CN116008305A - Chip gold thread defect detection device and detection method thereof - Google Patents
Chip gold thread defect detection device and detection method thereof Download PDFInfo
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- CN116008305A CN116008305A CN202211609250.6A CN202211609250A CN116008305A CN 116008305 A CN116008305 A CN 116008305A CN 202211609250 A CN202211609250 A CN 202211609250A CN 116008305 A CN116008305 A CN 116008305A
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- 238000001514 detection method Methods 0.000 title claims abstract description 115
- 230000007547 defect Effects 0.000 title claims abstract description 54
- 241000218202 Coptis Species 0.000 title claims abstract description 20
- 235000002991 Coptis groenlandica Nutrition 0.000 title claims abstract description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 61
- 238000007599 discharging Methods 0.000 claims description 34
- 238000004140 cleaning Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 30
- 239000010931 gold Substances 0.000 claims description 22
- 229910052737 gold Inorganic materials 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 16
- 230000007246 mechanism Effects 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 10
- 229920000742 Cotton Polymers 0.000 claims description 7
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- 238000007689 inspection Methods 0.000 description 4
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Abstract
The invention relates to the technical field of machine vision defect detection, in particular to a chip gold thread defect detection device, which comprises a detection table, wherein a fixing frame is arranged in the middle of the upper end surface of the detection table, and a detection camera is arranged in the fixing frame; the detection chip gold wire is subjected to image acquisition processing at different angles, so that multi-angle defect detection is realized on the chip gold wire, and the accuracy of the chip gold wire defect detection is remarkably improved.
Description
Technical Field
The invention relates to the technical field of machine vision defect detection, in particular to a chip gold thread defect detection device and a detection method thereof.
Background
The chip is provided with gold wires which are used for connecting the integrated circuit chip with the lead frame, and after the chip is produced, chip gold wire detection equipment is required to detect the chip so as to remove defective products, and then the chip is shipped;
when the existing chip gold wire detection device detects gold wires on a chip, an image collector and the chip are usually detected in a vertical state, for example, a chip gold wire detection machine disclosed in the patent number of CN109524323A is adopted, the adopted technical scheme is that a first driving component drives a camera to move to the upper part of a workpiece carrying table along the width direction of a machine body, and then a second detection camera drives a detection camera to move downwards, so that the detection camera can shoot the chip gold wires; although the chip gold wire shooting detection is realized, the patent only can shoot the vertical direction image acquisition detection to the chip gold wire, and the image that leads to gathering only includes the image data of chip Jin Xianshang terminal surface, therefore, when chip gold wire side has the defect, the defect of chip gold wire just can not be detected to the chip gold wire detection machine that above-mentioned patent discloses, and then the omission of chip gold wire image is adopted the problem, leads to the chip gold wire defect detection's degree of accuracy low.
Therefore, we propose a chip gold thread defect detection device, and also disclose a detection method of the chip gold thread defect detection device.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a chip gold wire defect detection device and a chip gold wire defect detection method, which are used for improving the detection efficiency of the chip gold wire defect and the accuracy of the chip gold wire defect detection.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the chip gold thread defect detection device comprises a detection table, wherein a fixing frame is arranged in the middle of the upper end face of the detection table, a detection camera is arranged in the fixing frame, a first electric sliding table is arranged on one side of the top of the detection table, a workpiece conveying mechanism is arranged on one side of the first electric sliding table, a feeding part is further arranged on one side of the top of the detection table, and a discharging part is further arranged on the other side of the top of the detection table;
the workpiece conveying mechanism comprises a connecting frame, one side of the connecting frame is connected with one side of the first electric sliding table, a rotating frame is arranged in the connecting frame in a rotating mode, fixing plates are arranged on two sides of the top of the rotating frame, a placing frame is arranged between the fixing plates, a workpiece groove is formed in the placing frame, supporting frames are arranged on two sides of the inner wall of the workpiece groove, movable frames are arranged on the front side and the rear side of the inner wall of the workpiece groove, second electric sliding tables are further arranged on two sides of the inner wall of the workpiece groove, one sides of the two second electric sliding tables are connected with two sides of the two movable frames respectively, through grooves are formed in the two movable frames respectively, a screw rod is arranged in the movable frames in a rotating mode, and sliding blocks are arranged on two sides of the surface of the screw rod;
one side of the fixing plate positioned at the left side is provided with a steering motor, and the output end of the steering motor is connected with one side of the placing frame.
Preferably, two annular sliding grooves are formed in one opposite sides of the fixing plate, sliding blocks are arranged on two sides of the placing frame, the two sliding blocks are respectively arranged in the two annular sliding grooves in a sliding mode, a driving frame is arranged on one side of the connecting frame, a driving motor is arranged at the top of the driving frame, a driving gear is arranged in the driving frame in a rotating mode, and tooth grooves meshed with the driving gear are formed in the outer peripheral surface of the rotating frame.
Preferably, one side of each sliding block is located in the movable frame and is in sliding connection with the inside of the movable frame, a first limiting block is arranged below the front side of each sliding block, a first miniature electric cylinder is further arranged above the front side of each sliding block, a second limiting block is arranged at the driving end of each first miniature electric cylinder, and rotating rollers are arranged in the first limiting blocks and the second limiting blocks in a rotating mode.
Preferably, the feeding part comprises a feeding frame and a feeding frame, the feeding frame is arranged on one side of the feeding frame, a movable feeding frame is arranged in the feeding frame, and the bottom of the movable feeding frame is driven by an electric push rod.
Preferably, the both sides of material loading frame inner wall all are provided with the electronic slip table of third, and one side of two electronic slips tables of third all extends to the inside of pay-off frame, two the opposite side of electronic slip table of third all is provided with the clamp flitch through electric putter.
Preferably, the feeding port is formed in the bottom of the inner wall of the feeding frame, a first servo electric cylinder is arranged at the top of the feeding frame, the driving end of the first servo electric cylinder extends to the inside of the feeding frame, and an electromagnetic chuck is arranged at one end of the first servo electric cylinder extending to the inside of the feeding frame.
Preferably, the front of mount still is provided with fourth electronic slip table, and the front of fourth electronic slip table is provided with the connection frame, the inside activity of connection frame is provided with the clearance frame, and the top of clearance frame seted up with detect camera matched with clearance groove.
Preferably, the cleaning cotton sliver is rotatably arranged below the cleaning groove, one side of the cleaning cotton sliver is rotatably driven through an output shaft of the motor, one side of the top of the connecting frame is provided with a second servo electric cylinder, and the driving end of the second servo electric cylinder is connected with one side of the top of the cleaning frame.
Preferably, the discharging part comprises a qualified product discharging frame and a unqualified product discharging frame, the qualified product discharging frame and the unqualified product discharging frame are arranged above the detecting table side by side, the tops of the qualified product discharging frame and the unqualified product discharging frame are provided with sliding frames in a sliding mode, the two sliding frames are provided with material receiving frames in the sliding frames, and the bottoms of the material receiving frames are driven by an electric push rod.
A detection method of a chip gold thread defect detection device comprises the following specific steps:
firstly, stacking chips to be detected on a movable material frame, pushing the movable material frame upwards by utilizing the driving end of an electric push rod to enable the uppermost chip to be positioned between two material clamping plates, clamping two sides of the chips by utilizing the two material clamping plates, and conveying the chips into the material frame under the driving of a third electric sliding table;
pushing the electromagnetic chuck downwards by utilizing the driving end of the first servo electric cylinder, adsorbing the upper end surface of the chip by the electromagnetic chuck, and then driving the chip to pass through the feeding port to be sent into the rack for limiting;
thirdly, supporting two sides of the bottom of the chip by using the upper end faces of the two supporting frames, driving the movable frame to approach one side of the chip by using the second electric sliding table until one side of the first limiting block contacts with the side of the chip, and then pushing the second limiting block downwards by the driving end of the first miniature electric cylinder until the bottom of the second limiting block contacts with the upper end face of the chip;
step four, the first electric sliding table is utilized to drive the whole connecting frame to move to the position right below the detection camera, the detection camera is used for collecting images of the chip gold wires in the placing frame, and the detection camera is used for collecting images of the whole chip gold wires by adjusting the positions of the first limiting blocks and the second limiting blocks on the two sides of the chip in the collecting process;
fifthly, an output shaft of a steering motor drives a placing frame to rotate between two fixed plates, the placing frame is in a vertical state, image acquisition is carried out on the side edges of the chip gold wires by utilizing a detection camera, the driving gear is driven to rotate in the driving frame by matching with the output shaft of the driving motor, the driving gear synchronously drives the rotating frame to rotate in the connecting frame in the rotating process, the chip angle in the placing frame is further adjusted, and defects are analyzed after multi-angle image acquisition is carried out on the chip gold wires;
step six, generating qualified signals and unqualified signals from analysis results, sending the qualified signals and the unqualified signals to a control module, driving a workpiece conveying mechanism to move to the upper part of a qualified product discharging frame or a unqualified product discharging frame through a first electric sliding table according to the signals of the analysis results, automatically taking out chips in the placing frame through a receiving frame, and then classifying and sending out the chips of the qualified products and the unqualified products.
The invention provides a chip gold thread defect detection device and a detection method thereof. Compared with the prior art, the method has the following beneficial effects:
the automatic feeding of the detection chip is realized by arranging the feeding part on the detection table, the efficiency of detecting the gold wire defects of the chip is improved, the detection chip is automatically conveyed by utilizing the workpiece conveying mechanism arranged on one side of the feeding part, the detection chip is positioned in the placement frame by matching the first limiting block and the second limiting block with the two supporting frames, and the detection camera is utilized to perform image acquisition and analysis on the gold wire of the detection chip in the placement frame, so that the detection efficiency of the gold wire defects of the chip is improved; the angle of the placing frame is adjusted by controlling the placing frame to rotate, and then the image acquisition processing of different angles is carried out on the gold wires of the detection chip in the placing frame, so that the multi-angle defect detection of the gold wires of the chip is realized, and the accuracy of the defect detection of the gold wires of the chip is obviously improved; the chip angle in the placing frame is further adjusted after the rotating frame rotates, the image acquisition comprehensiveness of the chip gold wires is improved, and the accuracy of chip gold wire defect detection is remarkably improved.
Through the both sides activity setting of first stopper and second stopper at the chip, utilize the inside live-rollers of first stopper and second stopper to contact with the side of chip, avoid first stopper and second stopper to produce frictional loss at the in-process that removes with the side of chip, effectively protected the integrality that detects the chip side, when utilizing the side that detects the camera to the chip gold thread to carry out image acquisition in addition, rotate to vertical state through the control rack, two sliding blocks of recontrol and the adjustment of detecting chip contact position, realize detecting the holistic image acquisition of chip gold thread, avoid appearing the hourglass of chip gold thread image, show the detection accuracy that improves the chip gold thread defect.
By arranging the connecting frame and the cleaning frame connecting structure on the front surface of the fixing frame, when the detection equipment is stopped, the lens of the detection camera enters the cleaning groove, so that the surface of the detection camera is prevented from being polluted in a stop state; when the lens surface of the detection camera is cleaned, the cleaning frame is continuously driven to lift upwards until the surface of the cleaning sliver is in contact with the lens surface of the detection camera, the motor is used for driving the cleaning sliver to rotate on the lens surface of the detection camera, automatic cleaning of the lens surface of the detection camera is achieved, and the fact that the detection camera surface has dirt to influence the accuracy of chip gold thread image acquisition is avoided.
Drawings
FIG. 1 is a schematic diagram of a device for detecting defects of gold wires of a chip according to an embodiment of the invention;
FIG. 2 is a front view of a device for detecting defects of gold wires of a chip according to an embodiment of the present invention;
FIG. 3 is a rear view showing a structure of a device for detecting gold wire defects of a chip according to an embodiment of the present invention;
FIG. 4 is a schematic view of a structure of a connecting frame, a rotating frame and a placing frame according to an embodiment of the present invention;
FIG. 5 is a schematic view of a turret, a rack, and a driving rack according to an embodiment of the invention;
FIG. 6 is a schematic view of the internal structure of a rack according to an embodiment of the present invention;
FIG. 7 is a schematic view of a structure of a fixing frame, a connecting frame and a cleaning frame according to an embodiment of the present invention;
fig. 8 is a schematic diagram of an internal structure of a connection frame and a cleaning frame according to an embodiment of the present invention.
In the figure, 10, a detection table; 20. a fixing frame; 30. detecting a camera; 40. a first electric slipway; 50. a workpiece conveying mechanism; 11. a connecting frame; 12. a rotating frame; 13. a fixing plate; 14. a placing rack; 15. a workpiece groove; 16. a support frame; 17. a drive rack; 18. a driving motor; 19. a drive gear; 21. a movable frame; 22. the second electric sliding table; 23. a through groove; 24. a screw rod; 25. a sliding block; 26. a steering motor; 27. an annular chute; 28. a slide block; 29. a first limiting block; 210. a first micro electric cylinder; 211. a second limiting block; 31. a feeding frame; 32. a feeding frame; 33. a movable material rack; 34. a third electric slipway; 35. a clamping plate; 36. a first servo cylinder; 41. a fourth electric slipway; 42. a connection frame; 43. a cleaning frame; 44. cleaning the groove; 45. cleaning cotton sliver; 46. a second servo cylinder; 51. a qualified product discharging frame; 52. a reject discharging frame; 53. a carriage; 54. and a receiving rack.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1 to 8, a chip gold wire defect detecting device includes a detecting table 10, a fixing frame 20 is provided in the middle of the upper end surface of the detecting table 10, and a detecting camera 30 is provided in the fixing frame 20, wherein the detecting camera 30 adopts a high-precision 500W color CCD camera, and a lens adopts a high-precision 12.5X high-magnification lens;
a first electric sliding table 40 is arranged on one side of the top of the detection table 10, and a workpiece conveying mechanism 50 is arranged on one side of the first electric sliding table 40;
the workpiece conveying mechanism 50 comprises a connecting frame 11, one side of the connecting frame 11 is connected with one side of the first electric sliding table 40, a rotating frame 12 is rotatably arranged in the connecting frame 11, two sides of the top of the rotating frame 12 are respectively provided with a fixed plate 13, and a placing frame 14 is arranged between the two fixed plates 13;
the workpiece groove 15 is formed in the rack 14, the two sides of the inner wall of the workpiece groove 15 are respectively provided with the supporting frames 16, the two supporting frames 16 are respectively and movably connected with the two sides of the inner wall of the workpiece groove 15, one sides of the two supporting frames 16 are driven by the electric push rod, the two sides of the inner part of the workpiece groove 15 are movably arranged through the two supporting frames 16, the upper end faces of the two supporting frames 16 are used for supporting the two sides of the bottom of a chip, the chip can be placed in the workpiece groove 15, in addition, when the chip is sent out from the workpiece groove 15, the two supporting frames 16 are controlled to move to the two sides, the two supporting frames 16 are separated from the two sides of the bottom of the chip, the chip can automatically fall out from the bottom of the workpiece groove 15, the automatic discharging of the chip is realized, and the detection efficiency of the chip is improved;
the front side and the rear side of the inner wall of the workpiece groove 15 are respectively provided with a movable frame 21, two sides of the inner wall of the workpiece groove 15 are also provided with a second electric sliding table 22, one side of each second electric sliding table 22 is respectively connected with two sides of each movable frame 21, through grooves 23 are respectively formed in the two movable frames 21, a screw rod 24 is rotatably arranged in each movable frame 21, sliding blocks 25 are respectively arranged on two sides of the surface of the screw rod 24, external threads on two sides of the surface of the screw rod 24 are opposite in rotation direction, and one end of the screw rod 24 is rotatably driven through an output shaft of a motor; one side of each sliding block 25 is located in the movable frame 21 and is in sliding connection, a first limiting block 29 is arranged below the front face of each sliding block 25, a first micro electric cylinder 210 is further arranged above the front face of each sliding block 25, a second limiting block 211 is arranged at the driving end of each first micro electric cylinder 210, rotating rollers are arranged in the first limiting block 29 and the second limiting block 211 in a rotating mode, after a chip is fed into the workpiece groove 15, the movable frame 21 is driven to approach one side of the chip by the aid of the second electric sliding table 22 until one side of the first limiting block 29 contacts with the side of the chip, then the driving end of each first micro electric cylinder 210 pushes the second limiting block 211 downwards until the bottom of each second limiting block 211 contacts with the upper end face of the chip, the chip is stably placed in the workpiece groove 15 by the aid of the first limiting block 29 and the second limiting block 211 in cooperation with the supporting frame 16, and stability of the chip in the detection process is guaranteed.
Further, a steering motor 26 is arranged on one side of the left side fixing plate 13, the output end of the steering motor 26 is connected with one side of the placement frame 14, annular sliding grooves 27 are formed in the opposite sides of the two fixing plates 13, sliding blocks 28 are arranged on two sides of the placement frame 14, and the two sliding blocks 28 are respectively arranged in the two annular sliding grooves 27 in a sliding manner;
the rack 14 is driven to rotate between the two fixed plates 13 through the output shaft of the steering motor 26, the sliding blocks 28 on two sides of the rack 14 are respectively located in the two annular sliding grooves 27 to slide, stability of the rack 14 in the rotation process is guaranteed, after the angle of the rack 14 is adjusted, the chips in the rack 14 are subjected to image acquisition processing at different angles, multi-angle defect detection is achieved on the chip gold wires, and accuracy of the chip gold wire defect detection is remarkably improved.
Further, one side of link 11 is provided with drive frame 17, and the top of drive frame 17 is provided with driving motor 18, the inside rotation of drive frame 17 is provided with drive gear 19, and the outer peripheral face of rotating frame 12 is provided with the tooth's socket that meshes with drive gear 19, when examining the chip gold thread, drive gear 19 at the inside rotation of drive frame 17 through the output shaft of driving motor 18, drive gear 19 is synchronous to drive rotating frame 12 at the inside rotation of link 11 in the pivoted in-process, realize the further adjustment to the chip angle in the rack 14 after rotating frame 12, improve the image acquisition comprehensiveness to the chip gold thread, and then show the accuracy that improves chip gold thread defect detection.
Example 2
Referring to fig. 1 to 3, a feeding portion is further disposed on one side of the top of the detection platform 10, the feeding portion includes a feeding frame 31 and a feeding frame 32, the feeding frame 32 is disposed on one side of the feeding frame 31, a movable frame 33 is disposed in the feeding frame 31, the bottom of the movable frame 33 is driven by an electric push rod, third electric sliding tables 34 are disposed on two sides of the inner wall of the feeding frame 31, one side of each of the two third electric sliding tables 34 extends to the inside of the feeding frame 32, clamping plates 35 are disposed on opposite sides of each of the two third electric sliding tables 34 by the electric push rod, the movable frame 33 is pushed upwards by the driving end of the electric push rod when the chip to be detected is stacked on the movable frame 33, the uppermost chip is located between the two clamping plates 35, two sides of the chip are clamped by the two clamping plates 35, and then the chip is fed into the inside of the feeding frame 32 under the driving of the third electric sliding tables 34;
the feeding port is formed in the bottom of the inner wall of the feeding frame 32, the first servo electric cylinder 36 is arranged at the top of the feeding frame 32, the driving end of the first servo electric cylinder 36 extends to the inside of the feeding frame 32, an electromagnetic chuck is arranged at one end of the first servo electric cylinder 36 extending to the inside of the feeding frame 32, after a chip enters the inside of the feeding frame 32 under the driving of the third electric sliding table 34, the driving end of the first servo electric cylinder 36 pushes the electromagnetic chuck downwards, the upper end face of the chip is adsorbed by the electromagnetic chuck, then the chip is driven to pass through the feeding port to be fed into the inside of the feeding frame 14 for limiting, the automatic feeding of the chip is realized through the mutual cooperation of the structures in the feeding frame 31 and the feeding frame 32, the high-precision detection treatment of the chip gold wire defects is realized by the structure of the feeding frame 14 in the cooperation workpiece conveying mechanism 50, the automation degree of the chip gold wire detection equipment is effectively improved, and the detection efficiency of the chip gold wire defects is remarkably improved.
Referring to fig. 7 and 8, a fourth electric sliding table 41 is further disposed on the front surface of the fixing frame 20, a connection frame 42 is disposed on the front surface of the fourth electric sliding table 41, a cleaning frame 43 is movably disposed in the connection frame 42, a cleaning groove 44 matched with the detection camera 30 is disposed at the top of the cleaning frame 43, a cleaning sliver 45 is rotatably disposed below the cleaning groove 44, one side of the cleaning sliver 45 is rotatably driven by an output shaft of a motor, a second servo cylinder 46 is disposed on one side of the top of the connection frame 42, a driving end of the second servo cylinder 46 is connected with one side of the top of the cleaning frame 43, after the defect detection of the chip gold wire is completed, the fourth electric sliding table 41 is utilized to drive the connection frame 42 to move to the position right below the detection camera 30, then the driving end of the second servo cylinder 46 is utilized to drive the cleaning frame 43 to lift upwards in the connection frame 42, so that a lens of the detection camera 30 enters the cleaning groove 44, and the surface of the detection camera 30 is prevented from being polluted in a stop state; when the lens surface of the detection camera 30 is cleaned, the cleaning frame 43 is continuously driven to be lifted upwards until the surface of the cleaning cotton sliver 45 is in contact with the lens surface of the detection camera 30, and the motor is used for driving the cleaning cotton sliver 45 to rotate on the lens surface of the detection camera 30, so that the automatic cleaning of the lens surface of the detection camera 30 is achieved, and the influence of dirt on the surface of the detection camera 30 on the accuracy of chip gold thread image acquisition is avoided.
Referring to fig. 1 and 2, a discharging portion is further provided on one side of the top of the inspection bench 10, the discharging portion includes a qualified product discharging frame 51 and a unqualified product discharging frame 52, the qualified product discharging frame 51 and the unqualified product discharging frame 52 are arranged above the inspection bench 10 side by side, the tops of the qualified product discharging frame 51 and the unqualified product discharging frame 52 are both slidably provided with a sliding frame 53, the inside of the two sliding frames 53 is provided with a material receiving frame 54, the bottom of the material receiving frame 54 is driven by an electric push rod, after the image acquisition of the gold wire defects of the chip is completed through the inspection camera 30 and the defect analysis of the inspection terminal is performed, the analysis result is generated into a qualified signal and an unqualified signal, the qualified signal is sent to the control module, the first electric slide table 40 drives the workpiece conveying mechanism 50 to move to the upper portion of the qualified product discharging frame 51 or the unqualified product discharging frame 52 according to the signal of the analysis result, the chips in the placement frame 14 are automatically taken out by the material receiving frame 54, and then the qualified products and the unqualified products of the chips are automatically classified out after the chip gold wire defect detection is achieved.
Example 3
Referring to fig. 1 to 8, the invention also discloses a detection method of the chip gold wire defect detection device, which comprises the following specific steps:
firstly, stacking chips to be detected on a movable material frame 33, pushing the movable material frame 33 upwards by utilizing the driving end of an electric push rod to enable the uppermost chip to be positioned between two material clamping plates 35, clamping two sides of the chips by utilizing the two material clamping plates 35, and conveying the chips into the material frame 32 under the driving of a third electric sliding table 34;
step two, pushing the electromagnetic chuck downwards by utilizing the driving end of the first servo electric cylinder 36, adsorbing the upper end surface of the chip by the electromagnetic chuck, and then driving the chip to pass through the feeding port to be sent into the rack 14 for limiting;
thirdly, supporting two sides of the bottom of the chip by using the upper end faces of the two supporting frames 16, driving the movable frame 21 to approach to one side of the chip by using the second electric sliding table 22 until one side of the first limiting block 29 contacts with the side of the chip, and then pushing the second limiting block 211 downwards by the driving end of the first micro electric cylinder 210 until the bottom of the second limiting block 211 contacts with the upper end face of the chip;
step four, the first electric sliding table 40 is utilized to drive the connecting frame 11 to integrally move to the position right below the detection camera 30, the detection camera 30 is used for collecting images of the chip gold wires in the placing frame 14, and the positions of the first limiting block 29 and the second limiting block 211 on two sides of the chip are adjusted in the collecting process, so that the detection camera 30 is used for collecting images of the whole chip gold wires;
fifthly, an output shaft of a steering motor 26 drives a rack 14 to rotate between two fixed plates 13, so that the rack 14 is in a vertical state, image acquisition is carried out on the side edges of chip gold wires by using a detection camera 30, a driving gear 19 is driven by an output shaft of a driving motor 18 to rotate in a driving frame 17, the driving gear 19 synchronously drives a rotating frame 12 to rotate in a connecting frame 11 in the rotating process, the chip angle in the rack 14 is further adjusted, and defects are analyzed after multi-angle image acquisition is carried out on the chip gold wires;
step six, the analysis result is sent to the control module to generate qualified signals and unqualified signals, the workpiece conveying mechanism 50 is driven to move to the upper portion of the qualified product discharging frame 51 or the unqualified product discharging frame 52 by the first electric sliding table 40 according to the signal of the analysis result, the chips in the placing frame 14 are automatically taken out by the material receiving frame 54, and then the qualified products and the unqualified products are classified and sent out.
And all that is not described in detail in this specification is well known to those skilled in the art.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a chip gold thread defect detection device, includes detection platform (10), the middle part of detection platform (10) up end is provided with mount (20), and the inside of mount (20) is provided with detects camera (30), one side at detection platform (10) top is provided with first electronic slip table (40), and one side of first electronic slip table (40) is provided with work piece conveying mechanism (50), one side at detection platform (10) top still is provided with material loading portion, and the opposite side at detection platform (10) top still is provided with discharge part; the method is characterized in that:
the workpiece conveying mechanism (50) comprises a connecting frame (11), one side of the connecting frame (11) is connected with one side of a first electric sliding table (40), a rotating frame (12) is arranged in the connecting frame (11) in a rotating mode, fixing plates (13) are arranged on two sides of the top of the rotating frame (12), a placing frame (14) is arranged between the two fixing plates (13), a workpiece groove (15) is formed in the placing frame (14), and supporting frames (16) are arranged on two sides of the inner wall of the workpiece groove (15);
the front side and the rear side of the inner wall of the workpiece groove (15) are respectively provided with a movable frame (21), two sides of the inner wall of the workpiece groove (15) are also provided with second electric sliding tables (22), one sides of the two second electric sliding tables (22) are respectively connected with two sides of the two movable frames (21), through grooves (23) are respectively formed in the two movable frames (21), a screw rod (24) is rotatably arranged in the movable frames (21), and sliding blocks (25) are respectively arranged on two sides of the surface of the screw rod (24);
a steering motor (26) is arranged on one side of the fixing plate (13) positioned on the left side, and the output end of the steering motor (26) is connected with one side of the placing frame (14).
2. The chip gold wire defect detection device according to claim 1, wherein: two annular spout (27) have all been seted up to one side that fixed plate (13) are relative, the both sides of rack (14) all are provided with slider (28), and two slider (28) are located the inside slip setting of two annular spouts (27) respectively, one side of link (11) is provided with drive frame (17), and the top of drive frame (17) is provided with driving motor (18), the inside rotation of drive frame (17) is provided with drive gear (19), and the outer peripheral face of rotating frame (12) is provided with the tooth's socket with drive gear (19) engaged with.
3. The chip gold wire defect detection device according to claim 1, wherein: two one sides of sliding block (25) all are located the inside sliding connection of movable frame (21), and sliding block (25) positive below is provided with first stopper (29), sliding block (25) positive top still is provided with first miniature electronic jar (210), and the drive end of first miniature electronic jar (210) is provided with second stopper (211), and wherein the inside of first stopper (29) and second stopper (211) is all rotated and is provided with the live-rollers.
4. The chip gold wire defect detection device according to claim 1, wherein: the feeding part comprises a feeding frame (31) and a feeding frame (32), the feeding frame (32) is arranged on one side of the feeding frame (31), a movable material frame (33) is arranged in the feeding frame (31), and the bottom of the movable material frame (33) is driven by an electric push rod.
5. The device for detecting gold wire defects of chips as defined in claim 4, wherein: the both sides of material loading frame (31) inner wall all are provided with third electronic slip table (34), and one side of two third electronic slip tables (34) all extends to the inside of pay-off frame (32), two the opposite one side of third electronic slip table (34) all is provided with through electric putter and presss from both sides flitch (35).
6. The device for detecting gold wire defects of chips as defined in claim 4, wherein: the feeding port is formed in the bottom of the inner wall of the feeding frame (32), a first servo electric cylinder (36) is arranged at the top of the feeding frame (32), the driving end of the first servo electric cylinder (36) extends to the inside of the feeding frame (32), and an electromagnetic chuck is arranged at one end of the first servo electric cylinder (36) extending to the inside of the feeding frame (32).
7. The chip gold wire defect detection device according to claim 1, wherein: the front of mount (20) still is provided with fourth electronic slip table (41), and the front of fourth electronic slip table (41) is provided with connecting frame (42), the inside activity of connecting frame (42) is provided with clearance frame (43), and clearance groove (44) with detection camera (30) matched with have been seted up at the top of clearance frame (43).
8. The device for detecting gold wire defects of chips as defined in claim 7, wherein: the cleaning cotton sliver (45) is rotatably arranged below the inside of the cleaning groove (44), one side of the cleaning cotton sliver (45) is rotatably driven by an output shaft of the motor, a second servo electric cylinder (46) is arranged on one side of the top of the connecting frame (42), and the driving end of the second servo electric cylinder (46) is connected with one side of the top of the cleaning frame (43).
9. The chip gold wire defect detection device according to claim 1, wherein: the discharging part comprises a qualified product discharging frame (51) and an unqualified product discharging frame (52), the qualified product discharging frame (51) and the unqualified product discharging frame (52) are arranged above the detection table (10) side by side, the tops of the qualified product discharging frame (51) and the unqualified product discharging frame (52) are provided with sliding frames (53) in a sliding mode, two material receiving frames (54) are arranged in the sliding frames (53), and the bottoms of the material receiving frames (54) are driven by an electric push rod.
10. A detection method of a chip gold thread defect detection device is characterized by comprising the following steps: the detection method comprises the following steps:
firstly, stacking a chip to be detected on a movable material frame (33), pushing the movable material frame (33) upwards by utilizing the driving end of an electric push rod to enable the chip at the uppermost layer to be positioned between two material clamping plates (35), clamping two sides of the chip by utilizing the two material clamping plates (35), and conveying the chip into the material frame (32) under the driving of a third electric sliding table (34);
secondly, pushing the electromagnetic chuck downwards by utilizing the driving end of the first servo electric cylinder (36), adsorbing the upper end surface of the chip by the electromagnetic chuck, and then driving the chip to pass through the feeding port to be sent into the rack (14) for limiting;
thirdly, supporting two sides of the bottom of the chip by using the upper end faces of the two supporting frames (16), driving the movable frame (21) to approach to one side of the chip by using the second electric sliding table (22) until one side of the first limiting block (29) contacts with the side of the chip, and then pushing the second limiting block (211) downwards by using the driving end of the first miniature electric cylinder (210) until the bottom of the second limiting block (211) contacts with the upper end face of the chip;
step four, the first electric sliding table (40) is utilized to drive the connecting frame (11) to integrally move to the position right below the detection camera (30), the detection camera (30) is used for collecting images of chip gold wires in the placing frame (14), and the detection camera (30) is used for collecting images of the whole chip gold wires by adjusting the positions of the first limiting blocks (29) and the second limiting blocks (211) on two sides of the chip in the collecting process;
step five, an output shaft of a steering motor (26) drives a placing frame (14) to rotate between two fixed plates (13), so that the placing frame (14) is in a vertical state, image acquisition is carried out on the side edges of chip gold wires by using a detection camera (30), a driving gear (19) is driven by an output shaft of a driving motor (18) to rotate in a driving frame (17), the driving gear (19) synchronously drives a rotating frame (12) to rotate in a connecting frame (11) in the rotating process, the chip angles in the placing frame (14) are further adjusted, and defects are analyzed after multi-angle image acquisition is carried out on the chip gold wires;
step six, the analysis result is sent to a control module to generate qualified signals and unqualified signals, a workpiece conveying mechanism (50) is driven to move to the upper portion of a qualified product discharging frame (51) or a unqualified product discharging frame (52) through a first electric sliding table (40) according to the signals of the analysis result, chips in a placing frame (14) are automatically taken out through a material receiving frame (54), and then the qualified products and the unqualified products are classified and sent out.
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| CN202211609250.6A CN116008305A (en) | 2022-12-12 | 2022-12-12 | Chip gold thread defect detection device and detection method thereof |
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| CN202211609250.6A CN116008305A (en) | 2022-12-12 | 2022-12-12 | Chip gold thread defect detection device and detection method thereof |
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