CN116991045A - Etching process for controlling etching (depth and shape of half etching area) - Google Patents
Etching process for controlling etching (depth and shape of half etching area) Download PDFInfo
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- CN116991045A CN116991045A CN202310871625.4A CN202310871625A CN116991045A CN 116991045 A CN116991045 A CN 116991045A CN 202310871625 A CN202310871625 A CN 202310871625A CN 116991045 A CN116991045 A CN 116991045A
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- etching process
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- 238000005530 etching Methods 0.000 title claims abstract description 112
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 39
- 230000001681 protective effect Effects 0.000 claims abstract description 29
- 238000012545 processing Methods 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 239000003814 drug Substances 0.000 claims abstract description 15
- 239000007769 metal material Substances 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000007797 corrosion Effects 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 5
- 239000012459 cleaning agent Substances 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000010791 quenching Methods 0.000 claims description 4
- 230000000171 quenching effect Effects 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses an etching process for controlling the size of an etching (depth and appearance of a half-etching area), which relates to the technical field of etching processing, and comprises the following steps: s1, preparing materials; step S2, pretreatment cleaning; s3, baking the coated photosensitive ink; s4, exposing; s5, developing; s6, sticking a protective film; step S7, first etching; s8, removing the protective film; step S9, etching for the second time; step S10, normal etching is carried out to a finished product; according to the invention, through the design of the film with the connection point, the traditional etching mode is adopted, the design of the connection point is adopted, the etching adopts a hedging mode (the liquid medicine is used for simultaneously processing the upper surface and the lower surface of the metal material), and the time is more advantageous, and the technology can better control the depth and the outline dimension of a half-etched area and avoid poor control of the size because the reverse side is deeply etched by 0.1mm for the first time and is hedged for the second time (the liquid medicine is used for simultaneously processing the upper surface and the lower surface of the metal material).
Description
Technical Field
The invention relates to the technical field of etching processing, in particular to an etching process for controlling the size of an etching (half etching area depth and outline).
Background
Etching manufacturing techniques are commonly used to fabricate plate-like components of materials such as metals, plastics, ceramics, and the like. This technique utilizes chemical reactions to remove portions of the surface of the material to form the desired shape and structure. Etching may be accomplished by a variety of methods, the most common of which is the use of acidic solutions and photolithographic processes. In the field of electronics fabrication and micro-nano processing, etching techniques are applied in the fabrication of semiconductor chips and other micro-devices. The following problems exist in the prior art:
at present, a circle of half etching is performed around the edge of an etched product, the etching depth is 0.3mm, and an electroplating process is needed in the later stage, so that the defects of a half etching area and the dimension of the outline are difficult to control.
For this purpose, a process flow for controlling the etching size is proposed to solve the above problems.
Disclosure of Invention
In order to solve the technical problems, the invention adopts the following technical scheme:
an etching process for etching (half-etched area depth, profile) size control, the etching process comprising the following steps:
s1, preparing materials, namely selecting a required metal cover plate and processing the metal cover plate into a required shape and size;
step S2, pretreatment cleaning: quenching and washing the surface of the material by using a solvent or other cleaning agents to remove impurities such as grease, dust and the like;
step S3, baking the coated photosensitive ink: uniformly coating a layer of photosensitive ink on the surface of the material, and baking and curing;
step S4, exposure: irradiating the area not covered by the pattern template with ultraviolet rays or laser by covering the pattern template on the photosensitive ink;
step S5, developing: immersing the material with the fixed pattern in a developer;
step S6, sticking a protective film: adhering a layer of protective film on the surface of the material;
step S7, first etching: etching the exposed areas by using chemical liquid to obtain the required grooves or patterns;
step S8, removing the protective film: removing the protective film and continuing the second etching;
step S9, second etching: continuing etching the rest part which is not corroded to finally obtain the required shape and size;
step S10, normal etching is carried out to a finished product: the normal etching process continues until the fabrication is complete.
The technical scheme of the invention is further improved as follows: in the step S1, the metal cover plate is 40-120009755 in model, the thickness of the metal cover plate is 0.4mm, and stainless steel SUS 304/4 h is adopted as a material.
The technical scheme of the invention is further improved as follows: in the step S3, this step is to enable the photosensitive ink to protect a part of the area from corrosion, forming a pattern.
The technical scheme of the invention is further improved as follows: in the step S4, the region not covered by the template is irradiated with ultraviolet rays or laser light to chemically react with the region, thereby fixing the pattern.
The technical scheme of the invention is further improved as follows: in the step S5, the material with the fixed pattern is soaked in the developer, so that the unexposed photosensitive ink is corroded by the developer, thereby exposing the desired pattern.
The technical scheme of the invention is further improved as follows: in the step S6, the protective film is used to prevent corrosion by portions not requiring etching.
The technical scheme of the invention is further improved as follows: the film pasting process of pasting the protective film in the step S6 comprises the following steps: after exposure development, the front side and the back side of the film are firstly stuck, the first etching processing is carried out, the processing depth is 0.1mm, and then the front side protective film is taken down, and the second etching (the liquid medicine simultaneously processes the upper surface and the lower surface of the metal material) is carried out.
The technical scheme of the invention is further improved as follows: the technology can better control the depth and the outline dimension of the half-etched area and avoid the poor control of the dimension (the depth and the outline of the half-etched area) because the depth of the back side is etched for 0.1mm for the first time and the opposite side is etched for the second time (the upper surface and the lower surface of the metal material are processed simultaneously by liquid medicine).
By adopting the technical scheme, compared with the prior art, the invention has the following technical progress:
the development of the cover plate 40-120009755, the material thickness is 0.4mm, the material SUS 304/4 h, the design scheme is to etch a circle around the edge of the product, the etching depth is 0.3mm, the later plating process is needed, the film is designed by using a tape connecting point, the traditional etching mode is adopted in the past, the tape connecting point is designed, the etching adopts a hedging mode (the liquid medicine is used for simultaneously processing the upper surface and the lower surface of the metal material), the time is more advantageous, the etching depth of the reverse side is 0.1mm for the first time, the hedging (the liquid medicine is used for simultaneously processing the upper surface and the lower surface of the metal material) is etched for the second time, the half etching area depth and the outline dimension can be better controlled, and the bad size control is avoided.
Drawings
FIG. 1 is a schematic diagram of an etching size control process flow of the present invention;
FIG. 2 is a graph of data before quality measurement profile improvement for a normal etching process according to the present invention;
FIG. 3 is a graph of profile measurement data after the addition of a film deposition process after profile improvement for etching quality measurement according to the present invention;
Detailed Description
The invention is further illustrated by the following examples:
example 1:
as shown in fig. 1-3, the present invention provides an etching process for etching (half-etched area depth, profile) size control, the etching process comprising the following steps:
s1, preparing materials, namely selecting a required metal cover plate and processing the metal cover plate into a required shape and size;
step S2, pretreatment cleaning: quenching and washing the surface of the material by using a solvent or other cleaning agents to remove impurities such as grease, dust and the like;
step S3, baking the coated photosensitive ink: uniformly coating a layer of photosensitive ink on the surface of the material, and baking and curing;
step S4, exposure: irradiating the area not covered by the pattern template with ultraviolet rays or laser by covering the pattern template on the photosensitive ink;
step S5, developing: immersing the material with the fixed pattern in a developer;
step S6, sticking a protective film: adhering a protective film on the surface of the material so as not to be corroded by the parts which do not need etching;
step S7, first etching: etching the exposed areas by using chemical liquid to obtain the required grooves or patterns;
step S8, removing the protective film: removing the protective film and continuing the second etching;
step S9, second etching: continuing etching the rest part which is not corroded to finally obtain the required shape and size;
step S10, normal etching is carried out to a finished product: continuing the normal etching process until the manufacturing is completed;
specifically, the cover plate metal cover plate model is 40-120009755, the material thickness is 0.4mm, stainless steel SUS 304/4 h material is adopted, the step S3 is to enable photosensitive ink to protect partial areas from corrosion, patterns are formed, and the step S4 is to expose: irradiating the area which is not covered by the template by ultraviolet rays or laser to enable the area to be subjected to chemical reaction, fixing patterns, and developing in the step S5: soaking the material with the fixed pattern in a developer to enable the unexposed photosensitive ink to be corroded under the action of the developer, so that the required pattern is exposed, and attaching a protective film in step S6: in order to avoid being corroded by the part which does not need etching, a film pasting process of pasting a protective film is carried out in the step S6: after exposure development, the front surface and the back surface of the film are firstly subjected to first etching processing, the processing depth is 0.1mm, then the front protective film is taken down, and second etching (the liquid medicine is used for simultaneously processing the upper surface and the lower surface of the metal material) is performed, wherein the depth of the etched back surface is 0.1mm for the first time, and the second etching is opposite to the second etching (the liquid medicine is used for simultaneously processing the upper surface and the lower surface of the metal material), so that the depth and the outline size of a half-etched area can be better controlled, and poor control of the size of the half-etched area is avoided.
In the embodiment, the cover plates 40-120009755 are developed, the thickness of the material is 0.4mm, stainless steel SUS3043/4h is adopted as the material, the design scheme is to etch one circle around the edge of the product, the etching depth is 0.3mm, the later electroplating process is considered, the film is designed by using a tape connecting point, the traditional etching mode is adopted in the past, the tape connecting point is designed, the etching adopts a hedging mode (the liquid medicine is used for simultaneously processing the upper surface and the lower surface of the metal material), the time is more advantageous, the back surface depth is etched for 0.1mm for the first time, the hedging (the liquid medicine is used for simultaneously processing the upper surface and the lower surface of the metal material) is etched for the second time, the half etching region depth and the overall dimension can be better controlled, and poor (half etching region depth and outline) size control is avoided.
The working principle of the etching size control is specifically described below.
1-3, selecting a required metal cover plate, processing the metal cover plate into a required shape and size, wherein the type of the metal cover plate is 40-120009755, the thickness of the material is 0.4mm, and the material is stainless steel SUS 304/4 h;
pretreatment cleaning: quenching and washing the surface of the material by using a solvent or other cleaning agents to remove impurities such as grease, dust and the like;
baking coating photosensitive ink: uniformly coating a layer of photosensitive ink on the surface of a material, and baking and curing the photosensitive ink to protect partial areas from corrosion to form patterns;
exposure: the pattern template is covered on the photosensitive ink, and the area which is not covered by the template is irradiated by ultraviolet rays or laser, so that chemical reaction occurs, and the pattern is fixed;
developing: immersing the material with the fixed pattern in a developer to enable the unexposed photosensitive ink to be corroded under the action of the developer, so that the required pattern is exposed;
sticking a protective film: and (3) sticking a layer of protective film on the surface of the material so as to avoid being corroded by parts which do not need etching, wherein the film sticking process for sticking the protective film comprises the following steps: after exposure development, firstly adhering the front surface and the back surface of the film, performing first etching processing with the processing depth of 0.1mm, and then taking down the front protective film for second etching (processing the upper surface and the lower surface of the metal material simultaneously by liquid medicine);
first etching: etching the exposed areas by using chemical liquid to obtain the required grooves or patterns;
and (5) removing the protective film: removing the protective film and continuing the second etching;
second etching: continuing etching the rest part which is not corroded to finally obtain the required shape and size;
normal etching to a finished product: continuing the normal etching process until the manufacturing is completed;
the research and development cover plate 40-120009755, material thickness 0.4mm, the material adopts stainless steel SUS3043/4h material, design scheme is half etching round around the product edge, the etching depth is 0.3mm, consider the later stage to need walk electroplating technology, film application area tie point design, traditional etching mode in the past, area tie point design, the etching adopts the hedging mode (liquid medicine carries out processing simultaneously to metal material upper and lower surface), it is more advantageous in time, this technology has because of having etched reverse side degree of depth 0.1mm for the first time, second etching hedging (liquid medicine carries out processing simultaneously to metal material upper and lower surface), can be better management and control half regional degree of depth, overall dimension, avoid (half regional degree of depth of etching, appearance) size management and control badly.
The foregoing invention has been generally described in great detail, but it will be apparent to those skilled in the art that modifications and improvements can be made thereto. Accordingly, it is intended to cover modifications or improvements within the spirit of the inventive concepts.
Claims (8)
1. An etching process for controlling the etching (depth and appearance of a half-etched area) size is characterized in that: the etching process comprises the following steps:
s1, preparing materials, namely selecting a required metal cover plate and processing the metal cover plate into a required shape and size;
step S2, pretreatment cleaning: quenching and washing the surface of the material by using a solvent or other cleaning agents to remove impurities such as grease, dust and the like;
step S3, baking the coated photosensitive ink: uniformly coating a layer of photosensitive ink on the surface of the material, and baking and curing;
step S4, exposure: irradiating the area not covered by the pattern template with ultraviolet rays or laser by covering the pattern template on the photosensitive ink;
step S5, developing: immersing the material with the fixed pattern in a developer;
step S6, sticking a protective film: adhering a layer of protective film on the surface of the material;
step S7, first etching: etching the exposed areas by using chemical liquid to obtain the required grooves or patterns;
step S8, removing the protective film: removing the protective film and continuing the second etching;
step S9, second etching: continuing etching the rest part which is not corroded to finally obtain the required shape and size;
step S10, normal etching is carried out to a finished product: the normal etching process continues until the fabrication is complete.
2. The etching process of etching (half-etched area depth, profile) size management according to claim 1, characterized in that: in the step S1, the model of the metal cover plate is 40-120009755, the material thickness is 0.4mm, and stainless steel SUS 304/4 h material is adopted.
3. The etching process of etching (half-etched area depth, profile) size management according to claim 1, characterized in that: in the step S3, this step is to enable the photosensitive ink to protect a part of the area from corrosion, forming a pattern.
4. The etching process of etching (half-etched area depth, profile) size management according to claim 1, characterized in that: in the step S4, the region not covered by the template is irradiated with ultraviolet rays or laser light to chemically react with the region, thereby fixing the pattern.
5. The etching process of etching (half-etched area depth, profile) size management according to claim 1, characterized in that: in the step S5, the material with the fixed pattern is soaked in the developer, so that the unexposed photosensitive ink is corroded by the developer, thereby exposing the desired pattern.
6. The etching process of etching (half-etched area depth, profile) size management according to claim 1, characterized in that: in the step S6, the protective film is used to prevent corrosion by portions not requiring etching.
7. The etching process of etching (half-etched area depth, profile) size management according to claim 1, characterized in that: the film pasting process of pasting the protective film in the step S6 comprises the following steps: after exposure development, the front side and the back side of the film are firstly stuck, the first etching processing is carried out, the processing depth is 0.1mm, and then the front side protective film is taken down, and the second etching (the liquid medicine simultaneously processes the upper surface and the lower surface of the metal material) is carried out.
8. The etching process of etching (half-etched area depth, profile) size management according to claim 1, characterized in that: the technology can better control the depth and the outline dimension of the half-etched area and avoid the poor control of the dimension (the depth and the outline of the half-etched area) because the depth of the back side is etched for 0.1mm for the first time and the opposite side is etched for the second time (the upper surface and the lower surface of the metal material are processed simultaneously by liquid medicine).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310871625.4A CN116991045A (en) | 2023-07-14 | 2023-07-14 | Etching process for controlling etching (depth and shape of half etching area) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310871625.4A CN116991045A (en) | 2023-07-14 | 2023-07-14 | Etching process for controlling etching (depth and shape of half etching area) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116991045A true CN116991045A (en) | 2023-11-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310871625.4A Pending CN116991045A (en) | 2023-07-14 | 2023-07-14 | Etching process for controlling etching (depth and shape of half etching area) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116991045A (en) |
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2023
- 2023-07-14 CN CN202310871625.4A patent/CN116991045A/en active Pending
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