CN209688578U - Color temperature-tunable flexible LED lamp strand and the filament lamp for using the filament item - Google Patents
Color temperature-tunable flexible LED lamp strand and the filament lamp for using the filament item Download PDFInfo
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- CN209688578U CN209688578U CN201920468475.1U CN201920468475U CN209688578U CN 209688578 U CN209688578 U CN 209688578U CN 201920468475 U CN201920468475 U CN 201920468475U CN 209688578 U CN209688578 U CN 209688578U
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Abstract
The utility model discloses a kind of color temperature-tunable flexible LED lamp strand and use the filament lamp of the filament item, the flexible LED lamp strand includes flexible circuit board, with a column and spaced arrangement is set to multiple high pressure packed LED chips in flexible circuit board, with a column and spaced arrangement is set to multiple low pressure packed LED chips in flexible circuit board, electrode on the both ends of flexible circuit board, high pressure packed LED chip is identical with the quantity of low pressure packed LED chip, between high pressure packed LED chip and low pressure packed LED chip it is concatenated after first in parallel in a manner of or be electrically connected in mode in parallel after first connecting and integrally constituted light source, one end of light source is connect with one of electrode, the other end is connect with another electrode, high color is coated on region where all high pressure packed LED chips Warm fluorescent glue is coated with low color temperature fluorescent glue on the region where all low pressure packed LED chips;Advantage is that only there are two electrodes, and solder joint is less, and electrodeless toning may be implemented, and toning range is big.
Description
Technical field
The utility model relates to a kind of LED lamps, more particularly, to a kind of color temperature-tunable flexible LED lamp strand and use
The filament lamp of the filament item.
Background technique
LED filament lamp is because of its structure and shape and similar and very popular, the traditional white heat of traditional incandescent lamp
It while lamp can dim or mixes colours, but existing LED filament lamp can dim, and but be difficult to mix colours, therefore in certain journey
The use of LED filament lamp is limited on degree.
In order to solve the problems, such as the color-temperature regulating of LED filament lamp, occurs the scheme of two kinds of color-temperature regulatings on the market: the first scheme
It is using the LED chip for encapsulating two groups of different numbers on the same substrate and to coat the fluorescent glue with different-colour, generates two
The light of group different-colour, the forward voltage drop difference and arranged in parallel of two groups of LED chips, as shown in Figure 1a, one group uses the first LED
Chip 91 and adjusting component 92, another group uses the second LED chip 93, and the quantity of the first LED chip 91 is less than the second LED core
The quantity of piece 93 makes between two groups that there are voltage differences, and when input current is smaller, the first LED chip 91 is lighted and the 2nd LED
Chip 93 does not work, and when input current is larger, the first LED chip 91 and the second LED chip 93 are all lit, due to two groups of LED
The colour temperature of chip is different, to realize toning temperature function;Second scheme is identical using encapsulating two groups on the same substrate
The LED chip of quantity simultaneously coats the fluorescent glue with different-colour, as shown in Figure 1 b, two groups of LED chips 94,95 arranged in parallel and
Every group of LED chip has independent two electrodes 96,97, and two groups of LED chips 94,95 share 4 electrodes, and each electrode connects respectively
It is connected in driving power, then carries out color-temperature regulating by adjusting the size of current of every group of LED chip.The side of above two color-temperature regulating
Case has the following problems: the first scheme, which needs to increase, adjusts component, and range of mixing colours is relatively narrow;Second scheme needs 4
Electrode, each electrode and driving power are welded, and not only driving power is complicated, but also solder joint is more be easy to cause rosin joint.
Summary of the invention
The technical problem to be solved by the utility model is to provide a kind of color temperature-tunable flexible LED lamp strands and use should
The filament lamp of filament item, only there are two electrodes for the flexible LED lamp strand, and solder joint is less, and electrodeless toning may be implemented, model of mixing colours
It encloses big.
Technical solution adopted by the utility model to solve the above technical problems is as follows: a kind of color temperature-tunable flexible LED lamp
Strand, it is characterised in that: including flexible circuit board, with a column and spaced arrangement is set in the flexible circuit board
Multiple high pressure packed LED chips, with a column and spaced arrangement is being set to multiple low pressure in the flexible circuit board just
The electrode for filling LED chip, being set on the both ends of the flexible circuit board, the column high pressure packed LED chip and one
The column low pressure packed LED chip is set side by side, the high pressure packed LED chip and the low pressure packed LED chip
Quantity it is identical, between the high pressure packed LED chip and the low pressure packed LED chip with first it is in parallel after concatenated side
Formula electrical connection is integral to be constituted light source or is electrically connected in mode in parallel after first connecting and integrally constituted light source, the light source
One end is connect with the electrode described in one of them, and the other end of the light source is connect with the electrode described in another, Suo Yousuo
High color temperature fluorescent glue, all low pressure packed LED chip institutes are coated on region where the high pressure packed LED chip stated
Region on be coated with low color temperature fluorescent glue.
The flexible circuit board is by flexible metal base plate and the print that is printed on the front of the flexible metal base plate
Brush route composition, the high pressure packed LED chip and the low pressure packed LED chip are installed on the printed wire
On.
Low pressure packed LED chip parallel connection described in each high pressure packed LED chip is one corresponding with position connects
It connects and constitutes a LED chip group, all LED chip groups, which are serially connected in, is integrally formed the light source.In the light source
High pressure packed LED chip between low pressure packed LED chip after first in parallel it is concatenated in a manner of be electrically connected it is integral.
The printed wire includes multistage parallel circuit, the number of segment of the parallel circuit and the high pressure formal dress
The number of LED chip is identical, and parallel circuit described in every section is made of upper parallel circuit and lower parallel circuit, described in the last period
The lower parallel circuit in parallel circuit passes through company with the upper parallel circuit in parallel circuit described in latter section
Link connects, and the upper parallel circuit in parallel circuit described in first segment is connect with the electrode described in one of them,
The lower parallel circuit in parallel circuit described in final stage is connect with the electrode described in another, is put down described in every section
On high pressure packed LED chip described in installing one on the upper parallel circuit in row line and the lower parallel circuit
High pressure forward LED core described in installation one on low pressure packed LED chip described in installation one or the lower parallel circuit
Low pressure packed LED chip described in installing one on piece and the upper parallel circuit, is installed on parallel circuit described in every section
The high pressure packed LED chip and the same polar foot of low pressure packed LED chip and described in this section
The upper parallel circuit connection, another same polar foot in parallel circuit is and in parallel circuit described in this section
The lower parallel circuit connection.The printed wire of this structure, so that corresponding high pressure packed LED chip and low pressure formal dress
LED chip is connected in parallel into a LED chip group, and all LED chip groups are connected in series again.
It is the packed LED chip of 5.7V~6.4V, the low pressure formal dress that the high pressure packed LED chip, which selects voltage,
LED chip selects voltage for the packed LED chip of 3.0V~3.4V, high pressure forward LED in parallel in LED chip group each in this way
There are certain voltage differences between chip and low pressure packed LED chip.
All high pressure packed LED chips, which are connected in series, constitutes a high voltage LED chip group, all low pressure
Packed LED chip, which is connected in series, constitutes a low-voltage LED chipset, the high voltage LED chip group and the low-voltage LED core
Piece group is connected in parallel light source described in integral constitute.High pressure packed LED chip in the light source and low pressure packed LED chip it
Between be electrically connected integrally in mode in parallel after first connecting.
The printed wire includes four parallel circuits, and parallel circuit described in every is by the disjunct septal line of multistage
Road composition, parallel circuit described in four respectively in the interval route be successively used as connection line, upper parallel circuit,
Lower parallel circuit, lower connection line, the upper connection line is identical with the number of segment of the lower connection line, and described is upper flat
Row line is identical with the number of segment of the lower parallel circuit, lower connection described in upper connection line and first segment described in first segment
Route is connect with the electrode described in one of them, lower connection described in upper connection line and final stage described in final stage
Route is connect with the electrode described in another, high pressure forward LED described in installation two on upper parallel circuit described in every section
Chip, low pressure packed LED chip described in installation two, upper parallel circuit described in every section on lower parallel circuit described in every section
One foot of high pressure packed LED chip described in one of upper installation connects with upper connection line described in corresponding one section, is another
One foot is connected with lower parallel circuit described in corresponding one section, installed on upper parallel circuit described in every section another described in
High pressure packed LED chip a foot and latter section described in the connection of upper connection line, another foot and corresponding one section of institute
The lower parallel circuit stated connects, and one of low pressure packed LED chip described in one installed on lower parallel circuit described in every section
A foot and it is one section corresponding described in the connection of lower connection line, another foot connect with upper parallel circuit described in corresponding one section
Connect, installed on lower parallel circuit described in every section another described in low pressure packed LED chip a foot and latter section of institute
The lower connection line stated connects, another foot is connected with upper parallel circuit described in corresponding one section.The track of this structure
Road so that all high pressure packed LED chips are by upper connection line high voltage LED chip group in series, and makes all low pressure
Packed LED chip is by lower connection line low-voltage LED chipset in series, and high voltage LED chip group and low-voltage LED chipset are simultaneously
Connection connection.
It is the packed LED chip of 3.0V~3.4V, the low pressure formal dress that the high pressure packed LED chip, which selects voltage,
It is the packed LED chip of 2.7V~2.9V that LED chip, which selects voltage, and high pressure packed LED chips all in this way, which are connected in series, to be constituted
High voltage LED chip group and all low pressure packed LED chips be connected in series exist between the low-voltage LED chipset constituted it is certain
Voltage difference.
The colour temperature of the high pressure packed LED chip is 3000K~10000K, the color of the low pressure packed LED chip
Temperature is 1800K~2700K;The high pressure packed LED chip and the low pressure packed LED chip pass through longitudinal routing side
Formula realizes electrical connection.
A kind of filament lamp using above-mentioned color temperature-tunable flexible LED lamp strand, including stem connect on the stem
It is connected to two seal wires, it is characterised in that: it is installed on after the flexible LED lamp strand bending is spiral on the stem,
The correspondence of electrode described in two in the flexible LED lamp strand is connect with seal wire described in two, then will by stem
Flexible LED lamp strand is sealed in blister, is filled with heat-conducting gas or protective gas, then connect driving power and lamp by seal wire
Filament lamp is made in head.
Compared with the prior art, the advantages of the utility model are:
A column high pressure packed LED chip and a column low pressure packed LED chip are set side by side in same flexible circuit board,
High pressure packed LED chip is identical with the quantity of low pressure packed LED chip, and high pressure packed LED chip and low pressure packed LED chip
Between it is concatenated after first in parallel in a manner of be electrically connected integrally to be constituted light source or be electrically connected in mode in parallel after first connecting and be connected into one
Body constitutes light source, and one end of light source is connect with one of electrode, and the other end of light source is connect with another electrode, i.e. flexible wires
Only one each electrode of the both ends of road plate, solder joint is less, to reduce the risk of rosin joint, also simplifies setting for driving power
Meter;By coating high color temperature fluorescent glue on the region where all high pressure packed LED chips, and in all low pressure forward LEDs
Low color temperature fluorescent glue is coated on region where chip, electrodeless toning may be implemented, and toning range is big;High pressure packed LED chip
It is identical with the quantity of low pressure packed LED chip, it does not need external connected electronic device and carrys out pressure regulation.
Detailed description of the invention
Fig. 1 a is a kind of existing schematic diagram of color-temperature regulating scheme;
Fig. 1 b is the schematic diagram of existing another color-temperature regulating scheme;
Fig. 2 a is the structure of the flexible LED lamp strand (uncoated high color temperature fluorescent glue and low color temperature fluorescent glue) of embodiment one
Schematic diagram;
Fig. 2 b is the structure of the flexible LED lamp strand (having been coated with high color temperature fluorescent glue and low color temperature fluorescent glue) of embodiment one
Schematic diagram;
Fig. 3 a is the structure of the flexible LED lamp strand (uncoated high color temperature fluorescent glue and low color temperature fluorescent glue) of embodiment two
Schematic diagram;
Fig. 3 b is the structure of the flexible LED lamp strand (having been coated with high color temperature fluorescent glue and low color temperature fluorescent glue) of embodiment two
Schematic diagram;
Fig. 4 is the structural schematic diagram of the filament lamp of embodiment three.
Specific embodiment
The utility model is described in further detail below in conjunction with figure embodiment.
Embodiment one:
A kind of color temperature-tunable flexible LED lamp strand that the present embodiment proposes, as shown in Figure 2 a and 2 b comprising flexible
Wiring board 1, with a column and spaced arrangement is set to multiple high pressure packed LED chips 2 in flexible circuit board 1, with a column
And spaced arrangement be set in flexible circuit board 1 multiple low pressure packed LED chips 3, be set to the two of flexible circuit board 1
Electrode 41,42 on end, a column high pressure packed LED chip 2 and a column low pressure packed LED chip 3 are set side by side, high pressure formal dress
LED chip 2 is identical with the quantity of low pressure packed LED chip 3, between high pressure packed LED chip 2 and low pressure packed LED chip 3 with
Concatenated mode is electrically connected integral composition light source after first in parallel, i.e., each high pressure packed LED chip 2 is one corresponding with position
Low pressure packed LED chip 3, which is connected in parallel, constitutes a LED chip group, and all LED chip groups, which are serially connected in, is integrally formed light
Source, one end of light source are connect with one of electrode 41, and the other end of light source is connect with another electrode 42, all high pressure formal dress
It is coated with high color temperature fluorescent glue 5 on region where LED chip 2, is coated on the region where all low pressure packed LED chips 3
There is low color temperature fluorescent glue 6.
In the present embodiment, flexible circuit board 1 is by flexible metal base plate 11 and the front for being printed in flexible metal base plate 11
On printed wire 12 form, high pressure packed LED chip 2 and low pressure packed LED chip 3 are installed on printed wire 12.
In the present embodiment, printed wire 12 includes multistage parallel circuit 13, the number of segment and high pressure formal dress of parallel circuit 13
The number of LED chip 2 is identical, and every section of parallel circuit 13 is made of upper parallel circuit 131 and lower parallel circuit 132, and the last period is flat
Lower parallel circuit 132 in row line 13 is connected with the upper parallel circuit 131 in latter section of parallel circuit 13 by connection line 133
It connects, the upper parallel circuit 131 in first segment parallel circuit 13 is connect with one of electrode 41, in final stage parallel circuit 13
Lower parallel circuit 132 connect with another electrode 42, on the upper parallel circuit 131 in every section of parallel circuit 13 install a height
It presses and a low pressure packed LED chip 3 is installed on packed LED chip 2 and lower parallel circuit 132, installed on every section of parallel circuit 13
High pressure packed LED chip 2 and the same polar foot of low pressure packed LED chip 3 with it is upper in this section of parallel circuit 13
The connection of parallel circuit 131, another same polar foot are connect with the lower parallel circuit 132 in this section of parallel circuit 13.This
The printed wire 12 of kind structure, so that corresponding high pressure packed LED chip 2 and low pressure packed LED chip 3 are connected in parallel into one
A LED chip group, all LED chip groups are connected in series again.
In the present embodiment, it is the packed LED chip of 5.7V~6.4V that high pressure packed LED chip 2, which selects voltage, and low pressure is just
Dress LED chip 3 selects voltage for the packed LED chip of 3.0V~3.4V, high pressure formal dress in parallel in LED chip group each in this way
There are certain voltage differences between LED chip 2 and low pressure packed LED chip 3.
Embodiment two:
A kind of color temperature-tunable flexible LED lamp strand that the present embodiment proposes, as shown in Figure 3a and Figure 3b shows comprising flexible
Wiring board 1, with a column and spaced arrangement is set to multiple high pressure packed LED chips 2 in flexible circuit board 1, with a column
And spaced arrangement be set in flexible circuit board 1 multiple low pressure packed LED chips 3, be set to the two of flexible circuit board 1
Electrode 41,42 on end, a column high pressure packed LED chip 2 and a column low pressure packed LED chip 3 are set side by side, high pressure formal dress
LED chip 2 is identical with the quantity of low pressure packed LED chip 3, between high pressure packed LED chip 2 and low pressure packed LED chip 3 with
Mode in parallel is electrically connected integral composition light source after first connecting, i.e., all high pressure packed LED chips 2, which are connected in series, constitutes one
High voltage LED chip group, all low pressure packed LED chips 3, which are connected in series, constitutes a low-voltage LED chipset, high voltage LED chip group
With low-voltage LED chipset be connected in parallel it is integral constitute light source, one end of light source is connect with one of electrode 41, light source it is another
One end is connect with another electrode 42, is coated with high color temperature fluorescent glue 5, institute on the region where all high pressure packed LED chips 2
Low color temperature fluorescent glue 6 is coated on the region for having 3 place of low pressure packed LED chip.
In the present embodiment, flexible circuit board 1 is by flexible metal base plate 11 and the front for being printed in flexible metal base plate 11
On printed wire 12 form, high pressure packed LED chip 2 and low pressure packed LED chip 3 are installed on printed wire 12.
In the present embodiment, printed wire 12 includes four parallel circuits 13, and every parallel circuit 13 is not attached to by multistage
Interval route composition, four parallel circuits 13 respectively in interval route be successively used as connection line 134, upper parallel circuit
131, lower parallel circuit 132, lower connection line 135, upper connection line 134 is identical with the number of segment of lower connection line 135, upper parallel
Route 131 is identical with the number of segment of lower parallel circuit 132, on first segment under connection line 134 and first segment connection line 135 with
One of electrode 41 connects, on final stage under connection line 134 and final stage connection line 135 with another electrode
42 connect, and install two high pressure packed LED chips 2 on every section of upper parallel circuit 131, install two on every section of lower parallel circuit 132
A low pressure packed LED chip 3, a foot of the high pressure packed LED chip 2 installed on every section of upper parallel circuit 131 with it is right
The upper connection of connection line 134 of one section answered, another foot are connected with corresponding one section lower parallel circuit 132, every section of upper parallel lines
One foot of another high pressure packed LED chip 2 installed on road 131 connect with latter section of upper connection line 134, another foot
It is connected with corresponding one section lower parallel circuit 132, the low pressure packed LED chip 3 installed on every section of lower parallel circuit 132
One foot and corresponding one section of lower connection of connection line 135, another foot are connected with corresponding one section upper parallel circuit 131, often
One foot of another low pressure packed LED chip 3 installed on the lower parallel circuit 132 of section connects with latter section of lower connection line 135
It connects, another foot is connected with corresponding one section upper parallel circuit 131.The printed wire 12 of this structure, so that all high positive pressures
LED chip 2 is filled by upper connection line 134 high voltage LED chip group in series, and makes all low pressure packed LED chips 3 logical
The low-voltage LED chipset in series of connection line 135 is crossed down, high voltage LED chip group is connected in parallel with low-voltage LED chipset.
In the present embodiment, it is the packed LED chip of 3.0V~3.4V that high pressure packed LED chip 2, which selects voltage, and low pressure is just
Filling LED chip 3 and selecting voltage is the packed LED chip of 2.7V~2.9V, and high pressure packed LED chips 2 all in this way are connected in series
The high voltage LED chip group of composition and all low pressure packed LED chips 3, which are connected in series between the low-voltage LED chipset constituted, to be existed
Certain voltage difference.
In the flexible LED lamp strand of above-mentioned two embodiment, the colour temperature range of choice of high pressure packed LED chip 2 is 3000K
~10000K, the colour temperature range of choice of low pressure packed LED chip 3 are 1800K~2700K.High pressure packed LED chip 2 and low pressure
Packed LED chip 3 realizes electrical connection by longitudinal routing mode.
The principle of the flexible LED lamp strand color-temperature regulating of above-mentioned two embodiment are as follows: when electric current is smaller, low pressure forward LED
Chip 3 obtains most of electric current, and high pressure packed LED chip 2 obtains a small amount of electric current, 3 all light of low pressure packed LED chip, high positive pressure
2 glimmer of LED chip is filled, the colour temperature of the flexible LED lamp strand shows low color temperature, as electric current increases, high pressure forward LED core at this time
Piece 2 obtains electric current and increases, and brightness gradually increases, and the colour temperature of the flexible LED lamp strand is gradually changed from low color temperature to high color temperature, when
When electric current increases to sufficiently large, 3 all light of high pressure packed LED chip 2 and low pressure packed LED chip, the flexible LED lamp strand at this time
Colour temperature show high color temperature.
Embodiment three:
The present embodiment proposes a kind of lamp of color temperature-tunable flexible LED lamp strand using embodiment one or embodiment two
Silk lamp, as shown in Figure 4 comprising stem 81 is connected with two seal wires 82,83 on stem 81, and flexible LED lamp strand 84 is bent into
It is installed on after helical form on stem 81, two in flexible LED lamp strand 84 electrode 41,42 is corresponding to be connected with two seal wires 82,83
It connects, then flexible LED lamp strand 84 is sealed in blister 85 by stem 81, is filled with heat-conducting gas or protective gas, then lead to
It crosses seal wire 82,83 and connects driving power (not shown) and lamp cap 86, filament lamp is made.
Claims (10)
1. a kind of color temperature-tunable flexible LED lamp strand, it is characterised in that: arrange and be alternatively arranged including flexible circuit board, with one
Multiple high pressure packed LED chips that mode is set in the flexible circuit board, with a column and spaced arrangement is set to
Multiple low pressure packed LED chips in the flexible circuit board, the electrode being set on the both ends of the flexible circuit board,
Low pressure packed LED chip described in the one column high pressure packed LED chip and a column is set side by side, the high pressure formal dress
LED chip is identical with the quantity of the low pressure packed LED chip, and the high pressure packed LED chip and the low pressure are just
Between dress LED chip it is concatenated after first in parallel in a manner of be electrically connected and integrally constituted light source or electric in mode in parallel after first connecting
Link into an integrated entity and constitute light source, one end of the light source is connect with the electrode described in one of them, the light source it is another
End is connect with the electrode described in another, and it is glimmering to be coated with high color temperature on the region where all high pressure packed LED chips
Optical cement is coated with low color temperature fluorescent glue on the region where all low pressure packed LED chips.
2. color temperature-tunable flexible LED lamp strand according to claim 1, it is characterised in that: the flexible circuit board
It is made of flexible metal base plate with the printed wire that is printed on the front of the flexible metal base plate, the high pressure formal dress
LED chip and the low pressure packed LED chip are installed on the printed wire.
3. color temperature-tunable flexible LED lamp strand according to claim 2, it is characterised in that: each high positive pressure
Low pressure packed LED chip described in dress LED chip is one corresponding with position, which is connected in parallel, constitutes a LED chip group, owns
The LED chip group, which is serially connected in, is integrally formed the light source.
4. color temperature-tunable flexible LED lamp strand according to claim 3, it is characterised in that: the printed wire packet
Multistage parallel circuit is included, the number of segment of the parallel circuit is identical as the number of high pressure packed LED chip, described in every section
Parallel circuit be made of upper parallel circuit and lower parallel circuit, the lower parallel lines in parallel circuit described in the last period
Road is connect with the upper parallel circuit in parallel circuit described in latter section by connection line, parallel described in first segment
The upper parallel circuit in route is connect with the electrode described in one of them, the institute in parallel circuit described in final stage
The lower parallel circuit stated is connect with the electrode described in another, on the upper parallel circuit in parallel circuit described in every section
Low pressure forward LED core described in installation one on high pressure packed LED chip described in installation one and the lower parallel circuit
One is installed on high pressure packed LED chip described in installing one on piece or the lower parallel circuit and the upper parallel circuit
A low pressure packed LED chip, the high pressure packed LED chip installed on parallel circuit described in every section and described
The same polar foot of low pressure packed LED chip connect with the upper parallel circuit in parallel circuit described in this section
It connects, another same polar foot is connect with the lower parallel circuit in parallel circuit described in this section.
5. color temperature-tunable flexible LED lamp strand according to claim 3 or 4, it is characterised in that: the high pressure formal dress
It is the packed LED chip of 5.7V~6.4V that LED chip, which selects voltage, and it is 3.0V that the low pressure packed LED chip, which selects voltage,
The packed LED chip of~3.4V.
6. color temperature-tunable flexible LED lamp strand according to claim 2, it is characterised in that: all high positive pressures
It fills LED chip and one high voltage LED chip group of composition is connected in series, all low pressure packed LED chips, which are connected in series, to be constituted
One low-voltage LED chipset, the high voltage LED chip group and the low-voltage LED chipset are connected in parallel integral composition
The light source.
7. color temperature-tunable flexible LED lamp strand according to claim 6, it is characterised in that: the printed wire packet
Four parallel circuits are included, parallel circuit described in every is made of the disjunct interval route of multistage, parallel lines described in four
Road respectively in the interval route be successively used as connection line, upper parallel circuit, lower parallel circuit, lower connection line,
The upper connection line is identical with the number of segment of the lower connection line, the upper parallel circuit and the lower parallel lines
The number of segment on road is identical, and lower connection line described in upper connection line and first segment described in first segment is and described in one of them
Electrode connection, lower connection line described in upper connection line and final stage described in final stage with the electricity described in another
Pole connects, high pressure packed LED chip described in installation two, lower parallel lines described in every section on upper parallel circuit described in every section
Low pressure packed LED chip described in road installation two, high pressure described in one installed on upper parallel circuit described in every section
One foot of packed LED chip and it is one section corresponding described in the connection of upper connection line, another foot and a corresponding Duan Suoshu
The connection of lower parallel circuit, install on upper parallel circuit described in every section another described in high pressure packed LED chip one
Upper connection line connection, another foot described in a foot and latter section are connected with lower parallel circuit described in corresponding one section, often
One foot of low pressure packed LED chip described in one installed on the lower parallel circuit of Duan Suoshu with described in corresponding one section
Lower connection line connection, another foot are connected with upper parallel circuit described in corresponding one section, lower parallel circuit described in every section
One foot of low pressure packed LED chip described in another of upper installation connect with lower connection line described in latter section, is another
A foot is connected with upper parallel circuit described in corresponding one section.
8. color temperature-tunable flexible LED lamp strand according to claim 6 or 7, it is characterised in that: the high pressure formal dress
It is the packed LED chip of 3.0V~3.4V that LED chip, which selects voltage, and it is 2.7V that the low pressure packed LED chip, which selects voltage,
The packed LED chip of~2.9V.
9. the color temperature-tunable flexible LED lamp strand according to claim 4 or 7, it is characterised in that: the high pressure formal dress
The colour temperature of LED chip is 3000K~10000K, and the colour temperature of the low pressure packed LED chip is 1800K~2700K;Described
High pressure packed LED chip and the low pressure packed LED chip realize electrical connection by longitudinal routing mode.
10. a kind of filament lamp using color temperature-tunable flexible LED lamp strand described in claim 4 or 7, including stem, institute
Two seal wires are connected on the stem stated, it is characterised in that: be installed on institute after the flexible LED lamp strand bending is spiral
On the stem stated, the correspondence of electrode described in two in the flexible LED lamp strand is connect with seal wire described in two.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920468475.1U CN209688578U (en) | 2019-04-09 | 2019-04-09 | Color temperature-tunable flexible LED lamp strand and the filament lamp for using the filament item |
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Application Number | Priority Date | Filing Date | Title |
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CN201920468475.1U CN209688578U (en) | 2019-04-09 | 2019-04-09 | Color temperature-tunable flexible LED lamp strand and the filament lamp for using the filament item |
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CN209688578U true CN209688578U (en) | 2019-11-26 |
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CN201920468475.1U Withdrawn - After Issue CN209688578U (en) | 2019-04-09 | 2019-04-09 | Color temperature-tunable flexible LED lamp strand and the filament lamp for using the filament item |
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CN (1) | CN209688578U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110030508A (en) * | 2019-04-09 | 2019-07-19 | 浙江阳光美加照明有限公司 | Color temperature-tunable flexible LED lamp strand and the filament lamp for using the filament item |
CN117133853A (en) * | 2023-10-27 | 2023-11-28 | 深圳市欣上科技有限公司 | 360 luminous flexible normal dress LED filament of degree |
-
2019
- 2019-04-09 CN CN201920468475.1U patent/CN209688578U/en not_active Withdrawn - After Issue
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110030508A (en) * | 2019-04-09 | 2019-07-19 | 浙江阳光美加照明有限公司 | Color temperature-tunable flexible LED lamp strand and the filament lamp for using the filament item |
CN110030508B (en) * | 2019-04-09 | 2024-03-01 | 浙江阳光美加照明有限公司 | Color temperature-adjustable flexible LED filament strip and filament lamp using same |
CN117133853A (en) * | 2023-10-27 | 2023-11-28 | 深圳市欣上科技有限公司 | 360 luminous flexible normal dress LED filament of degree |
CN117133853B (en) * | 2023-10-27 | 2024-05-10 | 深圳市欣上科技有限公司 | 360 Luminous flexible normal dress LED filament of degree |
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