CN117026174A - Composite water channel substrate and preparation method and application thereof - Google Patents
Composite water channel substrate and preparation method and application thereof Download PDFInfo
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- CN117026174A CN117026174A CN202311019860.5A CN202311019860A CN117026174A CN 117026174 A CN117026174 A CN 117026174A CN 202311019860 A CN202311019860 A CN 202311019860A CN 117026174 A CN117026174 A CN 117026174A
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- 239000000758 substrate Substances 0.000 title claims abstract description 74
- 239000002131 composite material Substances 0.000 title claims abstract description 52
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000003466 welding Methods 0.000 claims abstract description 91
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000000498 cooling water Substances 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 57
- 239000000077 insect repellent Substances 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 abstract description 34
- 238000004544 sputter deposition Methods 0.000 abstract description 26
- 239000013077 target material Substances 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 9
- 239000003507 refrigerant Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 239000012043 crude product Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001513 hot isostatic pressing Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a composite water channel substrate and a preparation method and application thereof, wherein the composite water channel substrate comprises a main body, a first cover plate is welded on one side of a target welding surface of the main body, and a second cover plate is welded on one side of the back surface of the main body; a first embedded water channel is formed in the welding contact surface of the main body and the first cover plate; a second embedded water channel is formed in the welding contact surface of the second cover plate and the main body; an open water channel is arranged on the back surface of the main body. The invention combines the double cooling modes of the open water channel and the embedded water channel, reduces the distance between the cooling water channel and the welding surface on the basis of ensuring the welding strength of the composite water channel substrate and the target blank, increases the cooling area and achieves the aim of fully cooling the target material in the sputtering process.
Description
Technical Field
The invention relates to the technical field of target sputtering, in particular to a composite water channel substrate, and a preparation method and application thereof.
Background
Sputtering is a common coating method in the field of semiconductors, and a target assembly participating in sputtering is generally formed by welding two parts of a target and a substrate. The working environment of the target assembly is severe, and the temperature of the target assembly is rapidly increased in the sputtering process, so that heat is required to be transferred through the substrate and rapidly cooled, and the problems of deformation of the target assembly and the like caused by the heat transfer are also required to be avoided.
At present, the target is cooled mainly through an open water channel on the back of the substrate, and in consideration of the problems of mounting strength, deformation and the like of the substrate, a thicker wall layer is generally designed between the water channel and the welding surface of the target so as to ensure the mounting strength of the substrate and prevent the deformation. However, the temperature is higher during sputtering of the target, the design is unfavorable for the sufficient cooling in the sputtering process of the target, and once the temperature is too high during the sputtering process, the risk of the target and the substrate being unwelded is easily generated.
CN 114918525a discloses a target cooling back plate and a welding method thereof, solid particles are filled in a water channel of a back plate bottom plate and then fixed with a back plate cover plate, so as to obtain a component to be welded; carrying out hot isostatic pressing welding on the components to be welded to obtain a semi-finished target cooling backboard; and removing solid particles in the semi-finished target cooling backboard to obtain the target cooling backboard.
CN 112372165a discloses a welding method of a target cooling backboard, the welding method comprises the following steps: (1) Machining the cover plate and the base, wherein the machined base comprises a cooling water channel; (2) Contacting the cover plate machined in the step (1) with the cooling water channel, performing assembly treatment on the cover plate and the base, and then performing vacuum brazing to obtain a target cooling backboard crude product; (3) And (3) performing friction stir welding on the welding seam of the crude product of the target cooling backboard in the step (2) to obtain the target cooling backboard.
CN 208733208U discloses a target backplate structure, the seed target backplate structure is through setting up a set of heat dissipation aluminum product in the below of accepting the board, and after supporting through main curb plate, the vice curb plate on the bottom plate again, inside aluminum sheet group can contact with accepting the board, transmits the temperature that the target surface produced, and the accessible sets up a refrigerant subassembly in the below of heat dissipation aluminum product, and refrigerant subassembly sets up serpentine crooked refrigerant pipe on the surface of top refrigerant board, can transmit the refrigerant, is convenient for exchange the heat that the heat dissipation aluminum product of top absorbed.
The target assembly is cooled by adding the cooling water channel or the component playing a role in heat dissipation in the target backboard, but the cooling effect is still to be improved due to the arrangement of a single cooling component, so that the aim of full cooling cannot be achieved.
In view of the shortcomings of the prior art, it is desirable to provide a substrate that has high weld strength with a target blank and is capable of sufficiently cooling the target blank.
Disclosure of Invention
The invention aims to provide a composite water channel substrate, a preparation method and application thereof, wherein a double-sided embedded water channel is designed on the welding surface and the back surface of the substrate and is combined with an open water channel, so that the purpose of fully cooling a target in a sputtering process is realized on the basis of ensuring the welding strength of the substrate and a target blank.
In order to achieve the aim of the invention, the invention adopts the following technical scheme:
in a first aspect, the invention provides a composite water channel substrate, which comprises a main body, wherein a first cover plate is welded on one side of a target welding surface of the main body, and a second cover plate is welded on one side of the back surface of the main body;
a first embedded water channel is formed in the welding contact surface of the main body and the first cover plate; a second embedded water channel is formed in the welding contact surface of the second cover plate and the main body; an open water channel is arranged on the back surface of the main body.
According to the composite water channel substrate provided by the invention, the open cooling water channel is designed on the back of the main body and is used for integrally cooling the backboard; the welding surface of the main body and the cover plate is provided with the double-sided embedded cooling water channel, so that the cooling of the welding surface is further enhanced, and the purpose of full cooling in the sputtering process of the target is realized by combining the double cooling modes of the open water channel and the embedded water channel, so that the distance between the cooling water channel and the welding surface is reduced on the basis of ensuring the welding strength of the substrate of the composite water channel and the target blank.
Preferably, the first embedded water channel is of a mosquito-repellent incense type roundabout structure.
Preferably, the depth of the first embedded water channel is 4.8-5.2mm, for example, 4.8mm, 4.9mm, 5mm, 5.1mm or 5.2mm, but not limited to the recited values, and other non-recited values in the range of values are equally applicable.
Preferably, the depth of the groove on the welding contact surface of the second cover plate and the main body is 5.3-5.5mm, for example, 5.3mm, 5.35mm, 5.4mm, 5.45mm or 5.5mm, but the present invention is not limited to the listed values, and other values not listed in the numerical range are equally applicable.
Preferably, the depth of the second embedded water channel is 4.8-5.2mm, for example, 4.8mm, 4.9mm, 5mm, 5.1mm or 5.2mm, but not limited to the recited values, and other non-recited values in the range of values are equally applicable.
Preferably, the second embedded water channel comprises a water inlet embedded water channel and a water outlet embedded water channel which are symmetrically arranged and are not communicated with each other.
Preferably, the water inlet embedded water channel is provided with a water inlet hole, and the water outlet embedded water channel is provided with a water outlet hole.
The water inlet hole and the water outlet hole are designed on the second cover plate, namely are arranged on the back surface of the composite water channel substrate, so that the assembly of the composite water channel substrate and the introduction of cooling water are facilitated.
Preferably, the side wall of the main body is provided with a first waist-shaped through hole and a second waist-shaped through hole which are symmetrically arranged and are not communicated with each other, the first waist-shaped through hole is communicated with a first embedded water channel and a water inlet embedded water channel, and the second waist-shaped through hole is communicated with the first embedded water channel and a water outlet embedded water channel.
The water flow enters the water inlet embedded water channel through the water inlet hole, then enters the first embedded water channel through the first waist-shaped through hole, cools the main body welding surface, flows through the mosquito-repellent incense type roundabout structure of the first embedded water channel, then flows out to the water outlet embedded water channel through the second waist-shaped through hole, flows out through the water outlet hole, and completes the reinforced cooling of the main body welding surface.
Preferably, the edges of the first kidney-shaped through hole and the second kidney-shaped through hole are respectively and independently provided with a boss.
Preferably, the height of the boss is 0.3-0.5mm, for example, 0.3mm, 0.35mm, 0.4mm, 0.45mm or 0.5mm, but not limited to the recited values, and other non-recited values within the range of values are equally applicable.
The arrangement of the boss can effectively prevent solder from flowing into the first kidney-shaped through hole and the second kidney-shaped through hole in the welding process of the main body and the first cover plate, and the cooling process is affected.
Preferably, the distance between the grooved edge of the second cover plate and the inner walls of the first kidney-shaped through hole and the second kidney-shaped through hole is 0.49-0.51mm, for example, 0.49mm, 0.5mm or 0.51mm, which is near one end of the first kidney-shaped through hole and the second kidney-shaped through hole, but not limited to the recited values, and other non-recited values in the numerical range are equally applicable.
The width of the groove of the second cover plate is larger than the width of the inner wall of the first kidney-shaped through hole and the width of the inner wall of the second kidney-shaped through hole by a certain distance in a unilateral manner, so that the edge bosses of the first kidney-shaped through hole and the second kidney-shaped through hole can be ensured to be contained in the groove of the second cover plate.
Preferably, a notch is formed on the welding contact surface of the main body and the second cover plate, a boss is arranged on the outer edge of the notch, the height of the boss is 0.3-0.5mm, for example, 0.3mm, 0.35mm, 0.4mm, 0.45mm or 0.5mm, but the welding contact surface is not limited to the listed values, and other non-listed values in the numerical range are applicable.
Preferably, a concave table is arranged at the outer edge of the welding contact surface of the second cover plate and the main body, and the concave table is matched with a boss at the outer edge of the notch of the main body.
The boss and the concave table which are arranged on the welding contact surface of the second cover plate and the main body are mutually embedded, so that the overflow of welding flux between the second cover plate and the main body in the welding process can be prevented.
Preferably, the diameter of the groove of the welding contact surface of the first cover plate and the main body is enlarged by 0.5-1mm compared with the diameter of the welding surface of the main body, for example, 0.5mm, 0.6mm, 0.8mm, 0.9mm or 1mm, but the present invention is not limited to the listed values, and other values not listed in the numerical range are equally applicable.
Preferably, the depth of the groove on the welding contact surface of the first cover plate and the main body is 1.9-2.1mm, for example, 1.9mm, 1.95mm, 2mm, 2.05mm or 2.1mm, but the present invention is not limited to the listed values, and other values not listed in the range of values are equally applicable.
The arrangement of the diameter and the depth of the groove of the first cover plate can enable one side of the target welding surface of the main body to sink into the groove of the first cover plate, so that firm combination of the two is realized.
In a second aspect, the present invention provides a method for preparing the composite waterway substrate according to the first aspect, the method comprising the steps of:
assembling the main board, the first cover board and the second cover board, and then performing vacuum brazing treatment to obtain a substrate assembly; turning the obtained substrate assembly to obtain the composite water channel substrate; and punching the second cover plate after the turning treatment.
The turning treatment is used for removing all surface allowance; the water inlet hole and the water outlet hole obtained after the punching treatment can be used for circulating high-pressure water flow, so that the target material can be fully cooled in the sputtering process.
Preferably, the vacuum brazing process is performed under high temperature conditions.
In a third aspect, the present invention provides the use of a composite waterway substrate according to the first aspect for the preparation of a target assembly;
the cooling water flow rate of the composite water channel substrate is more than or equal to 15L/min, for example, 15L/min, 16L/min, 17L/min, 18L/min or 19L/min, but the composite water channel substrate is not limited to the listed values, and other values which are not listed in the numerical range are applicable.
Compared with the prior art, the invention has the following beneficial effects:
according to the composite water channel substrate provided by the invention, the open cooling water channel is designed on the back of the main body and is used for integrally cooling the backboard; the welding surface of the main body and the cover plate is provided with the double-sided embedded cooling water channel, so that the cooling of the welding surface is further enhanced, the welding strength of the composite water channel substrate and the target blank can reach 136.3MPa through the combination of the double cooling modes of the open water channel and the embedded water channel, the distance between the cooling water channel and the welding surface is reduced, the cooling area is increased, the deformation of the sputtering surface is obviously reduced, and the aim of fully cooling the target in the sputtering process is fulfilled.
Drawings
Fig. 1 is a schematic cross-sectional view of a composite waterway substrate according to embodiment 1 of the present invention;
FIG. 2 is a top view of a composite waterway substrate provided in example 1 of the present invention;
fig. 3 is a schematic structural view of a second cover plate provided in embodiment 1 of the present invention;
wherein: 1, a main body; 2, a first cover plate; 3, a second cover plate; 4, a first embedded water channel; 5, a second embedded water channel; 6, opening a water channel; 7, a water inlet embedded water channel; 8, a water outlet embedded water channel; 9, a water inlet hole; 10, a water outlet hole; 11, a first kidney-shaped through hole; 12, a second kidney-shaped through hole.
Detailed Description
The technical scheme of the invention is further described by the following specific embodiments. It will be apparent to those skilled in the art that the examples are merely to aid in understanding the invention and are not to be construed as a specific limitation thereof.
Example 1
The present embodiment provides a composite water channel substrate, the schematic cross-sectional structure of which is shown in fig. 1, and the top view of which is shown in fig. 2 (the first cover plate 2 is not shown); the composite water channel substrate comprises a main body 1, a first cover plate 2 is welded on one side of a target welding surface of the main body 1, a second cover plate 3 is welded on one side of the back surface of the main body, and a structural schematic diagram of the second cover plate 3 is shown in fig. 3; a first embedded water channel 4 is formed in the welding contact surface of the main body 1 and the first cover plate 2, the first embedded water channel 4 is of a mosquito-repellent incense type roundabout structure, and the depth is 5mm; a second embedded water channel 5 is formed in the welding contact surface of the second cover plate 3 and the main body 1, and the depth of the second embedded water channel 5 is 5mm; the depth of the groove on the welding contact surface of the second cover plate 3 and the main body 1 is 5.4mm; an open water channel 6 is arranged on the back of the main body 1;
the second embedded water channel 5 comprises a water inlet embedded water channel 7 and a water outlet embedded water channel 8 which are symmetrically arranged and are not communicated with each other; the water inlet embedded water channel 7 is provided with a water inlet hole 9, and the water outlet embedded water channel 8 is provided with a water outlet hole 10; the side wall of the main body 1 is provided with a first waist-shaped through hole 11 and a second waist-shaped through hole 12 which are symmetrically arranged and are not communicated with each other, the first waist-shaped through hole 11 is communicated with the first embedded water channel 4 and the water inlet embedded water channel 7, and the second waist-shaped through hole 12 is communicated with the first embedded water channel 4 and the water outlet embedded water channel 8;
the edges of the first kidney-shaped through hole 11 and the second kidney-shaped through hole 12 are respectively and independently provided with a boss, and the height of the boss is 0.4mm; the distance between the grooved edge of the second cover plate 3 and the inner walls of the first kidney-shaped through hole 11 and the second kidney-shaped through hole 12 is 0.5mm respectively and independently near one ends of the first kidney-shaped through hole 11 and the second kidney-shaped through hole 12;
a gap is formed in the welding contact surface of the main body 1 and the second cover plate 3, a boss is arranged at the outer edge of the gap, and the height of the boss is 0.4mm; the outer edge of the welding contact surface of the second cover plate 3 and the main body 1 is provided with a concave table which is matched with a boss at the outer edge of a notch of the main body 1;
the diameter of the groove of the welding contact surface of the first cover plate 2 and the main body 1 is enlarged by 0.8mm compared with the diameter of the welding surface of the main body 1; the depth of the groove of the welding contact surface of the first cover plate 2 and the main body 1 is 2mm.
The preparation method of the composite waterway substrate comprises the following steps:
assembling the main board 1, the first cover board 2 and the second cover board 3, and then performing vacuum brazing treatment to obtain a substrate assembly; and turning the obtained substrate assembly, and then punching the second cover plate 3 to obtain the composite water channel substrate.
The flow rate of cooling water when the composite water channel substrate is used is 15L/min.
Example 2
The embodiment provides a composite water channel substrate, which comprises a main body 1, wherein a first cover plate 2 is welded on one side of a target welding surface of the main body 1, and a second cover plate 3 is welded on one side of the back surface of the main body; a first embedded water channel 4 is formed in the welding contact surface of the main body 1 and the first cover plate 2, the first embedded water channel 4 is of a mosquito-repellent incense type roundabout structure, and the depth is 4.8mm; a second embedded water channel 5 is formed in the welding contact surface of the second cover plate 3 and the main body 1, and the depth of the second embedded water channel 5 is 5mm; the depth of the groove on the welding contact surface of the second cover plate 3 and the main body 1 is 5.3mm; an open water channel 6 is arranged on the back of the main body 1;
the second embedded water channel 5 comprises a water inlet embedded water channel 7 and a water outlet embedded water channel 8 which are symmetrically arranged and are not communicated with each other; the water inlet embedded water channel 7 is provided with a water inlet hole 9, and the water outlet embedded water channel 8 is provided with a water outlet hole 10; the side wall of the main body 1 is provided with a first waist-shaped through hole 11 and a second waist-shaped through hole 12 which are symmetrically arranged and are not communicated with each other, the first waist-shaped through hole 11 is communicated with the first embedded water channel 4 and the water inlet embedded water channel 7, and the second waist-shaped through hole 12 is communicated with the first embedded water channel 4 and the water outlet embedded water channel 8;
the edges of the first kidney-shaped through hole 11 and the second kidney-shaped through hole 12 are respectively and independently provided with a boss, and the height of the boss is 0.3mm; the distance between the grooved edge of the second cover plate 3 and the inner walls of the first kidney-shaped through hole 11 and the second kidney-shaped through hole 12 is 0.49mm respectively and independently near one ends of the first kidney-shaped through hole 11 and the second kidney-shaped through hole 12;
a gap is formed in the welding contact surface of the main body 1 and the second cover plate 3, a boss is arranged at the outer edge of the gap, and the height of the boss is 0.3mm; the outer edge of the welding contact surface of the second cover plate 3 and the main body 1 is provided with a concave table which is matched with a boss at the outer edge of a notch of the main body 1;
the diameter of the groove of the welding contact surface of the first cover plate 2 and the main body 1 is enlarged by 0.5mm compared with the diameter of the welding surface of the main body 1; the depth of the groove on the welding contact surface of the first cover plate 2 and the main body 1 is 1.9mm.
The preparation method of the composite waterway substrate is the same as that of the embodiment 1.
The flow rate of cooling water when the composite water channel substrate is used is 17L/min.
Example 3
The embodiment provides a composite water channel substrate, which comprises a main body 1, wherein a first cover plate 2 is welded on one side of a target welding surface of the main body 1, and a second cover plate 3 is welded on one side of the back surface of the main body; a first embedded water channel 4 is formed in the welding contact surface of the main body 1 and the first cover plate 2, the first embedded water channel 4 is of a mosquito-repellent incense type roundabout structure, and the depth is 5.2mm; a second embedded water channel 5 is formed in the welding contact surface of the second cover plate 3 and the main body 1, and the depth of the second embedded water channel 5 is 5mm; the depth of the groove on the welding contact surface of the second cover plate 3 and the main body 1 is 5.5mm; an open water channel 6 is arranged on the back of the main body 1;
the second embedded water channel 5 comprises a water inlet embedded water channel 7 and a water outlet embedded water channel 8 which are symmetrically arranged and are not communicated with each other; the water inlet embedded water channel 7 is provided with a water inlet hole 9, and the water outlet embedded water channel 8 is provided with a water outlet hole 10; the side wall of the main body 1 is provided with a first waist-shaped through hole 11 and a second waist-shaped through hole 12 which are symmetrically arranged and are not communicated with each other, the first waist-shaped through hole 11 is communicated with the first embedded water channel 4 and the water inlet embedded water channel 7, and the second waist-shaped through hole 12 is communicated with the first embedded water channel 4 and the water outlet embedded water channel 8;
the edges of the first kidney-shaped through hole 11 and the second kidney-shaped through hole 12 are respectively and independently provided with a boss, and the height of the boss is 0.5mm; the distance between the grooved edge of the second cover plate 3 and the inner walls of the first kidney-shaped through hole 11 and the second kidney-shaped through hole 12 is 0.51mm respectively and independently near one ends of the first kidney-shaped through hole 11 and the second kidney-shaped through hole 12;
a gap is formed in the welding contact surface of the main body 1 and the second cover plate 3, a boss is arranged at the outer edge of the gap, and the height of the boss is 0.5mm; the outer edge of the welding contact surface of the second cover plate 3 and the main body 1 is provided with a concave table which is matched with a boss at the outer edge of a notch of the main body 1;
the diameter of the groove of the welding contact surface of the first cover plate 2 and the main body 1 is enlarged by 1mm compared with the diameter of the welding surface of the main body 1; the depth of the groove on the welding contact surface of the first cover plate 2 and the main body 1 is 2.1mm.
The preparation method of the composite waterway substrate is the same as that of the embodiment 1.
The flow rate of cooling water when the composite water channel substrate is used is 19L/min.
Example 4
The present embodiment provides a composite waterway substrate, which is different from embodiment 1 in that no boss is provided at the edges of the first kidney-shaped through hole 11 and the second kidney-shaped through hole 12; the outer edge of the welding contact surface of the main body 1 and the second cover plate 3 is provided with a notch, no boss is arranged, the outer edge of the welding contact surface of the second cover plate 3 and the main body 1 is not provided with a concave table, and the rest is the same as the embodiment 1.
Example 5
The present embodiment provides a composite waterway substrate, which is different from embodiment 1 in that the depth of the first embedded waterway 4 is adjusted to 4.5mm, and the rest is the same as embodiment 1.
Example 6
The present embodiment provides a composite waterway substrate, which is different from embodiment 1 in that the depth of the first embedded waterway 4 is adjusted to 5.5mm, and the rest is the same as embodiment 1.
Comparative example 1
The comparative example provides a substrate, the substrate includes the main part, the target welding face one side of main part welds there is first apron, the back of main part is provided with open water course.
Comparative example 2
This comparative example provides an embedded waterway substrate, which is different from example 1 in that the back surface of the main body is not provided with an open waterway, and the rest is the same as example 1.
The composite waterway substrates provided in examples 1 to 6, the substrate provided in comparative example 1 and the embedded waterway substrate provided in comparative example 2 were subjected to welding strength test by using a tensile tester, and sputtering surface deformation test by using a three-coordinate detector; and (3) simulating a sputtering environment of the target, heating the surface of the target to 120-150 ℃, controlling the inlet and outlet water pressure of cooling water to be 1MPa, testing the water leakage condition for 60 minutes, naturally cooling the target, and testing the welding strength and the sputtering surface deformation of the target blank and the composite water channel substrate, wherein the obtained results are shown in Table 1.
TABLE 1
| Welding strength (MPa) | Deflection of sputtering surface (mm) | |
| Example 1 | 136.3 | 0.09 |
| Example 2 | 131.5 | 0.11 |
| Example 3 | 127.8 | 0.13 |
| Example 4 | 87.7 | 0.22 |
| Example 5 | 122.6 | 0.17 |
| Example 6 | 118.4 | 0.19 |
| Comparative example 1 | 67.9 | 0.25 |
| Comparative example 2 | 45.2 | 0.33 |
As can be seen from table 1, the composite water channel substrate provided by the invention can rapidly and fully cool the sputtering surface of the target material on the basis of ensuring higher welding strength with the target blank, reduce the deformation of the sputtering surface and reduce the risk of desoldering the target blank and the substrate;
as can be seen from comparison of example 1 and example 4, no boss is provided on the welding contact surface of the main body with the first cover plate and the second cover plate, which can cause solder to flow out, thereby affecting the welding strength and the deformation of the sputtering surface; as is clear from comparison of examples 1 and 5 and 6, the first embedded water channel has too shallow or too deep depth, which reduces the welding strength and increases the deformation of the sputtering surface;
as is clear from comparison of example 1 and comparative examples 1 and 2, when the substrate is not provided with the embedded water channel or the open water channel, the target cannot be sufficiently cooled during the sputtering process, the welding strength is greatly reduced, the deformation of the sputtering surface is significantly increased, and the sputtering quality is further affected.
In summary, according to the composite water channel substrate provided by the invention, the open cooling water channel is designed on the back of the main body and is used for integrally cooling the back plate; the welding surface of the main body and the cover plate is provided with the double-sided embedded cooling water channel, so that the cooling of the welding surface is further enhanced, the welding strength of the composite water channel substrate and the target blank can reach 136.3MPa through the combination of the double cooling modes of the open water channel and the embedded water channel, the distance between the cooling water channel and the welding surface is reduced, the cooling area is increased, the deformation of the sputtering surface is obviously reduced, and the aim of fully cooling the target in the sputtering process is fulfilled.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and it should be apparent to those skilled in the art that any changes or substitutions that fall within the technical scope of the present invention disclosed herein are within the scope of the present invention.
Claims (10)
1. The composite water channel substrate is characterized by comprising a main body, wherein a first cover plate is welded on one side of a target welding surface of the main body, and a second cover plate is welded on one side of the back surface of the main body;
a first embedded water channel is formed in the welding contact surface of the main body and the first cover plate; a second embedded water channel is formed in the welding contact surface of the second cover plate and the main body; an open water channel is arranged on the back surface of the main body.
2. The composite waterway substrate of claim 1, wherein the first embedded waterway is a mosquito-repellent incense type circuitous structure;
preferably, the depth of the first embedded water channel is 4.8-5.2mm.
3. The composite waterway substrate of claim 1 or 2, wherein a groove depth of a welding contact surface of the second cover plate and the main body is 5.3-5.5mm;
preferably, the depth of the second embedded water channel is 4.8-5.2mm.
4. The composite waterway substrate of any of claims 1-3, wherein the second embedded waterway includes a water inlet embedded waterway and a water outlet embedded waterway symmetrically arranged and not communicating with each other;
preferably, the water inlet embedded water channel is provided with a water inlet hole, and the water outlet embedded water channel is provided with a water outlet hole;
preferably, the side wall of the main body is provided with a first waist-shaped through hole and a second waist-shaped through hole which are symmetrically arranged and are not communicated with each other, the first waist-shaped through hole is communicated with a first embedded water channel and a water inlet embedded water channel, and the second waist-shaped through hole is communicated with the first embedded water channel and a water outlet embedded water channel.
5. The composite waterway substrate of claim 4, wherein edges of the first and second kidney-shaped through holes are respectively and independently provided with bosses;
preferably, the height of the boss is 0.3-0.5mm.
6. The composite waterway substrate of claim 4 or 5, wherein a distance between a grooved edge of the second cover plate and inner walls of the first kidney-shaped through hole and the second kidney-shaped through hole is 0.49-0.51mm, respectively, near one ends of the first kidney-shaped through hole and the second kidney-shaped through hole.
7. The composite waterway substrate according to any one of claims 1 to 6, wherein a notch is formed in a welding contact surface of the main body and the second cover plate, a boss is arranged on an outer edge of the notch, and the height of the boss is 0.3-0.5mm;
preferably, a concave table is arranged at the outer edge of the welding contact surface of the second cover plate and the main body, and the concave table is matched with a boss at the outer edge of the notch of the main body.
8. The composite waterway substrate of any of claims 1-7, wherein a diameter of a groove of a welding contact surface of the first cover plate and the main body is enlarged by 0.5-1mm as compared to a diameter of a welding surface of the main body;
preferably, the depth of the groove of the welding contact surface of the first cover plate and the main body is 1.9-2.1mm.
9. A method of preparing a composite waterway substrate of any of claims 1-8, the method comprising the steps of:
assembling the main board, the first cover board and the second cover board, and then performing vacuum brazing treatment to obtain a substrate assembly; turning the obtained substrate assembly to obtain the composite water channel substrate;
and punching the second cover plate after the turning treatment.
10. Use of a composite waterway substrate according to any of claims 1-8 for the preparation of a target assembly;
the cooling water flow rate of the composite water channel substrate is more than or equal to 15L/min.
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| CN202311019860.5A CN117026174A (en) | 2023-08-14 | 2023-08-14 | Composite water channel substrate and preparation method and application thereof |
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| CN202311019860.5A CN117026174A (en) | 2023-08-14 | 2023-08-14 | Composite water channel substrate and preparation method and application thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104416253A (en) * | 2013-09-02 | 2015-03-18 | 宁波江丰电子材料股份有限公司 | Backboard forming method and backboard |
| CN112410740A (en) * | 2020-11-19 | 2021-02-26 | 宁波江丰电子材料股份有限公司 | Target material cooling back plate and preparation method thereof |
| CN115302206A (en) * | 2022-08-26 | 2022-11-08 | 宁波江丰电子材料股份有限公司 | Thin-wall part with embedded water channel and manufacturing method thereof |
| CN116572605A (en) * | 2023-05-12 | 2023-08-11 | 先导薄膜材料(安徽)有限公司 | Stainless steel and copper composite backboard and manufacturing method thereof |
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2023
- 2023-08-14 CN CN202311019860.5A patent/CN117026174A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104416253A (en) * | 2013-09-02 | 2015-03-18 | 宁波江丰电子材料股份有限公司 | Backboard forming method and backboard |
| CN112410740A (en) * | 2020-11-19 | 2021-02-26 | 宁波江丰电子材料股份有限公司 | Target material cooling back plate and preparation method thereof |
| CN115302206A (en) * | 2022-08-26 | 2022-11-08 | 宁波江丰电子材料股份有限公司 | Thin-wall part with embedded water channel and manufacturing method thereof |
| CN116572605A (en) * | 2023-05-12 | 2023-08-11 | 先导薄膜材料(安徽)有限公司 | Stainless steel and copper composite backboard and manufacturing method thereof |
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