CN117012684A - 调节式晶圆搬运机构 - Google Patents
调节式晶圆搬运机构 Download PDFInfo
- Publication number
- CN117012684A CN117012684A CN202311196932.3A CN202311196932A CN117012684A CN 117012684 A CN117012684 A CN 117012684A CN 202311196932 A CN202311196932 A CN 202311196932A CN 117012684 A CN117012684 A CN 117012684A
- Authority
- CN
- China
- Prior art keywords
- wafer
- locking
- plate
- connecting plate
- handling mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 claims description 125
- 239000002184 metal Substances 0.000 claims description 9
- 239000010453 quartz Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 7
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 7
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000004696 Poly ether ether ketone Substances 0.000 description 8
- 229920002530 polyetherether ketone Polymers 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311196932.3A CN117012684B (zh) | 2023-09-18 | 2023-09-18 | 调节式晶圆搬运机构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311196932.3A CN117012684B (zh) | 2023-09-18 | 2023-09-18 | 调节式晶圆搬运机构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN117012684A true CN117012684A (zh) | 2023-11-07 |
CN117012684B CN117012684B (zh) | 2023-12-08 |
Family
ID=88569288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202311196932.3A Active CN117012684B (zh) | 2023-09-18 | 2023-09-18 | 调节式晶圆搬运机构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN117012684B (zh) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH683420A5 (de) * | 1992-04-25 | 1994-03-15 | Tet Techno Investment Trust | Vorrichtung zum Halten und Positionieren einer Substratkassette. |
KR20120084196A (ko) * | 2011-01-19 | 2012-07-27 | 주식회사 탑 엔지니어링 | 글래스 패널용 흡착장치 |
CN103693343A (zh) * | 2014-01-02 | 2014-04-02 | 北京七星华创电子股份有限公司 | 一种多层存储台装置 |
CN108325930A (zh) * | 2018-02-26 | 2018-07-27 | 上海提牛机电设备有限公司 | 一种升降式硅片清洗辅助装置及其清洗方法 |
CN209708952U (zh) * | 2019-04-26 | 2019-11-29 | 昆山基侑电子科技有限公司 | 用于晶圆浸泡槽中的晃动机构 |
CN110950020A (zh) * | 2019-10-25 | 2020-04-03 | 深圳市拉普拉斯能源技术有限公司 | 一种翻舟装置 |
CN215988665U (zh) * | 2021-07-07 | 2022-03-08 | 禄丰隆基硅材料有限公司 | 一种提拉装置及硅片清洗系统 |
CN216323741U (zh) * | 2021-11-10 | 2022-04-19 | 常州科隆威智能技术有限公司 | 一种带水平调节的花篮支撑装置 |
CN217740492U (zh) * | 2022-05-23 | 2022-11-04 | 吉姆西半导体科技(无锡)有限公司 | 晶圆化学镀花篮载具移动机械手 |
CN116053188A (zh) * | 2023-01-13 | 2023-05-02 | 江苏亚电科技有限公司 | 一种圆片倾斜旋转的承载装置及圆片清洗干燥方法 |
-
2023
- 2023-09-18 CN CN202311196932.3A patent/CN117012684B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH683420A5 (de) * | 1992-04-25 | 1994-03-15 | Tet Techno Investment Trust | Vorrichtung zum Halten und Positionieren einer Substratkassette. |
KR20120084196A (ko) * | 2011-01-19 | 2012-07-27 | 주식회사 탑 엔지니어링 | 글래스 패널용 흡착장치 |
CN103693343A (zh) * | 2014-01-02 | 2014-04-02 | 北京七星华创电子股份有限公司 | 一种多层存储台装置 |
CN108325930A (zh) * | 2018-02-26 | 2018-07-27 | 上海提牛机电设备有限公司 | 一种升降式硅片清洗辅助装置及其清洗方法 |
CN209708952U (zh) * | 2019-04-26 | 2019-11-29 | 昆山基侑电子科技有限公司 | 用于晶圆浸泡槽中的晃动机构 |
CN110950020A (zh) * | 2019-10-25 | 2020-04-03 | 深圳市拉普拉斯能源技术有限公司 | 一种翻舟装置 |
CN215988665U (zh) * | 2021-07-07 | 2022-03-08 | 禄丰隆基硅材料有限公司 | 一种提拉装置及硅片清洗系统 |
CN216323741U (zh) * | 2021-11-10 | 2022-04-19 | 常州科隆威智能技术有限公司 | 一种带水平调节的花篮支撑装置 |
CN217740492U (zh) * | 2022-05-23 | 2022-11-04 | 吉姆西半导体科技(无锡)有限公司 | 晶圆化学镀花篮载具移动机械手 |
CN116053188A (zh) * | 2023-01-13 | 2023-05-02 | 江苏亚电科技有限公司 | 一种圆片倾斜旋转的承载装置及圆片清洗干燥方法 |
Also Published As
Publication number | Publication date |
---|---|
CN117012684B (zh) | 2023-12-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240110 Address after: 200120 Room 101, building 33, No. 1387, Zhangdong Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Shanghai pudate Semiconductor Equipment Co.,Ltd. Patentee after: Pudate Semiconductor Equipment (Xuzhou) Co.,Ltd. Address before: 200120 Room 101, building 33, No. 1387, Zhangdong Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee before: Shanghai pudate Semiconductor Equipment Co.,Ltd. |
|
TR01 | Transfer of patent right |