipe
- circuit board
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 172
- 239000002184 metal Substances 0.000 title claims abstract description 172
- 239000000758 substrate Substances 0.000 title claims abstract description 146
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 57
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 238000001704 evaporation Methods 0.000 claims abstract description 35
- 230000008020 evaporation Effects 0.000 claims abstract description 35
- 238000010521 absorption reaction Methods 0.000 claims abstract description 34
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 238000009833 condensation Methods 0.000 claims abstract description 25
- 230000005494 condensation Effects 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 description 12
- 238000012546 transfer Methods 0.000 description 12
- 239000010949 copper Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 238000013461 design Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000005086 pumping Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a metal substrate, a preparation method and a heat dissipation circuit board, relates to the technical field of circuit board heat dissipation, and aims to solve the problems that a heat exchange system of the metal substrate circuit board in the prior art is complex and heat exchange efficiency is insufficient. The metal substrate is an integrally formed metal substrate, a plurality of heat pipe channels are arranged in the metal substrate, heat pipe working media are filled in the heat pipe channels, the heat pipe channels are sealed backflow channels, each heat pipe channel is provided with a heat absorption evaporation area and a heat dissipation condensation area which extend along the axial direction of the heat pipe channel, the heat absorption evaporation area is used for absorbing heat of a heating element in contact with a circuit board of the metal substrate, and the heat dissipation condensation area is used for condensing steam generated in the heat absorption evaporation area. The preparation method is used for preparing the metal substrate, and the heat dissipation circuit board uses the metal substrate. The metal substrate, the preparation method and the heat dissipation circuit board provided by the invention are used for improving the heat dissipation capacity and the current density of the metal substrate circuit board.
Description
Technical Field
The invention relates to the technical field of heat dissipation of circuit boards, in particular to a metal substrate, a preparation method and a heat dissipation circuit board.
Background
It is well known that high temperature conditions occur when electronic devices are operated at high speeds. If the heat cannot be quickly taken away, the components at high temperature can soften and deform, parameters and performances can be changed, and even potential safety hazards exist. At present, heat on components can be quickly eliminated by utilizing a metal substrate board, so that the design of a printed circuit board with high density and high power is realized, and the metal substrate circuit board is an ideal solution for high-density and high-power products.
However, the current metal substrate circuit board is generally embedded with micro channels inside the metal core board, so as to realize efficient heat dissipation of the printed circuit board. The liquid inlet and the liquid outlet are needed, the flow of liquid is driven by an external pump to realize heat exchange, and the system is complex.
Disclosure of Invention
The invention aims to provide a metal substrate, a preparation method and a heat dissipation circuit board, which not only improve the heat dissipation capacity and the power density of the metal substrate circuit board, but also have simpler structure.
In a first aspect, the present invention provides a metal substrate, where the metal substrate is an integrally formed metal substrate, the metal substrate has a plurality of heat pipe channels therein, heat pipe working media are filled in the plurality of heat pipe channels, the plurality of heat pipe channels are sealed backflow channels, each heat pipe channel has a heat absorption evaporation area and a heat dissipation condensation area extending along an axial direction of the heat pipe channel, the heat absorption evaporation area is used for absorbing heat of a heating element in contact with a circuit board of the metal substrate, and the heat dissipation condensation area is used for condensing steam generated in the heat absorption evaporation area.
Compared with the prior art, the metal substrate provided by the invention has the following advantages:
the metal substrate provided by the embodiment of the invention is an integrally formed metal substrate, a plurality of heat pipe channels are arranged in the metal substrate, and heat pipe working media are filled in the plurality of heat pipe channels. When the heating element contacted with the circuit board generates heat, the heat pipe can quickly transfer heat energy from one point to another point, so that the heat pipe has supernormal heat conduction capacity and almost no heat loss, and therefore, the heat can be quickly radiated through the heat pipe working media in the heat pipe channels, and the heat radiation capacity is stronger. Compared with a common temperature equalizing plate with a buried heat pipe, the integrated heat pipe has the advantages that the metal substrate and the heat pipe channel are integrated, and the functions of the metal substrate circuit board and the heat pipe shell are combined and share, so that the thickness of the circuit board is greatly reduced, the system volume is small, and the heat pipe channel ensures the limit heat transfer capacity of the metal substrate circuit board.
Meanwhile, the heat pipe channels are sealed reflux channels, each heat pipe channel is provided with a heat absorption evaporation area and a heat dissipation condensation area, the heat absorption evaporation area extends along the heat pipe channel and is used for absorbing heat of a heating element contacted with the heat dissipation circuit board, and the heat dissipation condensation area is used for condensing steam generated by the heat absorption evaporation area. When the heating element contacted with the circuit board generates heat, the heat can be emitted to the heat absorption evaporation area, at the moment, the heat absorption evaporation area can be utilized to absorb the heat generated by the heating element, so that the heat pipe working medium in the heat absorption evaporation area absorbs the heat and then gasifies, and the gasified gas can move in the heat pipe channel until the gas moves to the heat dissipation condensation area of the heat pipe channel for condensation, thereby greatly improving the heat conduction capacity of the heat pipe integrated metal substrate circuit board, realizing high current density and high power density on the circuit board, realizing efficient heat conduction and heat dissipation without external pumping work, having simple heat dissipation structure and providing good circuit board foundation for the realization of the electric energy converter with high power density and the core circuit board of the electronic equipment.
Therefore, the metal substrate provided by the embodiment of the invention improves the heat dissipation capacity and the power density of the metal substrate circuit board, and has a simpler structure.
In a second aspect, the present invention also provides a method for preparing a metal substrate, including:
providing two metal plates having a plurality of recessed channels, each of the recessed channels having an opening;
butting two metal plates to form a prefabricated metal substrate, wherein a plurality of concave channels of the two metal plates are in one-to-one correspondence to form the heat pipe channels;
introducing a heat pipe working medium into the prefabricated metal substrate through the opening;
and sealing the opening of the concave channel.
Compared with the prior art, the preparation method of the metal substrate has the same beneficial effects as those of the metal substrate of the first aspect, and the description is omitted here.
In a third aspect, the present invention also provides a heat dissipation circuit board, which includes the metal substrate provided in the first aspect.
Compared with the prior art, the heat dissipation circuit board has the same beneficial effects as the metal substrate of the first aspect, and the description is omitted here.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
fig. 1 is a schematic structural diagram of a heat dissipating circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a metal substrate circuit board according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of an example of the A-side of a metal substrate according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view of the B-side of a metal substrate circuit board according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of the C-side of a metal substrate according to an embodiment of the present invention;
FIG. 6 is a cross-sectional view of a heat pipe channel according to an embodiment of the present invention;
fig. 7 is a flow chart of a method for manufacturing a metal substrate according to an embodiment of the invention.
Reference numerals:
100-metal substrate circuit board, 110-copper conductive layer, 120-insulating layer, 130-metal substrate, 131-heat pipe channel, 1311-heat absorption evaporation area, 1312-heat dissipation condensation area, 1313-convex structure, 1314-groove, 1315-net structure, 1321-heat insulation area, 200-heat dissipation element.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. The meaning of "a number" is one or more than one unless specifically defined otherwise.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present disclosure.
In the present invention, the words "exemplary" or "such as" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g." should not be taken as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.
In the present invention, "at least one" means one or more, and "a plurality" means two or more. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a alone, a and B together, and B alone, wherein a, B may be singular or plural. The character "/" generally indicates that the context-dependent object is an "or" relationship. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one (one) of a, b or c may represent: a, b, c, a and b, a and c, b and c, or a, b and c, wherein a, b, c can be single or multiple.
It is well known that high temperature conditions occur when electronic devices are operated at high speeds. If the heat cannot be quickly taken away, the components at high temperature can soften and deform, parameters and performances can be changed, and even potential safety hazards exist. At present, heat on components can be quickly eliminated by utilizing a metal substrate board, so that a high-density and high-power PCB design is realized, and the metal substrate circuit board is an ideal solution for high-density and high-power products. A typical 1oz, 2oz copper thick printed circuit board is limited by the temperature rise of the circuit board, and the current magnitude of the wiring is limited to 5-8A/mm2. If measures are taken, the heat conduction and heat dissipation capacity of the circuit board is improved, and the current can be improved to 12A-15A/mm < 2 >.
However, based on the idea of improving the heat conduction and dissipation capability of the circuit board, the current metal substrate circuit board is generally embedded with micro channels inside a metal core board, so as to realize efficient heat dissipation of the printed circuit board. The liquid inlet and the liquid outlet are needed, the flow of liquid is driven by an external pump to realize heat exchange, and the system is complex.
In view of the above problems, an embodiment of the present invention provides a heat dissipation circuit board, where the heat dissipation circuit board includes the metal substrate of the embodiment of the present invention, and the metal substrate circuit board with high heat conduction and dissipation capability is implemented through reasonable design of heat transfer capability, layout, and the like of the heat conduction heat pipe, so as to implement high current density of the metal substrate circuit board, and simplify the structure of the circuit board. The heat exchange system solves the problems that a heat exchange system of a metal substrate circuit board in the prior art is complex and the heat exchange efficiency is insufficient. It should be appreciated that the heat dissipating circuit board may include a copper conductive layer, an insulating layer, and a metal substrate.
Fig. 1 shows a schematic structural diagram of a heat dissipating circuit board according to an embodiment of the present invention, as shown in fig. 1, the heat dissipating circuit board according to an embodiment of the present invention includes a metal substrate circuit board 100 and a heat dissipating member 200, wherein when a heat generating element 300 is above the metal substrate circuit board 100, the heat dissipating member 200 may be fixed below the metal substrate circuit board 100 by using bolts or other fixing connection means, and when the heat generating element 300 is below the metal substrate circuit board 100, the heat dissipating member 200 may be fixed above the metal substrate circuit board 100 by using bolts or other fixing connection means. That is, the position of the heat sink 200 may be flexibly set according to the position of the heating element 300 on the circuit board, which is not limited herein.
It should be appreciated that the heating element 300 is a heat source in a circuit board, and may be a power switching device such as an Insulated Gate Bipolar Transistor (IGBT), a metal oxide semiconductor field effect transistor (Metal Oxide Semiconductor Field Effect Transistor, MOSFET), or may be a light emitting diode (Light Emitting Diode, LED), a transformer, or the like. The heat sink 200 may include an air-cooled heat sink and/or a water-cooled heat sink. The air-cooled radiator and/or the water-cooled radiator can further take away the participation heat of the metal substrate circuit board 100, so that the heat dissipation performance of the metal substrate circuit board 100 is improved.
Fig. 2 shows a schematic structural diagram of a metal substrate circuit board according to an embodiment of the present invention, and as shown in fig. 2, the metal substrate circuit board 100 according to an embodiment of the present invention includes a copper conductive layer 110, an insulating layer 120, and a metal substrate 130 arranged from top to bottom. The metal substrate 130 is a metal substrate according to an embodiment of the present invention.
For convenience of explanation, fig. 3 shows a cross-sectional view of an example of an a-plane of a metal substrate according to an embodiment of the present invention, as shown in fig. 3, a metal substrate 130 provided in an embodiment of the present invention is an integrally formed metal substrate, a plurality of heat pipe channels 131 are provided in the metal substrate 130, heat pipe working media are filled in the plurality of heat pipe channels 131, and the plurality of heat pipe channels 131 are sealed backflow channels. It should be understood that the heat pipe working medium is a heat exchange medium, and the heat exchange medium may include one of acetone, water or other heat exchange medium, which is not limited herein. Wherein, the outer shell of each heat pipe channel 131 is integrated with the metal substrate 130, the metal substrate 130 is formed by relatively installing an upper metal plate and a lower metal plate, grooves are arranged in the upper metal plate and the lower metal plate, and when the upper metal plate and the lower metal plate are relatively installed, the grooves can form the heat pipe channels 131, thereby realizing the structural sharing of the metal substrate 130, greatly reducing the thickness of the whole metal substrate 130, simplifying the structure, and simultaneously greatly improving the ultimate heat transfer capability compared with the common metal substrate.
Fig. 3 illustrates a heat pipe channel 131 in a metal substrate as a parallel channel, and the heat pipe channel 131 is hereinafter used as a parallel channel. The heat pipe channel 131 is of a channel type structure, and in other implementations, a mesh type structure may be used. The depth dimension of the groove structure is 0.5 mm-1 mm, the width is 0.5 mm-1.5 mm, and the length of the groove is determined by the heat transfer distance.
Illustratively, the copper conductive layer 110 is a conductive layer made of a copper plate, and is used for connecting with a chip on a board to form a circuit, and the thickness of the copper conductive layer 110 is 0.03mm-0.07mm. The middle insulating layer is responsible for insulating the conductive layer 110 from the bottom metal substrate 130, the thickness of the insulating layer is 0.1mm, and setting the insulating layer to 0.1mm can avoid heat transfer difficulties caused by too thick insulating layer.
When the heating element contacted with the metal substrate circuit board 100 generates heat, the heat pipe can quickly transfer the heat energy from one point to another point, so that the metal substrate provided by the embodiment of the invention has supernormal heat conduction capability and almost no heat loss, and therefore, the heat can be quickly radiated through the heat pipe working media in the heat pipe channels 131, and the heat radiation capability is stronger. The integration of the metal substrate 130 and the heat pipe channel 131 can greatly reduce the thickness of the metal substrate circuit board 100, reduce the system volume, and ensure the limit heat transfer capability of the metal substrate circuit board 100 by the heat pipe channel 131.
For example, fig. 4 shows a cross-sectional view of a B-side of a metal substrate circuit board according to an embodiment of the present invention, and as shown in fig. 4, a plurality of heat pipe channels 131 provided in the embodiment of the present invention are sealed reflow channels, each heat pipe channel 131 has a heat absorption evaporation area 1311 and a heat dissipation condensation area 1312 extending along an axial direction of the heat pipe channel 131, the heat absorption evaporation area 1311 is used for absorbing heat of a heat generating element 300 in contact with the metal substrate circuit board 100, and the heat dissipation condensation area 1312 is used for condensing steam generated by the heat absorption evaporation area 1311.
It should be understood that, as shown in fig. 4, the heat absorption evaporation zone 1311 and the heat dissipation condensation zone 1312 are not fixed areas, but are distinguished according to the positions of the heat generating elements 300. The portion of the heat pipe channel 131 that is closer to the heat generating element 300 may be defined as an endothermic evaporation region 1311, and the portion of the heat pipe channel 131 that is farther from the heat generating element 300 may be defined as a heat radiation condensation region 1312. When the heating element 300 in contact with the metal substrate circuit board 100 generates heat, the heat is transferred to the heat pipe channel contained in the metal substrate, and the heat is absorbed at the first transferred position, so that the heat pipe working medium is gasified to be in a gas state, the position is the heat absorption evaporation area 1311, the gasified gas can move in the heat pipe channel 131 until the gas starts to be converted from a gas state to a liquid state, and the area where the gas starts to be converted from the gas state to the liquid state and the whole condensation process is completed is the heat dissipation condensation area.
On this basis, because the heat pipe channels 131 are sealed backflow channels, when the heating element 300 contacted with the metal substrate circuit board 100 generates heat, the heat can be emitted to the heat absorption evaporation area 1311, at this time, the heat absorption evaporation area 1311 can be utilized to absorb the heat generated by the heating element 300, so that the heat pipe working medium of the heat absorption evaporation area 1311 absorbs the heat and is gasified, and gasified gas can move to the heat dissipation condensation area 1312 of the heat pipe channel 131 through the heat insulation area 1321 in the heat pipe channel 131 to be condensed, thereby achieving the characteristic of good heat dissipation effect in a sealed state, realizing efficient heat conduction and heat dissipation without external pumping work, having a simple heat dissipation structure, and providing a good circuit board foundation for realizing the electric energy converter with high power density and the core circuit board of the electronic equipment.
In one implementation, fig. 5 shows a cross-sectional view of the C-plane of the metal substrate according to an embodiment of the present invention, and as shown in fig. 5, the inner wall of each heat pipe channel 131 provided by the embodiment of the present invention has a capillary structure, where the capillary structure includes a plurality of protrusion structures 1313 disposed at intervals, and a groove 1314 is provided between two adjacent protrusion structures 1313. It should be understood that the protrusion structure 1313 corresponds to a capillary structure of the heat pipe, and the heat pipe working medium may be filled in the capillary structure of the inner wall of the heat pipe channel 131, and also corresponds to the heat pipe working medium may be filled in the groove 1314 of the inner wall of the heat pipe channel 131, where the non-capillary core area in the heat pipe channel 131 may be defined as a gaseous heat pipe working medium transmission channel.
In specific implementation, when the heating element contacted with the circuit board generates heat, the heat generated by the heating element can be dissipated to the capillary structure of the heat absorption evaporation area 1311, and the heat is absorbed by the heat pipe working medium in the capillary structure of the heat absorption evaporation area 1311, so that the heat is absorbed by the heat pipe working medium of the heat absorption evaporation area 1311 and is converted into gas. At this time, the gas is moved to the capillary structure in the heat dissipation condensation area 1312 through the gaseous heat pipe working medium transmission channel, the gas is condensed in the heat dissipation condensation area 1312 and then is converted into liquid, and then the liquid flows back through the protrusion structure 1313 and the groove 1314, so as to form a circulation loop. The embodiment of the invention can greatly increase the specific surface area of heat exchange by arranging the capillary structure in the form of the convex structure 1313 and the concave groove 1314, so that the heat exchange is more sufficient, and meanwhile, the special structure has smaller diffusion thermal resistance and higher temperature uniformity, the special structure improves the heat dissipation capacity of the metal substrate, the reliability of the cooled heating element and the electronic equipment is improved, and a new solution idea is provided for solving the temperature uniformity problem under high heat flow in a limited space.
In one implementation, FIG. 6 illustrates a cross-sectional view of a heat pipe channel of an embodiment of the present invention, as shown in FIG. 6, with a mesh structure 1315 inside each groove 1314 provided by the embodiment of the present invention. When the heat generated by the heating element is dissipated to the capillary structure of the heat absorption and evaporation area 1311, the mesh structure 1315 in the groove 1314 can provide a larger heat exchange specific surface area for the heat pipe working medium, so that the heat generated by the heating element 300 can be absorbed to the maximum extent by the heat pipe working medium and then converted into gas, then the gas is condensed into liquid by utilizing the mesh structure in each groove 1315 in the heat dissipation and condensation area 1312, and the liquid flows back to form a circulation loop, thereby further increasing the specific surface area in the phase change heat exchange process, enabling the heat exchange to be more sufficient, and improving the heat dissipation capability of the metal substrate.
In an alternative manner, the extending direction of the heat pipe channel 131 of the embodiment of the present invention is parallel to the upper and lower surfaces of the metal substrate 130. The heat pipe channels 131 can be flexibly arranged into parallel heat pipe channels, serpentine heat pipe channels, interdigital heat pipe channels or heat pipe channels with other shapes according to the positions of heating elements on the circuit board, the layout direction of the heat pipe channels 131 can be flexibly arranged according to the cooling requirement, the heat pipe channels 131 are specifically selected according to the actual requirement, the heat pipe channels are not limited here, and the directional transmission of heat can be realized.
By way of example, the heat pipe channel 131 of the embodiment of the present invention can flexibly arrange a plurality of heat pipe channels according to the position and the heat productivity of the heating element, and efficiently transfer and dissipate the heat through the heat pipe, so as to start the effect of temperature equalization on the metal plate, and realize the metal substrate circuit board with high heat conduction and dissipation capability through the heat transfer capability, layout, etc. of the heat conduction heat pipe with reasonable design, so as to realize the high current density of the metal substrate circuit board.
The heat conductivity coefficient of the integrally formed metal substrate is 10000W/mK-100000W/mK. Therefore, the heat pipe integrated metal substrate circuit board greatly improves the heat conduction capacity of the circuit board, thereby realizing high current density and high power density on the circuit board. Compared with a water-cooled heat management system, the heat pipe integrated type metal substrate circuit board electric energy converter and electronic equipment are adopted, the structure is simple, accessories such as a water pump and a water tank are not needed, and the system power density is high.
In an alternative manner, the metal substrate 130 of the embodiment of the present invention may be made of aluminum alloy, copper, stainless steel or other materials with good electrical and thermal conductivity.
The embodiment of the invention also provides a preparation method of the metal substrate, which can be used for preparing the metal substrate of the embodiment of the invention. Fig. 7 is a schematic flow chart of a method for manufacturing a metal substrate according to an embodiment of the invention. As shown in fig. 7, the method for manufacturing a metal substrate according to an embodiment of the present invention includes:
step 701: two metal plates are provided having a plurality of recessed channels, each recessed channel having an opening.
For example: providing two metal flat plates with the thickness of 1 mm-1.5 mm, machining a concave channel on the metal flat plates through precise milling, and opening two ends of the concave channel. According to the embodiment of the invention, the metal substrate is manufactured by using the metal flat plate with the thickness of 1 mm-1.5 mm, so that the thinned metal substrate can be obtained, the thinner the metal substrate is, the better the heat conduction capability is, and meanwhile, the two ends of the concave channel are designed to be provided with openings, so that the openings at the two ends are used for filling the heat pipe working medium into the concave structure in the subsequent steps.
Step 702: and butting the two metal plates to form a prefabricated metal substrate, wherein a plurality of concave channels formed on the two metal plates are in one-to-one correspondence to form heat pipe channels.
For example: the two metal plates with the same size after processing are oppositely placed to form a cavity, the edges of the length direction of the cavity are welded, welding seams are processed, and a plurality of concave channels of the two metal plates are in one-to-one correspondence to form heat pipe channels, so that a prefabricated metal substrate with the heat pipe channels is obtained.
Step 703: and introducing a heat pipe working medium into the prefabricated metal substrate through the opening.
For example: and through the openings reserved at the two ends of the concave channel, the heat exchange medium (namely the working medium of the heat pipe) is filled into the heat pipe channel, so that the heat pipe channel is filled with the heat exchange medium.
Step 704: and sealing the opening of the concave channel to obtain the integrated metal substrate.
For example: and after the heat exchange medium is filled, vacuumizing the prefabricated metal substrate to discharge air in the pipe. And then carrying out welding sealing treatment on the openings at the two ends to obtain the integrated metal substrate.
In an alternative manner, after providing two metal plates with a plurality of concave channels, the preparation method further includes: and processing a plurality of convex structures arranged at intervals on the inner wall of each concave channel, wherein grooves are formed between two adjacent convex structures, and the inner part of each groove is processed into a net-shaped structure.
For example: after the recessed channel is machined on the metal flat plate by precision milling, a capillary structure is machined on the inner wall of the recessed channel, for example: the plurality of protruding structures that the interval set up have the recess between two adjacent protruding structures, then process the inside of recess into network structure. The heat exchange device has the advantages that the specific surface area of heat exchange can be greatly increased, heat exchange is more sufficient, meanwhile, the heat exchange device has smaller diffusion thermal resistance and higher temperature uniformity, and the special structure improves the heat dissipation capacity of the metal substrate, so that the reliability of the cooled heating element and the electronic equipment is increased.
For example, after the heat pipe integrated metal substrate is processed, the circuit of the circuit board can be manufactured according to the circuit design in a traditional manufacturing mode of the metal substrate circuit board, the heat pipe integrated metal substrate circuit board is manufactured, and heating elements such as an IGBT, a MOSFET or an LED and the like are mounted on the heat pipe integrated metal substrate circuit board through welding.
According to the metal substrate circuit board structure of the integrated heat conduction pipe, the metal substrate circuit board with high heat conduction and dissipation capacity is realized through the heat conduction capacity, layout and the like of the heat conduction pipe with reasonable design, so that the high current density of the metal substrate circuit board is realized. The invention can realize high-efficiency heat conduction and heat dissipation without external pumping while improving the heat dissipation capacity of the metal substrate circuit board so as to improve the power density, has a simple heat dissipation structure, and provides a good circuit board foundation for realizing the core circuit board of the electric energy converter and the electronic equipment with high power density.
The metal substrate provided by the embodiment of the invention is an integrally formed metal substrate, a plurality of heat pipe channels are arranged in the metal substrate, and heat pipe working media are filled in the plurality of heat pipe channels. When the heating element contacted with the circuit board generates heat, the heat pipe can quickly transfer heat energy from one point to another point, so that the heat pipe has supernormal heat conduction capacity and almost no heat loss, and therefore, the heat can be quickly radiated through the heat pipe working media in the heat pipe channels, and the heat radiation capacity is stronger. The thickness of the metal substrate circuit board can be greatly reduced by integrating the metal substrate and the heat pipe channel, the system volume is small, and the heat pipe channel ensures the limit heat transfer capacity of the metal substrate circuit board.
Meanwhile, the heat pipe channels are sealed reflux channels, each heat pipe channel is provided with a heat absorption evaporation area and a heat dissipation condensation area, the heat absorption evaporation area extends along the heat pipe channel and is used for absorbing heat of a heating element contacted with the heat dissipation circuit board, and the heat dissipation condensation area is used for condensing steam generated by the heat absorption evaporation area. When the heating element contacted with the circuit board generates heat, the heat can be emitted to the heat absorption evaporation area, at the moment, the heat absorption evaporation area can be utilized to absorb the heat generated by the heating element, so that the heat pipe working medium in the heat absorption evaporation area absorbs the heat and then gasifies, and the gasified gas can move in the heat pipe channel until the gas moves to the heat dissipation condensation area of the heat pipe channel for condensation, thereby greatly improving the heat conduction capacity of the heat pipe integrated metal substrate circuit board, realizing high current density and high power density on the circuit board, realizing efficient heat conduction and heat dissipation without external pumping work, having simple heat dissipation structure and providing good circuit board foundation for the realization of the electric energy converter with high power density and the core circuit board of the electronic equipment.
The foregoing is merely a specific embodiment of the invention, and it will be apparent that various modifications and combinations thereof can be made without departing from the spirit and scope of the invention. Accordingly, the specification and drawings are merely exemplary illustrations of the present invention as defined in the appended claims and are considered to cover any and all modifications, variations, combinations, or equivalents that fall within the scope of the invention. It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents. Any person skilled in the art can easily think of changes or substitutions within the technical scope of the present disclosure, and the present disclosure is intended to be covered by the present disclosure. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The metal substrate is characterized by being integrally formed, a plurality of heat pipe channels are formed in the metal substrate, heat pipe working media are filled in the heat pipe channels, the heat pipe channels are sealed backflow channels, each heat pipe channel is provided with a heat absorption evaporation area and a heat dissipation condensation area, the heat absorption evaporation area is used for absorbing heat of a heating element in contact with a metal substrate circuit board, and the heat dissipation condensation area is used for condensing steam generated by the heat absorption evaporation area.
2. The metal substrate of claim 1, wherein the inner wall of each heat pipe channel has a capillary structure, the capillary structure comprising a plurality of protruding structures arranged at intervals, and a groove is arranged between two adjacent protruding structures.
3. The metal substrate according to claim 2, wherein an inside of each of the grooves has a mesh structure.
4. The metal substrate according to claim 1, wherein the plurality of heat pipe passages extend in a direction parallel to the upper and lower surfaces of the metal substrate.
5. The metal substrate of claim 1, wherein the shape of the plurality of heat pipe channels comprises parallel heat pipe channels, serpentine heat pipe channels, and interdigitated heat pipe channels.
6. The metal substrate according to any one of claims 1 to 5, wherein the heat conductivity of the integrally formed metal substrate is 10000W/mK to 100000W/mK.
7. A method of producing a metal substrate, the method comprising:
providing two metal plates having a plurality of recessed channels, each of the recessed channels having an opening;
butting two metal plates to form a prefabricated metal substrate, wherein a plurality of concave channels of the two metal plates are in one-to-one correspondence to form the heat pipe channels;
introducing a heat pipe working medium into the prefabricated metal substrate through the opening;
sealing the opening of the recessed channel to obtain an integrated metal substrate, wherein the metal substrate is according to any one of claims 1-6.
8. The method of claim 7, wherein after providing two metal plates having a plurality of recessed channels, the two metal plates are butted together to form a prefabricated metal substrate, and wherein the method further comprises:
processing a plurality of convex structures which are arranged at intervals on the inner wall of each concave channel, wherein grooves are formed between two adjacent convex structures;
the inside of each groove is processed into a net structure.
9. A heat dissipation circuit board, comprising a circuit board and a heat dissipation member, wherein the metal substrate circuit board comprises the metal substrate according to any one of claims 1 to 6.
10. The heat dissipating circuit board of claim 9, wherein the heat sink is disposed below the circuit substrate, and the heat sink comprises an air-cooled heat sink and/or a water-cooled heat sink.
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| CN202311433202.0A CN117156662A (en) | 2023-11-01 | 2023-11-01 | Metal substrate, preparation method and heat dissipation circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311433202.0A CN117156662A (en) | 2023-11-01 | 2023-11-01 | Metal substrate, preparation method and heat dissipation circuit board |
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