CN102873422B - Aluminum and aluminum alloy and copper diffusion brazing process - Google Patents
Aluminum and aluminum alloy and copper diffusion brazing process Download PDFInfo
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- CN102873422B CN102873422B CN201210398254.4A CN201210398254A CN102873422B CN 102873422 B CN102873422 B CN 102873422B CN 201210398254 A CN201210398254 A CN 201210398254A CN 102873422 B CN102873422 B CN 102873422B
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Abstract
The invention discloses an aluminum and aluminum alloy and copper diffusion brazing process, and belongs to the field of dissimilar material connection. The process adopts Al-Si-Cu ternary alloy powder (the content of Si is 5%-7%, the content of Cu is 28%-30%, and the balance is Al, all in mass percent) as the connection materials, and under certain vacuum degree and certain pressure, heat is preserved at the temperature of 525-555 DEG C for 10-60 minutes, so connection between aluminum and aluminum alloy and copper can be realized. By adopting the method, liquid phase is formed by diffusion of Cu and Si atoms on an aluminum/oxidation film interface, and the oxidation film on the aluminum surface is removed, so as to realize metallurgical bonding, the joint is compact, the reliability is high, and the aluminum and aluminum alloy and copper diffusion brazing process is applicable to large area joint between pure aluminum and alloy thereof and copper and to welding of complex structural parts.
Description
Technical field
The present invention relates to the diffusion brass solder technique of a kind of Al and Alalloy and copper, belong to field of dissimilar material connection.
Background technology
Aluminium and copper are metals very common in daily life, and aluminium content in the earth's crust is higher, and density is little, and conduction, good heat conductivity, the electrical and thermal conductivity performance of copper is only second to silver.Al and Alalloy and being connected in electric power, chemical industry, refrigeration, communications and transportation and aerospace industry of copper are widely used.
There is a lot of problem at present in the connection of Al and Alalloy and copper.Aluminum bronze thermophysical property (fusing point, linear expansion coefficient, thermal conductivity, melting heat) difference is large, directly in weld seam, there is larger thermal stress during welding, therefore connects poor effect; The direct chemical combination of aluminum bronze can generate multiple brittle intermetallic thing, and these compounds have had a strong impact on intensity and the corrosion resistance of joint; In addition the oxide-film on mother metal corrosion problem and aluminium surface all brings great obstruction to aluminum bronze welding.Effective method of attachment of current aluminum bronze has Solid-State Welding, soldering and melting.
Calendar year 2001, the people such as Li Yajiang of Shandong University have studied Cu/Al vacuum diffusion welding.Its technique allows copper coin directly contact with aluminium sheet, then 6.7 × 10
-5under the vacuum environment of Pa, style is applied to the pressure of 11.5MPa, under temperature is 520 DEG C ~ 540 DEG C conditions, is incubated 60min.The method adopts the technology of solids control equipment to implement welding, and owing to needing to apply 11.5MPa pressure in welding process, this pressure is comparatively large, and vacuum is also very high, reaches 6.7 × 10
-5pa, therefore the method structure is poor for applicability, and cost is high.
Within 2002, the superfine people of Sun De have studied the soldering processes of Al-Cu joint, the mechanical property of joint and corrosion resistance, and test adopts Zn-Al base solder to coordinate chloride fluoride flux to weld.Because oxide-film removed by the brazing flux adopting corrosivity stronger in welding process, there is brazing flux residue after therefore having welded, brazing flux residue can pollute and corrode environment.
The people such as Xue Songbai in 2003 have studied the gas brazing technology of Al/Cu pipe.The modified CsF-AlF containing 1%Si powder is adopted in test
3non-corrosiveness brazing flux coordinates Ag-Al system and Al-Si brazing filler metal successfully to weld.Although brazing flux non-corrosiveness in welding process, do not need cleaning, owing to being the technology adopting gas brazing, process operability requires high, and cannot implement large area combination, and therefore its scope of application is narrower.
Singapore's Study on manufacturing technology in 2004 T.A.Mai and A.C.Spowage adopt 350WNd:YAG laser instrument to achieve welding of the thick fine copper of 1mm and Al4047, tissue morphology under different bonding speed and microhardness are analyzed, the microhardness measuring Al/Cu fusion area is higher, result shows have a large amount of brittle intermetallic things to generate, and strength of joint is very poor.
The people such as the horse naval of Shandong University in 2007 have studied the vacuum brazing technique of Al/Cu dissimilar metal.Adopt sheet Al-Si solder at 590 DEG C ~ 615 DEG C insulation 1 ~ 5min in test, successfully weld.Because welding temperature is higher in test, substantially exceeds aluminum bronze eutectic point 548 DEG C, be therefore easy to the phenomenon causing joint corrosion.And solder is sheet, also cannot weld for some complex-shaped structural members.
The people such as T.Saeid of Iran in 2010 have studied 6061 aluminium alloys and rubs with the stirring of fine copper and weld (FSW), and analyzes its weld structure and performance.Connecting due to friction stir welding often can only welded blank, so its range of application is narrower.
In sum, develop a kind of Al and Alalloy that is applicable to and engage with the large area of copper and the solder technology important in inhibiting of complex structural member, and there is huge economic worth.
Summary of the invention
The object of the invention is to develop a kind of Al and Alalloy that is applicable to engage with the large area of copper and the welding procedure of complex structural member, its principle utilizes Cu, Si atom to diffuse to form liquid phase at aluminium/interfacial oxide film, remove the oxide-film on aluminium surface, thus realize metallurgical binding.
The technical solution used in the present invention is:
Al-Si-Cu ternary alloy three-partalloy powder (Si content is 5% ~ 7%, Cu content is 28% ~ 30%, surplus Al, is all mass percents) is adopted as articulamentum, to be coated in after furnishing slurry on joint face, in vacuum higher than 6.0 × 10
-3pa, pressure is 0.1 ~ 5.0MPa, and temperature is under the condition of 525 DEG C ~ 555 DEG C, is incubated 10 ~ 60 minutes, takes out style after cooling.
The advantage that the present invention has is:
(1) the present invention adopts alloyed powder as connecting material, and required Bonding pressure is low, and structure adaptability is strong, can realize Al and Alalloy and to engage with the large area of copper and labyrinth welds.
(2) compared with existing vacuum brazing technique, welding temperature of the present invention low (525 DEG C ~ 555 DEG C), is conducive to controlling corrosion phenomenon.
(3) compared with existing vacuum brazing technique, vacuum level requirements required for the present invention is low, pressure low (0.1 ~ 5.0MPa), is conducive to reducing process costs.
Detailed description of the invention
With embodiment, the present invention will be further described below, but the present invention is not limited to these embodiments.
Embodiment 1
1060 pure aluminum plates and T2 copper plate Linear cut are cut into the thin plate being of a size of 5mm × 5mm × 2mm and 10mm × 10mm × 2mm, then two thin plates are polished respectively to smooth on 400# and 800# sand paper, clean with alcohol washes after Ultrasonic Cleaning, then aluminium sheet being placed on respectively concentration is the NaOH solution of 10% and the HNO of 10%
3clear water wash clean is used after soaking 30s in solution.Preseting composition two in the middle of plates is 67Al-5Si-28Cu(wt%) the uniform sizing material of alloyed powder furnishing, install by the der group of stainless steel fixture according to aluminium sheet-alloyed powder-intermediate layer, control gap well, then apply the pressure of 5.0MPa downwards, be placed in vacuum drying oven, vacuum is 3.0 × 10
-3pa, 525 DEG C of insulations 30 minutes, then with stove cooling, when in-furnace temperature is lower than 100 DEG C, take out style, MST810 electronic universal tester carries out shear strength test, and test result was as table 1.
Embodiment 2
In the present embodiment, mother metal adopts 5052 aluminium alloys and T2 red copper as different from Example 1, and employing composition is 65Al-7Si-28Cu(wt%) alloy powder is as intermediate layer, and vacuum is 6.0 × 10
-3pa, pressure is 3.0MPa, and when adopting welding temperature to be set as 525 DEG C, be incubated 45 minutes, all the other processing steps are all identical with embodiment 1.
Embodiment 3
In the present embodiment, mother metal adopts 6061 aluminium alloys and T2 red copper as different from Example 1, and employing composition is 65Al-5Si-30Cu(wt%) alloy powder is as intermediate layer, and vacuum is 5.0 × 10
-3pa, pressure is 1.0MPa, and when adopting welding temperature to be set as 525 DEG C, be incubated 60 minutes, all the other processing steps are all identical with embodiment 1.
Embodiment 4
In the present embodiment, mother metal adopts 3003 aluminium alloys and T2 red copper as different from Example 1, and employing composition is 66Al-6Si-28Cu(wt%) alloy powder is as intermediate layer, and vacuum is 3.0 × 10
-3pa, pressure is 5.0MPa, and when adopting welding temperature to be set as 540 DEG C, be incubated 20 minutes, all the other processing steps are all identical with embodiment 1.
Embodiment 5
In the present embodiment, mother metal adopts 1060 fine aluminiums and T2 red copper as different from Example 1, and employing composition is 65Al-6Si-29Cu(wt%) alloy powder is as intermediate layer, and vacuum is 5.0 × 10
-3pa, pressure is 3.0MPa, and when adopting welding temperature to be set as 540 DEG C, be incubated 30 minutes, all the other processing steps are all identical with embodiment 1.
Embodiment 6
In the present embodiment, mother metal adopts 6061 aluminium alloys and T2 red copper as different from Example 1, and employing composition is 63Al-7Si-30Cu(wt%) alloy powder is as intermediate layer, and vacuum is 5.0 × 10
-3pa, pressure is 1.0MPa, and when adopting welding temperature to be set as 540 DEG C, be incubated 40 minutes, all the other processing steps are all identical with embodiment 1.
Embodiment 7
In the present embodiment, mother metal adopts 5050 aluminium alloys and T2 red copper as different from Example 1, and employing composition is 66Al-5Si-29Cu(wt%) alloy powder is as intermediate layer, and vacuum is 3.0 × 10
-3pa, pressure is 4.0MPa, and when adopting welding temperature to be set as 555 DEG C, be incubated 10 minutes, all the other processing steps are all identical with embodiment 1.
Embodiment 8
In the present embodiment, mother metal adopts 1060 fine aluminiums and T2 red copper as different from Example 1, and employing composition is 64Al-7Si-29Cu(wt%) alloy powder is as intermediate layer, and vacuum is 4.0 × 10
-3pa, pressure is 0.5MPa, and welding temperature is set as 555 DEG C, and be incubated 20 minutes, all the other process conditions and step are all identical with embodiment 1.
Embodiment 9
In the present embodiment, mother metal adopts 6005 aluminium alloys and T2 red copper as different from Example 1, and employing composition is 64Al-6Si-30Cu(wt%) alloy powder is as intermediate layer, and vacuum is 5.0 × 10
-3pa, pressure is 0.1MPa, and welding temperature is set as 555 DEG C, and be incubated 30 minutes, all the other process conditions and step are all identical with embodiment 1.
Table 1 shearing strength of joint test result
。
Claims (6)
1. the diffusion brass solder technique of an Al and Alalloy and copper, it is characterized in that: adopt Al-Si-Cu ternary alloy three-partalloy powder as articulamentum, under certain vacuum degree and suitable pressure, insulation soldering, holding temperature is 525 DEG C ~ 555 DEG C, and temperature retention time is 10 ~ 60 minutes; The Ingredient percent of Al-Si-Cu ternary alloy three-partalloy powder is Si 5% ~ 7%, Cu 28% ~ 30%, surplus Al.
2. the diffusion brass solder technique of Al and Alalloy according to claim 1 and copper, is characterized in that: vacuum is higher than 6.0 × 10
-3pa.
3. the diffusion brass solder technique of Al and Alalloy according to claim 1 and copper, is characterized in that: pressure is 0.1 ~ 5.0MPa.
4. the diffusion brass solder technique of Al and Alalloy according to claim 1 and copper, is characterized in that: holding temperature is 525 DEG C ~ 535 DEG C, and temperature retention time is 30 ~ 60 minutes.
5. the diffusion brass solder technique of Al and Alalloy according to claim 1 and copper, is characterized in that: holding temperature is 535 DEG C ~ 545 DEG C, and temperature retention time is 20 ~ 40 minutes.
6. the diffusion brass solder technique of Al and Alalloy according to claim 1 and copper, is characterized in that: holding temperature is 545 DEG C ~ 555 DEG C, and temperature retention time is 10 ~ 30 minutes.
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| CN201210398254.4A CN102873422B (en) | 2012-10-18 | 2012-10-18 | Aluminum and aluminum alloy and copper diffusion brazing process |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104439590B (en) * | 2014-11-07 | 2016-09-21 | 中国矿业大学 | A kind of 6061 aluminium alloys and the soldering processes of AZ31B magnesium alloy |
| CN105345195B (en) * | 2015-12-02 | 2017-06-23 | 哈尔滨工业大学 | A kind of method of aluminum or aluminum alloy and other solder bonding metals |
| CN106475679B (en) * | 2016-11-30 | 2018-07-27 | 山东大学 | A kind of discontinuous pressure process diffusion connecting process of unrepeatered transmission of copper and aluminium alloy |
| CN107154451A (en) * | 2017-03-20 | 2017-09-12 | 华灿光电（浙江）有限公司 | A kind of chip of light emitting diode and preparation method thereof |
| TWI697372B (en) * | 2019-08-27 | 2020-07-01 | 宏進金屬科技股份有限公司 | Brazing method |
| CN115255606B (en) * | 2022-06-21 | 2023-07-25 | 北京科技大学 | Diffusion connection method for copper and graphite of aluminum-containing intermediate layer |
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| JPH07328792A (en) * | 1994-06-03 | 1995-12-19 | Ngk Spark Plug Co Ltd | Brazing method of aluminum and aluminum alloy |
| JP2004107135A (en) * | 2002-09-18 | 2004-04-08 | Ngk Insulators Ltd | Method of joining high purity alumina and copper, joined body of high purity alumina and copper and joined body of high purity alumina and copper electrode |
| CN1743118A (en) * | 2005-09-06 | 2006-03-08 | 山东大学 | Diffusion soldering method capable of making copper-aluminium joint binding strength high |
| CN101537520A (en) * | 2009-04-30 | 2009-09-23 | 顺特电气有限公司 | Brazing method of aluminum electromagnetic wire and brass |
| CN102000896A (en) * | 2010-11-10 | 2011-04-06 | 中国电子科技集团公司第十四研究所 | Al-Cu transient liquid phase diffusion bonding method of Al alloy |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152024B (en) * | 2011-04-28 | 2012-10-03 | 浙江大学 | High-strength aluminum alloy brazing filler metal with melting point being lower than 500 DEG C and preparation method thereof |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07328792A (en) * | 1994-06-03 | 1995-12-19 | Ngk Spark Plug Co Ltd | Brazing method of aluminum and aluminum alloy |
| JP2004107135A (en) * | 2002-09-18 | 2004-04-08 | Ngk Insulators Ltd | Method of joining high purity alumina and copper, joined body of high purity alumina and copper and joined body of high purity alumina and copper electrode |
| CN1743118A (en) * | 2005-09-06 | 2006-03-08 | 山东大学 | Diffusion soldering method capable of making copper-aluminium joint binding strength high |
| CN101537520A (en) * | 2009-04-30 | 2009-09-23 | 顺特电气有限公司 | Brazing method of aluminum electromagnetic wire and brass |
| CN102000896A (en) * | 2010-11-10 | 2011-04-06 | 中国电子科技集团公司第十四研究所 | Al-Cu transient liquid phase diffusion bonding method of Al alloy |
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