CN117054702A - Test probe and test method of electronic device - Google Patents
Test probe and test method of electronic device Download PDFInfo
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- CN117054702A CN117054702A CN202311053369.4A CN202311053369A CN117054702A CN 117054702 A CN117054702 A CN 117054702A CN 202311053369 A CN202311053369 A CN 202311053369A CN 117054702 A CN117054702 A CN 117054702A
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- 238000012360 testing method Methods 0.000 title claims abstract description 371
- 239000000523 sample Substances 0.000 title claims abstract description 190
- 238000010998 test method Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 description 13
- 239000012535 impurity Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Abstract
The application discloses a test probe and a test method of an electronic device, wherein the test probe comprises a conical test end; the taper test end includes: a rigid portion and a flexible portion, the flexible portion being coupled to the rigid portion for performing a test when the taper test end is in contact with the contact electrode; the application reduces the contact area between the rigid part and the contact electrode by combining the rigid part and the flexible part, increases the contact area between the flexible part and the contact electrode, can effectively reduce the damage to the electronic device caused by repeated test, and effectively improves the contact performance between the test probe and the contact electrode.
Description
Technical Field
The present application relates to the field of electronic device testing, and in particular, to a test probe and a method for testing an electronic device.
Background
In the production process of electronic devices, it is often necessary to test the produced electronic devices and to capture bad products in time.
In actual operation, the research and development personnel of the application find that when testing is carried out on the electronic device through the test probe, repeated tests can generally damage the electronic device, and impurities adhered on the test probe influence the contact performance of the test probe and the electronic device, so that the test accuracy is low, and the test effect of the electronic device is influenced.
Disclosure of Invention
The application mainly solves the technical problem of providing a test probe and a test method of an electronic device, which can effectively reduce damage to the electronic device caused by repeated test and effectively improve the contact performance of the test probe and the electronic device.
In order to solve the technical problems, the application adopts a technical scheme that: providing a test probe, wherein the test probe comprises a conical test end; the taper test end includes: a rigid portion and a flexible portion, wherein the flexible portion is bonded to the rigid portion for performing a test when the tapered test end is in contact with a contact electrode.
In some embodiments, the side surface of the conical test end comprises a target surface and a test surface, wherein the exposed outer side surface of the rigid part forms the target surface, and the exposed outer side surface of the flexible part forms the test surface; the lowest point of the target surface relative to the bottom surface of the cone-shaped test probe is lower than or equal to the lowest point of the test surface relative to the bottom surface of the cone-shaped test probe; the lowest point of the target surface is 0.1-10 mu m lower than the lowest point of the test surface.
In some embodiments, the target surface has an area that is smaller than the area of the test surface.
In some embodiments, the rigid portion and the flexible portion further comprise inner sides, respectively, wherein the inner sides of the rigid portion and the flexible portion are bonded together.
In some embodiments, the rigid portion further comprises a bottom surface, the flexible portion further comprises a bottom surface, wherein the bottom surface of the rigid portion and the bottom surface of the flexible portion cooperate to form the bottom surface of the tapered test end; or the rigid part further comprises a bottom surface, the flexible part further comprises a bottom surface and an inner tangent plane lower than the bottom surface, and the bottom surface of the rigid part and the inner tangent plane of the flexible part are attached together.
In order to solve the above technical problems, another technical solution of the present application is to provide a method for testing an electronic device, including: providing a test probe, wherein the test probe is provided with a conical test end consisting of a rigid part and a flexible part; contacting the rigid part of the conical test end with a contact electrode, and penetrating the conical test end into the contact electrode; and adjusting the test probe to increase the contact area between the flexible part of the conical test end and the contact electrode.
In some embodiments, the side of the conical test end of the test probe includes a target surface and a test surface, wherein the exposed outer side of the rigid portion constitutes the target surface and the exposed outer side of the flexible portion constitutes the test surface; the method for making the rigid part of the conical test end contact with the contact electrode and making the conical test end go deep into the contact electrode comprises the following steps: and contacting the target surface of the conical test end with the contact electrode at a preset angle, and penetrating the conical test end into the contact electrode at the preset angle.
In some embodiments, the predetermined angle is less than 90 °.
In some embodiments, the adjusting the test probe comprises: the test probe is rotated along a central axis of the test probe and a stress is applied to the test probe along a direction perpendicular to the test surface so that the test probe contacts the contact electrode with the test surface.
Unlike the prior art, the test probe provided by the application comprises a conical test end formed by a rigid part and a flexible part, wherein the rigid part is configured to contact the contact electrode of the electronic device and penetrate into the contact electrode when the test probe contacts the contact electrode of the electronic device; the flexible portion is coupled to the rigid portion, the flexible portion being configured to contact the contact electrode of the electronic device to perform the test after the test probe contacts the contact electrode of the electronic device. The test probe is based on the contact of the rigid part and the contact electrode of the electronic device, and after the test probe is in deep contact with the contact electrode, the flexible part of the test probe is fully contacted with the contact electrode, and then the test is executed, so that the damage of the rigid part to the electronic device caused by repeated test is avoided, namely the contact area of the rigid part and the contact electrode is reduced, and the damage of the repeated test to the electronic device can be effectively reduced; and the flexible part is adjusted to be in contact with the contact electrode of the electronic device, so that the contact area of the flexible part and the contact electrode is increased, impurities adhered to the surface of the test probe are adhered to the surface of the contact electrode, the next measurement is prevented from being influenced, and the contact performance of the test probe and the contact electrode is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:
FIG. 1 is a schematic diagram of a first embodiment of a test probe according to the present application;
FIG. 2 is a forward cross-sectional view of FIG. 1 in accordance with the present application;
FIG. 3 is a top view of FIG. 1 in accordance with the present application;
FIG. 4 is a schematic diagram of a second embodiment of a test probe according to the present application;
FIG. 5 is a forward cross-sectional view of FIG. 4 in accordance with the present application;
FIG. 6 is a top view of FIG. 4 in accordance with the present application;
FIG. 7 is a schematic diagram of a third embodiment of a test probe according to the present application;
FIG. 8 is a forward cross-sectional view of FIG. 7 in accordance with the present application;
FIG. 9 is a top view of FIG. 7 in accordance with the present application;
FIG. 10 is a schematic diagram of a fourth embodiment of a test probe according to the present application;
FIG. 11 is a forward cross-sectional view of FIG. 10 in accordance with the present application;
FIG. 12 is a top view of FIG. 10 in accordance with the present application;
FIG. 13 is a top cross-sectional view of FIG. 10 in accordance with the present application;
FIG. 14 is a flow chart of a method of testing an electronic device according to the present application;
FIG. 15 is a schematic view showing the structure of the present application in which the target surface of the test probe contacts and penetrates into the contact electrode at a predetermined angle;
FIG. 16 is a schematic diagram of the structure of the present application after the test probe is adjusted.
In the drawings, a test probe 10, a rigid portion 100, a target surface 110, a rigid inner side 120, a rigid bottom surface 130, a flexible portion 200, a test surface 210, a flexible inner side 220, a flexible bottom surface 230, and an inner cutting surface 240.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present application are shown in the drawings. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The terms "first," "second," and the like in this disclosure are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
In addition, although the terms "first," "second," etc. may be used several times in the present application to describe various data (or various elements or various applications or various instructions or various operations), etc., these data (or elements or applications or instructions or operations) should not be limited by these terms. These terms are only used to distinguish one data (or element or application or instruction or operation) from another data (or element or application or instruction or operation). For example, the first position information may be referred to as second position information, and the second position information may be referred to as first position information, only the ranges included therein being different, without departing from the scope of the present application, the first position information and the second position information being all sets of various position and orientation information, only that they are not identical sets of position and orientation information.
Since the test structures (testkers) in electronic devices are typically designed under the circuit-out devices (pads) of the wafer, it is often necessary for the test probes to penetrate into the contact electrodes of the electronic devices when testing the electronic devices; in the prior art, a rigid test probe is generally adopted to test an electronic device, repeated tests usually cause damage to the electronic device, and impurities adhered to the test probe influence the contact performance of the test probe and the electronic device, so that the test accuracy is low, and the test effect of the electronic device is influenced.
Therefore, the contact area of the rigid part and the contact electrode is reduced, the damage to the electronic device caused by repeated testing can be effectively reduced, and the contact performance of the test probe and the electronic device can be effectively improved.
Referring to fig. 1, 2 and 3, fig. 1 is a schematic structural diagram of a first embodiment of a test probe according to the present application; fig. 2 is a front sectional view of the first embodiment, and fig. 3 is a top view of the first embodiment.
As shown in fig. 1, the test probe 10 is used for testing an electronic device, and includes a tapered test end including a rigid portion 100 and a flexible portion 200, the flexible portion 200 being combined with the rigid portion 100, and is used for performing a test to test an electrical characteristic of the electronic device when the tapered test end is in contact with a contact electrode.
The rigid portion 100 is a portion made of a rigid conductive material, that is, a material having little or negligible deformation under an external force, such as beryllium copper, phosphor copper, brass, carbon tool steel (SK 4), stainless steel material (Steel Use Stainless, SUS), etc.; the flexible portion 200 refers to a portion made of a flexible material, i.e., a material that is easily deformed but not broken by an external force, i.e., a flexible conductor material, such as zinc oxide (ZnO) and zinc sulfide (ZnS) in an inorganic semiconductor material, such as Indium Gallium Zinc Oxide (IGZO) in a metal oxide semiconductor material, such as triphenylamine, fullerene, phthalocyanine, perylene derivative, cyanine, etc. in a small molecular organic semiconductor material, such as polyacetylene type, polyaromatic ring type, copolymer type, etc. in a molecular organic semiconductor material, such as graphene, black phosphorus, liquid metal (gallium indium tin alloy), etc.
Specifically, the rigid portion 100 made of a rigid conductor material and the flexible portion 200 made of a flexible material are combined together to form a taper-shaped test end of the test probe; in performing the test of the electronic device, the rigid portion 100 of the test probe is configured to contact the contact electrode of the electronic device first and go deep into the contact electrode, and the flexible portion 200 of the test probe is configured to contact the contact electrode of the electronic device sufficiently so that the test probe performs the test with the flexible portion 200, such as the electrical characteristic test of the electronic device.
In some embodiments, the test probes may also perform electrical characterization testing of the electronic device with the rigid portion 100.
It will be appreciated that in order to reduce damage to the electronic device by the rigid portion 100, after the test probe is inserted into the contact electrode, the test probe is adjusted to increase the contact area between the flexible portion 200 and the contact electrode, so that the flexible portion 200 is fully contacted with the contact electrode, and then the flexible portion 200 is used for testing, such as testing the electrical characteristics of the electronic device.
In the present embodiment, the test probe is formed by combining the rigid portion 100 and the flexible portion 200, and during the test, the rigid portion 100 is configured to be firstly contacted with the contact electrode of the electronic device and to penetrate into the contact electrode, and then the flexible portion 200 is configured to be contacted with the contact electrode of the electronic device and to test the electrical characteristics of the electronic device with the flexible portion 200, so that the contact area between the rigid portion 100 and the electronic device is reduced, and the damage of the rigid portion 100 to the electronic device is reduced; and because the existence of the flexible part 200, after the stress is applied to the test probe, elastic deformation can be generated, so that impurities on the test probe are flicked away, the impurities adhered to the test probe are more easily adhered to the surface of the electronic device, and the contact performance of the test probe and the electronic device is effectively improved.
During the test, the test probe may be adjusted, i.e. as the test probe is adjusted, the rigid portion 100 of the test probe may be selected to contact the contact electrodes of the electronic device, or the flexible portion 200 of the test probe may be selected to contact the contact electrodes of the electronic device.
Specifically, before the electronic device is tested by the test probe, the test probe is adjusted such that the rigid portion 100 of the test probe contacts the contact electrode of the electronic device first, and after the rigid portion 100 of the test probe contacts and goes deep into the contact electrode of the electronic device, the test probe is adjusted again such that the flexible portion 200 of the test probe fully contacts the contact electrode of the electronic device, and the electrical characteristics of the electronic device are tested with the flexible portion 200.
The test probe is adjusted before the test, so that the rigid part of the test probe can directly contact with the contact electrode of the electronic device.
The adjustment of the test probe after the test probe goes deep into the contact electrode is to adjust the test probe itself, for example: the test probe is rotated about its central axis so that the flexible portion of the test probe is in full contact with the contact electrode of the electronic device.
In some embodiments, as shown in fig. 2, the test probe includes a tapered test end composed of a rigid portion 100 and a flexible portion 200, with the exposed outer side of the rigid portion 100 constituting the target surface 110 and the exposed outer side of the flexible portion 200 constituting the test surface 210, and the target surface 110 and the test surface 210 constituting the sides of the tapered test probe.
Specifically, the rigid portion 100 made of rigid material and the flexible portion 200 made of flexible material are combined together to form a cone-shaped test end, and the exposed target surface 110 of the rigid portion 100 and the exposed test surface 210 of the flexible portion 200 form the side surface of the cone-shaped test probe together; when testing an electronic device, configuring the target surface 110 of the conical test end to contact the contact electrode of the electronic device first, and enabling the target surface 110 to penetrate into the contact electrode first, so as to bring the test surface 210 into the contact electrode; and then the test probe rotates around the central axis of the test probe, so that the test surface 210 of the test probe is fully contacted with the contact electrode of the electronic device, the contact area of the test surface 210 and the contact electrode is increased, good ohmic contact is formed, and further the test surface 210 is used for testing, such as the electrical characteristic test of the electronic device.
In some embodiments, the test probe may further include a connection end connected to the taper test end, the connection end may also include a rigid portion and a flexible portion, the rigid portion of the connection end is connected to the rigid portion of the taper test end, and the flexible portion of the connection end is connected to the flexible portion of the taper test end, so that a test result in a test process is stable; and the connecting end can be a cone structure continuing to the cone test end, so that the test probe is an integral cone test probe.
In another embodiment, the connection end of the test probe may be cylindrical and connected to the taper test end, and the taper test end contacts the contact electrode during the test, and the connection end is not limited to have a flexible portion.
After the test probe rotates around the central axis of the test probe, so that the test surface 210 of the test probe contacts with the contact electrode of the electronic device, a stress can be applied to the test surface 210, so that the test surface 210 corresponding to the flexible portion 200 forms better ohmic contact with the contact electrode.
In some embodiments, the area of the target surface 110 corresponding to the rigid portion 100 is equal to the area of the test surface 210 corresponding to the flexible portion 200; the lowest point of the target surface relative to the bottom surface of the test probe is equal to the lowest point of the test surface relative to the bottom surface of the test probe, namely the lowest point of the target surface and the lowest point of the test surface are the same point, and the lowest point is the conical test end lowest point of the test probe; namely, the central axis of the test probe is divided, one half is a target surface corresponding to the rigid part, and the other half is a test surface corresponding to the flexible part.
In other embodiments, the area of the target surface 110 corresponding to the rigid portion 100 may be smaller than the area of the test surface 210 corresponding to the flexible portion 200; then, the lowest point of the target surface with respect to the bottom surface of the test probe may be lower than or equal to the lowest point of the test surface with respect to the bottom surface of the test probe; when the lowest point of the target surface is equal to the lowest point of the test surface, the area of the target surface 110 of the tapered test end of the test probe is smaller than the area of the test surface 210.
With continued reference to fig. 2, as shown in fig. 2, the rigid portion 100 and the flexible portion 200 respectively include corresponding inner sides, and the two inner sides are bonded together, that is, the rigid inner side 120 of the rigid portion 100 and the flexible inner side 220 of the flexible portion 200 are bonded together.
In some embodiments, the rigid inner side 120 of the rigid portion 100 may be a concave arc surface as viewed in a top-down cross section of the taper test end, the middle of the rigid portion 100 is thick, the two sides are thin, and the cross section of the rigid portion 100 has an area smaller than the cross section of the flexible portion 200; correspondingly, the flexible inner side 220 of the flexible portion 200 may be a convex arc surface, and the convex arc surface and the concave arc surface are just fit together, so that the rigid portion and the flexible portion are fit together.
As shown in fig. 2 and 3, the rigid portion 100 further includes a bottom surface, which is the rigid bottom surface 130, and the flexible portion 200 further includes a bottom surface, which is the flexible bottom surface 230, and the bottom surfaces of the rigid portion 100 and the flexible portion 200 cooperate to form the bottom surface of the cone-shaped test end, that is, the rigid bottom surface 130 and the flexible bottom surface 230 form the bottom surface of the cone-shaped test end.
In some embodiments, the area of rigid bottom surface 130 is less than the area of flexible bottom surface 230; for example, the cross-sectional shape of the rigid bottom surface 130 may be a concave crescent, a concave rectangle, or the like.
In some embodiments, the lowest point of the target surface 110 relative to the bottom surface of the cone test probe is the same point as the lowest point of the test surface 210 relative to the bottom surface of the cone test probe, i.e., the two lowest points are the same point; at this time, in order to make the rigid portion 100 contact the contact electrode of the electronic device first, the test probe may make the target surface 110 corresponding to the rigid portion 100 contact the contact electrode first at a certain inclination angle, and after the test probe goes deep into the contact electrode, the test probe is adjusted to increase the contact area between the test surface 210 corresponding to the flexible portion 200 and the contact electrode.
In some embodiments, with continued reference to FIG. 3, the lowest point of the target surface 110 relative to the bottom surface of the cone test probe is lower than the lowest point of the test surface 210 relative to the bottom surface of the cone test probe, with the lowest point of the target surface 110 being 0.1-10 μm, such as 0.5 μm, 1 μm, 2 μm, 5 μm, etc., lower than the lowest point of the test surface 210; i.e. the lowest point of the rigid portion is lower than the lowest point of the flexible portion.
Specifically, in order to make the rigid portion contact the contact electrode of the electronic device first, the lowest point of the target surface 110 corresponding to the rigid portion is lower than the lowest point of the test surface 210 corresponding to the flexible portion, and when the test probe contacts the contact electrode of the electronic device in the vertical direction, the lowest point of the target surface 110 corresponding to the rigid portion contacts the contact electrode first. In some embodiments, the test probe may also be configured to have the target surface 110 contact the contact electrode at an oblique angle.
Referring to fig. 4, 5 and 6, fig. 4 is a schematic structural view of a second embodiment of a test probe according to the present application; FIG. 5 is a forward cross-sectional view of a second embodiment; fig. 6 is a top view of the second embodiment.
As shown in fig. 4, the test probe is a test probe including a tapered test end, the tapered test end includes a rigid portion 100 and a flexible portion 200, and the rigid portion 100 and the flexible portion 200 are bonded together. As shown in fig. 5, the rigid portion 100 and the flexible portion 200 respectively include corresponding inner sides, the two inner sides are bonded together, that is, the rigid inner side 120 of the rigid portion 100 and the flexible inner side 220 of the flexible portion 200 are bonded together, and the rigid portion 100 and the flexible portion 200 respectively have a corresponding target surface 110 and a corresponding test surface 210, so as to form a side of the cone-shaped test probe, and the lowest point of the rigid portion is lower than the lowest point of the flexible portion. As shown in fig. 5 and 6, the rigid part 100 further includes a rigid bottom surface 130, the flexible part 200 further includes a flexible bottom surface 230, and the rigid bottom surface 130 and the flexible bottom surface 230 form the bottom surface of the cone-shaped test probe, and are attached together by the rigid inner side surface 120 of the rigid part and the flexible inner side surface 220 of the flexible part.
In some embodiments, the rigid inner side 120 of the rigid portion 100 may be semicircular in top cross-section of the cone-shaped test probe, and the corresponding semicircle of the rigid portion 100 may be thick in the middle and thin on both sides, and the cross-sectional area of the rigid portion 100 may be equal to the cross-sectional area of the flexible portion 200; correspondingly, the flexible inner side 220 of the flexible portion 200 may be a semicircle, that is, the semicircle corresponding to the rigid portion and the semicircle corresponding to the flexible portion are exactly fit, so that the rigid portion and the flexible portion are fit together.
In some embodiments, the cross-sectional area of the rigid portion 100 may be greater than the cross-sectional area of the flexible portion 200, i.e., the volume of the rigid portion 100 is greater than the volume of the flexible portion 200, or the cross-sectional area of the rigid portion 100 may also be less than the cross-sectional area of the flexible portion 200, i.e., the volume of the rigid portion 100 is less than the volume of the flexible portion 200.
In this embodiment, compared with the first embodiment, the thickness of the rigid portion is increased to improve the strength of the rigid portion, and also reduce the contact area between the rigid portion 100 and the electronic device, and reduce the damage of the rigid portion 100 to the electronic device; and because of the existence of the flexible part 200, impurities adhered on the test probe are more easily adhered on the surface of the electronic device, so that the contact performance of the test probe and the contact electrode is effectively improved.
Referring to fig. 7, 8 and 9, fig. 7 is a schematic structural view of a third embodiment of a test probe according to the present application; FIG. 8 is a forward cross-sectional view of a third embodiment; fig. 9 is a top view of the third embodiment.
As shown in fig. 7, the test probe is a cone-shaped test probe, and includes a rigid portion 100 and a flexible portion 200, and the rigid portion 100 and the flexible portion 200 are attached together. As shown in fig. 8, the rigid part 100 further includes a bottom surface, the flexible part 200 further includes a bottom surface and an inner cut surface 240 lower than the bottom surface, and the bottom surface of the rigid part 100 is bonded to the inner cut surface 240 of the flexible part 200, that is, the rigid bottom surface 130 of the rigid part 100 is bonded to the inner cut surface 240 of the flexible part 200; and the two inner sides of the rigid portion 100 and the flexible portion 200 are bonded together, that is, the rigid inner side 120 of the rigid portion 100 and the flexible inner side 220 of the flexible portion 200 are bonded together, and the rigid portion 100 and the flexible portion 200 respectively have a corresponding target surface 110 and a corresponding test surface 210, so as to form a side surface of the cone-shaped test probe, and the lowest point of the rigid portion is lower than the lowest point of the flexible portion. As shown in fig. 8 and 9, the bottom surface of the flexible portion 200 is a flexible bottom surface 230, and the flexible bottom surface 230 constitutes the bottom surface of the cone-shaped test probe.
In some embodiments, the inner cut surface 240 of the flexible portion 200 may be parallel to the bottom surface of the tapered test end.
In some embodiments, the area of the target surface 110 corresponding to the rigid portion 100 may be smaller than the area of the test surface 210 corresponding to the flexible portion 200, as seen in a forward cross-sectional view of the tapered test end.
In some embodiments, the area of the rigid bottom surface corresponding to rigid portion 100 may be less than or equal to the area of the flexible bottom surface corresponding to flexible portion 200 from a top cross-sectional view of the tapered test end.
In this embodiment, compared to the first embodiment, the contact area between the rigid portion 100 and the electronic device is further reduced, and the damage of the rigid portion 100 to the electronic device is reduced; and because the existence of the flexible part 200, after the stress is applied to the test probe, elastic deformation can be generated, so that impurities on the test probe are flicked away, the impurities adhered to the test probe are more easily adhered to the surface of the electronic device, and the contact performance of the test probe and the electronic device is effectively improved.
Referring to fig. 10, 11, 12 and 13, fig. 10 is a schematic structural view of a fourth embodiment of a test probe according to the present application; FIG. 11 is a forward cross-sectional view of a fourth embodiment; fig. 12 is a top view of a fourth embodiment; fig. 13 is a top cross-sectional view of a fourth embodiment.
As shown in fig. 10, the test probe is a probe including a taper test end, the taper test end includes a rigid portion 100 and a flexible portion 200, and the rigid portion 100 and the flexible portion 200 are bonded together; as shown in fig. 11, the exposed target surface 110 of the rigid portion 100 and the exposed test surface 210 of the flexible portion 200 form a side surface of the taper test end, the rigid portion 100 further includes a bottom surface, the flexible portion 200 further includes a bottom surface and an inner cutting surface 240 lower than the bottom surface, the bottom surface of the rigid portion 100 and the inner cutting surface 240 of the flexible portion 200 are bonded together, that is, the corresponding rigid bottom surface 130 and the inner cutting surface 240 of the rigid portion 100 are bonded together, and the rigid inner side surface of the rigid portion 100 and the flexible inner side surface of the flexible portion 200 are bonded together; as shown in fig. 12, the flexible bottom surface 230 of the flexible portion 200 forms the bottom surface of the cone-shaped test end. As shown in fig. 13, the area of the cross section corresponding to the rigid portion 100 is smaller than the area of the cross section corresponding to the flexible portion 200.
In some embodiments, the rigid inner side 120 of the rigid portion 100 may be a concave arc surface when viewed in a cross-section of the taper test end from the depression direction, and the rigid portion 100 is thick at the middle and thin at the two sides; while the flexible inner side surface 220 of the flexible portion 200 is a convex arc surface, the rigid inner side surface 120 of the rigid portion 100 and the flexible inner side surface 220 of the flexible portion 200 are bonded together; the rigid bottom surface 130 of the rigid portion 100 may be a concave arc surface, and the inner cut surface 240 of the flexible portion 200 may be a convex arc surface, so that the bottom surface 130 of the rigid portion 100 and the inner cut surface 240 of the flexible portion 200 are bonded together.
In this embodiment, the volume of the rigid portion is reduced and the volume of the flexible portion is increased relative to the first embodiment, so that the flexible portion and the contact electrode can further form a better ohmic contact.
Referring to fig. 14, fig. 14 is a flow chart of an embodiment of a testing method of an electronic device according to the present application.
As shown in fig. 14, the method comprises the following steps:
s1, providing a test probe, wherein the test probe is provided with a conical test end consisting of a rigid part and a flexible part.
Wherein the rigid portion 100 and the flexible portion 200 of the test probe are bonded together, the test probe is used for testing, e.g., testing, an electronic device, and the test probe is contacted with a contact electrode of the electronic device during the testing process to perform a test, e.g., testing an electrical characteristic of the electronic device by the test probe.
Specifically, the test probe is contacted with the contact electrode through the conical test end, so that the test probe can test the electrical characteristics of the electronic device to be tested.
S2, the cone-shaped testing end corresponding rigid part 100 of the testing probe is contacted with the contact electrode, and the cone-shaped testing end is penetrated into the contact electrode.
Specifically, the rigid portion 100 of the taper test end of the test probe is brought into contact with the contact electrode of the electronic device, and the taper test end is deeply inserted into the contact electrode.
In some embodiments, the tapered test end side of the test probe includes a target surface 110 and a test surface 210, wherein the exposed outer side of the rigid portion 100 constitutes the target surface 110 and the exposed outer side of the flexible portion 200 constitutes the test surface 210.
In some embodiments, the target surface 110 of the test probe is brought into contact with the contact electrode of the electronic device at a predetermined angle, and the test probe is brought into contact with the inside of the contact electrode at a predetermined angle. The preset angle refers to an included angle between the central axis of the test probe and the horizontal direction.
In some embodiments, the predetermined angle is less than 90 °, such as 30 °, 45 °, 60 °, 75 °, and the like.
S3, adjusting the test probe to increase the contact area between the flexible part of the conical test end and the contact electrode.
Wherein adjustment of the test probes is required in order to have the test probes test the electronic device with the test face 210.
Specifically, after the test probe penetrates into the contact electrode, the test probe is adjusted so that the test surface 210 of the test probe is fully contacted with the contact electrode of the electronic device, and the test probe is used for testing the electrical characteristics of the electronic device by the test surface 210.
Referring to fig. 15 and 16, fig. 15 is a schematic view illustrating a structure in which a target surface 110 of a test probe is contacted at a predetermined angle and penetrates into the contact electrode; FIG. 16 is a schematic diagram of the structure after adjusting the test probes.
In some embodiments, it is necessary to rotate the test probe along the central axis of the test probe, so that the test surface 210 of the test probe contacts the contact electrode of the electronic device, and the contact area between the test surface 210 and the contact electrode is increased, so that the contact area between the test surface 210 corresponding to the flexible portion 200 and the contact electrode is maximized, and further, the test surface 210 forms good ohmic contact with the contact electrode.
In some embodiments, stress may also be applied to the test probes in a direction perpendicular to the test face 210, such that the test face 210 forms a better ohmic contact with the contact electrode.
In this embodiment, the target surface 110 corresponding to the rigid portion 100 of the test probe contacts with and penetrates into the contact electrode, so as to adjust the test probe, so that the test probe makes full contact with the contact electrode of the electronic device with the test surface 210 corresponding to the flexible portion 200, thereby reducing the contact area between the rigid portion 100 and the electronic device and reducing the damage of the rigid portion 100 to the electronic device; and because the existence of the flexible part 200, after the stress is applied to the test probe, elastic deformation can be generated, so that impurities on the test probe are flicked away, the impurities adhered to the test probe are more easily adhered to the surface of the electronic device, and the contact performance of the test probe and the electronic device is effectively improved.
The test probe has a conical test end formed by a rigid part 100 and a flexible part 200, wherein the side surface of the conical test end comprises a target surface 110 and a test surface 210, the outer side surface of the rigid part 100 exposed outside forms the target surface 110, and the outer side surface of the flexible part 200 exposed outside forms the test surface 210.
In the above technical solution, a test probe includes a taper test end, where the taper test end includes a rigid portion 100 and a flexible portion 200, and the flexible portion 200 is combined with the rigid portion 100, where the rigid portion 100 is configured to, when the test probe contacts a contact electrode of an electronic device, first make a target surface 110 corresponding to the rigid portion 100 contact the contact electrode and go deep into the contact electrode; the flexible portion 200 is configured to fully contact the contact electrode of the electronic device with the test surface 210 corresponding to the flexible portion 200 after the test probe contacts the contact electrode of the electronic device to perform the test; the damage of the rigid part 100 to the electronic device caused by repeated testing is avoided, the contact area of the rigid part 100 and the contact electrode is reduced, and the damage of the repeated testing to the electronic device can be effectively reduced; and the flexible part 200 is adjusted to be in contact with the contact electrode of the electronic device, so that impurities adhered to the surface of the test probe can be adhered to the surface of the contact electrode, the measurement of the next electronic device is prevented from being influenced, and the contact performance of the test probe and the electronic device is effectively improved.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus, and method may be implemented in other manners. For example, the system embodiments described above are merely illustrative, e.g., the division of the modules or units is merely a logical functional division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.
Claims (10)
1. A test probe, wherein the test probe comprises:
a taper test end; the taper test end includes: a rigid portion and a flexible portion;
wherein the flexible portion is bonded to the rigid portion for performing a test when the tapered test end is in contact with a contact electrode.
2. The test probe of claim 1, wherein the probe comprises a probe body,
the side surface of the conical test end comprises a target surface and a test surface, wherein the outer side surface of the rigid part exposed outside forms the target surface, and the outer side surface of the flexible part exposed outside forms the test surface;
and the lowest point of the target surface relative to the bottom surface of the conical test end is lower than or equal to the lowest point of the test surface relative to the bottom surface of the conical test end.
3. The test probe of claim 2, wherein the probe comprises a probe body,
and when the lowest point of the target surface relative to the bottom surface of the conical test end is lower than the lowest point of the test surface relative to the bottom surface of the conical test end, the lowest point of the target surface is 0.1-10 mu m lower than the lowest point of the test surface.
4. The test probe of claim 2, wherein the probe comprises a probe body,
the area of the target surface is smaller than that of the test surface.
5. The test probe of claim 2, wherein the probe comprises a probe body,
the rigid portion and the flexible portion further comprise inner side surfaces respectively, wherein the inner side surfaces of the rigid portion and the flexible portion are attached together.
6. The test probe of claim 2, wherein the probe comprises a probe body,
the rigid part further comprises a bottom surface, and the flexible part further comprises a bottom surface, wherein the bottom surface of the rigid part and the bottom surface of the flexible part are matched to form the bottom surface of the conical test end; or alternatively
The rigid part further comprises a bottom surface, the flexible part further comprises a bottom surface and an inner tangent plane lower than the bottom surface, and the bottom surface of the rigid part and the inner tangent plane of the flexible part are attached together.
7. A method of testing an electronic device, comprising:
providing a test probe, wherein the test probe is provided with a conical test end consisting of a rigid part and a flexible part;
contacting the rigid part of the conical test end with a contact electrode, and penetrating the conical test end into the contact electrode;
and adjusting the test probe to increase the contact area between the flexible part of the conical test end and the contact electrode.
8. The test method of claim 7, wherein,
the side surface of the conical test end of the test probe comprises a target surface and a test surface, wherein the outer side surface of the rigid part exposed outside forms the target surface, and the outer side surface of the flexible part exposed outside forms the test surface;
the method for making the rigid part of the conical test end contact with the contact electrode and making the conical test end go deep into the contact electrode comprises the following steps:
and contacting the target surface of the conical test end with the contact electrode at a preset angle, and penetrating the conical test end into the contact electrode at the preset angle.
9. The test method of claim 8, wherein,
the preset angle is less than 90 degrees.
10. The test method of claim 8, wherein,
said adjusting said test probe comprising:
the test probe is rotated along a central axis of the test probe and a stress is applied to the test probe along a direction perpendicular to the test surface so that the test probe contacts the contact electrode with the test surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311053369.4A CN117054702A (en) | 2023-08-18 | 2023-08-18 | Test probe and test method of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311053369.4A CN117054702A (en) | 2023-08-18 | 2023-08-18 | Test probe and test method of electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117054702A true CN117054702A (en) | 2023-11-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311053369.4A Pending CN117054702A (en) | 2023-08-18 | 2023-08-18 | Test probe and test method of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117054702A (en) |
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2023
- 2023-08-18 CN CN202311053369.4A patent/CN117054702A/en active Pending
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