CN117133853A - 360 luminous flexible normal dress LED filament of degree - Google Patents
360 luminous flexible normal dress LED filament of degree Download PDFInfo
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- CN117133853A CN117133853A CN202311409848.5A CN202311409848A CN117133853A CN 117133853 A CN117133853 A CN 117133853A CN 202311409848 A CN202311409848 A CN 202311409848A CN 117133853 A CN117133853 A CN 117133853A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
Abstract
The invention relates to the technical field of flexible lamp strips, and provides a 360-degree luminous flexible forward-mounted LED filament which comprises a transparent flexible insulating plate, a metal circuit layer and a plurality of forward-mounted LED chips, wherein the metal circuit layer is arranged on the transparent flexible insulating plate, the plurality of forward-mounted LED chips are arranged on the metal circuit layer at intervals, the metal circuit layer is provided with a plurality of die bonding areas and a plurality of bending areas, at least one forward-mounted LED chip is arranged in each die bonding area, at least one bending area exists between two adjacent die bonding areas, and the first width of the die bonding areas is larger than the second width of the bending areas along the width direction of the 360-degree luminous flexible forward-mounted LED filament. Therefore, on the basis of using the forward-mounted LED chip as a light source, through the arrangement of the die bonding area and the bending area, the 360-degree luminous flexible forward-mounted LED filament can be arbitrarily bent, and the chip is not damaged, so that the filament is invalid.
Description
Technical Field
The invention relates to the technical field of flexible lamp strips, in particular to a 360-degree luminous flexible forward-mounted LED filament.
Background
The LED flexible filament is formed by assembling an LED on an FPC (flexible circuit board), has the advantages of slender, soft and plastic, 360-degree luminescence, energy conservation, environmental protection and the like, and can be bent and wound at will. In order to ensure the connection reliability of the LED lamp bead chip in a flexible state, the conventional flexible filament generally adopts a flip LED chip technology. However, using flip-chip LED chips is not very ideal for the overall light extraction of the flexible strip, and the light extraction of flip-chip LED chips is far less than that of a front-mounted LED chip.
At present, the forward-installed LED lamp strip cannot be bent at will, and the reason is as follows: the forward-mounted LED chip generally adopts an ultrasonic welding technology, ultrasonic waves transmit ultrasonic energy to a welding region through a ceramic nozzle, and local high temperature can be generated due to large acoustic resistance at the interface of the welding region. Under the combined action of pressure, heat and ultrasonic energy, the gold wire forms good ohmic contact between the chip electrode and the outer lead bonding area, and the connection of leads is completed. The diameter of the gold wire is generally about 1mil (0.0254 mm), and in order to improve the welding strength between the gold wire and the electrode, a gold ball is usually fired at the tail end of the gold wire by using an arc firing method. The diameter of the gold ball is generally about 3 times of the wire diameter (60-75 um), however, the thickness of the FPC is only 0.01mm, the thickness of the copper foil is about 0.03-0.05 mm, that is to say, the copper foil circuit is very precise and fine, so that the wire bonding process is difficult to complete on the flexible FPC substrate, and the conventional forward-mounted LED lamp strip cannot be bent at will.
Therefore, how to achieve the effect of arbitrary bending of the filament on the basis of using the forward-mounted LED has become one of the technical difficulties to be solved by those skilled in the art.
It should be noted that the information disclosed in this background section is only for the purpose of increasing the understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
Disclosure of Invention
The invention provides a novel 360-degree luminous flexible forward-mounted LED filament, which aims to solve the problem that the existing filament using a forward-mounted LED chip cannot be bent at will, so that the 360-degree luminous flexible forward-mounted LED filament can be bent at will and cannot be damaged.
The invention provides a 360-degree luminous flexible forward-mounted LED filament which comprises a transparent flexible insulating plate, a metal circuit layer and a plurality of forward-mounted LED chips. The metal circuit layer is arranged on the flexible transparent flexible insulating plate; the plurality of forward LED chips are arranged on the metal circuit layer at intervals; the metal circuit layer is provided with a plurality of die bonding areas and a plurality of bending areas, at least one forward-mounted LED chip is arranged in each die bonding area, the bending areas are arranged among the die bonding areas at intervals, the width direction of the flexible forward-mounted LED filament capable of emitting light at 360 degrees is along, and the first width of the die bonding areas is larger than the second width of the bending areas.
Further, the front-mounted LED chip is connected to the metal circuit layer through bonding wires. When the transparent flexible insulating plate is overlooked from the upper side of the 360-degree luminous flexible forward-mounted LED filament, an included angle is formed between the straight line where the length direction of the bonding wire is located and the straight line where the length direction of the 360-degree luminous flexible forward-mounted LED filament is located, and the included angle range is 10-90 degrees. The bonding wire may be a metal material.
Furthermore, the 360-degree luminous flexible forward LED filament further comprises an insulating protection layer, the bonding wire is covered by the insulating protection layer, and the hardness of the insulating protection layer is more than or equal to 40HD.
Further, the 360-degree luminous flexible forward-mounted LED filament further comprises a packaging layer, and the packaging layer covers the transparent flexible insulating plate, the metal circuit layer, the forward-mounted LED chip and the insulating protective layer.
Further, the thickness of the metal circuit layer is more than or equal to 0.1mm. The surface layer of the metal circuit layer is a silver layer or a gold layer, when the surface layer of the metal circuit layer is the silver layer, the thickness of the silver layer is more than or equal to 1 micro inch, and when the surface layer of the metal circuit layer is the gold layer, the thickness of the gold layer is more than or equal to 10 micro inches
According to the 360-degree luminous flexible forward-mounted LED filament, the forward-mounted LED chip is borne by adding the metal circuit layer with a certain thickness, the die bonding area for setting the forward-mounted LED chip and the bending area for bending and releasing force are distinguished in the metal circuit layer, and the width of the metal circuit layer in the die bonding area is larger than that of the metal circuit layer in the bending area, so that the bending area is used as a bending and releasing force place when the filament is bent, further, the 360-degree luminous flexible forward-mounted LED filament can be bent at will, and a lamp belt is not damaged.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and other advantages of the invention may be realized and obtained by means of the instrumentalities particularly pointed out in the specification and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief description will be given below of the drawings required for the embodiments or the prior art descriptions, and it is obvious that some of the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a 360-degree luminous flexible front-mounted LED filament according to a first embodiment of the present invention;
FIG. 2 is an enlarged schematic view of a portion of the area A of FIG. 1;
fig. 3 is a schematic structural diagram of a 360-degree luminous flexible front-mounted LED filament according to a second embodiment of the present invention;
FIG. 4 is an enlarged partial schematic view of area A of FIG. 3;
FIG. 5 is a schematic view of the structure of the 360 degree light emitting flexible front mounted LED filament of FIG. 3 with an insulating protective layer;
FIG. 6 is a schematic view of the 360 degree light emitting flexible front-mounted LED filament of FIG. 5 with an encapsulation layer;
fig. 7 is a schematic structural diagram of a 360-degree luminous flexible front-mounted LED filament according to a third embodiment of the present invention;
fig. 8 is a schematic structural diagram of a 360-degree light-emitting flexible front-mounted LED filament according to a fourth embodiment of the present invention;
fig. 9 is a schematic structural diagram of a 360-degree luminous flexible front-mounted LED filament according to a fifth embodiment of the present invention;
fig. 10 is a schematic structural diagram of a 360-degree luminous flexible front-mounted LED filament according to a sixth embodiment of the present invention;
fig. 11 is a schematic structural diagram of a 360-degree light-emitting flexible front-mounted LED filament according to a seventh embodiment of the present invention.
Reference numerals:
10-a transparent flexible insulating plate; 12-a metal circuit layer; 121-a die bonding area; 122-inflection region; 14-positively mounting an LED chip; 16-positive terminal; 18-a negative terminal; 20-bonding wires; 22-die bonding gap; 24-an insulating protective layer; 26-an encapsulation layer; beta-angle; w1-a first width; w2-a second width; w3-a third width; l1-a first length; l2-a second length; x-length direction; y-width direction.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention; the technical features designed in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other; all other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center," "lateral," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or components referred to must have a specific orientation or be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more. In addition, the term "comprising" and any variations thereof are meant to be "at least inclusive".
In the description of the present invention, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected via an intermediate medium, or in communication between two components. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of a 360-degree light-emitting flexible front-mounted LED filament according to a first embodiment of the present invention, and fig. 2 is a partially enlarged schematic diagram of a region a in fig. 1. To achieve at least one of the advantages and other advantages, a first embodiment of the present invention provides a 360 degree light emitting flexible front-mounted LED filament. As shown in the figure, the 360-degree light emitting flexible front-mounted LED filament includes a transparent flexible insulating plate 10, a metal wiring layer 12, and a plurality of front-mounted LED chips 14.
The transparent flexible insulating sheet 10 mainly plays a role of supporting the whole. The transparent flexible insulating plate 10 may be made of FPC (polyimide or polyester), BT (resin plate), PE (polyethylene), or mica, and the transparent flexible insulating plate 10 has a high temperature resistance, for example, a temperature of 1580 ℃. However, the present invention is not limited thereto, and other suitable materials may be selected for the transparent flexible insulating board 10 according to practical requirements.
The metal wiring layer 12 is disposed on the transparent flexible insulating plate 10. The metal wiring layer 12 has a certain thickness, and the thickness of the metal wiring layer 12 may be 0.1mm or more. The surface of the metal circuit layer 12 may be processed by electroplating or deposition to form a wire-bondable metal material, i.e., the surface layer of the metal circuit layer 12 is a silver layer or a gold layer, so as to facilitate the subsequent mounting of the front-mounted LED chip 14. When the surface layer of the metal circuit layer 12 is a silver layer, the thickness of the silver layer is more than or equal to 1 micro inch; when the surface layer of the metal circuit layer 12 is a gold layer, the thickness of the gold layer is not less than 10 microinches.
The metal circuit layer 12 is further provided with a positive terminal 16 and a negative terminal 18 for conducting electricity. In some embodiments, the metal circuit layer 12 may be directly stamped into the desired serial-parallel support shape by stamping or the like.
A plurality of front-mounted LED chips 14 are disposed on the metal wiring layer 12 at intervals. The front-mounted LED chip 14 may be fixed in the die bonding region 121 of the metal wiring layer 12 by die bonding adhesive. For example: the double-electrode LED chip can be made of silica gel, and the single-electrode LED chip can be made of silver gel or the like. In some embodiments, the light-emitting modes such as single-color light-emitting, double-color light-emitting, RGB three-color light-emitting, RGBW light-emitting, and RGBW light-emitting can be formed by adjusting the color, the placement position relationship, and the like of the front-mounted LED chip 14 according to actual needs.
The metal circuit layer 12 has a plurality of die attach regions 121 and a plurality of inflection regions 122. The die bonding areas 121 are used for disposing the front-mounted LED chips 14, and at least one front-mounted LED chip 14 is disposed in each die bonding area 121. The bending region 122 is a stress releasing region formed by bending the bending region 122 when bending the 360-degree light-emitting flexible forward-mounted LED filament. The bending regions 122 are disposed between the die bonding regions 121 at intervals, for example, 1 bending region 122 may be disposed between two adjacent die bonding regions 121, or 1 bending region 122 may be disposed in 3 or more die bonding regions 121, which may play a role in bending and releasing force. The first width W1 of the die bonding region 121 is greater than the second width W2 of the bending region 122 along the width direction Y of the 360-degree light-emitting flexible forward-mounted LED filament. Specifically, when an external force is applied to the 360-degree light-emitting flexible forward-mounted LED filament to bend, the die bonding region 121 on the metal circuit layer 12 is taken as a whole, and the width of the metal circuit layer 12 in the die bonding region 121 is larger than the width of the metal circuit layer 12 in the bending region 122, so that the bending region 122 bends the filament, and the forward-mounted LED chip 14 in the die bonding region 121 is not damaged.
Further, as seen in the length direction X of the 360-degree light-emitting flexible front-mounted LED filament, the first length L1 of the die bonding region 22 is less than or equal to the second length L2 of the bending region 122. So that when the lamp strip is bent, the main bending part is bent by the bending region 122, and the main force release point is born by the bending region 122, so that the chip and the lamp filament are not damaged. In the figure, L2 shown in the image is smaller than L1 due to the size of the drawing, but in actual use, the bending effect of the second length L2 being equal to or greater than the first length L1 (the bending region can be made larger during bending) is better, but the present invention is not limited thereto, and the second length L2 may be smaller than the first length L1.
Further, the front-mounted LED chip 14 is electrically connected to the metal wiring layer 12 by bonding wires 20. The bonding wire 20 is made of metal, which may be gold wire, copper wire, aluminum wire or alloy wire.
The transparent flexible insulating plate 10 and the metal circuit layer 12 are combined and matched, the transparent flexible insulating plate 10 mainly plays a role in supporting, fine and complex circuits do not need to be printed, the process requirements are reduced, and a flexible insulating material substrate which meets the process requirements and is low in cost can be selected. Because of the conductivity of the metal, the metal circuit layer 12 itself can be used as a circuit for electrical conduction, facilitating circuit design.
By arranging the metal circuit layer 12 below the forward-mounted LED chip 14, the overall heat dissipation effect can be further improved by means of the metal heat dissipation characteristic, the bottleneck limit that only low current can be conducted is broken through, and the applicability in the fields of general illumination and the like is higher.
In the present embodiment, the die bonding area 121 is provided with 2 front-mounted LED chips 14, and the 2 front-mounted LED chips 14 are connected in parallel. However, the present disclosure is not limited thereto, in other embodiments, only 1 front-mounted LED chip 14, or 4 front-mounted LED chips 14, or more front-mounted LED chips 14 may be disposed in each die bonding region 121, and the connection manner may be serial, parallel or serial-parallel, which may be specifically adapted according to practical requirements.
In some embodiments, when the number of the front-mounted LED chips 14 disposed in the die bonding region 121 is at least 2, the die bonding region 121 has die bonding gaps 22, and the die bonding gaps 22 can be openings, and have the effect of light transmission, so as to enhance 360-degree light emission. The third width W3 of the die bonding gap 22 is smaller than the first width W1 of the die bonding region 121 as viewed in the width direction Y of the 360-degree light-emitting flexible forward-mounted LED filament. When the lamp strip is bent, the main bending portion is bent by the bending region 122, and then, when part of the lamp strip is bent to the die bonding region 121 under extreme conditions, the main force release point is borne by the die bonding gap 22, that is, the bending of the die bonding region 121 is ensured by bending the die bonding gap 22, and the LED chip 14 is not damaged. In addition, by forming the hollowed-out area (such as the solid crystal gap 22 and the bending area 122) on the metal circuit layer 12, the whole has larger light transmittance, and the light emitting efficiency and the light emitting uniformity of the lamp strip can be improved.
Referring to fig. 3 and 4, fig. 3 is a schematic structural diagram of a 360-degree light-emitting flexible front-mounted LED filament according to a second embodiment of the present invention, and fig. 4 is a partially enlarged schematic diagram of a region a in fig. 3.
From the top of the 360-degree luminous flexible forward-mounted LED filament toward the transparent flexible insulating plate 10, an included angle beta is formed between the straight line of the bonding wire 20 in the length direction and the straight line of the flexible forward-mounted LED filament in the length direction X, the range of the included angle beta is 10-90 degrees, and preferably, the range of the included angle beta is 30-90 degrees and 45-90 degrees. Therefore, when the flexible forward-mounted LED filament emitting light in 360 degrees is bent in the length direction X, the bonding wire 20 is arranged in the direction more perpendicular to the length direction X of the flexible forward-mounted LED filament, so that the bending damage to the bonding wire 20 can be effectively avoided, and the quality of the lamp strip is guaranteed.
Referring to fig. 5 and 6, fig. 5 is a schematic structural diagram of the 360-degree light-emitting flexible front-mounted LED filament of fig. 3 provided with an insulating protective layer 24, and fig. 6 is a schematic structural diagram of the 360-degree light-emitting flexible front-mounted LED filament of fig. 5 provided with an encapsulation layer 26. The 360 degree light emitting flexible front-mounted LED filament further includes an insulating protective layer 24 and an encapsulation layer 26.
The insulating protective layer 24 encapsulates the bond wires 20. The insulating protective layer 24 can perform insulating protection function on the bonding wire 20, and breakage of the bonding wire 20 when being bent is avoided. The insulating protective layer 24 can also wrap the electrode area of the front-mounted LED chip 14 and the area of the line gap, etc., further avoiding breakage of the lamp strip during bending. The material of the insulating protective layer 24 may include at least one of epoxy resin, silicone, polyphthalamide, or PCT resin. The hardness of the insulating protection layer 24 is more than or equal to 40HD, the hardness is calculated as Shore hardness, the protection effect on the bonding wire 20 below the insulating protection layer and the forward-mounted LED chip 14 is better, and damage to the bonding wire 20 and the forward-mounted LED chip 14 caused by bending the filament is further avoided. The insulating protection layer 24 may be formed by spraying a liquid to cover the bonding wire 20 and the surface of the LED chip 14, and then forming a solid structure by high-temperature thermosetting, thereby obtaining the insulating protection layer 24.
The encapsulation layer 26 covers the transparent flexible insulating sheet 10, the metal wiring layer 12, the front-mounted LED chip 14, and the insulating protective layer 24. The encapsulation layer 26 mainly plays a role of encapsulation protection. The encapsulation layer 26 may be made of transparent material so as to transmit the light; encapsulation layer 26 may also be doped with a phosphor to convert light to a desired color (e.g., white); the encapsulation layer 26 may also be doped with a diffusing agent to facilitate transmission of the atomized milky light. In some embodiments, the encapsulation layer 26 also covers the back of the transparent flexible insulating sheet 10, facilitating 360 degree full angle light emission.
In some embodiments, the volume of the metal line layer 12 in the die attach region 121 is greater than the volume of the metal line layer 12 in the flex region 122. Since the die bonding region 121 on the metal circuit layer 12 is as a whole, and the volume of the metal circuit layer 12 in the die bonding region 121 is larger than the volume of the metal circuit layer 12 in the bending region 122, the bending region 122 bends the LED chip 14 in the die bonding region 121.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a 360-degree light-emitting flexible front-mounted LED filament according to a third embodiment of the present invention. Compared with the 360-degree light-emitting flexible front-mounted LED filament shown in fig. 3, the 360-degree light-emitting flexible front-mounted LED filament of the present embodiment is mainly different in that: the number of the front-mounted LED chips 14 arranged in each die bonding area 121 is 6, every two front-mounted LED chips 14 are connected in series, and each group of LED chip groups connected in series are connected in parallel.
It should be noted that the configuration of the metal circuit layer 12 and the arrangement of the die bonding region 121 in the present invention are not limited to the above embodiments, and for example, in other embodiments, the configuration of the metal circuit layer 12 and the arrangement of the die bonding region 121 shown in fig. 8 to 11 may be adopted. In addition, the shape and size of the metal circuit layer 12 are not limited, and the bending region 122 may have various shapes such as a column, a square, a polygon, etc. According to the structure of the invention, the module units are manufactured according to certain rules (such as serial-parallel connection mode, chip number, package filament number, filament length and the like), and then a plurality of module units are manufactured into other products (such as bulb, T tube, lamp strip, panel lamp and the like) according to corresponding circuit connection, which are all within the protection scope of the patent. Any shape filament designed by adopting the electric conduction, heat conduction, shaping and solid welding principles of the 360-degree luminous flexible forward-mounted LED filament disclosed by the embodiment of the invention is within the protection scope of the patent.
According to the 360-degree luminous flexible forward-mounted LED filament provided by the embodiment of the invention, the forward-mounted LED chip 14 is borne by adding the metal circuit layer 12 with a certain thickness, the die bonding area 121 for setting the forward-mounted LED chip 14 and the bending area 122 for bending and releasing force are distinguished in the metal circuit layer 12, the volume of the metal circuit layer 12 in the die bonding area 121 is larger than that of the metal circuit layer 12 in the bending area 122, and therefore, the 360-degree luminous flexible forward-mounted LED filament can be bent at will without damaging a lamp band.
In addition, it should be understood by those skilled in the art that although many problems exist in the prior art, each embodiment or technical solution of the present invention may be modified in only one or several respects, without having to solve all technical problems listed in the prior art or the background art at the same time. Those skilled in the art will understand that nothing in one claim should be taken as a limitation on that claim.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (8)
1. 360 luminous flexible normal dress LED filament of degree, its characterized in that: the 360-degree luminous flexible forward-mounted LED filament comprises:
a transparent flexible insulating plate;
the metal circuit layer is arranged on the flexible transparent flexible insulating plate;
the plurality of forward LED chips are arranged on the metal circuit layer at intervals;
the metal circuit layer is provided with a plurality of die bonding areas and a plurality of bending areas, at least one forward-mounted LED chip is arranged in each die bonding area, the bending areas are arranged among the die bonding areas at intervals, the width direction of the 360-degree luminous flexible forward-mounted LED filament is along, and the first width of the die bonding areas is larger than the second width of the bending areas.
2. A 360 degree light emitting flexible front-mounted LED filament as claimed in claim 1 wherein: the front-mounted LED chip is connected to the metal circuit layer through a bonding wire.
3. A 360 degree light emitting flexible front-mounted LED filament as claimed in claim 2 wherein: seen from the upper side of the 360-degree luminous flexible forward-mounted LED filament towards the transparent flexible insulating plate in a overlooking mode, an included angle is formed between a straight line where the length direction of the bonding wire is located and a straight line where the length direction of the 360-degree luminous flexible forward-mounted LED filament is located, and the included angle ranges from 10 degrees to 90 degrees.
4. A 360 degree light emitting flexible front-mounted LED filament as claimed in claim 2 wherein: the bonding wire is made of metal.
5. A 360 degree light emitting flexible front-mounted LED filament as claimed in claim 2 wherein: the 360-degree luminous flexible forward-mounted LED filament further comprises an insulating protective layer, the bonding wire is coated by the insulating protective layer, and the hardness of the insulating protective layer is more than or equal to 40HD.
6. A 360 degree light emitting flexible front-mounted LED filament as claimed in claim 5, wherein: the 360-degree luminous flexible forward-mounted LED filament further comprises an encapsulation layer, wherein the encapsulation layer covers the transparent flexible insulating plate, the metal circuit layer, the forward-mounted LED chip and the insulating protective layer.
7. A 360 degree light emitting flexible front-mounted LED filament as claimed in claim 1 wherein: the thickness of the metal circuit layer is more than or equal to 0.1mm.
8. A 360 degree light emitting flexible front-mounted LED filament as claimed in claim 1 wherein: the surface layer of the metal circuit layer is a silver layer or a gold layer, when the surface layer of the metal circuit layer is the silver layer, the thickness of the silver layer is more than or equal to 1 micro-inch, and when the surface layer of the metal circuit layer is the gold layer, the thickness of the gold layer is more than or equal to 10 micro-inches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311409848.5A CN117133853B (en) | 2023-10-27 | 360 Luminous flexible normal dress LED filament of degree |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311409848.5A CN117133853B (en) | 2023-10-27 | 360 Luminous flexible normal dress LED filament of degree |
Publications (2)
| Publication Number | Publication Date |
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| CN117133853A true CN117133853A (en) | 2023-11-28 |
| CN117133853B CN117133853B (en) | 2024-05-10 |
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