CN117153760A - Bonding sheet centering mechanism and bonding sheet centering method - Google Patents
Bonding sheet centering mechanism and bonding sheet centering method Download PDFInfo
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Abstract
The application discloses a bonding sheet centering mechanism and a bonding sheet centering method, and belongs to the field of semiconductor processing. The bonding sheet centering method comprises the following steps: calculating the pushing distance B of the first rear push rod and the second rear push rod according to the diameter d0 of the bonding sheet input in advance, and controlling the inward pushing distance B of the two push rods; controlling the first front push rod and the second front push rod to move inwards, and stopping moving when the first front push rod, the second front push rod, the first rear push rod and the second rear push rod are in contact with the bonding sheet; calculating the actual diameter D1 of the bonding sheet according to the positions of the four push rods, calculating a correction value C according to D1, and calculating an accurate pushing distance D according to the correction value C; all push rods return, and the first rear push rod and the second rear push rod are controlled to move inwards by a distance D; and controlling the first front push rod and the second front push rod to move inwards until the first front push rod and the second front push rod contact the bonding sheet, stopping moving, and completing centering. When the actual diameter of the bonding sheet deviates from the designed diameter, the bonding sheet can be more accurately centered and positioned, and the precision is higher.
Description
Technical Field
The application relates to the technical field of semiconductor processing, in particular to a bonding sheet centering mechanism and a bonding sheet centering method.
Background
In the wafer bonding technology, the wafer and the carrier are required to be bonded, and the requirement on the position center offset of the wafer or the carrier is high. In the prior art, there is a technology of three-point positioning of a wafer or a carrier, generally, the advancing distances of three positioning blocks are calculated according to the diameters of the wafer or the carrier, and then the positioning blocks are controlled to advance forward by corresponding distances so as to center and position the wafer or the carrier on a support.
However, considering that there is a dimensional deviation of the wafer or the carrier, the accuracy of centering the wafer or the carrier according to the above-mentioned positioning and centering method sometimes cannot meet the requirement, resulting in a reduction in the yield of products.
Disclosure of Invention
One object of an embodiment of the application is to: provided are a bonding sheet centering mechanism and a bonding sheet centering method, which can improve the centering accuracy of bonding sheets.
In order to achieve the above purpose, the application adopts the following technical scheme:
a bonding sheet centering mechanism for centering a bonding sheet, the bonding sheet being a wafer or a carrier sheet, the bonding sheet centering mechanism comprising:
a support for supporting the bonding sheet; the support piece is provided with a support center, a first central line and a second central line which pass through the support center and are perpendicular to each other;
the rear pushing assembly comprises a first rear push rod and a second rear push rod which are arranged at the rear side of the first central line and symmetrically arranged at two opposite sides of the second central line;
the front pushing assembly comprises a first front push rod and a second front push rod which are arranged on the front side of the first central line and symmetrically arranged on two opposite sides of the second central line;
a controller for controlling the rear pushing assembly and the front pushing assembly;
wherein the first rear push rod, the second rear push rod, the first front push rod and the second front push rod can move along the radial direction of the supporting piece towards or away from the supporting center; the first front push rod, the second front push rod, the first rear push rod and the second rear push rod are respectively provided with a force sensor; the force sensor is in communication with the controller.
Optionally, the device also comprises a marking push rod; the marking push rod is positioned at the front side of the first central line and positioned on the second central line, and is used for being inserted into the notch of the bonding sheet to position the bonding sheet
The marking push rod is movable in a radial direction of the support member in a direction approaching or separating from the support center.
Alternatively, the marking push rod is provided with an elastic member, which can be compressed by a force directed away from the support center.
A bonding sheet centering method is applied to the bonding sheet centering mechanism; the bonding sheet centering method comprises the following steps:
calculating the pushing distance B of the first rear push rod and the second rear push rod according to the diameter d0 of the bonding sheet which is input in advance; controlling the first rear push rod and the second rear push rod to move inwards by the distance B from a standby position;
controlling the first front push rod and the second front push rod to move inwards from a standby position, and stopping moving when the first front push rod, the second front push rod, the first rear push rod and the second rear push rod are in contact with a bonding sheet;
calculating the actual diameter d1 of the bonding sheet according to the positions of the first rear push rod, the second rear push rod, the first front push rod and the second front push rod; calculating a correction value C according to the D0 and the D1, and calculating the accurate pushing distance D of the first rear push rod (31) and the second rear push rod (32) according to the correction value C;
controlling the first rear push rod, the second rear push rod, the first front push rod and the second front push rod to move and return to a standby position;
controlling the first rear push rod and the second rear push rod to move inwards by the distance D; and controlling the first front push rod and the second front push rod to move inwards, stopping moving when contacting the bonding sheet, and finishing centering.
Alternatively, the correction value c= (D1-D0)/2, and the accurate push distance d=b-C.
Optionally, before controlling the first rear push rod and the second rear push rod to move inward by the distance B, the method further comprises:
and calculating the pushing distance A of the marking push rod according to the diameter d0 of the bonding sheet input in advance, controlling the marking push rod to move inwards by the distance A, and enabling the marking push rod to extend into the notch of the bonding sheet.
Optionally, when the first rear push rod and the second rear push rod are controlled to move inwards from the standby position by the distance B, the marking push rod is kept in the notch of the bonding sheet, and the marking push rod is in a compressed state.
Optionally, stopping movement when the first front push rod, the second front push rod, the first rear push rod, and the second rear push rod all contact the bonding sheet comprises:
when force feedback signals of the first front push rod, the second front push rod, the first rear push rod and the second rear push rod are received simultaneously, the first front push rod, the second front push rod, the first rear push rod and the second rear push rod are judged to contact with the bonding sheet, and the first front push rod and the second front push rod are controlled to stop moving inwards.
Optionally, the calculating the bonding pad actual diameter d1 includes:
when the first front push rod, the second front push rod, the first rear push rod and the second rear push rod are in contact with the bonding sheet, acquiring x coordinates and y coordinates of the first front push rod, the second front push rod, the first rear push rod and the second rear push rod, and acquiring x coordinates of the supporting center;
calculating the actual diameter d1 of the bonding sheet according to the x coordinate and the y coordinate of the first front push rod, the second front push rod, the first rear push rod and the second rear push rod and the x coordinate of the supporting center;
the calculating the pushing distance B of the first rear push rod and the second rear push rod according to the pre-input bonding piece diameter d0 comprises the following steps:
the first rear push rod can move inwards from a first standby position to a first working position, and the second rear push rod can move inwards from a second standby position to a second working position; the distance between the first rear push rod and the supporting center and the distance between the second rear push rod and the second standby position are both the distance W, and B=W-d 0/2.
The beneficial effects of the application are as follows: when the actual diameter of the bonding sheet deviates from the designed diameter, the application can also correct the pushing distance of the first rear push rod and the second rear push rod, thereby more accurately centering and positioning the bonding sheet and having higher positioning precision.
Drawings
The application is described in further detail below with reference to the drawings and examples.
FIG. 1 is a schematic view of a bonding pad centering mechanism according to an embodiment of the present application;
FIG. 2 is a schematic view of a marking push rod of a key blade centering mechanism according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a bonding pad alignment method according to a first embodiment of the present application;
FIG. 4 is a second schematic diagram of a bonding pad alignment method according to the first embodiment of the application;
FIG. 5 is a third schematic diagram of a bonding pad centering method according to the first embodiment of the application;
FIG. 6 is a fourth schematic diagram of a bonding pad alignment method according to the first embodiment of the present application;
FIG. 7 is a fifth schematic diagram of a bonding pad centering method according to the first embodiment of the present application;
FIG. 8 is a diagram illustrating a bonding pad alignment method according to a first embodiment of the present application;
FIG. 9 is a seventh schematic illustration of a bonding pad alignment method according to the first embodiment of the present application;
FIG. 10 is a schematic illustration of a bonding pad centering method according to a first embodiment of the present application;
FIG. 11 is a schematic diagram of a bonding pad alignment method according to a second embodiment of the present application;
FIG. 12 is a second schematic diagram of a bonding pad alignment method according to a second embodiment of the present application;
FIG. 13 is a third schematic view of a bonding pad alignment method according to a second embodiment of the present application;
FIG. 14 is a fourth schematic diagram of a bonding pad alignment method according to a second embodiment of the present application;
FIG. 15 is a flowchart of a method of aligning a bonding pad according to an embodiment of the present application;
fig. 16 is a conventional three-point positioning method of a bonding sheet.
In the figure: 10. a support; 101. a support center; 102. a first centerline; 103. a second centerline; 20. marking a push rod; 31. a first rear pushrod; 32. a second rear push rod; 41. a first front pushrod; 42. a second front push rod; 80. a positioning block; 90. a bonding sheet; 901. a sheet center; 91. and (5) a notch.
Detailed Description
In order to make the technical problems solved by the present application, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present application will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.
In the description of the present application, unless explicitly stated and limited otherwise, the terms "connected," "affixed" and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
Wafer bonding equipment is a common semiconductor processing equipment used to package wafers with carrier sheets, and the bonding step is performed in a bonding chamber. The carrier sheet is a wafer for carrying or glass for carrying, etc. The wafer bonding step is generally: when the bonding cavity is in an atmospheric environment, the first bonding piece is sent to the supporting piece, the centering mechanism moves to center the first bonding piece, the spacing piece extends to the upper side of the first bonding piece, the centering mechanism moves to center the second bonding piece, the bonding cavity is vacuumized, the upper pressure plate descends downwards to press, the spacing piece is pulled out, the centering mechanism of the first bonding piece and the second bonding piece returns, the pressure plate returns after a set time, and bonding between the wafer and the two bonding pieces of the bearing piece is completed. One of the first bonding sheet and the second bonding sheet is a wafer, and the other is a carrier sheet.
In the related art, as shown in fig. 16, there is a technique of three-point positioning the bonding sheet 90, generally, according to the diameter of the bonding sheet 90 to be processed, the distance of inward pushing of three positioning blocks 80 (for example, 12 inches, 10 inches, 8 inches, etc.) around the bonding sheet 90 is calculated, and then the three positioning blocks 80 are controlled to simultaneously be pushed inward by corresponding distances, so as to position the bonding sheet 90. It will be appreciated that when positioning the 12 inch, 10 inch, 8 inch bonding pad 90, the three positioning blocks 80 are advanced inwardly a first distance, a second distance, and a third distance in sequence, the first distance, the second distance, and the third distance increasing in sequence.
However, due to the variation in the diameter of the bonding pad, the three-point positioning method may result in misalignment. For example, when the design diameter of the bonding sheet is 12 inches, the bonding sheet may actually have a diameter greater than or less than 12 inches, and at this time, when three positioning blocks are simultaneously pushed inward by a first distance, the effect of centering the center of the bonding sheet with the center of the support member carrying the bonding sheet may not be achieved, and the centering positioning accuracy may sometimes not be able to meet the requirements, resulting in a reduction in the centering yield, a reduction in the bonding yield of the bonding sheet, and a reduction in the final product yield.
The application provides a bonding sheet centering mechanism and a bonding sheet centering method capable of improving wafer centering positioning accuracy.
The application is used for centering and positioning the bonding sheet 90, and the bonding sheet 90 is a wafer or a carrier sheet. After the bonding sheet is centered, the sheet center 901 of the bonding sheet 90 coincides with the support center 101 of the support 10, or the deviation value between the sheet center 901 and the support center 101 is within the accuracy range.
Compared with the existing three-point positioning mode, the application can center the bonding sheet 90 through the cooperation of a plurality of push rods of the first rear push rod 31 at the left rear side, the second rear push rod 32 at the right rear side, the first front push rod 41 at the left front side and the second front push rod 42 at the left rear side of the supporting center 101, and can correct the pushing distance of the left rear push rod and the right rear push rod when the actual diameter d1 of the bonding sheet 90 deviates from the designed diameter d0, thereby more accurately centering the bonding sheet 90 and having higher positioning precision. In addition, the application only needs to correct the pushing distance of the left rear push rod and the right rear push rod, does not need to input, calculate or correct the distance of the left front push rod and the right front push rod in advance, and has simpler control and easy realization.
Referring to fig. 1 to 15, a bonding sheet centering mechanism and a bonding sheet centering method will be described.
Referring to fig. 1 to 3, the bonding sheet centering mechanism includes a support 10, a rear push assembly, a front push assembly, a marking push rod 20, and a controller (not shown).
The support 10 includes a support surface for supporting the bonding pad 90, the support 10 may be a chuck or a plurality of spacers, and the support 10 is for supporting the bonding pad 90 or a carrier pad. Referring to fig. 3, the support 10 has a support center 101. The support 10 has a first center line 102 passing through the support center 101 and a second center line 103, the first center line 102 and the second center line 103 being perpendicular to each other, and the first center line 102 and the second center line 103 being parallel to the support surface. Wherein, the inward movement in the present application means a movement toward the support center 101, and the outward movement means a movement away from the support center 101.
Referring to fig. 1 and 3, the rear push assembly includes a first rear push rod 31 and a second rear push rod 32, and the front push assembly includes a first front push rod 41 and a second front push rod 42. Referring to fig. 3, the first rear push rod 31 and the second rear push rod 32 are located at the rear side of the first center line 102 and are symmetrical about the second center line 103. The first front push rod 41 and the second front push rod 42 are both positioned on the front side of the first center line 102 and are symmetrical about the second center line 103. Referring to fig. 1 and 2, the key piece 90 has a notch 91, the notch 91 and the marking push rod 20 are both located on the front side of the first center line 102, the notch 91 and the marking push rod 20 are both located on the second center line 103 (i.e. the second center line 103 passes through the notch 91 and the marking push rod 20), and the notch 91 faces the marking push rod 20.
The first rear push rod 31, the second rear push rod 32, the first front push rod 41, the second front push rod 42, and the marking push rod 20 are movable in a direction approaching or separating from the support center 101 in the radial direction of the support 10. The controller is used for controlling the first rear push rod 31, the second rear push rod 32, the first front push rod 41, the second front push rod 42 and the marking push rod 20 to move.
Referring to fig. 1, the first rear push rod 31, the second rear push rod 32, the first front push rod 41 and the second front push rod 42 may contact the edge position of the bonding sheet 90 without the notch 91 during the inward movement. Referring to fig. 2 and 4, the marking push rod 20 may extend into the notch 91 of the bonding sheet 90 when moving in a direction approaching the support center 101, so as to prevent the bonding sheet 90 from slipping when detecting the actual diameter of the bonding sheet 90.
Based on the bonding sheet centering mechanism of the application, the bonding sheet centering method comprises the following steps: correction step S100, reset step S200, centering step S300.
Part of the steps for positioning and centering the bonding pad 90 with an actual diameter d1 smaller than the design diameter d0 are illustrated in fig. 3-10. Part of the steps for positioning and centering the bonding pad 90 with an actual diameter d1 greater than the design diameter d0 are illustrated in fig. 11-14.
The correction step S100 includes:
s1002: calculating the pushing distance B of the first rear push rod 31 and the second rear push rod 32 according to the diameter d0 of the bonding sheet 90 which is input in advance; referring to fig. 5 or 13, the controller controls the first rear push rod 31 and the second rear push rod 32 to move inward from the standby position by a distance B, and the first rear push rod 31 and the second rear push rod 32 are symmetrical about the second center line 103 after moving into position.
S1003: referring to fig. 6 or 14, the first and second front pushers 41 and 42 are controlled to move inward from the standby position and stop moving when the first and second front pushers 41 and 42, the first and second rear pushers 31 and 32 contact the bonding pad 90.
S1004: the actual diameter d1 of the bonding sheet 90 is calculated based on the positions of the first rear push rod 31, the second rear push rod 32, the first front push rod 41, and the second front push rod 42.
S1005: the correction value C is calculated from the design diameter d0 and the actual diameter d1.
S1006: the accurate push distance D is calculated from the correction value C.
In the correction step S100, the positions of the first rear push rod 31 and the second rear push rod 32 remain symmetrical about the second center line 103, and the positions of the first front push rod 41 and the second front push rod 42 remain symmetrical about the second center line 103.
The resetting step S200 includes: referring to fig. 8, the first rear push rod 31, the second rear push rod 32, the first front push rod 41, and the second front push rod 42 are controlled to move outward to return to their standby positions.
The centering step S300 includes: referring to fig. 9, the first rear push rod 31 and the second rear push rod 32 are controlled to move inward by a distance D; with reference to fig. 10, the first front push rod 41 and the second front push rod 42 are controlled to move inwards, and the movement is stopped when the bonding sheet 90 is contacted, so that centering is completed.
It will be appreciated that, with respect to the three-point positioning method in the prior art, the present application is based on the cooperation of four pushers disposed at the left rear, right rear, left front and right front of the support center 101, and the actual diameter d1 of the bonding sheet 90 can be calculated based on the positions of the four pushers when the four pushers are all in contact with the outer edges of the bonding sheet 90 in the correction step, so as to calculate the correction value C for pushing the first rear pushers 31 and the second rear pushers 32 inward. In the prior art, when the actual diameter of the bonding sheet 90 deviates from the designed diameter, the alignment positioning of the bonding sheet 90 has an error, but the bonding sheet alignment mechanism and the alignment method of the application can correct the advancing distances of the first rear push rod 31 and the second rear push rod 32 before aligning the bonding sheet 90, so that the bonding sheet 90 can be aligned more accurately, and can meet the requirement of higher alignment positioning precision.
The application is based on the same system, not only can realize the detection of the actual diameter of the bonding sheet 90, but also can perform centering positioning on the bonding sheet 90 after correcting the pushing distance of the pushing rod based on the actual diameter, and has simpler structure and control method, and a special infrared probe equidistant sensor is not required to be arranged outside the pushing rod for pushing and positioning the bonding sheet 90 for measuring the actual diameter of the bonding sheet 90.
In both the correction step S100 and the centering step S300, the specific pushing distances of the first front push rod 41 and the second front push rod 42 are not required to be calculated and controlled, and the control is simpler.
In step S1005 and step S1006, the correction value C and the accurate push distance D may be calculated at least in the following three ways.
Mode one:
correction value c= (D1-D0)/2, accurate push distance d=b-C.
It can be understood that, according to the calculation mode of C, when D1> D0, the value of C is a positive value, and the calculated value of D is smaller than the value of C; when D1< D0, the value of C is negative, and the calculated value of D is larger than the value of C. Step S1005 and step S1006 in fig. 15 illustrate the present calculation method.
Mode two:
c is defined as the absolute value, i.e. c= |d1-d0|/2.
Judging whether d1 is smaller than d0; if yes (i.e., D1 is less than D0), calculating an accurate push distance d=b+c; if no (i.e., D1 is greater than D0), then the precise push distance d=b-C is calculated. In the correction step S100, the correction step S100 further includes a step S1001 in which the first rear push rod 31 and the second rear push rod 32 are controlled to move inward by the distance B.
Step S1001 includes: based on the previously inputted diameter d0 of the bonding piece 90, the pushing distance A of the marking push rod 20 is calculated, and the inward movement distance A of the marking push rod 20 is controlled so that the marking push rod 20 extends into the notch 91.
Referring to fig. 3 and 4, when the actual diameter d1 of the bonding pad 90 is smaller than the designed diameter d0 of the bonding pad 90, the marking push rod 20 will extend into the notch 91 of the bonding pad 90 when moving inward by the distance a, and the first rear push rod 31 and the second rear push rod 32 will not contact the outer edge of the bonding pad 90 when moving inward by the distance B.
Referring to fig. 12 and 13, when the actual diameter D1 of the bonding sheet 90 is larger than or smaller than the designed diameter D0 of the bonding sheet 90, the marking push rod 20 stretches into the notch 91 of the bonding sheet 90 when moving inward by the distance a, the marking push rod 20 touches the inner wall of the notch 91, and the first rear push rod 31 and the second rear push rod 32 contact the outer edge of the bonding sheet 90 and push the bonding sheet 90 forward by a certain distance when moving inward by the distance B, and in the pushing process of the first rear push rod 31 and the second rear push rod 32, the marking push rod 20 cooperates with the inner wall of the notch 91 to position the notch 91 to prevent the bonding sheet 90 from deflecting angularly, avoid the bonding sheet 90 from slipping and avoid the position change of the center 901 of the sheet, thereby facilitating the subsequent calculation of D1, C and D.
In this embodiment, the marking push rod 20 of the bonding sheet centering mechanism is provided with an elastic member; illustratively, the marking putter 20 includes a main shaft and a putter head at an inner end of the main shaft, wherein the putter head is movably connected to the main shaft, and an elastic member, which may be, but not limited to, a spring, is disposed between the putter head and the main shaft. The marker push rod 20 may be compressed under the force of an outward force.
Correspondingly, in the present embodiment, when the first rear push rod 31 and the second rear push rod 32 are controlled to move inward from the standby position by the distance B, the marking push rod 20 remains located in the notch 91 of the bonding sheet 90, and the marking push rod 20 is in a compressed state. It will be appreciated that, in order to enable the first rear push rod 31 and the second rear push rod 32 to smoothly push inward by the distance B when the actual diameter of the bonding sheet 90 is larger, the marking push rod 20 of the bonding sheet centering mechanism is configured to be elastically telescopic, and in the pushing process of the first rear push rod 31 and the second rear push rod 32, referring to fig. 13, since the bonding sheet 90 moves forward, the marking push rod 20 is compressed, so that the first rear push rod 31 and the second rear push rod 32 are pushed according to the pushing distance B, and the marking push rod 20 is ensured to remain clamped in the notch 91, and the sliding position deviation of the bonding sheet 90 is avoided. Thus, prior to step S1003, the bonding pad 90 notch 91, pad center 901 is maintained on the second centerline 103, facilitating subsequent calculations D1, C, and D.
In other embodiments, in step S1001, the marking push rod 20 may not extend inward to extend into the notch 91, and the marking push rod 20 may be lifted up and down to be inserted into the notch 91. It can be understood that in step S1001, the marking push rod 20 is pushed inward to extend into the notch 91, so that the bonding sheet 90 with different diameters can be adapted, and according to the design diameter of the bonding sheet 90, how much distance that the marking push rod 20 needs to be pushed can extend into the notch 91 can be calculated, and the structure of the bonding sheet centering mechanism is simpler.
In an embodiment, step S001 is further included before step S100, where step S001 includes: the bonding sheet 90 is sent to the support 10, the position of the notch 91 of the bonding sheet 90 is identified by means of image recognition or the like, the position of the center of the notch 91 of the bonding sheet 90 is identified, and the support 10 is controlled to rotate around the support center 101 so as to adjust the bonding sheet 90 to a state that the center of the notch 91 is located at the second center line 103 of the support base. Based on step S001, it is possible to locate the sheet center 901 of the bonding sheet 90 on the second center line 103 in step S100, and the notch 91 of the bonding sheet 90 is directed forward to face the marking push rod 20, so that the marking push rod 20 is conveniently inserted into the notch 91 to prevent the bonding sheet 90 from sliding in step S1002, and the actual diameter d1 of the bonding sheet 90 is conveniently calculated from the positions of the plurality of push rods.
Correspondingly, based on step S1001, the resetting step S200 includes: the first rear push rod 31, the second rear push rod 32, the first front push rod 41, the second front push rod 42 and the marking push rod 20 are controlled to move outwards to return to the respective standby positions.
In one embodiment, in step S1002, the distance B is calculated by:
referring to fig. 5, the first rear push rod 31 is movable inward from a first standby position to a first operating position, and the second rear push rod 32 is movable inward from a second standby position to a second operating position. The distance between the first rear push rod 31 and the support center 101 at the first standby position and the distance between the second rear push rod 32 and the support center 101 at the second standby position are both the distances W, b=w-d 0/2.
In one embodiment, in step S1001, the distance a is calculated by:
referring to fig. 4, the marking push rod 20 is movable inwardly from the third standby position to the third operating position. The distance between the third standby position of the marking push rod 20 and the supporting center 101 minus d0/2 is equal to a.
An embodiment of step S1003 is provided below, in which stopping movement when each of the first front push rod 41, the second front push rod 42, the first rear push rod 31, and the second rear push rod 32 contacts the bonding sheet 90 is performed specifically as follows.
When the force feedback signals of the four push rods of the first front push rod 41, the second front push rod 42, the first rear push rod 31 and the second rear push rod 32 are received, it is judged that the first front push rod 41, the second front push rod 42, the first rear push rod 31 and the second rear push rod 32 are in contact with the bonding sheet 90, and the first rear push rod 31 and the second rear push rod 32 are controlled to stop moving inwards. Correspondingly, in the bonding sheet centering mechanism, force sensors are respectively arranged on the first front push rod 41, the second front push rod 42, the first rear push rod 31 and the second rear push rod 32, and the force sensors are in communication connection with the controller.
When the actual diameter d1 of the bonding pad 90 is smaller than the designed diameter d0, referring to fig. 5, in step S1002, the first rear push rod 31 and the second rear push rod 32 move inward by the distance B and then do not contact the bonding pad 90, and referring to fig. 6, in step S1003, four push rods contact the bonding pad 90, and when force feedback of the first rear push rod 31, the second rear push rod 32, the first front push rod 41 and the second front push rod 42 is received simultaneously, it can be determined that all four push rods contact the bonding pad 90.
When the actual diameter d1 of the bonding pad 90 is greater than the designed diameter d0, referring to fig. 13, in step S1002, the first rear push rod 31 and the second rear push rod 32 have already contacted the bonding pad 90 after being moved inward by the distance B, and referring to fig. 14, in step S1003, the first front push rod 41 and the second front push rod 42 also contact the bonding pad 90, and when force feedback of the first rear push rod 31, the second rear push rod 32, the first front push rod 41 and the second front push rod 42 is received simultaneously, it can be determined that all four push rods contact the bonding pad 90.
It will be appreciated that even if the actual size of the bonding pad 90 is not known in advance, the bonding pad centering mechanism of the present application is provided with force sensors in each of the first rear push rod 31, the second rear push rod 32, the first front push rod 41 and the second front push rod 42, and the bonding pad centering mechanism and the bonding pad centering method of the present application can accommodate both cases where the actual size d1 of the bonding pad 90 is larger or smaller than the design size d0, and can smoothly perform the correction step S100.
The force sensor is one of contact sensors, and the force sensor can be a metal strain gauge, a pressure sensor and the like, so long as the push rod can be detected whether to contact with the edge of the bonding sheet. The force sensor is used for sensing whether contact is made, and is more accurate compared with other distance measuring sensors for sensing whether contact is made.
In one embodiment, calculating the actual diameter d1 of the bonding pad 90 according to the positions of the first rear push rod 31, the second rear push rod 32, the first front push rod 41, and the second front push rod 42 in step S1004 may be performed as follows.
When the first front push rod 41, the second front push rod 42, the first rear push rod 31 and the second rear push rod 32 are in contact with the bonding sheet 90, the x coordinate and the y coordinate of the first front push rod 41, the second front push rod 42, the first rear push rod 31 and the second rear push rod 32 are obtained, and the x coordinate of the supporting center 101 is obtained; the actual diameter d1 of the bonding pad 90 is calculated based on the x-coordinate, y-coordinate of the first front push rod 41, the second front push rod 42, the first rear push rod 31, the second rear push rod 32, and the x-coordinate of the support center 101.
An optional specific calculation method of d1 is as follows:
referring to fig. 7, after the step S1003 is performed, the first rear push rod 31 and the first front push rod 41 are abutted against the outer edge of the bonding sheet 90, and the first center line 102 of the support seat passes through the notch 91, the sheet center 901 and the support center 101 of the bonding sheet 90.
The point where the first rear push rod 31 contacts the edge of the bonding pad 90 is P1, and the intersection point of the second center line 103 and the perpendicular line drawn from the point P1 to the second center line 103 is P2. The point where the first front push rod 41 contacts the edge of the bonding pad 90 is P3, and the intersection point of the second center line 103 and the perpendicular line drawn from the point P3 to the second center line 103 is P4. The distance between the point P1 and the center 901 is L1, the distance between the point P1 and the point P2 is L2, and the distance between the point P2 and the center 901 is L3. The distance between the point P3 and the center 901 is L4, the distance between the point P3 and the point P4 is L5, and the distance between the point P4 and the center 901 is L6. Where l1=l4, L1, L4 are equal to the radius of the bonding pad 90.
Referring to fig. 7, a rectangular coordinate system is established, the coordinates of point P1 are (x 1, y 1), the coordinates of point P2 are (x 2, y 1), the coordinates of point P3 are (x 3, y 2), the coordinates of point P4 are (x 2, y 2), and the coordinates of the center 901 of the chip are (x 2, y 3). The x and y coordinates of the P1, P2, P3, and P4 points are known, the x coordinate of the center 901 of the sheet is known, the y coordinate is an unknown number, in other words, the x1, x2, x3, y1, and y2 are known numbers, and the y3 is an unknown number.
L1 2 =L2 2 +L3 2 ，L4 2 =L5 2 +L6 2 ，L2 2 +L3 2 ==L5 2 +L6 2 。
I.e. (x 2-x 1) 2 +（y3-y1） 2 =（x2-x3） 2 +（y2-y3） 2 Thus, based on the unitary quadratic equation, y3 can be calculated, so that specific lengths of L1 and L4 can be calculated, and d1 can be calculated. Specifically, l1=l4=d1/2.
In step S1001, the sheet center 901 of the bonding sheet 90 is located on the second center line 103; in step S1002, the first rear push rod 31 and the second rear push rod 32 are symmetrically and synchronously pushed inwards; in step S1003, the first front push rod 41 and the second front push rod 42 are symmetrically and synchronously pushed inward; thus, in step S1002 and step S1003, the sheet center 901 can be kept at the second center line 103, and the abscissa x2 of the sheet center 901 can be found when d1 is calculated, so that the diameter d1 of the bonding sheet 90 can be calculated based on the abscissas of the first front putter 41, the second front putter 42, the first rear putter 31, the second rear putter 32, and the second center line 103.
In other embodiments, the actual diameter d1 of the bonding pad 90 may also be calculated by other methods based on the positions of the first front pushrod 41, the second front pushrod 42, the first rear pushrod 31, and the second rear pushrod 32.
In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and the like are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and to simplify operation, rather than to indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for providing a special meaning.
In the description herein, reference to the term "one embodiment," "an example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in the foregoing embodiments, and that the embodiments described in the foregoing embodiments may be combined appropriately to form other embodiments that will be understood by those skilled in the art.
The technical principle of the present application is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the application and should not be taken in any way as limiting the scope of the application. Other embodiments of the application will be apparent to those skilled in the art from consideration of this specification without undue burden.
Claims (9)
1. The utility model provides a bonding piece centering mechanism which characterized in that is used for carrying out centering location to bonding piece (90), bonding piece (90) are wafer or carrier wafer, bonding piece centering mechanism includes:
a support (10) for supporting the bonding sheet (90); the support (10) has a support center (101), and also has a first center line (102) and a second center line (103) which pass through the support center (101) and are perpendicular to each other;
the rear pushing assembly comprises a first rear push rod (31) and a second rear push rod (32) which are arranged at the rear side of the first central line (102) and symmetrically arranged at two opposite sides of the second central line (103);
the front pushing assembly comprises a first front push rod (41) and a second front push rod (42) which are arranged on the front side of the first central line (102) and symmetrically arranged on two opposite sides of the second central line (103);
a controller for controlling the rear pushing assembly and the front pushing assembly;
wherein the first rear push rod (31), the second rear push rod (32), the first front push rod (41) and the second front push rod (42) can move along the radial direction of the support (10) towards or away from the support center (101); the first front push rod (41), the second front push rod (42), the first rear push rod (31) and the second rear push rod (32) are respectively provided with a force sensor; the force sensor is in communication with the controller.
2. The bonding sheet centering mechanism of claim 1, further comprising a marking pushrod (20); the marking push rod (20) is positioned on the front side of the first central line (102) and on the second central line (103), and the marking push rod (20) is used for being inserted into a notch (91) of the bonding sheet (90) to position the bonding sheet (90);
the marking push rod (20) is movable in a radial direction of the support (10) in a direction approaching or separating from the support center (101).
3. The key blade centering mechanism as claimed in claim 2, wherein said marking push rod (20) is provided with an elastic member, said marking push rod (20) being compressible under the force.
4. A bonding sheet centering method, characterized by being applied to the bonding sheet centering mechanism as claimed in any one of claims 1 to 3; the bonding sheet centering method comprises the following steps:
calculating the pushing distance B of the first rear push rod (31) and the second rear push rod (32) according to the diameter d0 of the pre-input bonding sheet (90); controlling the first rear push rod (31) and the second rear push rod (32) to move inwards by the distance B from a standby position;
controlling the first front push rod (41) and the second front push rod (42) to move inwards from a standby position, and stopping moving when the first front push rod (41), the second front push rod (42), the first rear push rod (31) and the second rear push rod (32) are in contact with a bonding sheet (90);
calculating an actual diameter d1 of a bonding sheet (90) according to the positions of the first rear push rod (31), the second rear push rod (32), the first front push rod (41) and the second front push rod (42); calculating a correction value C according to the diameter D0 and the diameter D1, and calculating the accurate pushing distance D of the first rear push rod (31) and the second rear push rod (32) according to the correction value C;
controlling the first rear push rod (31), the second rear push rod (32), the first front push rod (41) and the second front push rod (42) to move back to a standby position;
controlling the first rear push rod (31) and the second rear push rod (32) to move inwards by the distance D; and controlling the first front push rod (41) and the second front push rod (42) to move inwards, stopping moving when contacting the bonding sheet (90), and completing centering.
5. The bonding sheet centering method according to claim 4, wherein the correction value c= (D1-D0)/2, and the exact pushing distance d=b-C.
6. The bonding sheet centering method according to claim 4 or 5, characterized by further comprising, before controlling the first rear push rod (31), the second rear push rod (32) to move inward by the distance B:
calculating the pushing distance A of the marking push rod (20) according to the diameter d0 of the pre-input bonding sheet (90);
the marking push rod (20) is controlled to move inwards by the distance A so that the marking push rod (20) stretches into a notch (91) of the bonding sheet (90).
7. The bonding sheet centering method of claim 6, characterized in that the marking push rod (20) remains located within the notch (91) of the bonding sheet (90) and the marking push rod (20) is in a compressed state while the first rear push rod (31), the second rear push rod (32) are controlled to move inward from a standby position by the distance B.
8. The bonding pad centering method of claim 4 or 5, wherein stopping movement when the first front pushrod (41), the second front pushrod (42), the first rear pushrod (31), and the second rear pushrod (32) each contact a bonding pad (90) comprises:
when force feedback signals of the first front push rod (41), the second front push rod (42), the first rear push rod (31) and the second rear push rod (32) are received simultaneously, the first front push rod (41), the second front push rod (42), the first rear push rod (31) and the second rear push rod (32) are judged to be in contact with the bonding sheet (90), and the first front push rod (41) and the second front push rod (42) are controlled to stop moving inwards.
9. The bonding pad centering method of claim 4 or 5, wherein calculating the actual diameter d1 of the bonding pad (90) comprises:
when the first front push rod (41), the second front push rod (42), the first rear push rod (31) and the second rear push rod (32) are in contact with the bonding sheet (90), acquiring x coordinates and y coordinates of the first front push rod (41), the second front push rod (42), the first rear push rod (31) and the second rear push rod (32), and acquiring x coordinates of the supporting center (101);
calculating the actual diameter d1 of the bonding sheet (90) according to the x coordinate and the y coordinate of the first front push rod (41), the second front push rod (42), the first rear push rod (31) and the second rear push rod (32) and according to the x coordinate of the supporting center (101);
the calculating the pushing distance B of the first rear push rod (31) and the second rear push rod (32) according to the diameter d0 of the pre-input bonding sheet (90) comprises:
the first rear push rod (31) can move inwards from a first standby position to a first working position, and the second rear push rod (32) can move inwards from a second standby position to a second working position; the distance between the first standby position and the supporting center (101) of the first rear push rod (31) and the distance between the second standby position and the supporting center (101) of the second rear push rod (32) are both the distance W, and B=W-d 0/2.
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