CN116982016A - 电子设备 - Google Patents

电子设备 Download PDF

Info

Publication number
CN116982016A
CN116982016A CN202180094503.8A CN202180094503A CN116982016A CN 116982016 A CN116982016 A CN 116982016A CN 202180094503 A CN202180094503 A CN 202180094503A CN 116982016 A CN116982016 A CN 116982016A
Authority
CN
China
Prior art keywords
exhaust
electronic device
air
fins
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180094503.8A
Other languages
English (en)
Chinese (zh)
Inventor
高冈宏之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN116982016A publication Critical patent/CN116982016A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mathematical Physics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202180094503.8A 2021-02-26 2021-11-19 电子设备 Pending CN116982016A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021029445 2021-02-26
JP2021-029445 2021-02-26
PCT/JP2021/042681 WO2022180957A1 (ja) 2021-02-26 2021-11-19 電子機器

Publications (1)

Publication Number Publication Date
CN116982016A true CN116982016A (zh) 2023-10-31

Family

ID=83047905

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180094503.8A Pending CN116982016A (zh) 2021-02-26 2021-11-19 电子设备

Country Status (5)

Country Link
US (2) US12481336B2 (https=)
EP (1) EP4300568A4 (https=)
JP (1) JPWO2022180957A1 (https=)
CN (1) CN116982016A (https=)
WO (1) WO2022180957A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022181001A1 (https=) * 2021-02-26 2022-09-01
USD1095517S1 (en) * 2024-01-24 2025-09-30 Getac Technology Corporation Laptop computer
USD1078728S1 (en) * 2024-01-24 2025-06-10 Getac Technology Corporation Laptop computer

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6311767B1 (en) * 1999-05-26 2001-11-06 Intel Corporation Computer fan assembly
US7128131B2 (en) * 2001-07-31 2006-10-31 The Furukawa Electric Co., Ltd. Heat sink for electronic devices and heat dissipating method
US6671177B1 (en) * 2002-10-25 2003-12-30 Evga.Com Corporation Graphics card apparatus with improved heat dissipation
TWI278273B (en) * 2002-12-13 2007-04-01 Arima Computer Corp Heat dissipation device for electronic component
US7079394B2 (en) * 2003-01-08 2006-07-18 Lenovo (Singapore) Pte. Ltd. Compact cooling device
JP3799477B2 (ja) 2003-12-12 2006-07-19 ソニー株式会社 放熱フィン、冷却装置、電子機器及び冷却装置の製造方法
JP4752965B2 (ja) * 2009-10-08 2011-08-17 カシオ計算機株式会社 プロジェクタ
JP2012049315A (ja) 2010-08-26 2012-03-08 Sae Magnetics(H.K.)Ltd 回路基板
JP5017470B1 (ja) 2011-03-11 2012-09-05 株式会社東芝 テレビジョン受像機、及び電子機器
CN103576809B (zh) * 2012-07-24 2017-09-29 联想(北京)有限公司 电子设备及其第一、二电子设备和第一电子设备切换方法
JP2014085973A (ja) 2012-10-25 2014-05-12 Nec Personal Computers Ltd 放熱装置及び携帯情報機器
JP2015053330A (ja) 2013-09-05 2015-03-19 富士通株式会社 電子機器
JP6561705B2 (ja) * 2015-09-09 2019-08-21 富士通クライアントコンピューティング株式会社 情報処理装置

Also Published As

Publication number Publication date
US20230393636A1 (en) 2023-12-07
US20240385664A1 (en) 2024-11-21
EP4300568A1 (en) 2024-01-03
JPWO2022180957A1 (https=) 2022-09-01
US12481336B2 (en) 2025-11-25
EP4300568A4 (en) 2024-08-28
WO2022180957A1 (ja) 2022-09-01

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