CN117139762A - Process method suitable for removing Jin Tang tin locally on pins of inter-board connector - Google Patents
Process method suitable for removing Jin Tang tin locally on pins of inter-board connector Download PDFInfo
- Publication number
- CN117139762A CN117139762A CN202311187930.8A CN202311187930A CN117139762A CN 117139762 A CN117139762 A CN 117139762A CN 202311187930 A CN202311187930 A CN 202311187930A CN 117139762 A CN117139762 A CN 117139762A
- Authority
- CN
- China
- Prior art keywords
- tin
- jin
- pins
- inter
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims abstract description 47
- 230000008569 process Effects 0.000 title claims abstract description 31
- 238000005476 soldering Methods 0.000 claims abstract description 56
- 238000004140 cleaning Methods 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 238000005507 spraying Methods 0.000 claims description 41
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 18
- 230000004907 flux Effects 0.000 claims description 15
- 229910000831 Steel Inorganic materials 0.000 claims description 13
- 239000010959 steel Substances 0.000 claims description 13
- 229910052742 iron Inorganic materials 0.000 claims description 9
- 239000007921 spray Substances 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 210000003298 dental enamel Anatomy 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000012459 cleaning agent Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of a Jin Tang tin removing process for components, in particular to a Jin Tang tin removing process suitable for a pin part of an inter-board connector. The method comprises the following steps: step 1) manufacturing according to the actual size of the inter-board connector, and customizing a local tin coating tool for selective wave soldering of pins of the inter-board connector; step 2) programming the selective wave soldering equipment program; step 3) selective wave soldering Jin Tangxi operation; step 4) removing Jin Tang tin and then carrying out local reworking operation; step 5) connector cleaning operation after Jin Tang tin removal. The local tin coating tool in the step 1) consists of a pin end local protection tool, a pin root protection tool and a selective welding support carrier; the local protection tooling for the pin end is a tooling seat; the tool holder comprises: protection cavity board, connection otic placode and spacing boss. The invention satisfies the local removal Jin Tangxi treatment of the connector pins, ensures the high reliability of the connector pin assembly, improves the removal Jin Tang tin quality and saves the removal Jin Tang tin process cost.
Description
Technical Field
The invention relates to the technical field of a Jin Tang tin removing process for components, in particular to a Jin Tang tin removing process suitable for a pin part of an inter-board connector.
Background
Due to the increasing demands of high integration and miniaturization of electronic equipment, the connection space between PCBA boards in the aviation and aerospace fields is limited, and more units adopt lengthened connector pins to realize back board type opposite plug connection so as to reduce the stacking space.
At present, the surface of the connector pin between boards is generally subjected to gold plating treatment, and in order to prevent the phenomenon of gold embrittlement in the national and international military standards, it is specified that the gold-plated component pin can be welded to a welding hole of a PCB board by adopting Sn63Pn37 solder after Jin Tangxi removal treatment. The back board type opposite-plug connector has the following difficulty in realizing the process of partially removing Jin Tang tin from the pins of the welding area because the pins of the back board type opposite-plug connector need to be subjected to opposite-plug but can not be subjected to gold removal, and the Jin Tangxi can only be partially removed from the pins:
1) The pin end of the connector needs to protect the plug part, and the tin pot can not realize Jin Tangxi removal;
2) The connector pins are arranged in a plurality of rows in a staggered manner, so that soldering tin bridging is easy to generate;
3) Manual removal Jin Tangxi does not effectively control the removal Jin Tangxi position consistency.
Disclosure of Invention
The invention aims to provide a process method suitable for local removal of Jin Tang tin from pins of an inter-board connector, which aims to solve the problem that the process of local removal of Jin Tang tin is required before soldering of a multi-row pin back plate type opposite-plug connector, the existing method for removing Jin Tang tin from the multi-row pin connector is generally tin dipping of whole pins of a tin pot, and the local removal of Jin Tangxi of pins of the connector is required, so that the effective protection of the plug part cannot be realized, and the removal of Jin Tangxi cannot be realized by the tin pot; the connector pins are arranged in a plurality of rows in a staggered manner, and the phenomenon of solder bridging is easy to occur after tin coating, so that the reliability problems of electric connection and the like of products are further affected.
In order to solve the technical problems, the invention provides a process method suitable for local removal Jin Tang tin of pins of an inter-board connector, which is used for realizing local removal Jin Tangxi of a solderable area of the pins of the inter-board connector, and comprises the following steps:
step 1) manufacturing according to the actual size of the inter-board connector, and customizing a local tin coating tool for selective wave soldering of pins of the inter-board connector;
step 2) programming the selective wave soldering equipment program;
step 3) selective wave soldering Jin Tangxi operation;
step 4) removing Jin Tang tin and then carrying out local reworking operation;
step 5) connector cleaning operation after Jin Tang tin removal.
Preferably, the local tin coating tool in the step 1) is composed of a pin end local protection tool, a pin root protection tool and a welding support carrier;
the local protection tool for the pin end is a tool seat; the tool holder comprises: the device comprises a protection cavity plate, a connecting lug plate and a limiting boss; the left end and the right end of the protection cavity plate are symmetrically and integrally formed and connected with the connecting lug plate, the front side wall of the protection cavity plate is provided with a plurality of first inserting holes, the left end and the right end of the front side wall of the protection cavity plate are symmetrically provided with the limiting bosses, the limiting bosses are provided with first limiting holes, and the first limiting holes extend to penetrate through the protection cavity plate;
the pin root protection tool is a steel sheet plate, the steel sheet plate is abutted on the front side wall of the limiting boss, the steel sheet plate further comprises a plurality of second inserting holes and second limiting holes, the second inserting holes are in one-to-one correspondence with the first inserting holes, and the second limiting holes are in one-to-one correspondence with the first limiting holes;
the selective welding support carrier comprises: carrier plate, U-shaped groove and mounting ear plate; the front side wall of the carrier plate is provided with the U-shaped groove, the left end and the right end of the bottom of the groove cavity of the U-shaped groove are symmetrically provided with the mounting lug plate, and the mounting lug plate is provided with mounting screw holes so that the connecting lug plate and the mounting lug plate can be detachably mounted through locking screws.
Preferably, the positions of the first plugging holes and the second plugging holes are in one-to-one correspondence with the pin layout positions of the inter-board connector, so that pins of the inter-board connector can be plugged and penetrated.
Preferably, the positions of the first limiting hole and the second limiting hole correspond to the layout positions of the plug-in posts of the inter-board connector one by one, so that the plug-in posts of the inter-board connector can be plugged and penetrated.
Preferably, the protection cavity plate further comprises a fixing hole, the fixing hole is symmetrically formed in the left end and the right end of the top of the protection cavity plate, the fixing hole extends downwards to penetrate through the first limiting hole, and meanwhile, a fixing screw is locked on the fixing hole through threads.
Preferably, the step 2) specifically includes:
setting each axial movement position of the spray head: according to the dimension reference pictures of the actual tool and the connectors between the plates, and through a motor in the axial direction of the selective wave soldering equipment X, Y, Z, the control moving module accurately controls each axial moving position of the spray head;
setting technological parameters of curing equipment; the selective wave soldering equipment comprises a soldering flux spraying area, a preheating area and a jet tin pot area, and can accurately set the running path, the temperature, the speed, the tin spraying time and the tin spraying height parameters of the spray head, so as to meet the quantitative curing process parameters of the partial area removal Jin Tangxi; the soldering flux spraying module, the preheating module and the tin spraying module are smoothly operated at the Jin Tangxi part of the connector pin to be removed.
Preferably, the step 3) specifically includes: the selective wave soldering equipment is started up and operated, a Jin Tangxi removing program with the process parameter setting completed is called, a tool loaded with devices is placed on a selective wave soldering track, a series of processes of soldering flux spraying, preheating and tin spraying are completed, the quantity of sprayed flowing tin liquid is accurately controlled in a local area of a pin, and then a gold and tin enamel removing process method is achieved.
Preferably, the spraying amount of the soldering flux is 0.1-0.2 ml/s, the preheating temperature is 100-150 ℃, the preheating time is 60-100 s, the tin spraying speed is 3-5 mm/s, the tin spraying temperature is 260-280 ℃, the tin spraying height is 3-5 mm, and the nozzle adopts a nozzle with the inner diameter of 4-8 mm.
Preferably, the step 4) specifically includes: after Jin Tangxi is partially removed from pins of the inter-board connector, part of pins are bridged by soldering tin for reworking; the pin without tin feeding is assembled and protected through a pin local protection tool, a temperature control electric soldering iron with an ultrafine soldering iron head is used, the temperature of the electric soldering iron is 280-320 ℃, a tin sucking belt is added, the sucking time is 2-3S each time, and the residual solder on the pin is removed.
Preferably, the step 5) specifically includes: removing the Jin Tangxi connector, taking down the protection tool, uniformly spraying pins by using a cleaning agent, then placing the pins into a container filled with alcohol, immersing the connector in the liquid for 5min, cleaning the pins by using an anti-static brush, and removing residues and soldering flux residues; and after the cleaning is finished, taking out the connector, standing for 10min, and airing.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a process method for removing Jin Tang tin locally on pins of an inter-board connector, which comprises the steps of selectively wave-soldering a local tin-plating tool through the pins of the inter-board connector; selective wave soldering program, selective wave soldering removal Jin Tangxi; partial rework is performed after Jin Tangxi is removed aiming at partial residual tin of the pin; the final Jin Tangxi removal is accomplished by connector cleaning after Jin Tang tin removal; not only can the size and the position consistency of the tin coating be met according to the requirements, and the problem of local removal Jin Tangxi be solved, but also the Jin Tangxi can be removed in a plurality of sets at one time, so that the cost is reduced and the production efficiency is improved.
Drawings
Fig. 1 is a front view of the structure of the protection tool of the present invention.
Fig. 2 is a rear view of the structure of the protection tool of the present invention.
Fig. 3 is a partial structural cross-sectional view of the protection tool of the present invention.
Fig. 4 is a structural elevation view of the protection tool and the inter-board connector tool of the present invention.
Fig. 5 is a rear view of the structure of the protection tool and the board-to-board connector tool of the present invention.
Fig. 6 is a block diagram of the protective tooling, the inter-board connector and the selective welding support carrier tooling of the present invention.
Fig. 7 is a structural diagram of the cooperation of the selective soldering support carrier and the tin spraying nozzle.
In the figure: 1-tool seat, 11-protection cavity plate, 12-connection lug plate, 13-limit boss, 14-plug hole I, 15-limit hole I, 16-fixed hole, 2-steel sheet plate, 21-plug hole II, 22-limit hole II, 3-selective welding support carrier, 31-carrier plate, 32-U-shaped groove, 33-installation lug plate, 41-nozzle, 42-tin furnace, 5-connector, 51-pin and 52-plug column.
Detailed Description
The invention is described in further detail below with reference to the drawings and the specific examples. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention.
Example 1:
as shown in fig. 1 to 7, the present invention provides a process method adapted to local removal Jin Tang of tin from pins of an inter-board connector, for implementing local removal Jin Tangxi of a solderable area of pins of an inter-board connector, comprising the steps of:
step 1) manufacturing according to the actual size of the inter-board connector, and customizing a local tin coating tool for selective wave soldering of pins of the inter-board connector;
step 2) programming the selective wave soldering equipment program;
step 3) selective wave soldering Jin Tangxi operation;
step 4) removing Jin Tang tin and then carrying out local reworking operation;
step 5) connector cleaning operation after Jin Tang tin removal.
The local tin coating tool in the step 1) consists of a pin end local protection tool, a pin root protection tool and a selective welding support carrier;
the local protection tooling for the pin end is a tooling seat; the tool holder 1 comprises: the protection cavity plate 11, the connecting lug plate 12 and the limiting boss 13; the left end and the right end of the protection cavity plate 11 are symmetrically and integrally formed and connected with the connecting lug plate 12, the front side wall of the protection cavity plate 11 is provided with a plurality of first inserting holes 14, the left end and the right end of the front side wall of the protection cavity plate 11 are symmetrically provided with limiting bosses 13, the limiting bosses 13 are provided with first limiting holes 15, and the first limiting holes 15 extend to penetrate through the protection cavity plate 11;
the pin root protection tool is a steel sheet plate 2, the steel sheet plate 2 is abutted against the front side wall of the limiting boss 13, and the steel sheet plate 2 at the root of the pin 51 is tightly propped and fixed through the limiting boss 13; the steel sheet plate 2 also comprises a plurality of second inserting holes 21 and second limiting holes 22 which are arranged, the positions of the second inserting holes 21 and the first inserting holes 14 are in one-to-one correspondence, and the positions of the second limiting holes 22 and the first limiting holes 15 are in one-to-one correspondence;
the selective welding support carrier 3 includes: carrier plate 31, U-shaped slot 32 and mounting ear plate 33; the front side wall of the carrier plate 31 is provided with a U-shaped groove 32, the left end and the right end of the bottom of the groove cavity of the U-shaped groove 32 are symmetrically provided with mounting lug plates 33, and the mounting lug plates 33 are provided with mounting screw holes, so that the connecting lug plates 12 and the mounting lug plates 33 can be detachably mounted through locking screws, the quick-change pin end local protection tool is completed, the front and the back tin spraying of the multi-row pin connector can be realized, and the problem of the limit of the tin spraying height is solved.
The positions of the first inserting holes 14 and the second inserting holes 21 are corresponding to the layout positions of the pins 51 of the inter-board connector 5 one by one, so that the pins 51 of the inter-board connector 5 can be inserted into the pins.
The positions of the first limiting holes 15 and the second limiting holes 22 are corresponding to the layout positions of the plug posts 52 of the inter-board connector 5 one by one, so that the plug posts 52 of the inter-board connector 5 can be plugged and penetrated.
The protection cavity plate 11 further comprises a fixing hole 16, the fixing hole 16 is symmetrically formed in the left end and the right end of the top of the protection cavity plate 11, the fixing hole 16 extends downwards to penetrate through the first limiting hole 15, and meanwhile, a fixing screw is locked on the fixing hole 16 in a threaded mode.
By the arrangement of the tool seat 1 (namely, the local protection of the end of the pin 51), the local protection of the end of the pin 51 of the connector 5 can be achieved; by providing the above-described steel plate 2 (i.e., protecting the root portion of the pin 51), it is possible to achieve local protection of the root portion of the pin 51 of the connector 5. When the lead is removed Jin Tangxi, the accurate local tin coating can be ensured to be carried out on the lead 51, the end-to-insert part and the root part of the lead 51 are ensured not to be coated with tin, and the other local areas of the lead 51 can be removed Jin Tangxi by protecting the end-to-insert part and the root part of the lead 51.
The step 2) specifically comprises the following steps:
setting each axial movement position of the spray head: according to the dimension reference pictures of the actual tool and the connectors between the plates, and through a motor in the axial direction of the selective wave soldering equipment X, Y, Z, the control moving module accurately controls each axial moving position of the spray head; the tin spraying nozzle comprises a nozzle 41 and a tin furnace 42, so that the spraying flow tin liquid is accurately controlled in the local area of the pin 51, and further, the gold and tin enamel removing process is realized.
Setting technological parameters of curing equipment; the selective wave soldering equipment comprises a soldering flux spraying area, a preheating area and a jet tin pot area, and can accurately set the running path, the temperature, the speed, the tin spraying time and the tin spraying height parameters of the spray head, so as to meet the quantitative curing process parameters of the partial area removal Jin Tangxi; the soldering flux spraying module, the preheating module and the tin spraying module are smoothly operated at the Jin Tangxi part of the connector pin to be removed, and the tin coating quality of the connector pin is ensured.
The step 3) specifically comprises the following steps: the selective wave soldering equipment is started up and operated, a Jin Tangxi removing program with the process parameter setting completed is called, a tool loaded with devices is placed on a selective wave soldering track, a series of processes of soldering flux spraying, preheating and tin spraying are completed, the quantity of sprayed flowing tin liquid is accurately controlled in a local area of a pin, and then a gold and tin enamel removing process method is achieved.
The spraying amount of the soldering flux is 0.1-0.2 ml/s, the preheating temperature is 100-150 ℃, the preheating time is 60-100 s, the tin spraying speed is 3-5 mm/s, the tin spraying temperature is 260-280 ℃, the tin spraying height is 3-5 mm, and the nozzle adopts a nozzle with the inner diameter of 4-8 mm.
The step 4) specifically comprises the following steps: after Jin Tangxi is partially removed from pins of the inter-board connector, part of pins are bridged by soldering tin for reworking; the pin without tin feeding is assembled and protected through a pin local protection tool, a temperature control electric soldering iron with an ultrafine soldering iron head is used, the temperature of the electric soldering iron is 280-320 ℃, a tin sucking belt is added, the sucking time is 2-3S each time, and the residual solder on the pin is removed.
The step 5) specifically comprises the following steps: removing the Jin Tangxi connector, taking down the protection tool, uniformly spraying pins by using a cleaning agent, then placing the pins into a container filled with alcohol, immersing the connector in the liquid for 5min, cleaning the pins by using an anti-static brush, and removing residues and soldering flux residues; and after the cleaning is finished, taking out the connector, standing for 10min, and airing.
The above description is only illustrative of the preferred embodiments of the present invention and is not intended to limit the scope of the present invention, and any alterations and modifications made by those skilled in the art based on the above disclosure shall fall within the scope of the appended claims.
Claims (10)
1. A process for localized removal of Jin Tang tin from pins of an inter-board connector for localized removal Jin Tangxi of a solderable area of a pin of an inter-board connector, comprising the steps of:
step 1) manufacturing according to the actual size of the inter-board connector, and customizing a local tin coating tool for selective wave soldering of pins of the inter-board connector;
step 2) programming the selective wave soldering equipment program;
step 3) selective wave soldering Jin Tangxi operation;
step 4) removing Jin Tang tin and then carrying out local reworking operation;
step 5) connector cleaning operation after Jin Tang tin removal.
2. The method for removing Jin Tang tin from pins of an inter-board connector according to claim 1, wherein the local tin lining tool in the step 1) is composed of a pin end local protection tool, a pin root protection tool and a selective welding support carrier;
the local protection tool for the pin end is a tool seat (1); the tool holder (1) comprises: the protection cavity plate (11), the connecting lug plate (12) and the limit boss (13); the left end and the right end of the protection cavity plate (11) are symmetrically and integrally formed and connected with the connecting lug plate (12), a plurality of first inserting holes (14) are formed in the front side wall of the protection cavity plate (11), the left end and the right end of the front side wall of the protection cavity plate (11) are symmetrically provided with the limiting boss (13), the limiting boss (13) is provided with a first limiting hole (15), and the first limiting hole (15) extends to penetrate through the protection cavity plate (11);
the pin root protection tool is characterized in that the pin root protection tool is a steel sheet plate (2), the steel sheet plate (2) is abutted against the front side wall of the limiting boss (13), the steel sheet plate (2) further comprises a plurality of second inserting holes (21) and second limiting holes (22) which are formed in the steel sheet plate, the second inserting holes (21) correspond to the first inserting holes (14) one by one, and the second limiting holes (22) correspond to the first limiting holes (15) one by one;
the selective welding support carrier (3) comprises: a carrier plate (31), a U-shaped groove (32) and a mounting lug plate (33); the U-shaped groove (32) is formed in the front side wall of the carrier plate (31), the mounting lug plates (33) are symmetrically arranged at the left end and the right end of the bottom of the groove cavity of the U-shaped groove (32), and mounting screw holes are formed in the mounting lug plates (33), so that the connecting lug plates (12) and the mounting lug plates (33) can be detachably mounted through locking screws.
3. A process for removing Jin Tang tin from board-to-board connector pins according to claim 2, wherein the first and second plugging holes (14, 21) are formed at positions corresponding to the layout positions of the pins (51) of the board-to-board connector (5) one by one so that the pins (51) of the board-to-board connector (5) can be plugged into each other.
4. A process for removing Jin Tang tin from pins of an inter-board connector according to claim 2, wherein the first limiting hole (15) and the second limiting hole (22) are formed at positions corresponding to the layout positions of the plug posts (52) of the inter-board connector (5) one by one, so that the plug posts (52) of the inter-board connector (5) can be plugged into the socket holes.
5. The method for removing Jin Tang tin from pins of an inter-board connector according to claim 2, further comprising fixing holes (16), wherein the fixing holes (16) are symmetrically formed at left and right ends of the top of the protection cavity plate (11), the fixing holes (16) extend downwards to penetrate through the first limiting holes (15), and fixing screws are screwed and locked on the fixing holes (16).
6. The method of claim 1, wherein the step 2) comprises:
setting each axial movement position of the spray head: according to the dimension reference pictures of the actual tool and the connectors between the plates, and through a motor in the axial direction of the selective wave soldering equipment X, Y, Z, the control moving module accurately controls each axial moving position of the spray head;
setting technological parameters of curing equipment; the selective wave soldering equipment comprises a soldering flux spraying area, a preheating area and a jet tin pot area, and can accurately set the running path, the temperature, the speed, the tin spraying time and the tin spraying height parameters of the spray head, so as to meet the quantitative curing process parameters of the partial area removal Jin Tangxi; the soldering flux spraying module, the preheating module and the tin spraying module are smoothly operated at the Jin Tangxi part of the connector pin to be removed.
7. The method of claim 6, wherein the step 3) comprises: the selective wave soldering equipment is started up and operated, a Jin Tangxi removing program with the process parameter setting completed is called, a tool loaded with devices is placed on a selective wave soldering track, a series of processes of soldering flux spraying, preheating and tin spraying are completed, the quantity of sprayed flowing tin liquid is accurately controlled in a local area of a pin, and then a gold and tin enamel removing process method is achieved.
8. The process for removing Jin Tang tin from pins of a connector between boards according to claim 7, wherein the spraying amount of the soldering flux is 0.1-0.2 ml/s, the preheating temperature is 100-150 ℃, the preheating time is 60-100 s, the tin spraying speed is 3-5 mm/s, the tin spraying temperature is 260-280 ℃, the tin spraying height is 3-5 mm, and the nozzle is a nozzle with the inner diameter of 4-8 mm.
9. The method of claim 1, wherein the step 4) comprises: after Jin Tangxi is partially removed from pins of the inter-board connector, part of pins are bridged by soldering tin for reworking; the pin without tin feeding is assembled and protected through a pin local protection tool, a temperature control electric soldering iron with an ultrafine soldering iron head is used, the temperature of the electric soldering iron is 280-320 ℃, a tin sucking belt is added, the sucking time is 2-3S each time, and the residual solder on the pin is removed.
10. A process for localized removal of Jin Tang tin from board connector pins as defined in claim 1, wherein said step 5) comprises: removing the Jin Tangxi connector, taking down the protection tool, uniformly spraying pins by using a cleaning agent, then placing the pins into a container filled with alcohol, immersing the connector in the liquid for 5min, cleaning the pins by using an anti-static brush, and removing residues and soldering flux residues; and after the cleaning is finished, taking out the connector, standing for 10min, and airing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311187930.8A CN117139762A (en) | 2023-09-15 | 2023-09-15 | Process method suitable for removing Jin Tang tin locally on pins of inter-board connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311187930.8A CN117139762A (en) | 2023-09-15 | 2023-09-15 | Process method suitable for removing Jin Tang tin locally on pins of inter-board connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117139762A true CN117139762A (en) | 2023-12-01 |
Family
ID=88911938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311187930.8A Pending CN117139762A (en) | 2023-09-15 | 2023-09-15 | Process method suitable for removing Jin Tang tin locally on pins of inter-board connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117139762A (en) |
-
2023
- 2023-09-15 CN CN202311187930.8A patent/CN117139762A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2208279C2 (en) | Connector distinguished by high-density disposition of components and its manufacturing process | |
| CN100493295C (en) | Method of mounting printed circuit board by flat package IC and its soldering method and air conditioner | |
| CN112840748A (en) | Circuit board structure, electronic product, and preparation method and maintenance method of circuit board structure | |
| US11731207B2 (en) | Systems and methods for providing an interface on a printed circuit board using pin solder enhancement | |
| CN113613407B (en) | Automatic pasting and welding method for CPGA device | |
| CN117139762A (en) | Process method suitable for removing Jin Tang tin locally on pins of inter-board connector | |
| DE102010005249A1 (en) | Method for dismantling an electronic component | |
| JPH07307563A (en) | Soldering device | |
| US7159758B1 (en) | Circuit board processing techniques using solder fusing | |
| CN112820652B (en) | Method for removing Jin Tang tin from L-shaped welding terminal of QFN packaging device | |
| CN111541123B (en) | Connector bracket and connector tin-coating and gold-removing device | |
| US6353191B1 (en) | Column grid array connector | |
| JPH09307219A (en) | Soldering treatment | |
| CN114589367A (en) | Automatic batch tin coating tool system and method for welding pin type aviation plug connector | |
| CN111836474B (en) | Electronic device and method for manufacturing the same, and printed board and method for manufacturing the same | |
| KR100709613B1 (en) | Method for making electronic modules with ball connector or with integrated preforms capable of being soldered on a printed circuit and implementing device | |
| CN100475002C (en) | Printed circuit board, method of soldering electronic components, and air conditioning apparatus with printed circuit board | |
| KR100657217B1 (en) | Method for partially soldering of printed circuit board | |
| CN109195356A (en) | A kind of Through-hole reflow used for printed circuit board connects technique | |
| JPH07170061A (en) | Mounting of electric component | |
| CN110351962A (en) | A kind of secondary via hole reflow method | |
| KR100399967B1 (en) | Repairing method of rambus inline memory module using a dotting nozzle device | |
| CN113904191B (en) | Tin lining tool and tin lining method for connector between gold-plated pin plates | |
| US6039241A (en) | Mechanism for removal of surface mount connectors using heat conduction through pins | |
| EP2451257B1 (en) | Circuit board assembly, connector, and soldering method therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |