CN117102129A - Cleaning device for wafer - Google Patents
Cleaning device for wafer Download PDFInfo
- Publication number
- CN117102129A CN117102129A CN202311120289.6A CN202311120289A CN117102129A CN 117102129 A CN117102129 A CN 117102129A CN 202311120289 A CN202311120289 A CN 202311120289A CN 117102129 A CN117102129 A CN 117102129A
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- China
- Prior art keywords
- cleaning
- wafer
- fixedly connected
- electric telescopic
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 131
- 235000012431 wafers Nutrition 0.000 claims description 113
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 41
- 238000007789 sealing Methods 0.000 claims description 22
- 238000007790 scraping Methods 0.000 claims description 14
- 238000001179 sorption measurement Methods 0.000 claims description 14
- 238000004891 communication Methods 0.000 claims description 13
- 239000007921 spray Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 238000005507 spraying Methods 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 3
- 230000005012 migration Effects 0.000 claims description 2
- 238000013508 migration Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 230000002411 adverse Effects 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 5
- 239000003344 environmental pollutant Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 231100000719 pollutant Toxicity 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application relates to a cleaning device for a wafer, which belongs to the technical field of wafer cleaning and aims to solve the technical problems that the prior wafer cleaning device has poor cleaning effect on the wafer and causes adverse effect on the subsequent processing of the wafer.
Description
Technical Field
The application relates to the technical field of wafer cleaning, in particular to a cleaning device for wafers.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material of the wafer is silicon, and the wafer is contacted with pollutants such as dust, bacteria, grease, organic matters and the like in the air in the manufacturing process, and the pollutants can be attached to the surface of the wafer to form a harmful pollution layer, so that the wafer needs to be cleaned by a cleaning device.
The prior Chinese patent with publication number of CN212136399U discloses a wafer cleaning device, which comprises a base station, a sucker, a cleaning mechanism and a controller. The base station comprises a bottom surface and a surrounding baffle surrounding the periphery of the bottom surface. The sucking disc with the base is rotated and is connected, the sucking disc is kept away from bottom surface one side is equipped with at least one and is used for adsorbing the adsorption equipment of wafer. The cleaning mechanism is arranged on the extending direction of the base towards the sucker, and at least comprises a spray head which is arranged towards the sucker and used for spraying cleaning liquid. And the controller is used for controlling the spray head to spray cleaning liquid towards the wafer loaded on the sucker and controlling the sucker to drive the wafer adsorbed by the sucker to rotate together with the wafer relative to the base station. The wafer cleaning device also controls the wafer to rotate in the process of cleaning the wafer, so that the cleaning liquid sprayed out of the spray head acts on the surface of the wafer more uniformly, poor cleaning effect caused by uneven spraying of the cleaning liquid is avoided, and the cleaning efficiency is improved.
To above-mentioned related art, the sucking disc drives the wafer and rotates, realize the cleanness to the wafer through evenly spraying the cleaning solution at the wafer surface, because the wafer is fragile and fragile article, current wafer belt cleaning device is through the cleaning solution that sprays when cleaning the wafer, in order to avoid the wafer cracked, the pressure that the washing solution sprayed can be less, and some pollutants on the wafer can adhere to the wafer surface, just can not effectively get rid of it through the spraying of cleaning solution, lead to current wafer belt cleaning device not good to the cleaning performance of wafer, cause adverse effect to the follow-up processing of wafer.
Disclosure of Invention
The application aims to provide a cleaning device for a wafer, which can solve the problems that the prior wafer cleaning device has poor cleaning effect on the wafer and adversely affects the subsequent processing of the wafer.
In order to achieve the above purpose, the present application provides the following technical solutions: the utility model provides a belt cleaning device for wafer, including wasing the pond, wasing the pond surface and being provided with the lifting unit, be provided with the mounting panel on the lifting unit, and the mounting panel sets up inside wasing the pond, washs pond one side and is provided with the clean subassembly that is used for cleaning the wafer, and the embedding of mounting panel upper end is provided with the rotating assembly that is used for rotating the wafer, and the wafer sets up in rotating assembly upper end, washs the fixed control portion that is provided with of pond opposite side, washs pond surface embedding and is provided with the spray assembly that is used for spraying the cleaning solution;
the rotating assembly comprises a driving part and an adsorption part, wherein the driving part is embedded in the upper end of the mounting plate, the adsorption part is arranged at the upper end of the driving part, the wafer is arranged at the upper end of the adsorption part, the cleaning assembly comprises a push-pull part arranged on one side of the cleaning tank and a scraping part arranged on one side of the push-pull part, the push-pull part is connected with the upper end of the mounting plate, the driving part is used for driving the adsorption part and the wafer to rotate, the adsorption part is used for adsorbing and fixing the wafer, the push-pull part is used for driving the scraping part to move, and the scraping part is used for cleaning the wafer.
Further, cleaning solution is contained in the cleaning tank, the mounting plate vertically penetrates through the mounting plate to form a mounting hole and a water outlet groove, a plurality of groups of water outlet grooves are formed in the water outlet groove, the mounting hole and the water outlet grooves are arranged at intervals, the inner wall of the mounting hole is provided with a communication hole, the communication hole is communicated with the lower portion of the mounting plate, the water outlet groove is used for allowing the cleaning solution to pass through, and the communication hole is used for discharging the cleaning solution in the mounting hole.
Further, the driving part comprises a bottom plate fixedly connected inside the mounting hole and a motor fixedly connected to the upper end of the bottom plate, the motor is electrically connected with the control part, the inner wall of the mounting hole is fixedly connected with a supporting ring, one end of the communicating hole is opened and arranged above the supporting ring, and the bottom plate is used for supporting the motor.
Further, the adsorption component comprises a sealing shell which is connected with the supporting ring in a sealing and rotating way and a first electric telescopic rod which is fixedly connected with the inner wall of the lower end of the sealing shell, the first electric telescopic rod is connected with the control part in a wireless signal way, the output end of the motor is fixedly connected with the lower end of the sealing shell, the upper end of the first electric telescopic rod is fixedly connected with a piston, the outer surface of the piston is attached to the inner wall of the sealing shell, and the first electric telescopic rod is used for driving the piston to move vertically.
Further, the embedded fixedly connected with breather pipe of seal housing upper end, breather pipe upper end run through fixedly connected with suction disc head, seal housing upper end fixedly connected with limiting plate, suction disc head and breather pipe respectively with limiting plate upper and lower end embedding fixedly connected, the limiting plate is used for supporting the suction disc head, the wafer setting is in suction disc head upper end, the suction disc head is used for adsorbing fixed wafer, the limiting plate is used for supporting the suction disc head.
Further, the push-and-pull part is including the contact setting at the hollow stopper of wasing pond one side and run through fixed connection's second electric telescopic handle with hollow stopper, and second electric telescopic handle and control portion electric connection, hollow stopper one side fixedly connected with sliding strip, and sliding strip and washs pond one side sliding connection, second electric telescopic handle one end fixedly connected with connecting strip, hollow stopper is used for spacing to the second electric telescopic handle, and the flexible of second electric telescopic handle is used for driving connecting strip horizontal migration.
Further, mounting panel upper end fixedly connected with fixed block, and the fixed block is provided with two sets of, two sets of fixed block between fixedly connected with gib block, and gib block both sides run through swing joint, gib block is used for supporting the gib block and to its direction.
Further, the scraping component comprises a first brush strip fixedly connected to one side of the connecting strip and a bolt which penetrates through the first brush strip up and down in a threaded manner, the lower end of the bolt is fixedly connected with a second brush strip, one end of the second brush strip is slidably connected with one side of the connecting strip, the first brush strip and the second brush strip are in contact with a wafer, the first brush strip and the second brush strip are used for cleaning the wafer, and the bolt is used for adjusting the position of the second brush strip.
Further, the lifting assembly comprises a C-shaped supporting frame fixedly connected with two sides of the cleaning tank and a third electric telescopic rod fixedly connected with the upper end of the C-shaped supporting frame in a penetrating mode, two groups of third electric telescopic rods are arranged, the lower ends of the third electric telescopic rods are fixedly connected with the upper end of the mounting plate, the two groups of third electric telescopic rods are electrically connected with the control part, a water outlet component is embedded in one side of the cleaning tank, and the two groups of third electric telescopic rods are used for driving the mounting plate to vertically move.
Further, spray the supporting shoe of subassembly including fixed connection in the washing pond upper end, and the supporting shoe is provided with two sets of, two sets of supporting shoe upper end fixedly connected with connecting pipe, connecting pipe one end fixedly is provided with the water pump, and the external cleaning solution water tank of the water pump other end, the fixed pipe of supporting shoe surface embedding fixedly connected with, fixed pipe other end fixedly connected with shower nozzle, and the shower nozzle corresponds the setting with the suction disc head, water pump and control portion electric connection, the water pump is used for inside with cleaning solution pump to the connecting pipe, fixed pipe is used for intercommunication connecting pipe and shower nozzle.
Compared with the prior art, the application has the beneficial effects that:
according to the cleaning device for the wafer, provided by the application, the purpose of improving the cleaning effect of the cleaning device on the wafer is achieved through the arrangement of the lifting component, the mounting plate, the rotating component, the cleaning component, the control part and the spraying component, and the problem that the existing wafer cleaning device is poor in cleaning effect on the wafer and adversely affects the subsequent processing of the wafer is solved.
Drawings
FIG. 1 is a schematic perspective view of a cleaning apparatus for wafers according to the present application;
FIG. 2 is a schematic view showing an internal structure of a cleaning tank of a cleaning apparatus for wafers according to the present application;
FIG. 3 is a schematic view of a mounting plate of a cleaning apparatus for wafers according to the present application;
FIG. 4 is a schematic view showing a driving part and a driving part structure of a cleaning apparatus for wafers according to the present application;
FIG. 5 is a schematic view of a cleaning assembly of a cleaning apparatus for wafers according to the present application;
FIG. 6 is a schematic view of the push-pull member and the scraping member of a cleaning apparatus for wafers according to the present application;
FIG. 7 is a schematic view of a lifting assembly of a cleaning apparatus for wafers according to the present application;
fig. 8 is a schematic view of a spray assembly of a cleaning apparatus for wafers according to the present application.
In the figure: 1. a cleaning pool; 2. a lifting assembly; 21. a C-shaped supporting frame; 22. a third electric telescopic rod; 3. a mounting plate; 31. a mounting hole; 32. a communication hole; 33. a water outlet tank; 4. a rotating assembly; 41. a driving part; 411. a bottom plate; 412. a support ring; 413. a motor; 42. a driving part; 421. a seal housing; 422. a first electric telescopic rod; 423. a piston; 424. a vent pipe; 425. a limiting plate; 426. a suction disc head; 5. a cleaning assembly; 51. a push-pull member; 511. a hollow limiting block; 512. a second electric telescopic rod; 513. a connecting strip; 514. a fixed block; 515. a guide bar; 516. a sliding bar; 52. a scraping member; 521. a first brush bar; 522. a bolt; 523. a second brush bar; 6. a control unit; 7. a water outlet member; 8. a spray assembly; 81. a support block; 82. a connecting pipe; 83. a water pump; 84. a fixed tube; 85. a spray head; 9. and (3) a wafer.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
As shown in fig. 1, 2 and 5, a cleaning device for a wafer comprises a cleaning tank 1, a lifting assembly 2 is arranged on the outer surface of the cleaning tank 1, a mounting plate 3 is arranged on the lifting assembly 2, the mounting plate 3 is arranged inside the cleaning tank 1, a cleaning assembly 5 for cleaning the wafer 9 is arranged on one side of the cleaning tank 1, a rotating assembly 4 for rotating the wafer 9 is embedded in the upper end of the mounting plate 3, the wafer 9 is arranged on the upper end of the rotating assembly 4, a control part 6 is fixedly arranged on the other side of the cleaning tank 1, a spraying assembly 8 for spraying cleaning liquid is embedded in the outer surface of the cleaning tank 1, the rotating assembly 4 comprises a driving part 41 embedded in the upper end of the mounting plate 3 and an absorbing part 42 arranged on the upper end of the driving part 41, the wafer 9 is arranged on the upper end of the absorbing part 42, the cleaning assembly 5 comprises a push-pull part 51 arranged on one side of the cleaning tank 1 and a scraping part 52 arranged on one side of the push-pull part 51, the push-pull part 51 is connected with the upper end of the mounting plate 3, the driving part 41 is used for driving the absorbing part 42 and the wafer 9 to rotate, the absorbing part 42 is used for absorbing and fixing the wafer 9, the scraping part 52 is used for absorbing and driving the scraping part 52 to move the wafer 52.
The application is further described below with reference to examples.
Referring to fig. 3 and 6-8, cleaning solution is contained in the cleaning tank 1, a mounting hole 31 and a water outlet groove 33 are vertically and vertically penetrated through the mounting plate 3, the water outlet grooves 33 are provided with a plurality of groups, the mounting hole 31 and the water outlet grooves 33 of the groups are arranged at intervals, a communication hole 32 is formed in the inner wall of the mounting hole 31, the communication hole 32 is communicated with the lower part of the mounting plate 3, the water outlet groove 33 is used for allowing the cleaning solution to pass through, the communication hole 32 is used for discharging the cleaning solution in the mounting hole 31, when the mounting plate 3 moves downwards, the cleaning solution in the cleaning tank 1 can flow through the water outlet groove 33, so that the mounting plate 3 can be immersed, a driving part 41 comprises a bottom plate 411 fixedly connected in the mounting hole 31 and a motor 413 fixedly connected to the upper end of the bottom plate 411, the motor 413 is electrically connected with the control part 6, the inner wall of the mounting hole 31 is fixedly connected with a supporting ring 412, one end of the communication hole 32 is opened above the supporting ring 412, the bottom plate 411 is used for supporting the motor 413, cleaning solution accumulated at the upper end of the supporting ring 412 can be discharged to the lower part of the mounting plate 3 through the communication hole 32, the cleaning solution accumulation is avoided, the motor 413 can be controlled to rotate through the control part 6, the adsorption part 42 comprises a sealing shell 421 which is connected with the supporting ring 412 in a sealing and rotating way and a first electric telescopic rod 422 which is fixedly connected with the inner wall of the lower end of the sealing shell 421, the first electric telescopic rod 422 is connected with the control part 6 in a wireless signal way, the output end of the motor 413 is fixedly connected with the lower end of the sealing shell 421, the upper end of the first electric telescopic rod 422 is fixedly connected with a piston 423, the outer surface of the piston 423 is attached to the inner wall of the sealing shell 421, the first electric telescopic rod 422 is used for driving the piston 423 to vertically move, the cleaning solution can be prevented from contacting the motor 413 through the sealing shell 421, the supporting ring 412 and the bottom plate 411, the motor 413 can drive the sealing shell 421 to rotate, it should be noted that, the first electric telescopic rod 422 is connected with the control portion 6 through wireless signals, the control portion 6 controls the expansion and contraction of the first electric telescopic rod 422, wherein this technical scheme is not an innovative part of the document of the present application, and belongs to common knowledge, a person skilled in the art has the ability to think of a specific structure thereof, the upper end of the sealing shell 421 is embedded and fixedly connected with the vent pipe 424, the upper end of the vent pipe 424 is penetrated and fixedly connected with the suction cup head 426, the upper end of the sealing shell 421 is fixedly connected with the limiting plate 425, the suction cup head 426 and the vent pipe 424 are respectively embedded and fixedly connected with the upper end and the lower end of the limiting plate 425, the limiting plate 425 is used for supporting the suction cup head 426, the wafer 9 is arranged at the upper end of the suction cup head 426, the limiting plate 425 is used for supporting the suction cup head 426, the wafer 9 can be driven to rotate by the limiting plate 425 and the suction cup head 426 when the sealing shell 421 rotates, when the first electric telescopic rod 422 is contracted, the piston 423 can be driven to move downwards, so that the air pressure among the piston 423, the air pipe 424, the suction disc head 426 and the wafer 9 is reduced, the wafer 9 is adsorbed and fixed at the upper end of the suction disc head 426 through the negative pressure energy, the push-pull part 51 comprises a hollow limiting block 511 which is arranged at one side of the cleaning tank 1 in a contact manner and a second electric telescopic rod 512 which is fixedly connected with the hollow limiting block 511 in a penetrating manner, the second electric telescopic rod 512 is electrically connected with the control part 6, a sliding bar 516 is fixedly connected at one side of the hollow limiting block 511, the sliding bar 516 is in sliding connection with one side of the cleaning tank 1, one end of the second electric telescopic rod 512 is fixedly connected with a connecting bar 513, the hollow limiting block 511 is used for limiting the second electric telescopic rod 512, the second electric telescopic rod 512 is stretched and used for driving the connecting bar 513 to move horizontally, the cleaning tank 1 is used for limiting the sliding bar 516, the second electric telescopic rod 512 can only move vertically, the control part 6 can control the extension and retraction of the second electric telescopic rod 512, the upper end of the mounting plate 3 is fixedly connected with the fixing blocks 514, the fixing blocks 514 are provided with two groups, a guide bar 515 is fixedly connected between the fixing blocks 514 of the two groups, the guide bar 515 is in penetrating and movable connection with two sides of the connecting bar 513, the guide bar 515 is used for supporting the connecting bar 513 and guiding the connecting bar 513, shaking of the connecting bar 513 during moving can be relieved, the wafer 9 is prevented from being damaged by impact, the scraping part 52 comprises a first brush bar 521 fixedly connected with one side of the connecting bar 513 and a bolt 522 in penetrating threaded connection with the first brush bar 521 up and down, the lower end of the bolt 522 is fixedly connected with a second brush bar 523, one end of the second brush bar 523 is in sliding connection with one side of the connecting bar 513, the first brush bar 521 and the second brush bar 523 are both in contact with the wafer 9, the first brush bar 521 and the second brush bar 523 are used for cleaning the wafer 9, the bolt 522 is used for adjusting the position of the second brush bar 523, the second brush bar 523 can be close to the first brush bar 521 or far away from the first brush bar 521 through the rotation of the bolt 522, the first brush bar 521 and the second brush bar 523 both comprise L-shaped fixed bars and sponge bars, one end of the connecting bar 513 can drive the first brush bar 521 and the second brush bar 523 to move, thereby the first brush bar 521 and the second brush bar 523 brush the outer surface of the wafer 9, the pollutants adsorbed on the surface of the wafer 9 can be brushed down, the lifting assembly 2 comprises a C-shaped supporting frame 21 fixedly connected with two sides of the cleaning tank 1 and a third electric telescopic rod 22 fixedly connected with the upper end of the C-shaped supporting frame 21, the third electric telescopic rod 22 is provided with two groups, the lower ends of the third electric telescopic rods 22 of the two groups are fixedly connected with the upper end of the mounting plate 3, the third electric telescopic rods 22 of the two groups are electrically connected with the control part 6, can control the expansion and contraction of third electric telescopic handle 22 through control portion 6, wash pond 1 one side embedding is provided with water outlet member 7, water outlet member 7 includes water pipe and stop valve, and stop valve and control portion 6 electric connection, can discharge the inside cleaning solution of wash pond 1 through water outlet member 7, the third electric telescopic handle 22 of two sets of is used for driving mounting panel 3 vertical removal, thereby can drive part 41 and adsorption component 42 and all remove, make wafer 9 can be immersed by the cleaning solution, spray subassembly 8 includes fixed connection at the supporting shoe 81 of wasing pond 1 upper end, and supporting shoe 81 is provided with two sets of, the supporting shoe 81 upper end fixedly connected with connecting pipe 82 of two sets of, connecting pipe 82 one end is fixed and is provided with water pump 83, and the external cleaning solution water tank of water pump 83 other end, supporting shoe 81 surface embedding fixedly connected with fixed pipe 84, the fixed pipe 84 other end fixedly connected with shower nozzle 85, and shower nozzle 85 corresponds the setting with suction disc 426, water pump 83 and control portion 6 electric connection, water pump 83 is used for carrying cleaning solution to 82 inside, fixed pipe 84 is used for communicating 82 and shower nozzle 85, water pump 83 and shower nozzle 83 can be through fixed pipe 83, and shower nozzle 83 can be through the control portion operation control portion 9.
When in use, firstly, the center of the wafer 9 is wiped clean by clean cloth and then pressed on the upper end of the suction disc head 426, then the first electric telescopic rod 422 is controlled by the control part 6 to shrink for a certain distance, so that the wafer 9 is adsorbed on the upper end of the suction disc head 426, then the bolt 522 is rotated, the distance between the first brush bar 521 and the second brush bar 523 is adjusted according to the thickness of the wafer 9, then the third electric telescopic rod 22 of the two groups is controlled by the control part 6 to stretch for a certain distance, the wafer 9 is immersed in cleaning liquid in the cleaning tank 1, the second electric telescopic rod 512 and the motor 413 are controlled by the control part 6 to start, the motor 413 rotates to enable the wafer 9 to rotate, meanwhile, the first brush bar 521 and the second brush bar 523 can be reciprocally brushed on the outer surface of the wafer 9 to clean pollutants attached on the outer surface of the wafer 9, after a period of time, the second electric telescopic rod 512 and the motor 413 are controlled by the control part 6 to stop the first brush bar 521 and the second brush bar 523 at the positions which are not contacted with the wafer 9, then the control part 6 is used for controlling the third electric telescopic rods 22 of the two groups to shrink for a distance to enable the mounting plate 3 to rise and separate from the cleaning liquid, then the control part 6 is used for controlling the water pump 83 and the motor 413 to start, the cleaning liquid is sprayed to the upper end of the rotating wafer 9, the water pump 83 is closed after a period of time, the residual cleaning liquid can be thrown off when the wafer 9 rotates by the control part 6, the subsequent drying treatment is facilitated, the effective cleaning of the wafer 9 can be realized, the cleaning effect of the wafer 9 is improved, meanwhile, the cleaning liquid on the wafer 9 can be thrown off after the cleaning is finished, the subsequent drying treatment is facilitated, the contamination can be prevented from adversely affecting subsequent processing of the wafer 9.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The foregoing is only a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art, who is within the scope of the present application, should be covered by the protection scope of the present application by making equivalents and modifications to the technical solution and the inventive concept thereof.
Claims (10)
1. A cleaning device for wafers, comprising a cleaning tank (1), characterized in that: the outer surface of the cleaning tank (1) is provided with a lifting component (2), the lifting component (2) is provided with a mounting plate (3), the mounting plate (3) is arranged inside the cleaning tank (1), one side of the cleaning tank (1) is provided with a cleaning component (5) for cleaning a wafer (9), the upper end of the mounting plate (3) is embedded with a rotating component (4) for rotating the wafer (9), the wafer (9) is arranged at the upper end of the rotating component (4), the other side of the cleaning tank (1) is fixedly provided with a control part (6), and the outer surface of the cleaning tank (1) is embedded with a spraying component (8) for spraying cleaning liquid;
the rotating assembly (4) comprises a driving part (41) embedded in the upper end of the mounting plate (3) and an adsorption part (42) arranged at the upper end of the driving part (41), the wafer (9) is arranged at the upper end of the adsorption part (42), the cleaning assembly (5) comprises a push-pull part (51) arranged on one side of the cleaning tank (1) and a scraping part (52) arranged on one side of the push-pull part (51), the push-pull part (51) is connected with the upper end of the mounting plate (3), the driving part (41) is used for driving the adsorption part (42) and the wafer (9) to rotate, the adsorption part (42) is used for adsorbing and fixing the wafer (9), the push-pull part (51) is used for driving the scraping part (52) to move, and the scraping part (52) is used for cleaning the wafer (9).
2. A cleaning apparatus for wafers as set forth in claim 1, wherein: cleaning solution is contained in the cleaning tank (1), the mounting plate (3) vertically penetrates through the mounting hole (31) and the water outlet groove (33), the water outlet groove (33) is provided with a plurality of groups, the mounting hole (31) and the water outlet groove (33) are arranged at intervals, the inner wall of the mounting hole (31) is provided with the communication hole (32), the communication hole (32) is communicated with the lower portion of the mounting plate (3), the water outlet groove (33) is used for allowing the cleaning solution to pass through, and the communication hole (32) is used for discharging the cleaning solution in the mounting hole (31).
3. A cleaning apparatus for wafers as set forth in claim 2, wherein: the driving part (41) comprises a bottom plate (411) fixedly connected inside the mounting hole (31) and a motor (413) fixedly connected to the upper end of the bottom plate (411), the motor (413) is electrically connected with the control part (6), a supporting ring (412) is fixedly connected to the inner wall of the mounting hole (31), one end opening of the communication hole (32) is arranged above the supporting ring (412), and the bottom plate (411) is used for supporting the motor (413).
4. A cleaning apparatus for wafers as claimed in claim 3, wherein: the adsorption component (42) comprises a sealing shell (421) which is connected with the supporting ring (412) in a sealing and rotating mode and a first electric telescopic rod (422) which is fixedly connected with the inner wall of the lower end of the sealing shell (421), the first electric telescopic rod (422) is connected with the control part (6) in a wireless signal mode, the output end of the motor (413) is fixedly connected with the lower end of the sealing shell (421), the upper end of the first electric telescopic rod (422) is fixedly connected with a piston (423), the outer surface of the piston (423) is attached to the inner wall of the sealing shell (421), and the first electric telescopic rod (422) is used for driving the piston (423) to move vertically.
5. A cleaning apparatus for wafers as set forth in claim 4, wherein: sealing shell (421) upper end embedding fixedly connected with breather pipe (424), breather pipe (424) upper end runs through fixedly connected with suction disc head (426), sealing shell (421) upper end fixedly connected with limiting plate (425), suction disc head (426) and breather pipe (424) respectively with limiting plate (425) upper and lower end embedding fixedly connected, limiting plate (425) are used for supporting suction disc head (426), wafer (9) set up in suction disc head (426) upper end, suction disc head (426) are used for adsorbing fixed wafer (9), limiting plate (425) are used for supporting suction disc head (426).
6. A cleaning apparatus for wafers as set forth in claim 1, wherein: push-and-pull part (51) are including contact setting up in hollow stopper (511) of wasing pond (1) one side and run through fixed connection's second electric telescopic handle (512) with hollow stopper (511), and second electric telescopic handle (512) and control part (6) electric connection, hollow stopper (511) one side fixedly connected with slider (516), and slider (516) and washs pond (1) one side sliding connection, second electric telescopic handle (512) one end fixedly connected with connecting strip (513), hollow stopper (511) are used for spacing to second electric telescopic handle (512), the flexible of second electric telescopic handle (512) is used for driving connecting strip (513) horizontal migration.
7. A cleaning apparatus for wafers as set forth in claim 6, wherein: the upper end of the mounting plate (3) is fixedly connected with fixing blocks (514), the fixing blocks (514) are provided with two groups, guide strips (515) are fixedly connected between the two groups of fixing blocks (514), the guide strips (515) are movably connected with two sides of the connecting strips (513) in a penetrating mode, and the guide strips (515) are used for supporting the connecting strips (513) and guiding the connecting strips.
8. A cleaning apparatus for wafers as set forth in claim 7, wherein: the scraping component (52) comprises a first brush bar (521) fixedly connected to one side of the connecting bar (513) and a bolt (522) penetrating through the first brush bar (521) up and down, a second brush bar (523) is fixedly connected to the lower end of the bolt (522), one end of the second brush bar (523) is slidably connected to one side of the connecting bar (513), the first brush bar (521) and the second brush bar (523) are in contact with the wafer (9), the first brush bar (521) and the second brush bar (523) are used for cleaning the wafer (9), and the bolt (522) is used for adjusting the position of the second brush bar (523).
9. A cleaning apparatus for wafers as set forth in claim 1, wherein: lifting assembly (2) include with wash C type support frame (21) of pond (1) both sides fixed connection and with C type support frame (21) upper end run through fixed connection's third electric telescopic handle (22), and third electric telescopic handle (22) be provided with two sets of, two sets of third electric telescopic handle (22) lower extreme all with mounting panel (3) upper end fixed connection, two sets of third electric telescopic handle (22) all with control portion (6) electric connection, wash pond (1) one side embedding and be provided with water outlet member (7), two sets of third electric telescopic handle (22) be used for driving mounting panel (3) vertical removal.
10. A cleaning apparatus for wafers as set forth in claim 5, wherein: spray subassembly (8) including fixed connection supporting shoe (81) in washs pond (1) upper end, and supporting shoe (81) are provided with two sets of, two sets of supporting shoe (81) upper end fixedly connected with connecting pipe (82), connecting pipe (82) one end fixedly is provided with water pump (83), and the external cleaning solution water tank of water pump (83) other end, supporting shoe (81) surface embedding fixedly connected with fixed pipe (84), fixed pipe (84) other end fixedly connected with shower nozzle (85), and shower nozzle (85) correspond the setting with suction disc head (426), water pump (83) and control portion (6) electric connection, water pump (83) are used for with cleaning solution pump to connecting pipe (82) inside, fixed pipe (84) are used for intercommunication connecting pipe (82) and shower nozzle (85).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311120289.6A CN117102129A (en) | 2023-09-01 | 2023-09-01 | Cleaning device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311120289.6A CN117102129A (en) | 2023-09-01 | 2023-09-01 | Cleaning device for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117102129A true CN117102129A (en) | 2023-11-24 |
Family
ID=88812525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311120289.6A Withdrawn CN117102129A (en) | 2023-09-01 | 2023-09-01 | Cleaning device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117102129A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118136569A (en) * | 2024-03-29 | 2024-06-04 | 苏州冠礼科技有限公司 | Multi-size semiconductor drying device |
-
2023
- 2023-09-01 CN CN202311120289.6A patent/CN117102129A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118136569A (en) * | 2024-03-29 | 2024-06-04 | 苏州冠礼科技有限公司 | Multi-size semiconductor drying device |
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Application publication date: 20231124 |