CN117042338B - Printed circuit board production process for high-end server and printed circuit board - Google Patents
Printed circuit board production process for high-end server and printed circuit board Download PDFInfo
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- CN117042338B CN117042338B CN202311294590.9A CN202311294590A CN117042338B CN 117042338 B CN117042338 B CN 117042338B CN 202311294590 A CN202311294590 A CN 202311294590A CN 117042338 B CN117042338 B CN 117042338B
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- printed circuit
- tin melting
- circuit board
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 46
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 111
- 238000002844 melting Methods 0.000 claims abstract description 74
- 239000007788 liquid Substances 0.000 claims abstract description 63
- 230000008018 melting Effects 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims abstract description 26
- 238000005553 drilling Methods 0.000 claims abstract description 24
- 230000008569 process Effects 0.000 claims abstract description 21
- 238000007747 plating Methods 0.000 claims abstract description 13
- 230000005611 electricity Effects 0.000 claims abstract description 5
- 239000003814 drug Substances 0.000 claims description 47
- 239000007789 gas Substances 0.000 claims description 26
- 238000005507 spraying Methods 0.000 claims description 11
- 238000002791 soaking Methods 0.000 claims description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 208000013715 atelosteogenesis type I Diseases 0.000 claims description 4
- 238000007670 refining Methods 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000001569 carbon dioxide Substances 0.000 claims description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 3
- 239000001307 helium Substances 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 description 10
- 239000002245 particle Substances 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 238000005243 fluidization Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to the technical field of PCB manufacturing, in particular to a printed circuit board production process for a high-end server and a printed circuit board, wherein a negative film process is adopted to carry out on-board electricity and outer layer treatment on the PCB, and then tin-plating and back drilling treatment are sequentially carried out on the PCB; wherein, the tin melting treatment comprises the following steps: injecting tin melting liquid into the compressed gas to disperse and refine the grain size of the tin melting liquid in the compressed gas; the high-end server is used for tin plating the high-aspect-ratio PCB with the printed circuit board production process with low cost and high efficiency, and can stably ensure that the drilling holes of the high-aspect-ratio PCB are uniformly deposited with a tin layer.
Description
Technical Field
The invention relates to the technical field of PCB manufacture, in particular to a printed circuit board production process for a high-end server and a printed circuit board.
Background
Network communication and data transmission have been developed in the high-speed and high-capacity transmission direction, and the problem of distortion caused by the need of strictly controlling signals such as reflection, scattering and delay of high-speed signal transmission has been shown that the factors affecting the signal integrity of a signal system have a great influence on the integrity of the signal system, except for the design of a PCB (printed circuit board), the board material, the transmission line, the connector, the chip package and the like, such as the thickness of the back board, the size of the back board, the number of layers of the back board, the alignment of the back board, the back drilling depth and the stub line, the electroplating drilling depth and the via hole.
As network communication and data transmission are advancing toward high-speed and high-capacity transmission, PCB boards will advance toward large-size, ultra-multi-layer and high-thickness, playing a key role in network transmission, and thus, manufacturing PCB boards will face more difficulties and more demands must be placed on PCB board manufacturing.
At present, copper burrs remained in holes after back drilling are conveniently etched away by etching after back drilling of a PCB (printed circuit board) after copper tin electroplating, so that the signal transmission integrity of the through holes is prevented from being influenced. However, before back drilling of the PCB, the PCB is processed through a positive process, which is as follows: plate electricity-outer layer-pattern electroplating-tinning-back drilling-film removing-etching-tin stripping-outer layer transferring AOI.
However, the positive process described above has disadvantages: because the tinning liquid has viscosity, the grain size of water molecules is 50-100 mu m, the tinning liquid cannot be well poured into the drilled holes of the PCB, a tin layer is required to be manufactured through pattern electroplating and tinning, and then tin stripping treatment is also required. The pattern electroplating and tinning processes are required to be carried out on a gantry electroplating copper-tin wire and a VCP vertical continuous electroplating copper-tin wire, and the electroplating liquid medicine replacement is carried out on the equipment production lines in vertical vibration, jet flow, filtration and swinging modes, otherwise, the liquid medicine is difficult to pour into the drilling holes of the PCB. In actual production, the positive flow can not well fill the liquid medicine into the drilled holes of the PCB with the aspect ratio larger than 16:1, the quality and thickness of tin plating in the holes are affected, and when the PCB is etched later, the defects such as thinner tin plating in the holes, bubbles and the like can cause copper-free open-circuit of the holes. In this connection, it is also necessary to thicken the tin coating in order to increase the tin plating in the drill hole, which undoubtedly increases the production costs.
Disclosure of Invention
The invention aims to avoid the defects in the prior art and provide a printed circuit board production process for a high-end server, which can tin-plate a high-aspect-ratio PCB with low cost and high efficiency and can stably ensure that a required tin layer is uniformly deposited on a drilled hole of the high-aspect-ratio PCB.
In order to achieve the above purpose, the present invention provides the following technical solutions:
providing a production process of a printed circuit board for a high-end server, adopting a negative film process to carry out on-board electricity and outer layer treatment on a PCB, and then sequentially carrying out tin-removing and back drilling treatment on the PCB;
wherein, the tin melting treatment comprises the following steps:
injecting tin melting liquid into the compressed gas to disperse and refine the grain size of the tin melting liquid in the compressed gas;
and (3) carrying out tin melting soaking treatment on the PCB, then horizontally placing the PCB, and spraying tin melting liquid medicine after refining on the drilled holes on the PCB.
In some embodiments, the pressure of the compressed gas is 30mpa to 50mpa.
In some embodiments, the tin bath solution has a particle size of 0.5 μm to 1 μm.
In some embodiments, the compressed gas is an inert gas.
In some embodiments, the inert gas is at least one of nitrogen, carbon dioxide, argon, and helium.
In some embodiments, the etching, stripping and transfer layer AOI processes are performed sequentially after the PCB board backdrilling process.
In some embodiments, the PCB board is placed in a horizontal assembly line, a tin melting station is arranged on the horizontal assembly line, and when the PCB board flows to the tin melting station, liquid tin is sprayed on the drilling holes of the PCB board.
In some embodiments, the compressed gas is injected into a container, and the tin melting liquid medicine is injected into the container, so that the volume ratio of the container to the tin melting liquid medicine is 10-11:1.
The printed circuit board production process for the high-end server has the beneficial effects that:
(1) According to the production process of the printed circuit board for the high-end server, the tin layer is deposited on the PCB in a tin melting mode, wherein the PCB is soaked in tin melting liquid medicine, so that the tin melting liquid medicine is primarily coated on the PCB, and the PCB is coated in a large area. And then spraying the fluidization tin liquid medicine into the holes of the PCB, wherein the fluidization tin liquid medicine for spraying needs to be injected into compressed gas firstly, and the compressed gas disperses and refines the tin liquid medicine into aqueous solution with small particle size through self flowing pressure.
(2) According to the production process of the printed circuit board for the high-end server, the soaking mode and the jet mode are mutually cooperated, the soaking mode can be used for rapidly coating a large-area tin layer on the PCB, the tin melting efficiency and the tin melting amount are guaranteed, and the jet mode is used for injecting tin melting liquid medicine with small particle size into the drill holes of the PCB, so that the tin melting liquid medicine can be fully filled into the drill holes, rapid tin melting in a short time, the tin melting quality is guaranteed, and the production period is effectively reduced.
(3) According to the production process of the printed circuit board for the high-end server, the tin layer can be prepared in a soaking and jet mode, a large-scale copper-tin wire plating is not needed, and the production cost is low; in addition, the tin layer can be prepared through a negative film process, and pattern electroplating, tinning and tin stripping treatment in a positive film process are not needed, so that the production period is effectively shortened, and the effect of reducing the production cost is achieved; in addition, the tin consumption of the jet flow tin melting is low, the tin thickness in the PCB hole is ensured without a large amount of tin plating, and the production cost is further reduced.
(4) According to the printed circuit board production process for the high-end server, the step of spraying tin can overcome the problem that the drilling depth of the high-aspect ratio PCB is large, the tin-melting liquid medicine can be stably poured into the drilling of the PCB, the controllability is high, the production stability is improved, and the production quality of the PCB is guaranteed.
(5) According to the production process of the printed circuit board for the high-end server, the tin-melting liquid medicine is not only sprayed to generate spraying fluid, but also thinned under the impact of compressed gas before being sprayed, so that the grain diameter thinning degree of the tin-melting liquid medicine is ensured, and then the tin-melting liquid medicine is effectively poured into the drilled holes of the PCB.
The printed circuit board is manufactured by the printed circuit board production process based on the high-end server.
The high-end server printed circuit board is a PCB with the aspect ratio larger than 16:1; and tin with the thickness of 0.5-1 mu m is deposited in the wall of the drilling hole in the PCB.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.
In the accompanying drawings:
fig. 1 is a flowchart of a printed circuit board production process for a high-end server of embodiment 2.
Detailed Description
Preferred embodiments of the present invention will be described in more detail below. While the preferred embodiments of the present invention have been illustrated, it should be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the invention. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Example 1
In the production process of the printed circuit board for the high-end server disclosed by the embodiment, as shown in fig. 1, the negative film process is adopted to carry out on-board electricity and outer layer treatment on the PCB, and then tin-plating and back drilling treatment are sequentially carried out on the PCB;
wherein, the tin melting treatment comprises the following steps:
injecting tin melting liquid into the compressed gas to disperse and refine the grain size of the tin melting liquid in the compressed gas;
and (3) carrying out tin melting soaking treatment on the PCB, then horizontally placing the PCB, and spraying tin melting liquid medicine after refining on the drilled holes on the PCB.
The working principle of the printed circuit board production process for the high-end server is as follows: the PCB is soaked in the tin-melting liquid medicine, so that the tin-melting liquid medicine is primarily coated on the PCB, and the PCB is coated in a large area. And then spraying the fluidization tin liquid medicine on the drilled holes of the PCB, wherein the fluidization tin liquid medicine for spraying is required to be injected into compressed gas, and the compressed gas disperses and refines the tin liquid medicine into aqueous solution with small particle size through self flowing pressure.
The printed circuit board production process for the high-end server has the following functions and benefits: the compressed gas disperses and refines the tin-melting liquid medicine into aqueous solution with small particle size through self flowing pressure, and the tin-melting liquid medicine is fully filled into the drilled holes of the PCB due to the small particle size of the tin-melting liquid medicine, so that the problem that the large-particle-size tin-melting liquid medicine is difficult to enter the drilled holes of the PCB with high aspect ratio is avoided, the electrical performance of the PCB is improved, and the practice proves that the PCB with high aspect ratio of more than 25:1 can be uniformly tinned. The soaking mode and the jet mode are mutually cooperated, the soaking mode can rapidly coat a large-area tin layer on the PCB, tin melting efficiency and tin melting amount are guaranteed, the jet mode injects tin melting liquid medicine with small particle size into the drill holes of the PCB, so that the tin melting liquid medicine can be fully filled into the drill holes, rapid tin melting in a short time is realized, tin melting quality is guaranteed, and production period is effectively reduced. The tin layer can be prepared by soaking and jet flow modes, a large-scale copper-tin wire plating is not needed, and the production cost is low; in addition, the tin layer can be prepared through a negative film process, and pattern electroplating, tinning and tin stripping treatment in a positive film process are not needed, so that the production period is effectively shortened, and the effect of reducing the production cost is achieved; in addition, the tin consumption of the jet flow tin melting is low, the tin thickness in the PCB hole is ensured without a large amount of tin plating, and the production cost is further reduced. The step of spraying tin melting can solve the problem that the drilling depth of the PCB is large in the high aspect ratio, ensures that tin melting liquid medicine can be stably poured into the drilling of the PCB, has strong controllability, improves the stability of production, and ensures the production quality of the PCB.
Example 2
The printed circuit board production process for the high-end server disclosed by the embodiment uses a negative film process, and comprises the following steps of:
s1, carrying out plate electricity on a PCB so as to thicken the thickness of a copper plating layer in a hole;
s2, performing outer layer treatment to prepare a dry film;
s3, sequentially carrying out tin treatment and back drilling treatment on the PCB, wherein the tin treatment comprises the following steps:
injecting tin melting liquid into the compressed gas to disperse and refine the grain size of the tin melting liquid in the compressed gas;
and (3) carrying out tin melting soaking treatment on the PCB, then horizontally placing the PCB, and spraying tin melting liquid medicine after refining on the drilled holes on the PCB.
In this embodiment, the pressure of the compressed gas is 30Mpa to 50Mpa, preferably 40Mpa. The compressed gas with the pressure can better disperse and refine the tin melting liquid medicine, and ensure the fineness particle size of the tin melting liquid medicine, so that the particle size of the tin melting liquid medicine is 0.5-1 mu m.
Under normal conditions, the grain size of the tin melting liquid medicine is 50-100 mu m, and the grain size of the tin melting liquid medicine can be effectively thinned to 0.5-1 mu m under the dispersion and gasification effects of compressed gas, namely, the grain size of the liquid medicine is greatly thinned, and the tin melting liquid medicine can be ensured to be filled into the drilled holes of the PCB. The tin melting liquid medicine is not only jet flow mode to generate jet flow, but also refined by the impact of compressed gas before jet flow, thus ensuring the grain diameter refinement degree of the tin melting liquid medicine and then effectively filling into the drill holes of the PCB.
In this embodiment, the compressed gas is an inert gas. Preferably, the inert gas is at least one of nitrogen, carbon dioxide, argon and helium.
The inert gas does not affect the performance of the tin bath. In practical applications, other inert gases can be used.
In this embodiment, after the back drilling treatment of the PCB board, etching, film removal and transfer layer AOI treatment are sequentially performed.
Because the tin layer prepared by the tin melting method does not need pattern electroplating and tin plating, the process after back drilling does not involve tin stripping, thereby improving the production efficiency and saving the materials.
In this embodiment, will the PCB board is arranged in horizontal assembly line, be equipped with the tin station that changes on the horizontal assembly line, when the PCB board flows to tin station that changes, spouts the fluidization tin liquid medicine to the drilling of PCB board.
After the PCB is processed, the PCB can be automatically sprayed with tin liquid medicine when being placed on a horizontal assembly line, the automation degree is high, the production efficiency is improved, and the tin liquid medicine can flow into the drilled holes of the PCB conveniently through the horizontal assembly line.
In this embodiment, the compressed gas is injected into a container, and the tin melting liquid medicine is injected into the container, so that the ratio of the volume of the container to the volume of the tin melting liquid medicine is 10-11:1, preferably 10:1.
The tin-melting water quantity is controlled according to the container, so that the tin-melting water quantity can be conveniently and accurately regulated, and the grain diameter of the tin-melting water can be accurately controlled.
Example 3
This example discloses a high-end server printed circuit board made by the process of example 2.
In this embodiment, the high-end server printed circuit board is a PCB board with an aspect ratio greater than 16:1; the tin layer is deposited in the wall of the hole of the PCB with the thickness of 0.5-1 mu m and is used as a corrosion resistant layer during etching, so that the quality meets the requirements of customers, and the production process capability of the back drilling plate with high aspect ratio is improved; meanwhile, the negative film process can be simplified, and the production cost can be saved.
The tin thickness of 0.5-1 mu m is deposited in the hole wall of the drilling hole of the PCB with the aspect ratio larger than 16:1, so that the problem of poor tin deposition effect of the PCB with the aspect ratio larger than 16:1 in the prior art is solved, and the production and development of the PCB with the high aspect ratio are facilitated. In practical application, the PCB with the high aspect ratio larger than 25:1 can be tinned. And moreover, batch verification proves that copper-free scrapping of holes caused by poor tin deposition in the holes can be avoided.
The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise. Also, it should be appreciated that techniques, methods and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and apparatus should be considered part of the specification. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values.
In the description of the present application, it should be understood that, positional terms such as "front, rear, upper, lower, left, right", "transverse, vertical, horizontal", and "top, bottom", etc., are generally based on positional or positional relationships, and are merely for convenience of describing the present application and simplifying the description, and these positional terms do not indicate and imply that the devices or elements referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus should not be construed as limiting the scope of protection of the present application; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above" and the like, may be used herein for ease of description to describe a spatial positional relationship of one device or feature to another device or feature. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. Exemplary terms "above … …" can include both orientations of "above … …" and "below … …. The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are merely for convenience of distinguishing the corresponding components, and unless otherwise stated, the terms have no special meaning, and thus should not be construed as limiting the scope of the present application.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A production process of a printed circuit board for a high-end server is characterized in that a negative film process is adopted to carry out on-board electricity and outer layer treatment on a PCB, and then tin-plating and back drilling treatment are sequentially carried out on the PCB;
wherein, the tin melting treatment comprises the following steps:
injecting tin melting liquid into the compressed gas to disperse and refine the grain size of the tin melting liquid in the compressed gas;
carrying out tin melting soaking treatment on the PCB, then horizontally placing the PCB, and spraying tin melting liquid medicine after refining on holes drilled on the PCB;
the pressure of the compressed gas is 30 mpa-50 mpa, and the grain size of the tin melting liquid medicine is 0.5 μm-1 μm.
2. The process for producing printed circuit boards for high-end servers according to claim 1, wherein the compressed gas is at least one of nitrogen, carbon dioxide, argon and helium.
3. The process for producing a printed circuit board for a high-end server according to claim 1, wherein the etching, the stripping and the transfer layer AOI treatment are sequentially performed after the back drilling treatment of the PCB.
4. The process according to claim 1, wherein the PCB is placed in a horizontal line, a tin melting station is provided on the horizontal line, and the liquid tin is sprayed into the holes of the PCB when the PCB flows to the tin melting station.
5. The process according to claim 1, wherein the compressed gas is injected into the container, and the tin melting liquid is injected into the container so that the ratio of the volume of the container to the volume of the tin melting liquid is 10-11:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311294590.9A CN117042338B (en) | 2023-10-09 | 2023-10-09 | Printed circuit board production process for high-end server and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311294590.9A CN117042338B (en) | 2023-10-09 | 2023-10-09 | Printed circuit board production process for high-end server and printed circuit board |
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| Publication Number | Publication Date |
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| CN117042338A CN117042338A (en) | 2023-11-10 |
| CN117042338B true CN117042338B (en) | 2024-01-12 |
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| CN202311294590.9A Active CN117042338B (en) | 2023-10-09 | 2023-10-09 | Printed circuit board production process for high-end server and printed circuit board |
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| CN116056334A (en) * | 2022-12-30 | 2023-05-02 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of tiny back drilling hole |
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