CN212800536U

CN212800536U - Plating solution jet flow box assembly for IC carrier plate

Info

Publication number: CN212800536U
Application number: CN202020995882.0U
Authority: CN
Inventors: 王爱臣; 王兴平; 田东培; 王芳; 董光义
Original assignee: Cookson Enthone Chemistry Shanghai Co Ltd
Current assignee: Alent Enthone Chemistry Shanghai Co Ltd
Priority date: 2020-06-03
Filing date: 2020-06-03
Publication date: 2021-03-26
Anticipated expiration: 2030-06-03

Abstract

The utility model provides a plating bath jet flow box subassembly for IC support plate, plating bath jet flow box subassembly includes the jet flow box of two symmetries, and every jet flow box is provided with the inner chamber that is used for holding the plating bath and is used for spraying a plurality of jet flow holes of plating bath, and when chemical plating, the jet flow box of two symmetries sprays the plating bath to hanging the surface of waiting to plate the IC support plate between them simultaneously through a plurality of jet flow holes. The plating solution jet box assembly can realize uniform chemical plating of the IC carrier plate in a laboratory, is used for laboratory research of SAP or MSAP technology of the IC carrier plate, and provides reliable technological parameters and data for subsequent mass production.

Description

Plating solution jet flow box assembly for IC carrier plate

Technical Field

The utility model relates to a jet flow part, more specifically say and relate to a plating bath jet flow box subassembly for IC support plate, mainly used laboratory scale carries out IC support plate chemical plating process test.

Background

At present, the development of the electronic industry is very rapid, and the requirement of the industry on the complexity of electronic products is higher and higher. The development direction of electronic products is higher integration level, stronger function and lower energy consumption, and consumer electronic products also have the trend of small, light and thin. Taking a smart phone as an example, since more and more functions are added and larger screens are equipped, reducing power consumption becomes a key point, and reducing size and increasing integration level are effective ways to realize multifunction and low power consumption. Reducing the feature size of the PCB is a key technology, and more integration needs to be achieved in a fixed area. In the past, PCBs were used to implement the interconnection of chips and end products, but are now becoming integrated solutions. Slp (substrate Like pcb), a production technology of carrier boards, is one of the solutions to meet the large-scale demands today. Today's "circuit boards" have obscured the definition between PCB and IC carrier boards, SLP is therefore so named.

The main difference between the conventional PCB and IC carrier is line width and line spacing (L/S), and the similar carrier can shorten the line width/line spacing from 40/50 micrometers of HDI (high density interconnect circuit board) to 20/35 micrometers, i.e. the minimum line width/line spacing is shortened from 40 micrometers of HDI to 30 micrometers of SLP. The SLP board for the intelligent mobile phone has the advantages that the bearing quantity of electronic components in the same area can be more than twice of that of HDI. Class carrier boards are the trend for next generation PCB hardboards.

Due to the reduction of the line width/line distance, the used materials are thinner and the size of the via hole is smaller. The processing technology of the IC carrier plate is imperative. SAP (semi-additive) and mSAP (modified semi-additive) are commonly used processes in IC carrier production, which can fill the gap between IC and PCB manufacturing capabilities. Both the SAP and mSAP processes begin with a core dielectric and a thin copper layer during PCB production. One of the fundamental differences between these two process flows is the thickness of the seed copper layer. Typically, the SAP process starts with a thin chemical copper layer (less than 1.5mm), while the mSAP starts with a thin laminated copper foil (greater than 1.5 mm). Whichever process is chosen, a uniform layer of electroless copper is a fundamental guarantee for achieving subsequent finer line processing.

The chemical copper plating device used for the SAP or mSAP process of the IC carrier plate in the market is mostly produced in a large scale and is suitable for mass production. A general electroless copper plating apparatus includes a plurality of jet pipes, an electroless plating tank, and an electroless plating solution circulating apparatus. The plurality of independent jet flow pipes are used for circularly stirring the plating solution, and simultaneously, the high-speed jet flow mode also enhances the solution exchange of the plating solution on the surface and in the holes of the carrier plate, so that the uniformity of the plating layer is better. Each jet pipe is respectively connected with a pipeline of the chemical plating solution circulating device. One or more uniformly arranged round holes are arranged at the bottom of the chemical plating tank and are used as inlets of plating solution entering the pipeline of the circulating device. In practical applications, before a new product is used in the SAP process or the mSAP process, the effect of the process needs to be verified in the laboratory to determine whether the process can be stably used in subsequent mass production and achieve the expected effect. At present, no chemical plating device which is suitable for being used in a laboratory and used for verifying the effect of the SAP process or the mSAP process of the IC carrier plate exists, so that the laboratory-scale process verification cannot be completed.

Disclosure of Invention

The utility model aims at providing a plating bath jet box subassembly for IC support plate, this plating bath jet box subassembly can realize the even chemical plating of IC support plate in the laboratory, for example, the accurate chemical copper technology of IC support plate.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

a plating solution jet flow box assembly for an IC carrier plate comprises two symmetrical jet flow boxes, wherein each jet flow box is provided with an inner cavity for containing plating solution and a plurality of jet flow holes for jetting the plating solution, and when the plating solution jet flow box assembly works, the two symmetrical jet flow boxes jet the plating solution to the surface of the IC carrier plate to be plated hung between the two symmetrical jet flow boxes through the plurality of jet flow holes.

Preferably, each of the aforementioned spray boxes is further provided with a window made of a transparent material for observing the condition of the plating solution in the inner cavity of the spray box.

Preferably, each of the above-mentioned jet boxes is in a rectangular parallelepiped shape including a front face, a back face, a top face, a bottom face, a left side face and a right side face.

Preferably, the plurality of the spray holes are uniformly distributed on the front surface of each spray box in a staggered mode, and the window is arranged on the back surface of each spray box.

Preferably, the diameter of the jet holes is 0.5-1.5 mm, and the distance is 2-4 mm.

More preferably, the diameter of the spouting holes is 1.0mm, and the pitch is 3 mm.

Preferably, the entire back surface of each of the aforementioned flow-jet cartridges is made of a transparent material for observing the condition of the plating solution in the inner cavity of the flow-jet cartridge.

Preferably, the above-mentioned spray box is further provided with a plating solution receiving box for connecting with a pipe of the plating solution circulating unit.

More preferably, the plating solution receiving cartridge is disposed at the top of the flow-jet cartridge.

Preferably, a filter screen is arranged inside the jet flow box and used for filtering impurities in the plating solution so as to prevent the impurities from entering the jet flow box and blocking the jet flow hole.

Preferably, the two symmetrical jet cartridges are fixedly connected by a rigid connecting member to prevent them from moving or wobbling during the jetting process.

Preferably, the two symmetrical jet cartridges are fixedly connected diagonally by two rigid rods.

The utility model provides a plating bath jet box subassembly for IC support plate for the first time, it includes the jet box of two symmetries. The plating solution jet box assembly can realize uniform chemical plating of the IC carrier plate in a laboratory, is used for laboratory research of SAP or mSAP process of the IC carrier plate, and provides reliable process parameters and data for subsequent mass production. The utility model discloses following beneficial effect has:

the utility model discloses following beneficial effect has:

(1) the utility model discloses a plating solution jet flow box subassembly includes two symmetrical jet flow boxes, and the IC support plate that waits to plate suspends between these two jet flow boxes, and the surface that hangs the IC support plate that waits to plate between them sprays the plating solution to a plurality of spray holes that stagger evenly distributed on every jet flow box for the plating solution forms even deposit on the surface of the IC support plate that waits to plate, thereby forms even chemical plating layer, for example accurate chemical copper technology;

(2) the utility model discloses a back of the jet box of plating bath jet box subassembly is provided with visual window or the whole back is made by transparent material for the condition of the plating bath of jet box is visual, is convenient for in time adjust the pressure and the flow that get into the plating bath of jet box according to the condition of the plating bath of observing, avoids reacing the plating bath local pressure that treats plating IC support plate surface too big, and the impact is treated plating IC support plate surface and is leaded to its deformation.

Drawings

In order to illustrate the embodiments of the invention more clearly, reference will now be made briefly to the attached drawings of embodiments, it being understood that the drawings described below are only examples of some embodiments of the invention, and that other drawings may be derived from these drawings by a person skilled in the art without the inventive step in the forerunner.

FIG. 1 schematically illustrates the structure of a plating bath jet cartridge assembly according to an embodiment of the present invention.

FIG. 2 schematically illustrates the structure of the front face of one jet cartridge of the plating bath jet cartridge assembly of FIG. 1.

FIG. 3 schematically illustrates the two fluidic cartridges of the plating bath fluidic cartridge assembly of FIG. 1 fixedly coupled together.

Detailed Description

In the description of the present invention, the "condition of the plating solution" refers to the level and flow condition of the plating solution in the inner cavity of the jet flow cartridge. The flow rate, the jet flow mode and the like of the plating solution entering the jet flow box can be adjusted in time according to the observed liquid level and the flowing condition of the plating solution.

In the description of the present invention, the jet box can be made of any material suitable for containing plating solution, such as PVC material. When the rear surface of the jet flow cartridge is provided with the transparent window, the transparent window may be made of a transparent acrylic plate, and when the entire rear surface of the jet flow cartridge is a transparent material, the rear surface may be made of a transparent acrylic plate.

In order to make the technical means, creation features, achievement purposes and effects of the present invention easy to understand and understand, the present invention is further explained below with reference to the accompanying drawings.

As shown in fig. 1, the plating bath jet box assembly 1 of the present invention includes a jet box 1A and a jet box 1B, and an IC substrate 2 to be plated is suspended between the jet box 1A and the jet box 1B. The shapes and structures of the jet flow cartridge 1A and the jet flow cartridge 1B of the plating bath jet flow cartridge assembly 1 are completely symmetrical. In the example shown in the figure, the spout box 1A and the spout box 1B are in a rectangular parallelepiped shape, and the surface thereof provided with the spout holes matches the shape of the IC carrier board 2 to be plated. For example a cuboid having dimensions 30mm X80 mm X160 mm. Of course, the flow-ejecting box 1A and the flow-ejecting box 1B may have other shapes, and it is possible to provide a surface provided with flow-ejecting holes that matches the shape of the IC carrier 2 so as to uniformly eject the plating solution thereto. The jet flow box 1A and the jet flow box 1B are respectively provided with inner cavities for containing plating solution. The spout cartridge 1A includes a front surface (not shown), a back surface 11A, a top surface 12A, a bottom surface (not shown), a left side surface 14A, and a right side surface (not shown). The flow box 1B includes a front surface 10B, a back surface (not shown), a top surface 12B, a bottom surface (not shown), a left side surface (not shown), and a right side surface 15B. The top surface 12A and the top surface 12B are respectively provided with a plating solution receiving box 121A and a plating solution receiving box 121B for receiving plating solution from the plating solution circulating unit and releasing the plating solution into the inner cavities of the jet flow box 1A and the jet flow box 1B. The plating solution receiving box 121A and the plating solution receiving box 121B are provided with filter screens (not shown in the figure) for filtering impurities in the plating solution to prevent the impurities from entering the jet flow box and blocking the jet flow hole. The plating solution receiving cassette 121A and the plating solution receiving cassette 121B are cylindrical in shape in the embodiment shown in FIG. 1. A plurality of ejection holes are provided in the front surface of the ejection cartridge 1A and the front surface 10B of the ejection cartridge 1B, respectively, and the ejection hole 101B is provided in the front surface 10B. The size of the jet holes can be phi 1.0mm, the distance between the jet holes is 3mm, and the jet holes are uniformly distributed on the front surface of the jet box 1A and the front surface 10B of the jet box 1B in a staggered mode (see figure 2). Transparent windows are respectively arranged on the back surface 11A and the back surface of the jet flow box 1B, and the window 111A is arranged on the back surface 11A and is used for observing the liquid level and the flowing condition of the plating solution in the inner cavity so as to know the condition of the plating solution in time and then adjusting the flow rate and the jet flow mode of the plating solution in time according to the observed condition of the plating solution.

The jet flow box 1A and the jet flow box 1B can be connected through a rigid connecting piece to fix the distance between the jet flow box 1A and the jet flow box 1B, and the distance between the jet flow box 1A and the jet flow box 1B can be adjusted according to needs, so that the phenomenon that the front surface of the jet flow box 1A and the front surface 10B of the jet flow box 1B shake relative to an IC carrier plate to be plated due to pressure in the plating solution spraying process to cause uneven plating solution spraying can be avoided. In the structure shown in fig. 3, two rigid rods 16 are provided diagonally between the jet box 1A and the jet box 12B, so that the jet box 1A and the jet box 1B are fixedly connected, and the distance therebetween can be adjusted by adjusting the length of the rod 16 therebetween.

The utility model discloses a working method of system as follows:

in use, the bath receiving box 121A and bath receiving box 121B on the jet flow box 12A and jet flow box 12B of the bath jet flow box assembly receive the bath (e.g., from the circulation device), are filtered and released into the inner cavity, and then the bath is sprayed to the IC carrier plate suspended between the two jet flow boxes simultaneously through the spray hole of the jet flow box 1A and the spray hole 101B of the jet flow box 1B.

Through the above description, can see and compare with the chemical plating device of the IC support plate that is used for the laboratory now, the utility model discloses a plating bath jet box subassembly utilizes the jet box of two symmetries, sets up a plurality of jet orifices in the front of jet box, realizes forming even metal deposition on the surface of waiting to plate the IC support plate, and sets up the visual window at the back of jet box, can observe the plating bath condition (including liquid level height and flow situation) in the jet box inner chamber at any time to flow size and the jet mode of plating bath are in time adjusted to the plating bath condition in the inner chamber that observes, reduce and wait to plate the too big deformation that leads to it of IC support plate local pressure.

Therefore, the plating solution jet box assembly of the utility model achieves the following obvious technical effects:

the uniform metal deposition is formed on the surface of the IC carrier plate to be plated, the flow and the jet flow mode of the plating solution can be adjusted in time, the deformation of the IC carrier plate to be plated caused by overlarge local pressure is reduced, and reliable process parameters and data are provided for subsequent mass production;

the basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The plating solution jet flow box assembly for the IC carrier plate is characterized by comprising two symmetrical jet flow boxes, wherein each jet flow box is provided with an inner cavity for containing plating solution and a plurality of jet flow holes for jetting the plating solution, and when the plating solution jet flow box assembly works, the two symmetrical jet flow boxes jet the plating solution to the surface of the IC carrier plate to be plated hung between the two symmetrical jet flow boxes through the plurality of jet flow holes.

2. The plating solution jet box assembly for the IC carrier plate according to claim 1, wherein each jet box is further provided with a window made of a transparent material for observing the condition of the plating solution in the inner cavity of the jet box.

3. The plating bath jet box assembly for an IC carrier according to claim 2, wherein each jet box is rectangular parallelepiped and comprises a front surface, a back surface, a top surface, a bottom surface, a left side surface and a right side surface.

4. The plating bath jet box assembly for an IC carrier plate according to claim 3, wherein the plurality of jet holes are uniformly distributed on the front surface of each jet box in a staggered manner, and the window is arranged on the back surface of each jet box.

5. The jet box assembly for IC carrier plate of claim 1, wherein the diameter of the jet hole is 0.5-1.5 mm and the distance is 2-4 mm.

6. The plating bath jet box assembly for an IC carrier plate according to claim 3, wherein the entire back surface of each jet box is made of a transparent material for observing the condition of the plating bath in the inner cavity of the jet box.

7. The plating solution jet box assembly for the IC carrier according to claim 1, wherein the jet box is further provided with a plating solution receiving box for connecting with the pipe of the plating solution circulating unit.

8. The plating solution jet box assembly for IC carrier plate according to claim 7, wherein the interior of the jet box is provided with a filter screen for filtering impurities in the plating solution to prevent the impurities from entering the jet box and blocking the jet hole.

9. The plating bath jet box assembly for an IC carrier according to claim 1, wherein the two symmetrical jet boxes are fixedly connected by a rigid connecting component to prevent the two jet boxes from moving or shaking during the jet process.

10. The plating bath jet box assembly for an IC carrier according to claim 9, wherein the two symmetrical jet boxes are fixedly connected at opposite corners by two rigid rods.