CN117155338A

CN117155338A - Hybrid filter

Info

Publication number: CN117155338A
Application number: CN202311183880.6A
Authority: CN
Inventors: 左成杰; 何成功; 何军
Original assignee: Anhui Yunta Electronic Technologies Co ltd
Current assignee: Anhui Yunta Electronic Technologies Co ltd
Priority date: 2023-09-13
Filing date: 2023-09-13
Publication date: 2023-12-01

Abstract

The invention provides a hybrid filter in which a filter assembly provided with an electromagnetic element and a filter assembly provided with an acoustic wave device are electrically connected in opposite directions to form a three-dimensional hybrid filter structure, which realizes miniaturization of a hybrid filter formed of the filter assembly provided with the electromagnetic element and the filter assembly provided with the acoustic wave device, and which is better in filtering performance than a separate filter assembly.

Description

Hybrid filter

Technical Field

The invention relates to the technical field of radio frequency, in particular to a hybrid filter.

Background

The filter is an electronic element used in the field of signal processing, and has the function of filtering clutter and interference signals in a circuit, retaining needed signals, and is widely applied to the fields of communication, electronics, computers and the like.

With the development and popularization of technologies such as mobile internet, internet of things and 5G, the hybrid filter has become a general solution for communication such as 5G, wiFi [7 ] in the next stage, but the area of the hybrid filter is larger than that of a single filter, and many innovations are required in terms of performance improvement and miniaturization of the hybrid filter.

Disclosure of Invention

In view of the above, the present invention provides a hybrid filter, which has the following technical scheme:

a hybrid filter, the hybrid filter comprising:

a first substrate; the first substrate is provided with a first surface and a second surface which are oppositely arranged;

a first functional layer located on one side of the first surface; a second functional layer located on one side of the second surface;

the first functional layer comprises at least one first connecting end; the second functional layer comprises at least one second connecting end;

at least one first through hole penetrating through the first substrate in a first direction, and a first connection structure located in the first through hole; the first direction is perpendicular to the plane of the first substrate and points to the second functional layer from the first substrate;

the first connecting structure is connected with the first connecting end and the second connecting end;

the first functional layer comprises at least one first electromagnetic element; the second functional layer comprises a first acoustic wave device;

or, the first functional layer includes a first acoustic wave device; the second functional layer comprises at least one first electromagnetic element.

A hybrid filter, the hybrid filter comprising:

The first filter chip and the second filter chip are oppositely arranged in the second direction;

the first filter chip includes: the device comprises a second substrate and a third functional layer positioned on one side of the second substrate, wherein the third functional layer comprises at least one fifth connecting end and at least one sixth connecting end;

the second filter chip includes: the device comprises a third substrate and a fourth functional layer positioned on one side of the third substrate, wherein the fourth functional layer comprises at least one seventh connecting end and at least one eighth connecting end; the second direction is perpendicular to the first filter chip and is directed to the second filter chip by the first filter chip;

at least one fourth through hole and at least one fifth through hole penetrating through the first filter chip in the second direction; a fourth connection structure located within the fourth through hole; a fifth connection structure located within the fifth through hole;

at least one sixth connection structure and at least one seventh connection structure between the first filter chip and the second filter chip; in the second direction, the sixth connection structure and the fourth connection structure connect the fifth connection end and the seventh connection end; the seventh connecting structure and the fifth connecting structure are connected with the sixth connecting end and the eighth connecting end;

The third functional layer comprises at least one second electromagnetic element; the fourth functional layer comprises a second acoustic device;

or, the third functional layer includes a second acoustic device; the fourth functional layer comprises at least one second electromagnetic element.

Compared with the prior art, the invention has the following beneficial effects:

Based on the above, the first functional layer and the second functional layer are respectively arranged on the first surface and the second surface of the first substrate, the first functional layer and the second functional layer are respectively provided with the first electromagnetic element or the first acoustic wave device, and the first functional layer and the second functional layer are different, that is, the first functional layer provided with the first electromagnetic element and the second functional layer provided with the first acoustic wave device are connected through the first connecting end, the first connecting structure and the second connecting end in the first direction; or the first functional layer provided with the first acoustic wave device is connected with the second functional layer provided with the first electromagnetic element in the first direction through the first connecting end, the first connecting structure and the second connecting end, the first direction is perpendicular to the plane where the first substrate is located, and the first substrate points to the second functional layer, that is, the first functional layer and the second functional layer are electrically connected in opposite directions, the miniaturization of the hybrid filter formed by the first functional layer provided with the first electromagnetic element, the second functional layer provided with the first acoustic wave device and the first substrate is realized, or the miniaturization of the hybrid filter formed by the first functional layer provided with the first acoustic wave device, the second functional layer provided with the first electromagnetic element and the first substrate is realized, and the filtering performance of the hybrid filter is better.

In addition, in the hybrid filter provided by the invention, the first filter chip and the second filter chip are oppositely arranged in the second direction, the first filter chip comprises a third functional layer, the second filter chip comprises a fourth functional layer, the third functional layer and the fourth functional layer are respectively provided with a second electromagnetic element or a second acoustic wave device, and the third functional layer and the fourth functional layer are different, that is, the third functional layer provided with the second electromagnetic element and the fourth functional layer provided with the second acoustic wave device are electrically connected in the second direction through a fifth connecting end, a sixth connecting end, a seventh connecting end, an eighth connecting end, a fourth connecting structure, a fifth connecting structure, a sixth connecting structure and a seventh connecting structure; or the third functional layer provided with the second electromagnetic element and the fourth functional layer provided with the second acoustic device are electrically connected in the second direction through a fifth connecting end, a sixth connecting end, a seventh connecting end, an eighth connecting end, a fourth connecting structure, a fifth connecting structure, a sixth connecting structure and a seventh connecting structure; the second direction is perpendicular to the first filter chip and is directed to the second filter chip by the first filter chip; that is, the third functional layer and the fourth functional layer are electrically connected in the opposite direction, downsizing of the hybrid filter formed by the first filter chip provided with the second electromagnetic element and the second filter chip provided with the second acoustic wave device is achieved, or downsizing of the hybrid filter formed by the first filter chip provided with the second acoustic wave device and the second acoustic wave device provided with the second electromagnetic element is achieved, and the filtering performance of the hybrid filter is better.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a hybrid filter according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention;

Fig. 9 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention;

fig. 10 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention;

FIG. 11 is a schematic diagram of a hybrid filter according to an embodiment of the present invention;

fig. 12 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention;

fig. 13 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a hybrid filter according to an embodiment of the present invention; the hybrid filter includes:

A first substrate 01; the first substrate 01 has a first surface 01a and a second surface 01b disposed opposite to each other.

A first functional layer 02 located on the first surface 01a side; a second functional layer 03 located on the second surface 01b side.

The first functional layer 02 includes at least one first connection 02a; the second functional layer 03 comprises at least one second connection 03a.

At least one first through hole penetrating through the first substrate 01 in a first direction M, and a first connection structure 04 located in the first through hole; the first direction M is perpendicular to the plane of the first substrate 01, and the first substrate 01 points to the second functional layer 03.

The first connection structure 04 connects the first connection end 02a and the second connection end 03a.

The first functional layer 02 comprises at least one first electromagnetic element Q; the second functional layer 03 includes a first acoustic wave device U.

Or, the first functional layer 02 includes a first acoustic wave device U; the second functional layer 03 comprises at least one first electromagnetic element Q.

Specifically, the material of the first substrate 01 includes, but is not limited to, a silicon material, a glass material, a GaAs material, an organic base material, a ceramic base material, and the like.

In the hybrid filter, the first functional layer 02 and the second functional layer 03 are respectively disposed on the first surface 01a and the second surface 01b of the first substrate 01, at least one first connection end 02a is disposed in the first functional layer 02, at least one second connection end 03a is disposed in the second functional layer 03, in this embodiment, the first through hole is formed in the first substrate 01 by using a substrate perforation (Through Substrate Via, abbreviated as TSV) technology, and the first through hole is perforated in the first direction M, and the first connection structure 04 is disposed in the first through hole, and the first connection structure 04 connects the first connection end 02a and the second connection end 03a, so that the first functional layer 02 and the second functional layer 03 are communicated, and it is to be noted that the number of the first connection end 02a and the second connection end 03a is not specifically limited, and the number of the first connection ends 02a and the second connection ends 03a are the same according to the number of the first connection ends 02a and the first connection ends 03 a. It should be noted that, in fig. 1, the first connection end 02a and the second connection end 03a are merely examples of connection ports, and the shapes and positions of the first connection end 02a and the second connection end 03a are not specifically limited, and are set according to needs; the at least one first electromagnetic element Q may be a capacitor, an inductor, or the like.

Note that, when the first functional layer 02 includes at least one first electromagnetic element Q, the second functional layer 03 includes a first acoustic wave device U, unlike the second functional layer 03; when the first functional layer 02 includes the first acoustic wave device U, the second functional layer 03 includes at least one first electromagnetic element Q; the hybrid filter formed by electrically connecting the functional layer provided with the electromagnetic element and the functional layer provided with the acoustic wave device in the first direction M improves the filtering performance of the hybrid filter and simultaneously realizes the miniaturization of the hybrid filter.

Optionally, referring to fig. 2, fig. 2 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention; in another embodiment of the present invention, the first functional layer 02 further includes at least one third connection terminal 02b; the second functional layer 03 further comprises at least one fourth connection 03b.

The hybrid filter further includes:

at least one first bonding pad 05 located on a side of the first functional layer 02 facing away from the first substrate 01; at least one second bonding pad 06 on the side of the second functional layer 03 facing away from the first substrate 01.

The third connection terminal 02b is connected to the first bonding pad 05; the fourth connection terminal 03b is connected to the second pad 06.

Specifically, the first functional layer 02 further includes at least one third connection terminal 02b, and the second functional layer 03 further includes at least one fourth connection terminal 03b; the third connection terminal 02b connects a device in the first functional layer 02, such as the first electromagnetic element Q or the first acoustic wave device U, and connects it to the first pad 05, and the fourth connection terminal 03b connects a device in the second functional layer 03, such as the first electromagnetic element Q or the first acoustic wave device U; and connects it to the second pad 06.

It should be noted that, in fig. 2, the third connection end 02b and the fourth connection end 03b are merely examples of connection ports, and the shapes and positions of the third connection end 02b and the fourth connection end 03b are not specifically limited, and are set according to needs; the first bonding pad 05 and the second bonding pad 06 are connection points for connecting the hybrid filter with an external structure, and the connection stability of the hybrid filter with the external structure can be improved by arranging the first bonding pad 05 and the second bonding pad 06; the materials of the first connection structure 04, the first bonding pad 05 and the second bonding pad 06 are all metal materials capable of conducting electricity, so that the electric connection of the hybrid filter can be realized; note that the first connection structure 04 may be a metal structure filling the through hole, or may be a metal connection line, and is not particularly limited.

Optionally, referring to fig. 3, fig. 3 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention; in another embodiment of the invention, when the first functional layer 02 comprises at least one first electromagnetic element Q; when the second functional layer 03 includes a first acoustic wave device U, the first electromagnetic element Q includes:

a first metal layer 07, a first dielectric layer 08, and a second metal layer 09 sequentially disposed in the first direction M; the first metal layer 07 is electrically connected to the third connection terminal 02b, and the second metal layer 09 is electrically connected to the first connection terminal 02 a.

The first acoustic wave device U includes: a first electrode 10, a first piezoelectric film 11, and a second electrode 12 sequentially arranged in the first direction M; the first electrode 10 is electrically connected to the second connection terminal 03a, and the second electrode 12 is electrically connected to the fourth connection terminal 03 b.

Optionally, in another embodiment of the present invention, the first electromagnetic element Q includes a first capacitor; the first capacitor may be a MIM capacitor, and the MIM (metal-insulator-metal) capacitor is a metal-insulator-metal capacitor structure, and may perform filtering and frequency division functions in the first functional layer 02.

Specifically, in this embodiment, the first electromagnetic element Q in the first functional layer 02 may be a first capacitor, and the first capacitor may be one capacitor or may be a capacitor assembly connected to a plurality of capacitors; as shown in fig. 3, when the first electromagnetic element Q is a first capacitance, the first capacitance is taken as an example to describe that the first metal layer 07 is connected to the first pad 05 through the third connection terminal 02b, the second metal layer 09 is connected to the first electrode 10 of the first acoustic wave device U in the second functional layer 03 through the first connection terminal 02a, the first connection structure 04, and the second connection terminal 03a, and the second electrode 12 of the first acoustic wave device U is connected to the second pad 06 through the fourth connection terminal 03b, so that a hybrid filter is formed, and since the hybrid filter is disposed on the first surface 01a and the second surface 01b of the first substrate 01, and the first functional layer 02 and the second functional layer 03 are connected in the first direction M through the first connection structure 04, the first functional layer 02 provided with the first electromagnetic element Q, and the second functional layer 03 provided with the first acoustic wave device U are disposed, so that the hybrid filter having improved performance of the shortest connection structure is achieved.

Optionally, referring to fig. 4, fig. 4 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention; in another embodiment of the present invention, when the first functional layer 02 includes a first acoustic wave device U; when the second functional layer 03 includes at least one first electromagnetic element Q, the first acoustic wave device U includes:

a first electrode 10, a first piezoelectric film 11, and a second electrode 12 sequentially arranged in the first direction M; the first electrode 10 is electrically connected to the third connection terminal 02b, and the second electrode 12 is electrically connected to the first connection terminal 02 a.

The first electromagnetic element Q includes: a first metal layer 07, a first dielectric layer 08, and a second metal layer 09 sequentially disposed in the first direction M; the first metal layer 07 is electrically connected to the second connection terminal 03a, and the second metal layer 09 is electrically connected to the fourth connection terminal 03 b.

Specifically, in this embodiment, the first electromagnetic element Q in the second functional layer 03 may be a first capacitor, and the first capacitor may be one capacitor or may be a capacitor assembly connected to a plurality of capacitors; as shown in fig. 4, when the first electromagnetic element Q is a first capacitor, the first capacitor is taken as an example for explanation; the first electrode 10 in the first functional layer 02 is connected to the first bonding pad 05 through the third connection terminal 02b, the second electrode 12 is connected to the first metal layer 07 of the first capacitor in the second functional layer 03 through the first connection terminal 02a, the first connection structure 04 and the second connection terminal 03a, and the second metal layer 09 of the first capacitor is connected to the second bonding pad 06 through the fourth connection terminal 03b, thereby forming a hybrid filter, and since the hybrid filter is disposed on the first surface 01a and the second surface 01b of the first substrate 01, and the first functional layer 02 and the second functional layer 03 are connected in the first direction M through the first connection structure 04, and the first acoustic wave device U is disposed in the first functional layer 02, and the second electromagnetic element Q is disposed in the second functional layer 03, the first functional layer 02 provided with the first acoustic wave device U and the second functional layer 03 provided with the first electromagnetic element Q are shortest connected, and the filter performance of the hybrid filter of this structure is improved, and the hybrid filter is miniaturized.

That is, the structure in the first functional layer 02 or the second functional layer 03 is not particularly limited, and only the filter element in the first functional layer 02 and the second functional layer 03 need be connected in the first direction M, and the present invention also includes a structure of a hybrid filter, which will be described below.

Optionally, referring to fig. 5, fig. 5 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention; in another embodiment of the present invention, the first functional layer 02 further includes at least one third connection terminal 02b; the second functional layer 03 further comprises at least one fourth connection 03b.

The hybrid filter further includes: at least one first bonding pad 05 and at least one second bonding pad 06 on the side of the first functional layer 02 facing away from the first substrate 01.

A second connection structure 13 penetrating the first functional layer 02 and the first substrate 01 in the first direction M and located in the second through hole; a third through hole penetrating the first functional layer 02; and a third connection structure 14 located in the third through hole.

The third connection terminal 02b and the fourth connection terminal 03b are connected to the first bonding pad 05 through the second connection structure 13; the first connection terminal 02a is connected to the second pad 06 through the third connection structure 14.

Specifically, the first functional layer 02 further includes at least one third connection terminal 02b, and the second functional layer 03 further includes at least one fourth connection terminal 03b; the third connection terminal 02b connects to a device in the first functional layer 02, such as the first electromagnetic element Q or the first acoustic wave device U, the fourth connection terminal 03b connects to a device in the second functional layer 03, such as the first electromagnetic element Q or the first acoustic wave device U, and a second through hole penetrating the first functional layer 02 and the first substrate 01 is provided in the first direction M, and a second connection structure 13 is provided in the second through hole, and the second connection structure 13 connects the third connection terminal 02b and the fourth connection terminal 03b to the first pad 05; in the first direction M, a third through hole is further provided in the first functional layer 02, and a third connection structure 14 is provided in the third through hole, and the second connection terminal 03a is connected to the first connection terminal 02a through the first connection structure 04, and the first connection terminal 02a is connected to the second bonding pad 06 through the third connection structure 14.

It should be noted that, in fig. 5, the third connection end 02b and the fourth connection end 03b are merely examples of connection ports, and the shapes and positions of the third connection end 02b and the fourth connection end 03b are not specifically limited, and are set according to needs; the first bonding pad 05 and the second bonding pad 06 are connection points for connecting the hybrid filter with an external structure, and the connection stability of the hybrid filter with the external structure can be improved by arranging the first bonding pad 05 and the second bonding pad 06; the materials of the first connection structure 04, the first bonding pad 05 and the second bonding pad 06 are all metal materials capable of conducting electricity, so that the electrical connection of the hybrid filter can be realized.

Since the hybrid filter in the present embodiment is disposed on the first surface 01a and the second surface 01b of the first substrate 01, and the first functional layer 02 and the second functional layer 03 are connected in the first direction M, the first functional layer 02 and the second functional layer 03 achieve the shortest connection, so that the filtering performance of the hybrid filter is improved, and the hybrid filter is miniaturized.

Optionally, referring to fig. 6, fig. 6 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention; in another embodiment of the invention, when the first functional layer 02 comprises at least one first electromagnetic element Q; when the second functional layer 03 includes a first acoustic wave device U, the first electromagnetic element Q includes:

The first electromagnetic element Q includes a first capacitance.

Specifically, in the present embodiment, when the first electromagnetic element Q in the first functional layer 02 is a first capacitance, the first capacitance is taken as an example, and the first metal layer 07 is connected to the third connection terminal 02b, the second metal layer 09 is connected to the first connection terminal 02a, and the first electrode 10 of the first acoustic wave device U in the second functional layer 03 is connected to the second connection terminal 03 a; the second electrode 12 is connected with the fourth connecting end 03 b; the second connection structure 13 connects the third connection terminal 02b and the fourth connection terminal 03b to the first pad 05 in the first direction M; the second connection end 03a is connected with the first connection end 02a through the first connection structure 04, and the first connection end 02a is connected with the second bonding pad 06 through the third connection structure 14; thus, a hybrid filter is formed, and since the hybrid filter is disposed on the first surface 01a and the second surface 01b of the first substrate 01 and the first functional layer 02 and the second functional layer 03 are connected in the first direction M by the first connection structure 04, and the first electromagnetic element Q is disposed in the first functional layer 02 and the first acoustic wave device U is disposed in the second functional layer 03, the first functional layer 02 provided with the first electromagnetic element Q and the second functional layer 03 provided with the first acoustic wave device U are connected in the shortest manner, and the miniaturization of the hybrid filter is achieved while the filtering performance of the hybrid filter of such a structure is improved.

Optionally, referring to fig. 7, fig. 7 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention; in another embodiment of the present invention, when the first functional layer 02 includes a first acoustic wave device U; when the second functional layer 03 includes at least one first electromagnetic element Q, the first acoustic wave device U includes:

Specifically, in the present embodiment, when the first electromagnetic element Q in the second functional layer 03 has a first capacitance, the first capacitance is taken as an example for explanation; the first electrode 10 of the first acoustic wave device U in the first functional layer 02 is connected to the third connection terminal 02b, the second electrode 12 is connected to the first connection terminal 02a, and the first metal layer 07 of the first capacitor in the second functional layer 03 is connected to the second connection terminal 03 a; the second metal layer 09 is connected to the fourth connection terminal 03 b; the second connection structure 13 connects the third connection terminal 02b and the fourth connection terminal 03b to the first pad 05 in the first direction M; the second connection end 03a is connected with the first connection end 02a through the first connection structure 04, and the first connection end 02a is connected with the second bonding pad 06 through the third connection structure 14; thus, a hybrid filter is formed, since the hybrid filter is disposed on the first surface 01a and the second surface 01b of the first substrate 01, and the first functional layer 02 and the second functional layer 03 are connected in the first direction M by the first connection structure 04, and the first acoustic wave device U is disposed in the first functional layer 02, and the first electromagnetic element Q is disposed in the second functional layer 03, the first functional layer 02 provided with the first acoustic wave device U and the second functional layer 03 provided with the first electromagnetic element Q are connected in the shortest manner, and the miniaturization of the hybrid filter is achieved while the filtering performance of the hybrid filter of such a structure is improved.

The second connection structure 13 may be a metal structure filling the through hole, or may be a metal connection line, and similarly, the third connection structure 14 may be a metal structure filling the through hole, or may be a metal connection line, which is not particularly limited.

Optionally, as shown in fig. 7, in another embodiment of the present invention, the hybrid filter further includes:

at least one first inductor 15, the first inductor 15 is electrically connected with the first capacitor.

Specifically, the first electromagnetic element Q may further include a first inductor 15, where the first inductor 15 may be one inductor or a combination of multiple inductors; in fig. 7, the first inductor 15 is illustrated as an example, and the first inductor 15 may be provided in the first electromagnetic element Q by rewiring or providing a through hole, or may be a spiral inductor using a metal layer, or the first inductor 15 may be provided on an encapsulation layer outside the hybrid filter, and the area of the hybrid filter chip may be reduced by providing the first inductor on the encapsulation layer outside the hybrid filter.

Optionally, referring to fig. 8, fig. 8 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention; in another embodiment of the present invention, the first substrate 01 further includes:

A first groove positioned on one side of the first substrate 01 facing the first acoustic wave device U, wherein the orthographic projection of the first groove on the first substrate 01 at least covers the orthographic projection of the first acoustic wave device U on the first substrate 01; the first recess is provided with a bragg reflection layer 16.

It should be noted that, the hybrid filter provided with the bragg reflection layer 16 can reflect the acoustic wave signal, reduce the dissipation of energy, and have higher structural strength.

Optionally, referring to fig. 9, fig. 9 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention; in another embodiment of the present invention, the first substrate 01 further includes:

and a second groove 17 positioned on one side of the first substrate 01 facing the first acoustic wave device U, wherein the orthographic projection of the first acoustic wave device U on the first substrate 01 at least covers the orthographic projection of the second groove 17 on the first substrate 01.

Specifically, since the orthographic projection of the first acoustic wave device U on the first substrate 01 covers the orthographic projection of the second recess 17 on the first substrate 01, a cavity is formed at the second recess 17, the thickness of the cavity in the first direction M is smaller than that of the first substrate 01, and when the cavity exists, the acoustic wave energy is limited in the first acoustic wave device U during operation, so that the filtering performance of the hybrid filter is ensured.

According to the foregoing embodiments, the two filter function layers are connected in the first direction M to reduce the volume of the hybrid filter, and therefore, the embodiment of the present invention further provides a hybrid filter, and referring to fig. 10, fig. 10 is a schematic structural diagram of another hybrid filter according to the embodiment of the present invention; the hybrid filter includes:

the first filter chip A and the second filter chip B are oppositely arranged in the second direction N.

The first filter chip a includes: the semiconductor device comprises a second substrate 21 and a third functional layer 22 positioned on one side of the second substrate 21, wherein the third functional layer 22 comprises at least one fifth connecting end 22a and at least one sixth connecting end 22b.

The second filter chip B includes: a third substrate 23 and a fourth functional layer 24 located on one side of the third substrate 23, wherein the fourth functional layer 24 includes at least one seventh connection end 24a and at least one eighth connection end 24b; the second direction N is perpendicular to the first filter chip A and is directed by the first filter chip A to the second filter chip B.

At least one fourth through hole and at least one fifth through hole penetrating through the first filter chip a in the second direction N; a fourth connection structure 25 located within the fourth through hole; a fifth connection structure 26 located within the fifth through hole.

At least one sixth connection structure 27 and at least one seventh connection structure 28 between the first filter chip a and the second filter chip B; in the second direction N, the sixth connection structure 27 connects the fifth connection end 22a and the seventh connection end 24a with the fourth connection structure 25; the seventh connecting structure 28 connects the sixth connecting end 22b with the eighth connecting end 24b with the fifth connecting structure 26.

The third functional layer 22 comprises at least one second electromagnetic element q; the fourth functional layer 24 comprises a second acoustic device u.

Alternatively, the third functional layer 22 includes a second acoustic device u; the fourth functional layer 24 comprises at least one second electromagnetic element q.

Specifically, the hybrid filter shown in fig. 10 is exemplified by a fifth connection 22a, a sixth connection 22b, a seventh connection 24a, an eighth connection 24b, a fourth connection 25, a fifth connection 26, a sixth connection 27, and a seventh connection 28.

The materials of the second substrate 21 and the third substrate 23 include, but are not limited to, a silicon material, a glass material, a GaAs material, an organic base material, a ceramic base material, and the like; the fifth connecting end 22a, the seventh connecting end 24a, the fourth connecting structure 25 and the sixth connecting structure 27 are in one-to-one correspondence, that is, the number of them is the same; the sixth connecting end 22b, the eighth connecting end 24b, the fifth connecting structure 26 and one seventh connecting structure 28 are in one-to-one correspondence, that is, the same number.

The fifth connection end 22a and the sixth connection end 22B of the first filter chip a are connection ports for connecting the first filter chip a to other structures, and the seventh connection end 24a and the eighth connection end 24B of the second filter chip B are connection ports for connecting the second filter chip B to other structures, and it should be noted that, in fig. 10, the fifth connection end 22a, the sixth connection end 22B, the seventh connection end 24a, and the eighth connection end 24B are merely examples of connection ports, and the shapes and positions of the fifth connection end 22a, the sixth connection end 22B, the seventh connection end 24a, and the eighth connection end 24B are not limited specifically, and are set as needed.

The fourth through hole and the fifth through hole are formed in the first filter chip a through substrate via (Through Substrate Via, abbreviated as TSV) technology, and the fourth through hole and the fifth through hole are perforated in the second direction N, a fourth connection structure 25 is provided in the fourth through hole, the fourth connection structure 25 is connected to the fifth connection end 22a in the first filter chip a, the fifth connection end 22a in the first filter chip a is connected to the seventh connection end 24a in the second filter chip B through a sixth connection structure 27, so that the first filter chip a is connected to one end of the second filter chip B, a fifth connection structure 26 is provided in the fifth through hole, the fifth connection structure 26 is connected to the sixth connection end 22B in the first filter chip a, and the sixth connection end 22B in the first filter chip a is connected to the eighth connection end 24B in the second filter chip B through a seventh connection structure 28, so that the first filter chip a is connected to the other end of the second filter chip B.

Optionally, as shown in fig. 10, in another embodiment of the present invention, the hybrid filter further includes:

at least one third pad 29 and at least one fourth pad 30 on the side of the first filter chip a facing away from the second filter chip B.

The fifth connection terminal 22a is connected to the third pad 29 through the fourth connection structure 25; the sixth connection terminal 22b is connected to the fourth pad 30 through the fifth connection structure 26.

Specifically, the fifth connection terminal 22a is connected to the third pad 29 through the fourth connection structure 25; the sixth connection end 22b is connected with the fourth bonding pad 30 through the fifth connection structure 26, the third bonding pad 29 and the fourth bonding pad 30 are connection points for connecting the hybrid filter with an external structure, and the connection stability of the hybrid filter with the external structure can be improved due to the arrangement of the third bonding pad 29 and the fourth bonding pad 30; the fourth connection structure 25, the fifth connection structure 26, the sixth connection structure 27, the seventh connection structure 28, the third pad 29 and the fourth pad 30 are all made of a metal material that can conduct electricity, so that electrical connection of the hybrid filter can be achieved. The fourth connection structure 25, the fifth connection structure 26, the sixth connection structure 27, and the seventh connection structure 28 may be metal structures filling the through holes, or may be metal connection lines, and are not particularly limited.

In the present embodiment, in the second direction N, the fourth connection structure 25 and the sixth connection structure 27 connect the fifth connection end 22a of the first filter chip a and the seventh connection end 24a of the second filter chip B to the third pad 29, and the fifth connection structure 26 and the seventh connection structure 28 connect the sixth connection end 22B of the first filter chip a and the eighth connection end 24B of the second filter chip B to the fourth pad 30, since the third functional layer 22 includes at least one second electromagnetic element q; the fourth functional layer 24 includes a second acoustic device u; alternatively, the third functional layer 22 includes a second acoustic device u; the fourth functional layer 24 includes at least one second electromagnetic element q, and achieves the shortest electrical connection between the first filter chip a provided with the electromagnetic element and the second filter chip B provided with the acoustic wave device, or the shortest electrical connection between the first filter chip a provided with the acoustic wave device and the second filter chip B provided with the electromagnetic element, improving the filtering performance of the hybrid filter and achieving miniaturization of the hybrid filter.

Optionally, referring to fig. 11, fig. 11 is a schematic structural diagram of a hybrid filter according to another embodiment of the present invention; in another embodiment of the invention, when the third functional layer 22 comprises at least one second electromagnetic element q; when the fourth functional layer 24 includes a second acoustic device u, the second electromagnetic element q includes:

A third metal layer 31, a second dielectric layer 32 and a fourth metal layer 33 sequentially arranged in the second direction N; the third metal layer 31 is electrically connected to the fifth connection terminal 22a, and the fourth metal layer 33 is electrically connected to the sixth connection terminal 22 b.

The second acoustic wave device u includes: a third electrode 34, a second piezoelectric film 35, and a fourth electrode 36 sequentially arranged in the second direction N; the third electrode 34 is electrically connected to the seventh connection terminal 24a, and the second electrode 36 is electrically connected to the eighth connection terminal 24 b.

The second electromagnetic element q comprises a second capacitance; the second capacitor may be a MIM capacitor, and the MIM (metal-insulator-metal) capacitor is a metal-insulator-metal capacitor structure, and may perform filtering and frequency division functions in the first filter chip a.

Specifically, in the present embodiment, when the second electromagnetic element q in the first filter chip a is the second capacitor, the second capacitor is taken as an example, as shown in fig. 11, the third metal layer 31 is connected to the fifth connection terminal 22a, the third electrode 34 is connected to the seventh connection terminal 24a, and the fourth connection structure 25 and the sixth connection structure 27 connect the fifth connection terminal 22a of the first filter chip a and the seventh connection terminal 24a of the second filter chip B to the third bonding pad 29; the fourth metal layer 33 is connected to the sixth connection terminal 22b, and the fourth electrode 36 is connected to the eighth connection terminal 24 b; the fifth connection structure 26 and the seventh connection structure 28 connect the sixth connection terminal 22B of the first filter chip a and the eighth connection terminal 24B of the second filter chip B to the fourth pad 30, since the third functional layer 22 includes at least one second electromagnetic element q; the fourth functional layer 24 includes a second acoustic device u; the shortest electrical connection between the first filter chip A provided with the second electromagnetic element q and the second filter chip B provided with the second acoustic wave device u is realized, the filtering performance of the hybrid filter is improved, and the miniaturization of the hybrid filter is realized.

Optionally, as shown in fig. 11, in another embodiment of the present invention, the hybrid filter further includes:

at least one second inductor 37, the second inductor 37 is electrically connected with the second capacitor.

Specifically, in fig. 11, a second inductor 37 is illustrated as an example, and the second inductor 37 may be disposed in the first filter chip a by rewiring or disposing a through hole, in addition to this, the second inductor 37 may also be disposed on an encapsulation layer outside the hybrid filter, and the area of the hybrid filter chip may be reduced by disposing on the encapsulation layer outside the hybrid filter.

It should be noted that, since the second capacitor may also be provided with a plurality of capacitors, the connection between the first metal layer 12 and the second metal layer 14 of the second capacitor is not particularly limited, and referring to fig. 12, fig. 12 is a schematic structural diagram of another hybrid filter according to an embodiment of the present invention; in fig. 12, two capacitors in series are taken as an example, the third metal layer 31 is used as the first metal layer of the two capacitors in series, the second dielectric layer 32 is used as the common dielectric layer of the two capacitors in series, the fourth metal layer 33 includes the second metal layer 33a of the first capacitor and the second metal layer 33b of the second capacitor, and since the two capacitors in series share one third metal layer 31, the second metal layer 33a of the first capacitor is electrically connected with the fourth connection structure 25, and the second metal layer 33b of the second capacitor is connected with the fifth connection structure 26, so that the connection between the first filter chip a and the fourth connection structure 25 and the fifth connection structure 26 can be realized.

Optionally, referring to fig. 13, fig. 13 is a schematic structural diagram of a hybrid filter according to another embodiment of the present invention; in another embodiment of the present invention, when the third functional layer 22 includes a second acoustic device u; when the fourth functional layer 24 includes at least one second electromagnetic element q, the second acoustic device u includes:

a third electrode 34, a second piezoelectric film 35, and a fourth electrode 36 sequentially arranged in the second direction N; the third electrode 34 is electrically connected to the fifth connection terminal 22a, and the fourth electrode 36 is electrically connected to the sixth connection terminal 22 b.

The second electromagnetic element q includes: a third metal layer 31, a second dielectric layer 32 and a fourth metal layer 33 sequentially arranged in the second direction N; the third metal layer 31 is electrically connected to the seventh connection terminal 24a, and the fourth metal layer 33 is electrically connected to the eighth connection terminal 24 b.

The second electromagnetic element q comprises a second capacitance; the second capacitor may be a MIM capacitor, and the MIM (metal-insulator-metal) capacitor is a metal-insulator-metal capacitor structure, and may perform filtering and frequency division functions in the second filter chip B.

Specifically, in the present embodiment, when the second electromagnetic element q in the second filter chip B is a second capacitor, the second capacitor is taken as an example, as shown in fig. 12, the third electrode 34 is connected to the fifth connection terminal 22a, the third metal layer 31 is connected to the seventh connection terminal 24a, and the fourth connection structure 25 and the sixth connection structure 27 connect the fifth connection terminal 22a of the first filter chip a and the seventh connection terminal 24a of the second filter chip B to the third bonding pad 29; the third electrode 34 is connected to the sixth connection terminal 22b, and the fourth metal layer 33 is connected to the eighth connection terminal 24 b; the fifth connection structure 26 and the seventh connection structure 28 connect the sixth connection terminal 22B of the first filter chip a and the eighth connection terminal 24B of the second filter chip B to the fourth pad 30, since the third functional layer 22 includes the second acoustic wave device u; the fourth functional layer 24 includes at least one second electromagnetic element q, and achieves the shortest electrical connection between the first filter chip a provided with the second acoustic wave device u and the second filter chip B provided with the second electromagnetic element q, improving the filtering performance of the hybrid filter and achieving miniaturization of the hybrid filter.

Note that, when the third functional layer 22 includes a second acoustic device u; when the fourth functional layer 24 includes at least one second electromagnetic element q, the second capacitor may be a plurality of capacitors, or the second inductor 37 may be provided, which will not be described herein.

In the above embodiment, the first acoustic wave device U and the second acoustic wave device U include: a surface acoustic wave resonator, a bulk acoustic wave resonator, a surface acoustic wave filter, or a bulk acoustic wave filter; the surface acoustic wave filter comprises a temperature compensation type surface acoustic wave filter (Temperature compensated SAW, abbreviated as TC-SAW) or an ultra-high performance surface acoustic wave filter (incredible high performance SAW, abbreviated as IHP-SAW) and the like; the bulk acoustic wave filter includes a thin film bulk acoustic wave filter (film bulk acoustic resonator, abbreviated as FBAR) and the like, and the bulk acoustic wave resonator includes a single bulk acoustic wave resonator or a network of a plurality of interconnected bulk acoustic wave resonators and the like, and the kind of the surface acoustic wave resonator, the bulk acoustic wave resonator, the surface acoustic wave filter, or the bulk acoustic wave filter is not particularly limited.

Of course, based on the structure of the bragg reflection layer and the cavity can be increased when the first acoustic wave device U is arranged, and the filtering performance of the hybrid filtering can be improved by increasing the bragg reflection layer and the cavity when the second acoustic wave device U is arranged, which is not described in detail herein.

The above description of a hybrid filter provided by the present invention has been provided in detail, and specific examples have been applied herein to illustrate the principles and embodiments of the present invention, the above examples being provided only to help understand the method of the present invention and its core ideas; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.

It should be noted that, in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described as different from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.

It is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include, or is intended to include, elements inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A hybrid filter, the hybrid filter comprising:

2. The hybrid filter of claim 1, wherein the first functional layer further comprises at least one third connection; the second functional layer further comprises at least one fourth connecting end;

the hybrid filter further includes:

at least one first bonding pad positioned on one side of the first functional layer away from the first substrate; at least one second bonding pad positioned on one side of the second functional layer away from the first substrate;

the third connecting end is connected with the first bonding pad; the fourth connecting end is connected with the second bonding pad.

3. The hybrid filter of claim 1, wherein the first functional layer further comprises at least one third connection; the second functional layer further comprises at least one fourth connecting end;

the hybrid filter further includes: at least one first bonding pad and at least one second bonding pad positioned on one side of the first functional layer away from the first substrate;

A second through hole penetrating through the first functional layer and the first substrate in the first direction, and a second connection structure located in the second through hole; a third through hole penetrating the first functional layer; a third connection structure located within the third through hole;

the third connecting end and the fourth connecting end are connected with the first bonding pad through the second connecting structure; the first connecting end is connected with the second bonding pad through the third connecting structure.

4. A hybrid filter according to claim 2 or 3, wherein when the first functional layer comprises at least one first electromagnetic element; when the second functional layer includes a first acoustic wave device, the first electromagnetic element includes:

in the first direction, a first metal layer, a first dielectric layer and a second metal layer are sequentially arranged; the first metal layer is electrically connected with the third connecting end, and the second metal layer is electrically connected with the first connecting end;

the first acoustic wave device includes: a first electrode, a first piezoelectric film and a second electrode which are sequentially arranged in the first direction; the first electrode is electrically connected with the second connecting end, and the second electrode is electrically connected with the fourth connecting end.

5. A hybrid filter according to claim 2 or 3, wherein when the first functional layer comprises a first acoustic wave device; when the second functional layer includes at least one first electromagnetic element, the first acoustic wave device includes:

a first electrode, a first piezoelectric film and a second electrode which are sequentially arranged in the first direction; the first electrode is electrically connected with the third connecting end, and the second electrode is electrically connected with the first connecting end;

the first electromagnetic element includes: in the first direction, a first metal layer, a first dielectric layer and a second metal layer are sequentially arranged; the first metal layer is electrically connected with the second connecting end, and the second metal layer is electrically connected with the fourth connecting end.

6. The hybrid filter of claim 1, wherein the first electromagnetic element comprises a first capacitance.

7. The hybrid filter of claim 6, further comprising:

at least one first inductor, the first inductor is connected with the first electric capacity electricity.

8. The hybrid filter of claim 1, wherein the first substrate further comprises:

The first groove is positioned on one side of the first substrate facing the first acoustic wave device, and the orthographic projection of the first groove on the first substrate at least covers the orthographic projection of the first acoustic wave device on the first substrate; and a Bragg reflection layer is arranged in the first groove.

9. The hybrid filter of claim 1, wherein the first substrate further comprises:

and the second groove is positioned on one side of the first substrate facing the first acoustic wave device, and the orthographic projection of the first acoustic wave device on the first substrate at least covers the orthographic projection of the second groove on the first substrate.

10. A hybrid filter, the hybrid filter comprising:

11. The hybrid filter of claim 10, further comprising:

at least one third bonding pad and at least one fourth bonding pad which are positioned on one side of the first filter chip away from the second filter chip;

The fifth connecting end is connected with the third bonding pad through the fourth connecting structure; the sixth connecting end is connected with the fourth bonding pad through the fifth connecting structure.

12. The hybrid filter of claim 10, wherein when the third functional layer comprises at least one second electromagnetic element; when the fourth functional layer includes a second acoustic device, the second electromagnetic element includes:

the third metal layer, the second dielectric layer and the fourth metal layer are sequentially arranged in the second direction; the third metal layer is electrically connected with the fifth connecting end, and the fourth metal layer is electrically connected with the sixth connecting end;

the second acoustic device includes: a third electrode, a second piezoelectric film, and a fourth electrode sequentially arranged in the second direction; the third electrode is electrically connected with the seventh connecting end, and the second electrode is electrically connected with the eighth connecting end.

13. The hybrid filter of claim 10, wherein when the third functional layer comprises a second acoustic device; when the fourth functional layer includes at least one second electromagnetic element, the second acoustic device includes:

A third electrode, a second piezoelectric film, and a fourth electrode sequentially arranged in the second direction; the third electrode is electrically connected with the fifth connecting end, and the fourth electrode is electrically connected with the sixth connecting end;

the second electromagnetic element includes: the third metal layer, the second dielectric layer and the fourth metal layer are sequentially arranged in the second direction; the third metal layer is electrically connected with the seventh connecting end, and the fourth metal layer is electrically connected with the eighth connecting end.

14. The hybrid filter of claim 10, wherein the second electromagnetic element comprises a second capacitance.

15. The hybrid filter of claim 14, further comprising:

and the second inductor is electrically connected with the second capacitor.