CN117020473A - Medium-temperature solder - Google Patents
Medium-temperature solder Download PDFInfo
- Publication number
- CN117020473A CN117020473A CN202310478075.XA CN202310478075A CN117020473A CN 117020473 A CN117020473 A CN 117020473A CN 202310478075 A CN202310478075 A CN 202310478075A CN 117020473 A CN117020473 A CN 117020473A
- Authority
- CN
- China
- Prior art keywords
- solder
- rosin
- temperature solder
- raw materials
- medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 91
- 230000004907 flux Effects 0.000 claims abstract description 28
- 239000002994 raw material Substances 0.000 claims abstract description 26
- 238000005476 soldering Methods 0.000 claims abstract description 21
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 19
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 19
- 239000002245 particle Substances 0.000 claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052738 indium Inorganic materials 0.000 claims abstract description 13
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 13
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 35
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 35
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 35
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 27
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 20
- 239000000654 additive Substances 0.000 claims description 16
- 230000000996 additive effect Effects 0.000 claims description 16
- 239000002562 thickening agent Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052797 bismuth Inorganic materials 0.000 claims description 14
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 13
- 229910052718 tin Inorganic materials 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 11
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 10
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 10
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 10
- 229960004889 salicylic acid Drugs 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 7
- 239000000969 carrier Substances 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002202 Polyethylene glycol Substances 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 125000005233 alkylalcohol group Chemical group 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- 230000000630 rising effect Effects 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 150000003505 terpenes Chemical class 0.000 claims description 5
- 235000007586 terpenes Nutrition 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000003466 welding Methods 0.000 abstract description 38
- 230000007797 corrosion Effects 0.000 abstract description 8
- 238000005260 corrosion Methods 0.000 abstract description 8
- 239000002253 acid Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004005 microsphere Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000004626 scanning electron microscopy Methods 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 238000004611 spectroscopical analysis Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000004367 Lipase Substances 0.000 description 1
- 102000004882 Lipase Human genes 0.000 description 1
- 108090001060 Lipase Proteins 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004453 electron probe microanalysis Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 235000019421 lipase Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a medium-temperature solder, in particular to a medium-temperature solder with the welding temperature of 220-240 ℃, which comprises 76-87% of raw materials, 6-12% of soldering flux and 2-12% of porous carrier according to weight percentage, wherein the raw materials comprise tin and indium, and the porous carrier mainly comprises polyvinyl alcohol spherical carrier particles. When the solder is used, the solder joint has good surface gloss and better acid resistance and corrosion resistance. The solder can effectively solve the technical problems of insufficient surface hardness, insufficient corrosion resistance of welding spots after use and the like of the existing lead-free solder.
Description
Technical Field
The invention relates to the technical field of electronic solders, in particular to a medium-temperature solder.
Background
In the beginning of the century, medium-temperature solder taking tin and lead as main components in the electronic industry is still in the mainstream manufacturing process, but is harmful to the body for a long time without protection due to the fact that the lead content is high, and is not environment-friendly. Lead-free solders have become a research hotspot in recent years because lead in sn—pb solders used in conventional soldering techniques is prohibited from being used because of environmental pollution. The Sn-Zn medium temperature lead-free solder needs to strengthen active flux when in use, so as to ensure the welding quality, and has the defect of poor wettability.
Disclosure of Invention
The present invention is directed to a medium temperature solder to solve the above-mentioned problems.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the medium-temperature solder with the soldering temperature of 220-240 ℃ comprises, by weight, 76-87% of raw materials, 6-12% of soldering flux and 2-12% of porous carriers, wherein the raw materials comprise tin and indium, and the porous carriers mainly comprise polyvinyl alcohol spherical carrier particles.
Further, the internal porosity of the polyvinyl alcohol (PVA) spherical carrier particles is not less than 60 percent, and the particle diameter is 350-560 mu m.
Further, the raw materials also comprise bismuth, copper and nickel, wherein the indium is 22%, the bismuth is 7%, the nickel is 1.8%, the copper is 0.3%, and the balance is tin.
Further, the soldering flux comprises rosin, a thickener, an additive and deionized water.
Further, the rosin is 20%, the thickener is 32% and the additive is 4%, wherein the rosin is one or more of acrylic rosin, disproportionated rosin, hydrogenated rosin and polymerized rosin, the thickener comprises triethylamine and span, and the weight ratio of the triethylamine to span is 20:1, wherein the additive comprises glutaric acid and salicylic acid, and the weight ratio of the glutaric acid to the salicylic acid is 1:1.
further, the soldering flux also comprises 3% of a mixture comprising one or more of polyethylene glycol, terpene oil, alcohol ether and alkyl alcohol.
In order to achieve the above purpose, the present invention further provides the following technical solutions:
a method for preparing a medium temperature solder, comprising:
step 1, placing soldering flux into a crucible for melting, heating and melting, and fully stirring;
step 2, then placing the raw materials and the porous carrier, heating to 180-210 ℃, and maintaining for 3-7min;
and step 3, taking out impurities on the surface of the melted alloy, and then putting the melted alloy into a mold for cooling.
Further, the temperature in the step 1 is 100-120 ℃, and the temperature rising speed in the step 2 is 90-120 ℃/min.
Compared with the prior art, the invention has the beneficial effects that:
in the invention, the porous carrier is adopted, so that micropores of the porous carrier can be enlarged under the condition of heating to 180-210 ℃, and the porous carrier has larger caliber and compact micropores, thereby facilitating the raw materials: tin, indium, bismuth, nickel and the like are rapidly dispersed and filled, so that the preparation time is shortened, the metallographic structure of the reinforced material is improved, meanwhile, the inner part and the surface of the mixture are dispersed and hardened, and the surface hardness of the prepared solder welding spot can be improved. And the welding temperature is 220-240 ℃ so that the welding flux can be used for welding, and the porous carrier starts to melt at the temperature, so that the porous carrier and the raw materials can be released onto a welded carrier plate (substrate), the welding flux has good fluidity, and the welding can be realized rapidly. Meanwhile, the liquid solder has very low viscosity, and after reaching the melting temperature, the liquid solder can quickly infiltrate the welding surface to improve the tight contact between the welding surface such as a substrate and the solder, thereby facilitating the melting of the contact reaction. Because of the existence of the porous carrier, after welding and cooling of the solder, a compact protective film layer can be formed on the surface of the welding spot, and the welding spot has good surface gloss and better acid resistance and corrosion resistance. And because bismuth, copper and nickel are added, the hardness of a solder welding spot can be further improved, and the liquid phase temperature of the solder tends to the solid phase temperature, so that the fluidity of the solder is improved, and the solder has good corrosion resistance and oxidation resistance. The spot was observed by Scanning Electron Microscopy (SEM) and energy spectroscopy (EDS) and found to be smooth and relatively flat on its outer surface. And when the appearance is seen, the surface of the welding spot is bright, and the welding spot is full and free from continuous welding. When in use, the adhesive is easier to generate good affinity with a base material (solid material), and the welding seam is smooth and beautiful. Therefore, the solder of the invention can effectively solve the technical problems of insufficient surface hardness, insufficient corrosion resistance of welding spots after use and the like of the traditional medium-temperature lead-free solder.
Drawings
FIG. 1 is a schematic diagram of a method for preparing a low temperature solder according to the present invention.
Fig. 2 is a schematic view showing the result of the solder reflow test of the solder a and the solder B according to the present invention.
Fig. 3 is a schematic view showing the result of the test of the solder reflow properties of the solder a and the solder C according to the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 3, the present invention provides a technical solution:
example 1
The medium-temperature solder comprises, by weight, 81% of a raw material, 8% of a soldering flux and the balance of a porous carrier, wherein the raw material comprises tin and indium, and the porous carrier mainly comprises polyvinyl alcohol spherical carrier particles.
Specifically, the porosity in the particles of the polyvinyl alcohol (PVA) spherical carrier is not less than 60 percent, and the particle diameter is 450 microns. The polyvinyl alcohol microsphere carrier is prepared by adopting the commercial or the prior art, for example, the research progress of the polyvinyl alcohol microsphere carrier is Kang Feng, the research of immobilized lipase based on the polyvinyl alcohol microsphere carrier is Zhang Xiaohui, and the like.
Specifically, the raw materials also comprise bismuth, copper and nickel, wherein the content of indium is 22%, the content of bismuth is 7%, the content of nickel is 1.8%, the content of copper is 0.3%, and the balance of tin.
Specifically, the soldering flux comprises rosin, a thickener, an additive and deionized water.
Specifically, the rosin is 20%, the thickener is 32% and the additive is 4%, wherein the rosin is one or more of acrylic rosin, disproportionated rosin, hydrogenated rosin and polymerized rosin, the thickener comprises triethylamine and span, and the weight ratio of the triethylamine to span is 20:1, wherein the additive comprises glutaric acid and salicylic acid, and the weight ratio of the glutaric acid to the salicylic acid is 1:1.
specifically, the soldering flux further comprises a mixture of 3%, wherein the mixture comprises one or more of polyethylene glycol, terpene oil, alcohol ether and alkyl alcohol.
A preparation method of medium-temperature solder comprises the following steps:
step 1, placing soldering flux into a crucible for melting, heating and melting, and fully stirring;
step 2, then placing the raw materials and the porous carrier, heating to 186 ℃, and maintaining for 4min;
and step 3, taking out impurities on the surface of the melted alloy, and then putting the melted alloy into a mold for cooling.
Specifically, the temperature in the step 1 is 108 ℃, and the temperature rising speed in the step 2 is 100 ℃/min.
Example 2
The medium-temperature solder comprises, by weight, 84% of a raw material, 9% of a soldering flux and the balance of a porous carrier, wherein the raw material comprises tin and indium, and the porous carrier mainly comprises polyvinyl alcohol spherical carrier particles.
Specifically, the porosity in the particles of the polyvinyl alcohol (PVA) spherical carrier is not less than 60 percent, and the particle diameter is 500 mu m.
Specifically, the raw materials also comprise bismuth, copper and nickel, wherein the content of indium is 22%, the content of bismuth is 7%, the content of nickel is 1.8%, the content of copper is 0.3%, and the balance of tin.
Specifically, the soldering flux comprises rosin, a thickener, an additive and deionized water.
Specifically, the rosin is 20%, the thickener is 32% and the additive is 4%, wherein the rosin is one or more of acrylic rosin, disproportionated rosin, hydrogenated rosin and polymerized rosin, the thickener comprises triethylamine and span, and the weight ratio of the triethylamine to span is 20:1, wherein the additive comprises glutaric acid and salicylic acid, and the weight ratio of the glutaric acid to the salicylic acid is 1:1.
specifically, the soldering flux further comprises a mixture of 3%, wherein the mixture comprises one or more of polyethylene glycol, terpene oil, alcohol ether and alkyl alcohol.
A preparation method of medium-temperature solder comprises the following steps:
step 1, placing soldering flux into a crucible for melting, heating and melting, and fully stirring;
step 2, then placing the raw materials and the porous carrier, heating to 200 ℃, and maintaining for 5min;
and step 3, taking out impurities on the surface of the melted alloy, and then putting the melted alloy into a mold for cooling.
Specifically, the temperature in the step 1 is 113 ℃, and the temperature rising speed in the step 2 is 109 ℃/min.
Example 3
The medium-temperature solder comprises, by weight, 85% of raw materials, 10% of soldering flux and the balance of porous carriers, wherein the raw materials comprise tin and indium, and the porous carriers mainly consist of polyvinyl alcohol spherical carrier particles.
Specifically, the porosity in the particles of the polyvinyl alcohol (PVA) spherical carrier is not less than 60 percent, and the particle diameter is 490 mu m.
Specifically, the raw materials also comprise bismuth, copper and nickel, wherein the content of indium is 22%, the content of bismuth is 7%, the content of nickel is 1.8%, the content of copper is 0.3%, and the balance of tin.
Specifically, the soldering flux comprises rosin, a thickener, an additive and deionized water.
Specifically, the rosin is 20%, the thickener is 32% and the additive is 4%, wherein the rosin is one or more of acrylic rosin, disproportionated rosin, hydrogenated rosin and polymerized rosin, the thickener comprises triethylamine and span, and the weight ratio of the triethylamine to span is 20:1, wherein the additive comprises glutaric acid and salicylic acid, and the weight ratio of the glutaric acid to the salicylic acid is 1:1.
specifically, the soldering flux further comprises a mixture of 3%, wherein the mixture comprises one or more of polyethylene glycol, terpene oil, alcohol ether and alkyl alcohol.
A preparation method of medium-temperature solder comprises the following steps:
step 1, placing soldering flux into a crucible for melting, heating and melting, and fully stirring;
step 2, then placing the raw materials and the porous carrier, heating to 201 ℃, and maintaining for 6min;
and step 3, taking out impurities on the surface of the melted alloy, and then putting the melted alloy into a mold for cooling.
Specifically, the temperature in the step 1 is 113 ℃, and the temperature rising speed in the step 2 is 112 ℃/min.
Comparative example 1
In comparative example 1 of this embodiment, a part of the flux, specifically the thickener and the additive, was omitted, and the remaining material components and parameters were the same as those in example 2.
Solder a was then prepared as in example 2 and solder B was prepared as in comparative example 1, and then circuit board 20 pieces were soldered with this solder a and solder B, respectively, with each piece randomly extracted a bit. The weld joints were tested for Brinell hardness according to standard DL/T868-2004, with the specific results shown in Table 1 below.
TABLE 1
Solder A prepared in example 2 and solder B prepared in comparative example 1 were immersed in a dilute hydrochloric acid solution of 15% to wash off oil stains on the surfaces, and then dried in the air, and placed in a closed container, with a base material of red copper, and a suitable size of, for example, 0.4mm was selected to have a side length of 30X 30 mm. According to GB11364289 test method for spreadability and caulking ability of solder, the spreadability of solder was tested, and solder A and B were tested at 220℃and 230℃and 240℃as temperature points, and then the spread area of solder on the surface of a copper sheet was measured with a integrator, and the average value was taken as the test result, see FIG. 2 in detail.
Comparative example 2
In comparative example 2 of this embodiment, the porous support was omitted and the remaining material composition and parameters were the same as in example 3.
Comparative example 2 was prepared as solder C, and then circuit board 20 pieces were soldered with this solder C, each randomly extracted a bit. The weld joints were tested for Brinell hardness according to standard DL/T868-2004, with the specific results shown in Table 2 below.
Table 2 below
The test was performed similarly for the flow of solder, and the test parameters remained consistent except for the solder C material. With solder a as a reference, see in particular fig. 3.
The solder A, B, C solder circuit boards were randomly drawn one by one with a standard prescribed brine concentration of 5mass% using a salt spray test, and then tested for 336 hours. The test piece after the test was subjected to surface observation of the solder joint by using an electron scanning mirror EPMA (and an energy spectrometer (EDS)), and it was found that the surface of the solder a was minimally eroded (randomly distributed in a dot pattern, with a ratio of about 6% of the entire surface), and the solder B was secondarily (randomly distributed in a region, with a ratio of not more than 16.7% of the entire surface), and finally the solder B was uniformly eroded (with a ratio of about 42.8% of the entire surface).
As can be seen from the analysis in Table 2, the Brinell hardness of the solder joint surface is approximately in the range of 17.2 to 18.3, that is, the Brinell hardness of the solder surface is at a more normal level, while the Brinell hardness of the solder A point surface in Table 1 is approximately in the range of 22.1 to 23.5, which is significantly improved compared with Table 2. In table 1, although the solder a and the solder B differ in flux composition, the overall properties of the solder a and the solder B do not differ much. The brinell hardness of the surface of the solder B spot is generally in the range of 23.5 to 24.2. But all were significantly more brinell harder than the solder C pad surface of table 2. The invention adopts the porous carrier, so that micropores of the porous carrier can be enlarged under the condition of heating to 180-210 ℃, and the porous carrier has larger caliber and compact micropores, thereby facilitating the raw materials: tin, indium, bismuth, nickel and the like are rapidly dispersed and filled, so that the preparation time is shortened, the metallographic structure of the reinforced material is improved, meanwhile, the inner part and the surface of the mixture are dispersed and hardened, and the surface hardness of the prepared solder welding spot can be improved. And the welding temperature is 220-240 ℃ so that the welding flux can be used for welding, and the porous carrier starts to melt at the temperature, so that the porous carrier and the raw materials can be released onto a welded carrier plate (substrate), the welding flux has good fluidity, and the welding can be realized rapidly. Meanwhile, the liquid solder has very low viscosity, and after reaching the melting temperature, the liquid solder can quickly infiltrate the welding surface to improve the tight contact between the welding surface such as a substrate and the solder, thereby facilitating the melting of the contact reaction. Because of the existence of the porous carrier, after welding and cooling of the solder, a compact protective film layer can be formed on the surface of the welding spot, and the welding spot has good surface gloss and better acid resistance and corrosion resistance. And because bismuth, copper and nickel are added, the hardness of a solder welding spot can be further improved, and the liquid phase temperature of the solder tends to the solid phase temperature, so that the fluidity of the solder is improved, and the solder has good corrosion resistance and oxidation resistance. The spot was observed by Scanning Electron Microscopy (SEM) and energy spectroscopy (EDS) and found to be smooth and relatively flat on its outer surface. And when the appearance is seen, the surface of the welding spot is bright, and the welding spot is full and free from continuous welding. When in use, the adhesive is easier to generate good affinity with a base material (solid material), and the welding seam is smooth and beautiful. Therefore, the solder of the invention can effectively solve the technical problems of insufficient surface hardness, insufficient corrosion resistance of welding spots after use and the like of the current lead-free solder.
The low-temperature solder can be used for medium-temperature lead-free welding process of electronic products such as high-end instruments and meters, computers and the like. The application of the medium-temperature lead-free alloy solder greatly saves energy sources, reduces exhaust emission and contributes to protecting production environment and reducing production cost.
The remainder of the description of the invention is not prior art.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The medium-temperature solder is characterized by comprising, by weight, 76-87% of raw materials, 6-12% of soldering flux and 2-12% of porous carriers, wherein the raw materials comprise tin and indium, and the porous carriers mainly consist of polyvinyl alcohol spherical carrier particles.
2. A medium temperature solder according to claim 1 wherein the polyvinyl alcohol (PVA) spherical carrier has an intra-particle porosity of not less than 60% and a particle diameter of 350 to 560 μm.
3. A medium temperature solder according to claim 1 wherein the raw materials further comprise bismuth, copper and nickel, wherein indium is 22%, bismuth is 7%, nickel is 1.8%, copper is 0.3%, and the balance is tin.
4. A medium temperature solder according to claim 1, wherein the flux comprises rosin, thickener, additive, deionized water.
5. A medium temperature solder according to claim 4, wherein the rosin is 20%, the thickener is 32%, the additive is 4%, wherein the rosin is one or more of acrylic rosin, disproportionated rosin, hydrogenated rosin, and polymerized rosin, and the thickener comprises triethylamine and span in a weight ratio of 20:1, wherein the additive comprises glutaric acid and salicylic acid, and the weight ratio of the glutaric acid to the salicylic acid is 1:1.
6. a medium temperature solder according to claim 5, wherein the flux further comprises a blend of 3%, the blend comprising one or more of polyethylene glycol, terpene oil, alcohol ether, alkyl alcohol.
7. A method for producing the medium temperature solder according to any one of claims 1 to 6, comprising:
step 1, placing soldering flux into a crucible for melting, heating and melting, and fully stirring;
step 2, then placing the raw materials and the porous carrier, heating to 180-210 ℃, and maintaining for 3-7min;
and step 3, taking out impurities on the surface of the melted alloy, and then putting the melted alloy into a mold for cooling.
8. The method of manufacturing a low temperature solder according to claim 7, wherein the temperature in step 1 is 100-120 ℃, and the temperature rising rate in step 2 is 90-120 ℃/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310478075.XA CN117020473A (en) | 2023-04-27 | 2023-04-27 | Medium-temperature solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310478075.XA CN117020473A (en) | 2023-04-27 | 2023-04-27 | Medium-temperature solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117020473A true CN117020473A (en) | 2023-11-10 |
Family
ID=88634218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310478075.XA Pending CN117020473A (en) | 2023-04-27 | 2023-04-27 | Medium-temperature solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117020473A (en) |
-
2023
- 2023-04-27 CN CN202310478075.XA patent/CN117020473A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2826589B1 (en) | Flux, solder composition and method for producing electronic circuit mounting substrate | |
| CN107088716B (en) | Environment-friendly low-temperature residue-free solder paste and preparation method thereof | |
| CN105014253A (en) | Lead-free tin solder paste and preparation method thereof | |
| CN101491866B (en) | Low-temperature leadless cored solder alloy and produced solder paste | |
| CN109848603B (en) | Lead-free solder paste and preparation method thereof | |
| CN108465973A (en) | A kind of unleaded medium temperature solder(ing) paste and preparation method thereof | |
| JP6136851B2 (en) | Solder flux and solder paste | |
| WO2010098357A1 (en) | Metal filler, low-temperature-bonding lead-free solder and bonded structure | |
| CN110202295A (en) | A kind of low temperature aluminum soft soldering tin cream and preparation method thereof | |
| CN111318832B (en) | Low-temperature lead-free soldering paste and preparation method thereof | |
| CN106392380A (en) | No-clean flux high in welding passing rate | |
| CN104439751A (en) | Novel low-melting-point lead-free solder | |
| JP2011147982A (en) | Solder, electronic component, and method for manufacturing the electronic component | |
| CN109014655B (en) | Silver alloy soldering paste with good dispensing performance and preparation method thereof | |
| CN117020473A (en) | Medium-temperature solder | |
| CN1927524A (en) | Water soluble scaling powder core leadless solder wire | |
| CN109967811A (en) | A kind of LED lamp and preparation method thereof with aluminium foil circuit board making | |
| CN112894195A (en) | Low-silver lead-free solder alloy for brazing and preparation method thereof | |
| CN116586820A (en) | Low-temperature solder | |
| CN113579547A (en) | Brazing filler metal paste for copper-aluminum dissimilar metal brazing flux-free brazing and brazing method | |
| JP4662483B2 (en) | Conductive filler and medium temperature solder material | |
| CN101323059A (en) | Endogenetic Cu6Sn5 granule reinforced leadless compound solder alloy and manufacture method thereof | |
| CN103753047B (en) | Lead-free solder | |
| CN114986019B (en) | Solder flux, preparation method thereof and solder | |
| KR102069276B1 (en) | Electronic parts soldering cream and method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |