CN113579547A - Brazing filler metal paste for copper-aluminum dissimilar metal brazing flux-free brazing and brazing method - Google Patents
Brazing filler metal paste for copper-aluminum dissimilar metal brazing flux-free brazing and brazing method Download PDFInfo
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- CN113579547A CN113579547A CN202110926858.0A CN202110926858A CN113579547A CN 113579547 A CN113579547 A CN 113579547A CN 202110926858 A CN202110926858 A CN 202110926858A CN 113579547 A CN113579547 A CN 113579547A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/282—Zn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
- B23K35/288—Al as the principal constituent with Sn or Zn
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
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Abstract
The invention belongs to the field of brazing materials, and particularly relates to brazing filler metal paste for copper-aluminum dissimilar metal brazing flux-free brazing and a brazing method. The solder paste consists of a binder and the following components in parts by weight: 0.1-0.5 part of AlTiB particles, 1-3 parts of Si powder, 1-3 parts of P powder and 60-80 parts of Zn85Al15 solder powder. According to the brazing paste disclosed by the invention, Si powder and Zn85Al15 powder react to form a ternary eutectic brazing filler metal, the Si powder can deprive oxygen to inhibit oxidation of an aluminum base metal and a molten brazing filler metal, the P powder can also deoxidize to remove an oxide film on the surface of copper, the molten brazing filler metal is wetted, spread and filled with gaps, and brazing flux-free brazing of copper and aluminum dissimilar metals in an atmospheric environment can be realized. In addition, Si can inhibit diffusion of Cu and Al atoms, production of brittle compounds on the copper side of the joint is reduced, AlTiB particles can effectively refine the copper-aluminum joint structure of the Si-containing brazing filler metal, the obtained brazing seam structure is refined, and the joint strength is high.
Description
Technical Field
The invention belongs to the field of brazing materials, and particularly relates to brazing filler metal paste for copper-aluminum dissimilar metal brazing flux-free brazing and a brazing method.
Background
Copper has excellent heat conduction and electric conduction, while aluminum has heat conduction and electric conduction second to copper, but has the advantages of low density, high specific strength and low price. With the rapid development of industry, the theme of light weight, energy conservation and environmental protection has been developed, the copper resource pressure can be relieved by adopting the copper-aluminum dissimilar metal composite structure, and the respective performance advantages, such as weight reduction, cost reduction, energy conservation, consumption reduction and the like, can be fully utilized, so that the brazing connection of the copper-aluminum dissimilar metals cannot be avoided.
At present, a thicker copper-aluminum brittle compound layer is easily generated on the copper side of a copper-aluminum joint brazed by Zn-Al solder, which can weaken the mechanical property of the joint.
In addition, when copper-aluminum dissimilar metals are brazed in an atmospheric environment, the biggest challenge is that the compact aluminum oxide film on the surface of the aluminum base material prevents the brazing filler metal alloy from wetting and spreading on the base material. Therefore, it is necessary to remove the oxide film on the surface of the base material by using a flux during the brazing process. On one hand, the use of the soldering flux is easy to generate air holes and inclusions in the welding seam, so that the corrosion resistance of the joint is greatly reduced; on the other hand, brazing filler metal overflowing from the welding seam is easily adhered to the pipe wall, so that slag is difficult to remove after welding. In addition, in the brazing process, the brazing flux is volatile, pollutes the environment and is harmful to the health of human bodies; the residual brazing flux residue has strong corrosivity, is easy to corrode the copper-aluminum joint and influences the service life of the copper-aluminum joint.
Disclosure of Invention
The invention aims to provide a brazing paste for brazing dissimilar metals of copper and aluminum without a brazing flux, which can realize brazing dissimilar metals of copper and aluminum without the brazing flux in an atmospheric environment, and has the advantages of thin brittle compound layer on the copper side, refined brazing seam structure and higher joint strength.
A second object of the present invention is to provide a brazing method based on the above brazing paste.
In order to realize the purpose, the technical scheme of the brazing paste for the copper-aluminum dissimilar metal brazing flux-free brazing is as follows:
a brazing filler metal paste for copper-aluminum dissimilar metal brazing flux-free brazing consists of a binder and the following components in parts by weight: 0.1-0.5 part of AlTiB particles, 1-3 parts of Si powder, 1-3 parts of P powder and 60-80 parts of Zn85Al15 solder powder.
In the brazing process, the preferential compounds of Si powder and Zn85Al15 powder in the brazing filler metal paste react to form Zn85Al14.1Si0.9 brazing filler metal which is ternary eutectic brazing filler metal, the melting temperature is 425 ℃, and the reaction is as follows:
Zn85Al15+0.9Si＝Zn85Al14.1Si0.9+0.9Al
meanwhile, the residual Si powder is alloyed with the aluminum base material, the Si powder can deprive oxygen to inhibit the oxidation of the aluminum base material and the molten solder, the P powder can also deoxidize to remove an oxide film on the surface of copper, and the Zn85Al14.1Si0.9 molten solder starts to be wetted, spread and filled with gaps, so that the brazing is completed. The invention can realize the brazing flux-free brazing of copper-aluminum dissimilar metals in the atmospheric environment, Si can inhibit the diffusion of Cu and Al atoms, the production of brittle compounds on the copper side of the joint is reduced, AlTiB particles can effectively refine the copper-aluminum joint structure containing Si brazing filler metal, the obtained brazing seam structure is refined, and the joint strength is higher.
Preferably, the AlTiB particles are composed of, by mass: 5-8% of Ti, 1.5-3% of B and the balance of Al. More preferably, the particle size of the AlTiB particles is 30-80 μm.
Preferably, the binder is an organic macromolecular binder, the melting temperature is 166-185 ℃, and the decomposition temperature is not higher than 450 ℃.
Preferably, the main component of the binder is ethyl cellulose. Preferably, the binder consists of ethyl cellulose and a solvent, the solvent is a mixed solvent consisting of ethyl acetate and ethanol, and the mass ratio of the ethyl cellulose to the ethyl acetate to the ethanol is (1-2) to (2-4) to (3-5). More preferably, the binder is used in an amount of 8 to 15 parts.
Among the binders, ethyl cellulose is dissolved in the binders of ethanol and ethyl acetate, the melting temperature of the binders is 166-185 ℃, a tough film is formed, the binder is basically decomposed at 450 ℃, the brazing surface can be protected in the whole brazing process, the brazing surface and the molten brazing filler metal are not oxidized, and the brazing effect without the brazing flux in the atmospheric environment is further optimized.
The brazing method of the invention adopts the technical scheme that:
a brazing method of copper-aluminum dissimilar metal comprises the following steps: and (3) brazing the copper piece and the aluminum piece by using the brazing paste under the atmospheric environment and the condition without the brazing flux.
The brazing method of the copper-aluminum dissimilar metal can realize the rapid induction brazing of the copper-aluminum dissimilar metal in the atmospheric environment, does not pollute the environment, and is low in cost and environment-friendly.
Preferably, a sawtooth-shaped groove is machined in the surface to be welded of the copper part, the brazing filler metal paste is coated on the groove, then the brazing filler metal paste is assembled with the aluminum part, and the aluminum part is induction brazed after being dried.
More preferably, the drying temperature is 150-220 ℃; the temperature of the induction brazing is 430-450 ℃.
Drawings
FIG. 1 is a schematic view of copper-aluminum dissimilar metal brazing according to the present invention;
FIG. 2 is a brazing seam structure diagram of brazing by using a conventional Zn85Al brazing filler metal;
FIG. 3 is a view showing the structure of a brazing seam soldered by the solder paste of example 5;
in the figure, 1-aluminum plate, 2-solder paste, 3-copper plate, 4-inductor.
Detailed Description
The invention mainly relates to a brazing filler metal paste for copper-aluminum dissimilar metal brazing without a brazing flux and a brazing method thereof.
According to the brazing filler metal paste, Si powder and Zn85Al15 powder react to form Zn85Al14.1Si0.9 ternary eutectic brazing filler metal, the residual Si powder is alloyed with an aluminum base metal, the Si powder can deprive oxygen to inhibit the oxidation of the aluminum base metal and molten brazing filler metal, the P powder can also deoxidize to remove an oxide film on the surface of copper, and the Zn85Al14.1Si0.9 molten brazing filler metal is wetted, spread and filled with gaps, so that the brazing filler metal free of copper and aluminum dissimilar metals in an atmospheric environment can be realized.
The copper side of the copper-aluminum joint brazed by the existing Zn-Al solder is easy to generate a thicker copper-aluminum brittle compound layer. The soldering paste contains Si, is easier to diffuse to the copper side than Al, can inhibit the diffusion of Cu and Al atoms, can block the combination of the Cu and Al atoms on an interface, and reduces the production of brittle compounds on the copper side of the joint; however, Si element easily causes the coarsening of the structure in the copper-aluminum joint, and experiments show that the added AlTiB can refine the structure of the obtained copper-aluminum joint, thereby improving the joint strength.
The schematic diagram of the brazing method of the invention is shown in fig. 1, the brazing filler metal paste 2 is coated on the parts to be welded of the aluminum plate 1 and the copper plate 3, and after drying, induction brazing is realized in the inductor 4, specifically, the steps can be adopted:
removing an oxide film and oil stains on surfaces to be welded of an aluminum plate and a copper plate by adopting a mechanical or chemical method, scrubbing the surfaces with acetone or alcohol, and naturally airing the surfaces for later use;
step two, processing the surface to be welded of the copper plate into a continuous sawtooth groove shape, uniformly coating a proper amount of brazing filler metal paste, oppositely placing the surface to be welded of the aluminum plate on the surface to be welded of the copper plate coated with the brazing filler metal paste, assembling, and fixing by using a clamp;
putting the fixed copper-aluminum component into an oven, and drying for a certain time at a certain temperature;
and step four, putting the dried copper-aluminum combined component on a working platform, putting the part to be welded in an inductor, starting a power supply, heating to a certain temperature, preserving heat for a certain time, and melting, wetting and spreading the brazing filler metal to finish joint filling.
And step five, after the brazing is finished, naturally cooling the weldment, and taking down the welded copper-aluminum component after the weldment to be welded is cooled to room temperature.
The copper plate may be pure copper or a copper alloy, and the aluminum plate may be pure aluminum or an aluminum alloy.
The surface to be welded of the copper plate is processed into a continuous sawtooth groove shape, so that the welding contact area can be increased, and the joint strength is increased. The depth of the groove is 0.5-3mm, and the width is 1-3 mm.
The drying conditions can be selected as follows: drying the mixture for 15 to 20min at the temperature of between 150 and 220 ℃.
The brazing conditions can be selected as follows: preserving the heat for 15-20 s at 430-450 ℃.
Embodiments of the present invention will be described in detail below with reference to examples, but it will be understood by those skilled in the art that the following examples are only illustrative of the present invention and should not be construed as limiting the scope of the present invention. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.
Specific embodiment of brazing filler metal paste for copper-aluminum dissimilar metal fluxless brazing
Example 1
The brazing filler metal paste for the copper-aluminum dissimilar metal brazing flux-free brazing in the embodiment comprises the following components in parts by weight: 0.1 part of AlTiB particles, 1 part of Si powder, 1 part of P powder, 60 parts of Zn85Al15 solder powder and 8 parts of binder.
The AlTiB particles comprise the following components in percentage by mass: 5% of Ti, 1.5% of B and 93.5% of Al; the particle diameter is 30-80 μm.
The binder consists of ethyl cellulose, ethyl acetate and ethanol according to the mass ratio of 1.5:3: 4.
The preparation method of the solder paste comprises the following steps: dissolving ethyl cellulose into a mixed solution of ethyl acetate and ethanol, stirring to prepare a binder, and then adding AlTiB particles, Si powder, P powder and Zn85Al15 solder powder to prepare paste.
Example 2
The brazing filler metal paste for the copper-aluminum dissimilar metal brazing flux-free brazing in the embodiment comprises the following components in parts by weight: 0.2 part of AlTiB particles, 2 parts of Si powder, 2 parts of P powder, 65 parts of Zn85Al15 solder powder and 10 parts of binder.
The AlTiB particles comprise the following components in percentage by mass: 6% of Ti, 2% of B and 92% of Al. The particle diameter is 30-80 μm.
The binder was the same as in example 1.
Example 3
The brazing filler metal paste for the copper-aluminum dissimilar metal brazing flux-free brazing in the embodiment comprises the following components in parts by weight: 0.3 part of AlTiB particles, 3 parts of Si powder, 3 parts of P powder, 70 parts of Zn85Al15 solder powder and 12 parts of binder.
The AlTiB particles comprise the following components in percentage by mass: 8% of Ti, 3% of B and 89% of Al. The particle diameter is 30-80 μm.
The binder was the same as in example 1.
Example 4
The brazing filler metal paste for the copper-aluminum dissimilar metal brazing flux-free brazing in the embodiment comprises the following components in parts by weight: 0.4 part of AlTiB particles, 1 part of Si powder, 1 part of P powder, 75 parts of Zn85Al15 solder powder and 13 parts of binder.
The AlTiB particles comprise the following components in percentage by mass: 7% of Ti, 2.5% of B and 90.5% of All. The particle diameter is 30-80 μm.
The binder was the same as in example 1.
Example 5
The brazing filler metal paste for the copper-aluminum dissimilar metal brazing flux-free brazing in the embodiment comprises the following components in parts by weight: 0.5 part of AlTiB particles, 2 parts of Si powder, 2 parts of P powder, 80 parts of Zn85Al15 solder powder and 15 parts of binder.
The AlTiB particles comprise the following components in percentage by mass: 5.5 percent of Ti, 2.5 percent of B and 92 percent of Al. The particle diameter is 30-80 μm.
The binder was the same as in example 1.
Second, specific examples of the brazing method
Example 6
The brazing method of copper-aluminum dissimilar metals according to the present embodiment is described by taking the brazing paste of example 5 as an example, and includes the following steps:
(1) removing an oxide film and oil stains on the surfaces to be welded of the copper and aluminum plates by adopting a mechanical or chemical method, scrubbing the surfaces with acetone or alcohol, and naturally airing the surfaces for later use; the copper plate is T2 red copper, and the aluminum plate is 3003 aluminum alloy.
(2) Processing the surface to be welded of the copper plate into a continuous sawtooth groove shape, wherein the groove depth is 0.5-3mm, and the groove width is 1-3mm, uniformly coating a proper amount of brazing filler metal paste in the groove (according to the joint form and the brazing surface size, determining the optimal brazing filler metal amount through tests), relatively placing the surface to be welded of the aluminum plate on the surface to be welded of the copper plate coated with the brazing filler metal paste, assembling, and fixing by using a clamp;
(3) putting the fixed copper-aluminum component into an oven, and drying for 18min at 180 ℃;
(4) and putting the dried copper-aluminum combined component on a working platform, putting the part to be welded in an inductor, starting a power supply, heating to 440 ℃, preserving heat for 18s, and melting, wetting and spreading the brazing filler metal to finish joint filling.
(5) And after the brazing is finished, naturally cooling the weldment, and taking down the welded copper-aluminum component after the weldment to be welded is cooled to room temperature.
In other embodiments of the brazing method of the present invention, the drying conditions may be: oven drying at 150 deg.C for 20min, or oven drying at 220 deg.C for 15min, etc.; the brazing condition can be heat preservation for 20s at 430 ℃, or heat preservation for 15s at 450 ℃, and the like; in the binder, the mass ratio of ethyl cellulose, ethyl acetate and ethanol may be adjusted within the range of (1-2): 2-4): 3-5, and may be 1:2:3, 2:4:5, etc., all of which may obtain substantially the same effects as the above embodiments.
Third, Experimental example
Under the same experimental conditions, Zn85Al brazing filler metal is matched with a non-corrosive brazing flux to perform induction brazing on copper-aluminum dissimilar metal, brazing filler metal paste in the embodiment 5 is used for performing non-flux induction brazing on the copper-aluminum dissimilar metal, brazing seam structures and joint tensile strength of two joints are compared, and the test results are shown in figures 2-3 and table 1.
As can be seen from the figure, the brazing seam structure of the copper-aluminum joint brazed by the Zn85Al solder is thick and has pores, and the gray bamboo shoot-shaped brittle compound layer on the copper side is thicker, while the brazing seam structure of the copper-aluminum joint brazed by the brazing paste in the embodiment 5 is refined, and the gray bamboo shoot-shaped brittle compound on the copper side is less.
TABLE 1 tensile Strength comparison of braze joints
It can be seen that the average strength of the solder joints of example 5 in table 1 is higher than that of the Zn85Al solder joints, indicating higher joint strength.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The brazing filler metal paste for copper-aluminum dissimilar metal brazing flux-free brazing is characterized by comprising a binder and the following components in parts by weight: 0.1-0.5 part of AlTiB particles, 1-3 parts of Si powder, 1-3 parts of P powder and 60-80 parts of Zn85Al15 solder powder.
2. The brazing filler metal paste for the copper-aluminum dissimilar metal fluxless brazing according to claim 1, wherein the composition of the AlTiB particles in percentage by mass is as follows: 5-8% of Ti, 1.5-3% of B and the balance of Al.
3. The brazing filler metal paste for the brazing of the dissimilar metals of copper and aluminum as claimed in claim 1 or 2, wherein the grain size of the AlTiB particles is 30 to 80 μm.
4. The brazing filler metal paste for the brazing of the copper-aluminum dissimilar metal without the flux as claimed in claim 1, wherein the binder is an organic macromolecular binder, the melting temperature is 166-185 ℃, and the decomposition temperature is not higher than 450 ℃.
5. The brazing filler metal paste for the brazing of dissimilar metals, copper and aluminum, without the flux, according to claim 1 or 4, wherein the binder comprises ethyl cellulose as a main component.
6. The brazing filler metal paste for the brazing of the copper-aluminum dissimilar metal without the brazing flux as claimed in claim 5, wherein the binder consists of ethyl cellulose and a solvent, the solvent is a mixed solvent consisting of ethyl acetate and ethanol, and the mass ratio of the ethyl cellulose to the ethyl acetate to the ethanol is (1-2) to (2-4) to (3-5).
7. The brazing filler metal paste for the flux-free brazing of copper-aluminum dissimilar metals according to claim 6, wherein the amount of the binder is 8 to 15 parts.
8. A brazing method of copper-aluminum dissimilar metal is characterized by comprising the following steps: brazing a copper part and an aluminum part in an atmospheric environment without a flux by using the brazing paste according to any one of claims 1 to 7.
9. The method for brazing dissimilar metals of copper and aluminum according to claim 8, wherein zigzag grooves are machined on the to-be-brazed surface of the copper piece, the brazing filler metal paste is coated on the grooves, and then the brazing filler metal paste is assembled with the aluminum piece and induction brazed after drying.
10. The brazing method for the copper-aluminum dissimilar metal according to claim 9, wherein the drying temperature is 150-220 ℃; the temperature of the induction brazing is 430-450 ℃.
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| CN202110926858.0A CN113579547B (en) | 2021-08-12 | 2021-08-12 | Brazing filler metal paste for copper-aluminum dissimilar metal brazing flux-free brazing and brazing method |
| BE20216006A BE1029682B1 (en) | 2021-08-12 | 2021-12-21 | SOLDER PASTE FOR FLUX-FREE SOLDERING OF DIFFERENT METALS COPPER AND ALUMINUM AND SOLDERING PROCESSES THEREOF |
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| CN202110926858.0A CN113579547B (en) | 2021-08-12 | 2021-08-12 | Brazing filler metal paste for copper-aluminum dissimilar metal brazing flux-free brazing and brazing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114043027A (en) * | 2021-11-12 | 2022-02-15 | 哈尔滨工业大学 | Sintering welding method by using melt-leaching method |
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| CN109590637A (en) * | 2018-12-13 | 2019-04-09 | 郑州机械研究所有限公司 | A kind of rotary blade preforming pricker painting material |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114043027A (en) * | 2021-11-12 | 2022-02-15 | 哈尔滨工业大学 | Sintering welding method by using melt-leaching method |
| CN114043027B (en) * | 2021-11-12 | 2024-01-12 | 哈尔滨工业大学 | Fusion leaching sintering welding method |
Also Published As
| Publication number | Publication date |
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| BE1029682A1 (en) | 2023-03-08 |
| BE1029682B1 (en) | 2023-03-13 |
| CN113579547B (en) | 2023-03-10 |
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