CN117080107B - Semiconductor package detection system and detection process - Google Patents
Semiconductor package detection system and detection process Download PDFInfo
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- CN117080107B CN117080107B CN202311321629.1A CN202311321629A CN117080107B CN 117080107 B CN117080107 B CN 117080107B CN 202311321629 A CN202311321629 A CN 202311321629A CN 117080107 B CN117080107 B CN 117080107B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 238000001514 detection method Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000008569 process Effects 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims description 40
- 230000005540 biological transmission Effects 0.000 claims description 34
- 238000007689 inspection Methods 0.000 claims description 23
- 230000002457 bidirectional effect Effects 0.000 claims description 17
- 238000012545 processing Methods 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 8
- 230000002950 deficient Effects 0.000 claims description 6
- 230000001174 ascending effect Effects 0.000 claims description 5
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 244000309464 bull Species 0.000 claims description 3
- 241000252254 Catostomidae Species 0.000 claims 2
- 230000007306 turnover Effects 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention discloses a semiconductor package detection system and a semiconductor package detection process, and relates to the technical field of semiconductor package detection. According to the semiconductor packaging detection system and the detection process, the picking and placing of the box to be detected and the orientation adjustment of the lower surface, namely the periphery of the box to be detected, can be realized only through the forward and reverse rotation of the servo motor, and the upper surface image of the box to be detected, which is shot by the first camera, is matched, so that the quick turn-over image taking and flaw detection of six surfaces of the box to be detected can be realized, the work efficiency and the accuracy of flaw detection are effectively improved, and the manual load is reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor package detection, in particular to a semiconductor package detection system and a semiconductor package detection process.
Background
After the wafer from the wafer front process is subjected to a dicing process, the wafer is cut into small chips (Die), the cut chips are attached to the small islands of the corresponding substrate (Lead frame) frame by using glue, and bonding pads (Bond pads) of the chips are connected to corresponding pins (Lead) of the substrate by using ultrafine metal (gold, tin, copper, aluminum) wires or conductive resin to form a required circuit; then, the independent wafer is packaged and protected by a plastic shell, whether the appearance of the packaged semiconductor is flawless or not is observed through visual inspection after plastic packaging, and currently, the packaged semiconductor is conveyed to a detection personnel through a conveying belt for detection aiming at the semiconductor packaging, and the personnel manually turn over the plastic box to observe whether the defects exist on different surfaces or not.
At present, adopt the manual work to carry out visual inspection to the plastic box after the semiconductor encapsulation, need the manual work to the plastic box turn over, its detection mode inefficiency and artifical burden are high to miss easily, lead to the defective rate to improve.
Accordingly, in view of the above, research and improvement on the existing structure and defects have been made, and a semiconductor package inspection system and inspection process are proposed.
Disclosure of Invention
The invention provides a semiconductor package detection system and a semiconductor package detection process aiming at the defects of the prior art, and solves the problems in the background art.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a semiconductor encapsulation detecting system, includes transmission platform, carries material subassembly and turns over material subassembly, transmission platform's surface is provided with the transmission band, carry material subassembly equidistance to distribute in the surface of transmission band, and carry the inside of material subassembly to be settled and wait to detect the box, the both sides of transmission band are provided with the support, and the top side of support is fixed with first camera, turn over material subassembly parallel arrangement in the right side of support, turn over material subassembly includes feeding case, second camera, background board, servo motor, lead screw, conical gear group, gearbox, stop collar, movable rod, lift sucking disc, movable sleeve, eccentric gear bull stick, rack and interlock board, the inner wall left side of feeding case is provided with the second camera, and the right side of feeding case is provided with the background board, the top both sides of feeding case are provided with servo motor, and servo motor's bottom is connected with the lead screw, the outer wall of lead screw is fixed with conical gear group, and the side of conical gear group is connected with the spacer sleeve, and the inside of spacer sleeve inserts and is equipped with the movable rod, the bottom of movable rod is connected with the eccentric gear bull stick, the movable sleeve has the movable sleeve through the movable sleeve, the movable sleeve has the eccentric bearing.
Further, the material carrying assembly comprises a material carrying platform, a hollow sucker and a bidirectional air pump, wherein the hollow sucker is arranged in the material carrying platform, and the bottom of the hollow sucker is connected with the bidirectional air pump.
Further, the hollow sucker is equidistantly distributed in the material carrying platform, and the upper surface of the hollow sucker is contacted with the bottom of the box to be detected.
Further, the hollow sucker and the box to be detected are arranged in a one-to-one correspondence mode, and the hollow sucker is communicated with the bidirectional air pump.
Further, both ends of the linkage plate are fixedly connected with the movable sleeve, and the movable rod is in transmission connection with the servo motor through the linkage plate, the movable sleeve and the screw rod.
Further, the outer opening structure size of the movable rod is matched with the inner opening structure size of the limiting sleeve, and the movable rod and the transmission belt are vertically distributed.
Further, the rod body part of the eccentric gear rotating rod is positioned at one side of the lifting sucker, which is close to the background plate, and the rod body part of the eccentric gear rotating rod is not connected with the lifting sucker.
Further, the lifting sucker is in transmission connection with the servo motor through the movable rod, the limiting sleeve, the gearbox, the conical gear set and the screw rod, and is in one-to-one corresponding arrangement with the box to be detected.
Further, the rack is positioned on one side of the eccentric gear rotating rod, and the rack is in meshed connection with the eccentric gear rotating rod.
Further, a testing process of the semiconductor package testing system comprises the following operation steps:
step one: the to-be-detected box is a plastic box after semiconductor encapsulation, the to-be-detected box is arranged in the material carrying platform, so that the to-be-detected box is clung to the upper surface of the hollow sucker, the to-be-detected box is transmitted to the lower part of the first camera through the transmission belt, the first camera shoots an upper surface image of the to-be-detected box and transmits the upper surface image to the image processing center, and the image processing center subjects the image to graying treatment to highlight a flaw part;
step two: if the upper surface of the box to be detected is detected and is defective, the mechanical arm between the first camera and the feeding box clamps the box to be detected and takes the box to be detected out based on the fact that the box to be detected is defective when the box to be detected moves to the right side of the first camera, and if the upper surface of the box to be detected is not defective after the upper surface of the box to be detected is detected, the conveying belt conveys the box to be detected into the feeding box;
step three: when the box to be detected is positioned below the lifting sucker, the servo motor drives the screw rod to rotate so that the movable sleeve carries the linkage plate to descend, the linkage plate descends so that the movable rod extends out of the limiting sleeve, and the lifting sucker descends and presses the upper surface of the box to be detected to adsorb the box to be detected;
step four: after the box to be detected is stably adsorbed, the servo motor reversely rotates to enable the linkage plate to drive the lifting sucker to ascend, the screw rod reversely rotates to drive the limiting sleeve to rotate through the conical gear set and the gearbox, wherein the rotating speed of the limiting sleeve is regulated through the gearbox, the limiting sleeve can carry the movable rod to rotate, the lifting sucker rotates to enable four sides of the box to be detected to face the second camera in sequence while ascending, and the servo motor pauses operation every ninety degrees of rotation of the lifting sucker to facilitate the second camera to shoot clearly;
step five: after all four sides of the box to be detected are shot, the box to be detected and the lifting sucker continue to ascend along with the movable sleeve, when the eccentric gear rotating rod on the side of the movable sleeve is meshed with the rack, the movable sleeve ascends and the eccentric gear rotating rod rolls along the surface of the rack, so that the rod body part of the eccentric gear rotating rod rotates and pushes the lifting sucker to rotate ninety degrees by taking the bottom of the movable rod as the center of a circle, and the lower surface of the box to be detected is shot by the second camera;
step six: after the four side images and the lower surface of the box to be detected are shot, the servo motor turns forward again to enable the movable sleeve to descend, the movable sleeve passes through the rack again when descending, the lifting sucker turns vertical direction again, and the box to be detected is placed back into the loading platform by the lifting sucker;
step seven: after the box to be detected is placed in the material loading platform, the bottom of the box to be detected is clung to the top of the hollow sucker, and at the moment, the bidirectional air pump pumps out the air in the hollow sucker so that the hollow sucker firmly adsorbs the box to be detected, so that the box to be detected can be separated from the box to be detected after the lifting sucker ascends;
step eight: the four-side image and the lower surface image of the box to be detected are transmitted to an image processing center, the image processing center carries out graying processing on the image to highlight the flaw part, based on an image processing result, if flaws are detected, after the box to be detected moves to the right side of the feeding box, the mechanical arm on the right side of the feeding box clamps the box to be detected to be taken out based on the box to be detected with flaws, if no flaws exist, the box to be detected is transmitted to the tail end through a transmission belt to be collected, and when the box to be detected is taken out, the bidirectional air pump injects air into the hollow sucker so that the box to be detected is separated from the hollow sucker.
The invention provides a semiconductor package detection system and a detection process, which have the following beneficial effects:
1. this semiconductor encapsulation detecting system and detection process utilizes servo motor to drive the positive and negative rotation of lead screw and can realize the lift of lift sucking disc, still can drive the stop collar through conical gear group, gearbox simultaneously and rotate in order to realize the level rotation of lift sucking disc for lift sucking disc can carry when rising and wait to detect the box level rotation, so that wait to detect four sides of box and shoot with detecting whether have the flaw, and for shooting clearly comprehensively, through lift sucking disc every rotatory ninety degrees then servo motor pause operation in order to make things convenient for the second camera to shoot clearly.
2. The semiconductor packaging detection system and the detection process have the advantages that after all four sides of the to-be-detected box are shot, the to-be-detected box can continuously ascend, so that the rod body of the eccentric gear rotating rod rotates and pushes the lifting sucker to rotate ninety degrees, the lower surface of the to-be-detected box faces the second camera to be shot, the to-be-detected box can be taken and placed and the orientation of the lower surface, namely the periphery of the to-be-detected box, of the to-be-detected box can be adjusted only through forward and reverse rotation of the servo motor, and the image of the upper surface of the to-be-detected box shot by the first camera is matched, so that quick turn-over image taking and flaw detection of six faces of the to-be-detected box can be realized, the work efficiency and the accuracy of flaw detection can be effectively improved, and the labor burden can be reduced.
3. The bottom of the box to be detected is clung to the top of the hollow sucker, and at the moment, the bidirectional air pump pumps out the air inside the hollow sucker so that the hollow sucker firmly adsorbs the box to be detected, so that the lifting sucker can be conveniently lifted and separated from the box to be detected, and when the box to be detected is taken out, the bidirectional air pump injects air into the hollow sucker so that the box to be detected is separated from the box to be detected.
Drawings
FIG. 1 is a schematic diagram of the internal structure of a feed box of a semiconductor package inspection system and inspection process according to the present invention;
FIG. 2 is a schematic diagram of the internal flow structure of a loading platform of a semiconductor package inspection system and inspection process according to the present invention;
FIG. 3 is a schematic diagram of a lead screw structure of a semiconductor package inspection system and inspection process according to the present invention;
FIG. 4 is a schematic top view of a semiconductor package inspection system and a process for inspecting a carrier plate according to the present invention;
FIG. 5 is a schematic diagram of an eccentric gear rotating rod and rack engagement structure of a semiconductor package inspection system and inspection process according to the present invention;
fig. 6 is a schematic diagram of a ninety degree rotation structure of a lifting chuck of a semiconductor package inspection system and inspection process according to the present invention.
In the figure: 1. a transmission platform; 2. a transmission belt; 3. a loading assembly; 301. a material carrying platform; 302. a hollow sucker; 303. a two-way air pump; 4. a bracket; 5. a first camera; 6. a material turning component; 601. a feed box; 602. a second camera; 603. a background plate; 604. a servo motor; 605. a screw rod; 606. a conical gear set; 607. a gearbox; 608. a limit sleeve; 609. a movable rod; 610. lifting the sucker; 611. a moving sleeve; 612. an eccentric gear rotating rod; 613. a rack; 614. a linkage plate; 7. and (5) detecting the box.
Detailed Description
Embodiments of the present invention are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the invention but are not intended to limit the scope of the invention.
As shown in fig. 1 to 6, the present invention provides the following technical solutions: the semiconductor packaging detection system comprises a transmission platform 1, a material carrying component 3 and a material turning component 6, wherein the surface of the transmission platform 1 is provided with a transmission belt 2, the material carrying component 3 is equidistantly distributed on the surface of the transmission belt 2, a box 7 to be detected is arranged in the material carrying component 3, two sides of the transmission belt 2 are provided with brackets 4, the top side of each bracket 4 is fixedly provided with a first camera 5, the material turning component 6 is arranged on the right side of each bracket 4 in parallel, the material turning component 6 comprises a feeding box 601, a second camera 602, a background plate 603, a servo motor 604, a screw rod 605, a conical gear set 606, a gearbox 607, a limiting sleeve 608, a movable rod 609, a lifting sucker 610, a movable sleeve 611, an eccentric gear rotating rod 612, a rack 613 and a linkage plate 614, the left side of the inner wall of the feeding box 601 is provided with a second camera 602, the right side of the feeding box 601 is provided with a background plate 603, the two sides of the top of the feeding box 601 are provided with a servo motor 604, the bottom end of the servo motor 604 is connected with a screw rod 605, the outer wall of the screw rod 605 is fixedly provided with a conical gear set 606, the side surface of the conical gear set 606 is connected with a gearbox 607, the bottom of the gearbox 607 is connected with a limit sleeve 608, the inside of the limit sleeve 608 is inserted with a movable rod 609, the bottom of the movable rod 609 is rotationally connected with a lifting sucker 610, the outer wall of the screw rod 605 is connected with a movable sleeve 611, the outer opening structure size of the movable rod 609 is matched with the inner opening structure size of the limit sleeve 608, the movable rod 609 and the transmission belt 2 are vertically distributed, the rod body part of the eccentric gear rotating rod 612 is positioned on one side of the lifting sucker 610 close to the background plate 603, the rod body part of the eccentric gear rotating rod 612 is not connected with the lifting sucker 610, the lifting sucker 610 is in transmission connection with the servo motor 604 through the movable rod 609, the limit sleeve 608, the gearbox 607, the conical gear set 606 and the screw rod 605, and the lifting sucker 610 and the box 7 to be detected are arranged in one-to-one correspondence;
the specific operation is that the to-be-detected box 7 is a plastic box after semiconductor encapsulation, the to-be-detected box 7 is arranged in the material carrying platform 301, the to-be-detected box 7 is transmitted to the lower part of the first camera 5 through the transmission belt 2, the first camera 5 shoots an upper surface image of the to-be-detected box 7 and transmits the upper surface image to the image processing center, the image processing center carries out gray processing on the image to highlight a flaw part, if the upper surface of the to-be-detected box 7 is detected, a mechanical arm between the first camera 5 and the feeding box 601 clamps and takes the to-be-detected box 7 out based on the fact that the to-be-detected box 7 moves to the right side of the first camera 5 when the to-be-detected box 7 is moved to the right side of the first camera 5, and the transmission belt 2 transmits the to-be-detected box 7 to the inside of the feeding box 601 if the upper surface of the to-be-detected box 7 is not flaw;
when the box 7 to be detected is positioned below the lifting sucker 610, the servo motor 604 drives the screw rod 605 to rotate so that the movable sleeve 611 carries the linkage plate 614 to descend, the linkage plate 614 descends so that the movable rod 609 extends out of the inside of the limit sleeve 608, the lifting sucker 610 descends and presses the upper surface of the box 7 to be detected to adsorb the box 7 to be detected, the upper surface of the box 7 to be detected is photographed, photographing of other surfaces of the box 7 to be detected is not affected when the upper surface of the box 7 to be detected is adsorbed, then the servo motor 604 reversely rotates so that the linkage plate 614 drives the lifting sucker 610 to ascend, the screw rod 605 reversely rotates so that the limit sleeve 608 is driven to rotate through the conical gear set 606 and the gearbox 607, the rotation speed of the limit sleeve 608 is regulated through the gearbox 607, and the movable rod 609 is carried to rotate by the limit sleeve 608, and the lifting sucker 610 ascends so that four sides of the box 7 to be detected face the second camera 602 in sequence to photograph;
the lifting of the lifting sucker 610 can be realized by utilizing the servo motor 604 to drive the forward and reverse rotation of the screw rod 605, and meanwhile, the limit sleeve 608 can be driven to rotate through the conical gear set 606 and the gearbox 607 to realize the horizontal rotation of the lifting sucker 610, so that the lifting sucker 610 can carry the box 7 to be detected to horizontally rotate when ascending, the four sides of the box 7 to be detected can be photographed to detect whether flaws exist, and for the purpose of photographing clearly and comprehensively, the servo motor 604 can pause operation to facilitate the second camera 602 to photograph clearly when the lifting sucker 610 rotates ninety degrees each time;
as shown in fig. 3 and fig. 5-6, the side surface of the moving sleeve 611 is rotatably connected with an eccentric gear rotating rod 612, racks 613 are fixed on two sides of the inner wall of the feeding box 601, the outer wall of the moving rod 609 is connected with a linkage plate 614 through a bearing, two ends of the linkage plate 614 are fixedly connected with the moving sleeve 611, the moving rod 609 is in transmission connection with the servo motor 604 through the linkage plate 614, the moving sleeve 611 and the screw rod 605, the racks 613 are positioned on one side of the eccentric gear rotating rod 612, and the racks 613 are in meshed connection with the eccentric gear rotating rod 612;
the specific operation is that after all four sides of the box 7 to be detected are shot, the box 7 to be detected and the lifting sucker 610 continue to rise along with the moving sleeve 611, when the eccentric gear rotating rod 612 on the side of the moving sleeve 611 is meshed with the rack 613, the moving sleeve 611 rises and the eccentric gear rotating rod 612 rolls along the surface of the rack 613, so that the rod body part of the eccentric gear rotating rod 612 rotates and pushes the lifting sucker 610 to rotate ninety degrees around the bottom of the movable rod 609, the lower surface of the box 7 to be detected is shot by the second camera 602, the four side images and the lower surface images of the box 7 to be detected are transmitted to the image processing center, the image processing center performs graying processing on the images to highlight the defect part, and based on the image processing result, if the defect is detected, the mechanical arm on the right side of the feeding box 601 clamps the box 7 to be detected, if the defect is not detected, the box 7 to be detected is transmitted to the tail end through the transmission belt 2 and is collected;
the four sides of the box 7 to be detected can be continuously lifted after being photographed, the eccentric gear rotating rod 612 rolls along the surface of the rack 613 in the lifting process, so that the rod body part of the eccentric gear rotating rod 612 rotates and pushes the lifting sucker 610 to rotate ninety degrees, the lower surface of the box 7 to be detected faces the second camera 602 to be photographed, the box 7 to be detected can be taken and placed and the direction of the lower surface, which is the periphery of the box 7 to be detected, can be adjusted only by the forward and reverse rotation of the servo motor 604, and the upper surface image of the box 7 to be detected, which is photographed by the first camera 5, is matched, and therefore quick turn-over image taking and flaw detection of six faces of the box 7 to be detected can be achieved, work efficiency and accuracy of flaw detection are effectively improved, and manual burden is reduced.
As shown in fig. 1-3, the material carrying assembly 3 comprises a material carrying platform 301, a hollow sucker 302 and a bidirectional air pump 303, wherein the hollow sucker 302 is arranged in the material carrying platform 301, the bottom of the hollow sucker 302 is connected with the bidirectional air pump 303, the hollow sucker 302 is equidistantly distributed in the material carrying platform 301, the upper surface of the hollow sucker 302 is in contact with the bottom of the box 7 to be detected, the hollow sucker 302 is in one-to-one correspondence with the box 7 to be detected, and the hollow sucker 302 is communicated with the bidirectional air pump 303;
the specific operation is as follows, wait to detect box 7 and be the plastic box after the semiconductor encapsulation, wait to detect box 7 and arrange in the inside of carrying platform 301, after all accomplishing the shooting on six surfaces of waiting to detect box 7, wait to detect box 7 and put back the inside of carrying platform 301 again, and take out the inside air of cavity sucking disc 302 through two-way air pump 303 so that cavity sucking disc 302 firmly adsorbs wait to detect box 7, it separates with waiting to detect box 7 after ascending in order to make things convenient for lifting sucking disc 610, and when taking out wait to detect box 7, two-way air pump 303 pours into the air into cavity sucking disc 302 inside so that wait to detect box 7 and separation rather than.
As shown in fig. 1 to 6, a testing process of a semiconductor package testing system includes the following steps:
step one: the to-be-detected box 7 is a plastic box after semiconductor encapsulation, the to-be-detected box 7 is arranged in the material carrying platform 301, so that the to-be-detected box 7 is clung to the upper surface of the hollow sucker 302, the to-be-detected box 7 is transmitted to the lower part of the first camera 5 through the transmission belt 2, the image of the upper surface of the to-be-detected box 7 is shot by the first camera 5 and is transmitted to the image processing center, and the image processing center subjects the image to gray processing to highlight defective parts;
step two: if the upper surface of the box 7 to be detected is detected and then has flaws, the mechanical arm between the first camera 5 and the feeding box 601 clamps and takes out the box 7 to be detected based on the flaws when the box 7 to be detected moves to the right side of the first camera 5, and the conveying belt 2 conveys the box 7 to be detected into the feeding box 601 if the upper surface of the box 7 to be detected is detected and then has no flaws;
step three: when the box 7 to be detected is positioned below the lifting sucker 610, the servo motor 604 drives the screw rod 605 to rotate so that the movable sleeve 611 carries the linkage plate 614 to descend, the linkage plate 614 descends so that the movable rod 609 extends out of the limiting sleeve 608, and the lifting sucker 610 descends and presses the upper surface of the box 7 to be detected to adsorb the box 7;
step four: after the box 7 to be detected is stably adsorbed, the servo motor 604 reversely rotates to enable the linkage plate 614 to drive the lifting sucker 610 to ascend, the screw rod 605 reversely rotates to drive the limiting sleeve 608 to rotate through the conical gear set 606 and the gearbox 607, wherein the rotating speed of the limiting sleeve 608 is regulated through the gearbox 607, the limiting sleeve 608 can also carry the movable rod 609 to rotate, the lifting sucker 610 rotates to enable four sides of the box 7 to be detected to sequentially face the second camera 602 while ascending, and the servo motor 604 can pause operation to facilitate the second camera 602 to shoot clearly when the lifting sucker 610 rotates ninety degrees;
step five: after all four sides of the box 7 to be detected are photographed, the box 7 to be detected and the lifting sucker 610 continue to ascend along with the moving sleeve 611, when the eccentric gear rotating rod 612 on the side of the moving sleeve 611 is meshed with the rack 613, the moving sleeve 611 ascends and the eccentric gear rotating rod 612 rolls along the surface of the rack 613, so that the rod body part of the eccentric gear rotating rod 612 rotates and pushes the lifting sucker 610 to rotate ninety degrees around the bottom of the movable rod 609, and the lower surface of the box 7 to be detected is photographed by the second camera 602;
step six: after the four side images and the lower surface of the box 7 to be detected are shot, the servo motor 604 turns forward again to enable the moving sleeve 611 to descend, and the moving sleeve 611 passes through the rack 613 again when descending, so that the lifting sucker 610 turns to be vertical again until the lifting sucker 610 returns the box 7 to be detected to the inside of the loading platform 301;
step seven: after the box 7 to be detected is placed in the material carrying platform 301, the bottom of the box 7 to be detected is tightly attached to the top of the hollow sucker 302, and at the moment, the bidirectional air pump 303 pumps out air in the hollow sucker 302 so that the hollow sucker 302 firmly adsorbs the box 7 to be detected, so that the lifting sucker 610 can be conveniently separated from the box 7 to be detected after being lifted;
step eight: the four-sided image and the lower surface image of the cartridge to be inspected 7 are transmitted to an image processing center, the image processing center subjects the image to graying processing to highlight the flaw portion, based on the image processing result, after the cartridge to be inspected 7 is moved to the right side of the feed box 601 if a flaw is detected, the mechanical arm on the right side of the feed box 601 clamps and takes out the cartridge to be inspected 7 based on the cartridge to be inspected 7 having a flaw, if no flaw is detected, the cartridge to be inspected 7 is transmitted to the end through the transmission belt 2 to be collected, and when the cartridge to be inspected 7 is taken out, the bidirectional air pump 303 injects air into the hollow suction cup 302 so that the cartridge to be inspected 7 is separated therefrom.
The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (10)
1. The utility model provides a semiconductor package detecting system, includes transmission platform (1), carries material subassembly (3) and turns over material subassembly (6), its characterized in that: the surface of the transmission platform (1) is provided with a transmission belt (2), the material carrying components (3) are equidistantly distributed on the surface of the transmission belt (2), the inside of the material carrying components (3) is provided with a to-be-detected box (7), two sides of the transmission belt (2) are provided with a support (4), the top side of the support (4) is fixedly provided with a first camera (5), the material turning components (6) are arranged on the right side of the support (4) in parallel, the material turning components (6) comprise a second camera (601), a background plate (603), a servo motor (604), a screw rod (605), a conical gear set (606), a gearbox (607), a limiting sleeve (608), a movable rod (609), a lifting sucker (610), a movable sleeve (611), an eccentric gear rotating rod (612), a rack (613) and a linkage plate (614), the left side of the inner wall of the feeding box (601) is provided with a second camera (602), the right side of the box (601) is provided with a background plate (603), the top of the motor (601) is provided with a feeding motor (604), the bottom end of the screw rod (605) is fixedly connected with the screw rod (604), and the side of taper gear group (606) is connected with gearbox (607), the bottom of gearbox (607) is connected with stop collar (608), and the inside of stop collar (608) is inserted and is equipped with movable rod (609), the bottom rotation of movable rod (609) is connected with lift sucking disc (610), the outer wall connection of lead screw (605) has movable sleeve (611), and the side rotation of movable sleeve (611) is connected with eccentric gear bull stick (612), the inner wall both sides of feeding case (601) are fixed with rack (613), the outer wall of movable rod (609) is connected with interlock board (614) through the bearing.
2. A semiconductor package inspection system according to claim 1, wherein: the material carrying assembly (3) comprises a material carrying platform (301), a hollow sucker (302) and a bidirectional air pump (303), wherein the hollow sucker (302) is arranged in the material carrying platform (301), and the bidirectional air pump (303) is connected to the bottom of the hollow sucker (302).
3. A semiconductor package inspection system according to claim 2, wherein: the hollow suckers (302) are distributed in the material carrying platform (301) at equal intervals, and the upper surfaces of the hollow suckers (302) are in contact with the bottom of the to-be-detected box (7).
4. A semiconductor package inspection system according to claim 2, wherein: the hollow sucker (302) and the box (7) to be detected are arranged in one-to-one correspondence, and the hollow sucker (302) is communicated with the bidirectional air pump (303).
5. A semiconductor package inspection system according to claim 1, wherein: the two ends of the linkage plate (614) are fixedly connected with the movable sleeve (611), and the movable rod (609) is in transmission connection with the servo motor (604) through the linkage plate (614), the movable sleeve (611) and the screw rod (605).
6. A semiconductor package inspection system according to claim 1, wherein: the outer opening structure size of the movable rod (609) is matched with the inner opening structure size of the limit sleeve (608), and the movable rod (609) and the conveying belt (2) are vertically distributed.
7. A semiconductor package inspection system according to claim 1, wherein: the rod body part of the eccentric gear rotating rod (612) is positioned at one side of the lifting sucker (610) close to the background plate (603), and the rod body part of the eccentric gear rotating rod (612) is not connected with the lifting sucker (610).
8. A semiconductor package inspection system according to claim 1, wherein: the lifting sucker (610) is in transmission connection with the servo motor (604) through the movable rod (609), the limiting sleeve (608), the gearbox (607), the conical gear set (606) and the screw rod (605), and the lifting sucker (610) and the box (7) to be detected are in one-to-one correspondence.
9. A semiconductor package inspection system according to claim 1, wherein: the rack (613) is positioned on one side of the eccentric gear rotating rod (612), and the rack (613) is in meshed connection with the eccentric gear rotating rod (612).
10. The inspection process of a semiconductor package inspection system according to any one of claims 1 to 9, wherein: the detection process of the semiconductor package detection system comprises the following operation steps:
step one: the to-be-detected box (7) is a plastic box after semiconductor encapsulation, the to-be-detected box (7) is arranged in the material carrying platform (301), the to-be-detected box (7) is clung to the upper surface of the hollow sucker (302), the to-be-detected box (7) is transmitted to the lower part of the first camera (5) through the transmission belt (2), the first camera (5) shoots an upper surface image of the to-be-detected box (7) and transmits the upper surface image to the image processing center, and the image processing center subjects the image to gray processing to highlight defective parts;
step two: if the upper surface of the box to be detected (7) is detected and then has flaws, the mechanical arm between the first camera (5) and the feeding box (601) clamps and takes out the box to be detected (7) based on the flaws when the box to be detected (7) moves to the right side of the first camera (5), and the conveying belt (2) conveys the box to be detected (7) to the inside of the feeding box (601) if the upper surface of the box to be detected (7) is detected and then has no flaws;
step three: when the box (7) to be detected is positioned below the lifting sucker (610), the servo motor (604) drives the screw rod (605) to rotate so that the movable sleeve (611) carries the linkage plate (614) to descend, the linkage plate (614) descends so that the movable rod (609) stretches out of the limiting sleeve (608), and the lifting sucker (610) descends and is pressed on the upper surface of the box (7) to be detected to adsorb the box;
step four: after the box (7) to be detected is stably adsorbed, the servo motor (604) reversely rotates to enable the linkage plate (614) to drive the lifting sucker (610) to ascend, the screw rod (605) reversely rotates to drive the limit sleeve (608) to rotate through the conical gear set (606) and the gearbox (607), wherein the rotating speed of the limit sleeve (608) is regulated through the gearbox (607), the limit sleeve (608) can carry the movable rod (609) to rotate, the lifting sucker (610) rotates while ascending to enable the four side faces of the box (7) to be detected to sequentially face the second camera (602), and the servo motor (604) can pause operation to facilitate the second camera (602) to shoot clearly when the lifting sucker (610) rotates ninety degrees each time;
step five: after all four sides of the box (7) to be detected are shot, the box (7) to be detected and the lifting sucker (610) continue to ascend along with the moving sleeve (611), when the eccentric gear rotating rod (612) on the side of the moving sleeve (611) is meshed with the rack (613), the moving sleeve (611) ascends and the eccentric gear rotating rod (612) rolls along the surface of the rack (613), so that the rod body part of the eccentric gear rotating rod (612) rotates and pushes the lifting sucker (610) to rotate ninety degrees by taking the bottom of the movable rod (609) as the center of a circle, and the lower surface of the box (7) to be detected is shot by the second camera (602);
step six: after the four side images and the lower surface of the box (7) to be detected are shot, the servo motor (604) turns forward again to enable the movable sleeve (611) to descend, the movable sleeve (611) passes through the rack (613) again when descending, the lifting sucker (610) turns to be vertical again, and the box (7) to be detected is placed back into the material loading platform (301) by the lifting sucker (610);
step seven: after the box (7) to be detected is placed in the material carrying platform (301), the bottom of the box (7) to be detected is tightly attached to the top of the hollow sucker (302), and at the moment, the bidirectional air pump (303) pumps out air in the hollow sucker (302) so that the hollow sucker (302) firmly adsorbs the box (7) to be detected, so that the lifting sucker (610) can be conveniently separated from the box (7) to be detected after being lifted;
step eight: the four-side image and the lower surface image of the box to be detected (7) are transmitted to an image processing center, the image processing center subjects the image to gray processing to highlight a flaw part, based on an image processing result, after the box to be detected (7) is moved to the right side of a feeding box (601) if flaws are detected, a mechanical arm on the right side of the feeding box (601) clamps and takes out the box to be detected (7) based on the box to be detected (7) with flaws, if no flaws exist, the box to be detected (7) is transmitted to the tail end through a transmission belt (2) to be collected, and when the box to be detected (7) is taken out, the bidirectional air pump (303) injects air into the hollow sucker (302) so that the box to be detected (7) is separated from the hollow sucker.
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| CN101673695A (en) * | 2008-09-08 | 2010-03-17 | 京元电子股份有限公司 | Double-side detection equipment for bare crystalline grains |
| CN106971957A (en) * | 2017-05-31 | 2017-07-21 | 成都福誉科技有限公司 | A kind of surface defect screening installation of solar silicon wafers |
| CN215812361U (en) * | 2021-07-30 | 2022-02-11 | 保定中泰新能源科技有限公司 | Solar energy component defect detector tilting mechanism |
| CN114355166A (en) * | 2022-01-10 | 2022-04-15 | 深圳市斯迈得半导体有限公司 | LED packaged chip detection device |
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2023
- 2023-10-13 CN CN202311321629.1A patent/CN117080107B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101673695A (en) * | 2008-09-08 | 2010-03-17 | 京元电子股份有限公司 | Double-side detection equipment for bare crystalline grains |
| CN106971957A (en) * | 2017-05-31 | 2017-07-21 | 成都福誉科技有限公司 | A kind of surface defect screening installation of solar silicon wafers |
| CN215812361U (en) * | 2021-07-30 | 2022-02-11 | 保定中泰新能源科技有限公司 | Solar energy component defect detector tilting mechanism |
| CN114355166A (en) * | 2022-01-10 | 2022-04-15 | 深圳市斯迈得半导体有限公司 | LED packaged chip detection device |
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