CN116970949A - Preparation method of intermetallic compound layer between metal parts - Google Patents
Preparation method of intermetallic compound layer between metal parts Download PDFInfo
- Publication number
- CN116970949A CN116970949A CN202311223522.3A CN202311223522A CN116970949A CN 116970949 A CN116970949 A CN 116970949A CN 202311223522 A CN202311223522 A CN 202311223522A CN 116970949 A CN116970949 A CN 116970949A
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- China
- Prior art keywords
- metal
- tin
- compound layer
- based solder
- coating
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- 239000002184 metal Substances 0.000 title claims abstract description 171
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 171
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 229910000765 intermetallic Inorganic materials 0.000 title description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 84
- 229910000679 solder Inorganic materials 0.000 claims abstract description 71
- 238000010438 heat treatment Methods 0.000 claims abstract description 53
- 238000000576 coating method Methods 0.000 claims abstract description 46
- 150000002736 metal compounds Chemical class 0.000 claims abstract description 45
- 239000011248 coating agent Substances 0.000 claims abstract description 44
- 238000007747 plating Methods 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims abstract description 26
- 238000005219 brazing Methods 0.000 claims abstract description 15
- 239000000945 filler Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 31
- 238000002844 melting Methods 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 15
- 230000004907 flux Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 claims description 3
- 239000012190 activator Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000013008 thixotropic agent Substances 0.000 claims description 3
- 229910000969 tin-silver-copper Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 230000008569 process Effects 0.000 description 14
- 239000003292 glue Substances 0.000 description 12
- 238000005303 weighing Methods 0.000 description 12
- 238000005476 soldering Methods 0.000 description 10
- 238000007599 discharging Methods 0.000 description 8
- 238000003466 welding Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000004321 preservation Methods 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
Abstract
The application provides a preparation method of a metal compound layer between metal parts, which comprises the following steps: a) Preparing tin-based solder on a surface to be plated of the surface of the metal part; b) Preheating the metal part obtained in the step A), heating, and cooling to obtain a metal coating, wherein the metal coating comprises a metal compound layer and a tin-based solder coating which are sequentially compounded; c) Fixing the metal parts obtained in the step B) to be connected, and preparing tin-based brazing filler metal between the metal parts; d) Preheating the metal part obtained in the step C), then heating, and cooling to obtain the intermetallic metal compound layer of the metal part. The application provides a preparation method of a metal compound layer between metal parts, which effectively purifies the surfaces of the metal parts and forms metal compounds between the metal parts by preparing a metal surface plating layer and forming the metal compound layer between the metal parts, thereby realizing reliable electrical connection and mechanical connection.
Description
Technical Field
The application relates to the technical field of coating preparation, in particular to a preparation method of a metal compound layer between metal parts.
Background
At present, conventional preparation methods of metal plating layers comprise technologies such as electroplating, hot dip plating and the like, the procedures of the technologies are complex, and high-oxidability substances such as strong acid and the like are needed in the preparation process, so that the cost is high and the environment is easy to pollute. In the upstream industry, especially the high-tech industry or the high-end medical industry, the metal plating is generally realized in a purchasing mode in consideration of the special requirements of the production environment of the metal plating, but with miniaturization and precision of products and confidentiality of the internal structure of the products, more and more parts or components have to be subjected to plating technology and metal connection in the processing process of the products.
The premise of forming reliable connection between metal parts is a metal surface coating, but the prior art schemes of forming compounds between metal parts and the metal surface coating have great difference. The differentiation of the schemes causes more production cost, investment of capital such as equipment and facilities, and the like.
Therefore, it is of great importance to provide a method for the effective connection between metal parts.
Disclosure of Invention
The technical problem solved by the application is to provide a preparation method of a metal compound layer between metal parts, which can lead the metal parts to have excellent electrical connection and mechanical connection.
The application provides a preparation method of a metal compound layer between metal parts, which comprises the following steps:
a) Preparing tin-based solder on a surface to be plated of the surface of the metal part;
b) Preheating the metal part obtained in the step A), heating, and cooling to obtain a metal coating, wherein the metal coating comprises a metal compound layer and a tin-based solder coating which are sequentially compounded, and the metal compound layer is compounded on the surface of the metal part;
c) Fixing the metal parts obtained in the step B) to be connected, and oppositely placing metal plating layers of the metal parts to prepare tin-based brazing filler metal between the metal plating layers;
d) Preheating the metal part obtained in the step C), then heating, and cooling to obtain the intermetallic metal compound layer of the metal part.
Preferably, in the step B), the preheating temperature is 40-70 ℃ lower than the melting point temperature of the tin-based solder, and the time is 50-120 s.
Preferably, in the step B), the heating temperature is 30-50 ℃ higher than the melting point temperature of the Yu Xiji solder, and the time is 30-80 s.
Preferably, in the step D), the preheating temperature is 40-70 ℃ lower than the melting point temperature of the tin-based solder, and the time is 50-120 s.
Preferably, in the step D), the heating temperature is 80-100 ℃ higher than the melting point temperature of the Yu Xiji solder, and the time is 60-120 s.
Preferably, the material of the metal part is one or more of copper, copper alloy, gold, silver, zinc and nickel.
Preferably, the tin-based solder comprises a metal alloy and a flux paste in a volume ratio of 1:1.
Preferably, the metal alloy is selected from SAC305 or SAC307 tin silver copper, and the soldering paste is selected from an activator, a thixotropic agent, a resin and an organic solvent.
Preferably, the thickness of the metal compound layer is 1-3 μm, the thickness of the tin-based solder plating layer is 0.1mm or more, and the thickness of the intermetallic metal compound layer is 0.2mm or more.
Preferably, in step a), the tin-based solder is prepared by coating, and in step C), the tin-based solder is prepared by coating.
The application provides a preparation method of a metal compound layer between metal parts, which comprises the steps of firstly preparing tin-based brazing filler metal on a surface to be plated of a single metal part, preheating the obtained metal part to uniformly heat the metal part and remove a surface oxidation layer, heating the metal part to fully wet the surface to be plated, and cooling the metal part to form the metal part with a metal plating layer; firstly fixing the metal part, preparing tin-based brazing filler metal between the metal plating layers of the metal part, preheating the metal part to uniformly heat the metal part, heating to fully wet the tin-based brazing filler metal, and melting soldering tin in the plating layer; and cooling to obtain the metal compound layer between the metal parts. In the process of preparing the intermetallic compound layer between metal parts, the preparation of the metal coating and intermetallic forming compound is realized successively by a method of preparing the surface and heating the tin-based paste solder; the tin-based paste solder is heated to a melting point (not more than 450 ℃) for the first time, the solder is subjected to purification and catalysis action on the metal surface through soldering flux in the heating process, the solder and the metal surface are subjected to wetting and diffusion bonding, finally an intermetallic compound layer is formed between the metal and the solder, and a welding spot is formed after cooling; and then, the plated metal parts are heated for the second time, under the action of the soldering flux, the tin-based paste solder and the soldering tin in the plating layer are melted, new welding spots are formed between the metal parts after cooling, and finally, the electric connection and the mechanical connection between the metals are realized through the welding spots.
Drawings
FIG. 1 is a schematic flow chart of the preparation of intermetallic compound layers between metal parts according to the present application;
fig. 2 is a schematic diagram of a specific placement structure of two metal parts according to the present application.
Detailed Description
For a further understanding of the present application, preferred embodiments of the application are described below in conjunction with the examples, but it should be understood that these descriptions are merely intended to illustrate further features and advantages of the application, and are not limiting of the claims of the application.
In order to realize the simplicity and high efficiency of the formation process of the intermetallic metal compound layer between the metal parts, the application provides a preparation method of the intermetallic metal compound layer between the metal parts, which sequentially realizes the preparation of the metal surface coating and the intermetallic metal compound layer between the metal parts by preparing the coating in a plurality of times, reduces the use or introduction of excessive materials, realizes energy conservation and emission reduction, can effectively purify the surfaces of the metal parts and form the compound layer between the metal parts, and realizes reliable electrical connection and mechanical connection between the metal parts. Specifically, the embodiment of the application discloses a preparation method of a metal compound layer between metal parts, and a flow diagram is shown in fig. 1, and the preparation method comprises two parts: preparation of metal surface coating S10) and preparation of intermetallic forming compounds S20); the method specifically comprises the following steps:
a) Preparing tin-based solder on a surface to be plated of the surface of the metal part;
b) Preheating the metal part obtained in the step A), heating, and cooling to obtain a metal coating, wherein the metal coating comprises a metal compound layer and a tin-based solder coating which are sequentially compounded, and the metal compound layer is compounded on the surface of the metal part;
c) Fixing the metal parts obtained in the step B) to be connected, and oppositely placing metal plating layers of the metal parts to prepare tin-based brazing filler metal between the metal plating layers;
d) Preheating the metal part obtained in the step C), then heating, and cooling to obtain the intermetallic metal compound layer of the metal part.
In the preparation process of the intermetallic compound layer between metal parts, a plating layer is firstly prepared on the surface of a single part, and a plating material is required to be prepared firstly; the paste flux is well known to those skilled in the art, and the present application is not particularly limited thereto. After the tin-based brazing filler metal is prepared, the tin-based brazing filler metal is prepared on the surface to be plated of the metal part, and particularly the tin-based brazing filler metal is coated on the surface to be plated of the metal part.
The application then subjects the metal part to a low temperature Duan Yure, and here a low temperature Duan Baowen, which causes the metal part to be heated uniformly and the surface oxide layer to be removed. The preheating temperature is 40-70 ℃ lower than the melting point temperature of the tin-based solder, and the heat preservation time is 50-120 s; specifically, the preheating temperature is 157-187 ℃, and the heat preservation time is 50-100 s. After preheating, raising the heating temperature to ensure that the temperature of the tin-based solder is 30-50 ℃ higher than the melting point temperature of the solder, and preserving heat for 30-80 s so as to ensure that the tin-based solder is changed from solid state to liquid state and is fully wetted on the surface of the metal part; specifically, the heating temperature is 257-277 ℃, and the temperature is kept for 30-50 s.
After the heating is finished, stopping heating the metal part and naturally cooling to room temperature, so that the preparation of the metal coating on the surface of the metal part is realized, wherein the metal coating comprises a metal compound layer and a tin-based solder coating which are sequentially compounded on the surface of the metal part; in the process, the tin-based solder is completely melted, but Sn in a small amount of melted tin-based solder chemically reacts with the base metal on the surface of the metal part to form a thin metal compound layer, the tin-based solder coating is an alloy layer formed by the tin-based solder, and the part of tin-based solder coating has a low melting point and is easier to form a compound layer with another metal part.
According to the application, a metal compound layer is then formed between the metal parts. The number of the metal parts prepared by the steps is selected according to the requirement, in the application, two metal parts with metal coatings on the surfaces are preferably fixed through a tool, the metal coatings of the metal parts are oppositely placed, the base body is exemplified by brass, and the placement mode of the metal parts is shown in figure 2. Preparing tin-based brazing filler metal between the metal plating layers; the tin-based solder comprises a metal alloy and a soldering paste in a volume ratio of 1:1, more specifically, the metal alloy is selected from SAC305 or SAC307 tin silver copper, and the soldering paste is selected from an activator, a thixotropic agent, a resin and an organic solvent. After the tin-based brazing filler metal is prepared, the tin-based brazing filler metal is prepared at the joint position between metal parts or parts, specifically, the tin-based brazing filler metal is coated at the joint position between the metal parts or between the metal parts, and the thickness of a tin-based brazing filler metal coating is more than 0.2 mm.
The application then subjects the metal part to a low temperature Duan Yure, and here a low temperature Duan Baowen, which causes the metal part to be heated uniformly. The preheating temperature is 40-70 ℃ lower than the melting point temperature of the tin-based solder, and the heat preservation time is 50-120 s; specifically, the preheating temperature is 157-187 ℃, and the heat preservation time is 50-100 s. After preheating, the heating temperature is increased, the temperature of the tin-based solder is 80-100 ℃ higher than the melting point temperature of the solder, and the temperature is kept for 60-120 s, so that the tin-based solder and a tin-based solder coating on the surface of a metal part are converted from a solid state to a liquid state, the metal parts are fully wetted, and soldering tin in the coating is melted, so that the tight connection of the metal parts is realized; specifically, the heating temperature is 287-327 ℃, and the temperature is kept for 60-100 s.
In the heating process, the tin-based solder between metal parts and the tin-based solder coating on the surfaces of the metal parts in the melting process are quickly wetted, and the tension of the surfaces of the tin-based solder is reduced along with the further increase of the temperature, so that a layer of metal compound is formed on the surfaces of the metal parts; from the viewpoint of micromaterials, tin and metal atoms in the tin-based solder form intermetallic compounds due to diffusion. Taking a metal part made of brass as an example, when the tin-based solder is melted and then wets the copper layer rapidly, tin atoms and copper atoms mutually permeate at the interface, and the structure of the initial Sn-Cu alloy is Cu 6 Sn 5 If the heat preservation time is too long and the temperature is too high, cu atoms further permeate into Cu 6 Sn 5 In which the local structure will be composed of Cu 6 Sn 5 Conversion to Cu 3 Sn alloy, the former alloy has high welding strength and good conductivity, while the latter alloy has brittleness, low welding strength and poor conductivity.
After the heating is finished, stopping heating the metal part, and naturally cooling to room temperature, so that the preparation of the metal compound layer between the metal parts is realized. The thickness of the metal compound layer is 1-3 mu m.
In order to further understand the present application, the following examples are provided to illustrate the preparation method of the intermetallic compound layer between metal parts according to the present application in detail, and the scope of the present application is not limited by the following examples.
Example 1
1. Raw materials
The material of the parts is as follows: brass;
paste tin-based solder: thousands of M705-GRN360;
2. process of implementation
S10) implementation process of metal surface coating
S11) weighing: firstly, weighing the weight G1 of test paper by using a balance, opening a preset dispenser mode, starting the dispenser, clicking a glue discharging switch for 10 times to dot paste tin-based solder on the test paper, weighing the weight G2 of the test paper containing the paste tin-based solder again, subtracting the weight G1 from the weight G2, and taking an average value to obtain the glue discharging amount of 0.18G each time (0.155-0.185G which is required to meet the weight requirement);
s12) coating: fixing the parts on an operating platform of a dispensing machine by using a fixture, opening a preset dispensing machine mode, starting the dispensing machine, and uniformly coating paste tin-based paste solder with known weight on three outer surfaces of metal to be plated respectively;
s13) preheating and S14) heating: starting heating equipment and calling a preset program until the equipment works normally, and using a temperature tester to test whether the heating equipment meets the preheating condition (the duration is 101 seconds in the temperature range of 157-187 ℃ and the standard is 50-120 seconds) and the heating condition (the duration is 69 seconds in the temperature range of 257-277 ℃ and the standard is 30-80 seconds); the parts are placed on a conveying tool, and the tool is conveyed into heating equipment to finish a preheating process and a heating process;
s15) cooling: taking out the part from the heating area, placing the part in a cooling area, and naturally cooling the part to room temperature to finish solidification;
the preparation of the metal surface plating layer is completed, wherein the plating layer comprises a metal compound layer and a tin-based solder plating layer, the thickness of the metal compound layer is 2 mu m, and the thickness of the tin-based solder plating layer is 0.22mm;
parts 1 and 2 were prepared in the manner described above;
s20) implementation of intermetallic Compounds
S21) fixing: pressing the joint surfaces of the metal part 1 and the metal part 2 together through a fixing tool, and oppositely placing the plating layers of the metal part 1 and the metal part 2;
s22) weighing: firstly, weighing the weight G1 of test paper by using a balance, starting a preset glue dispenser mode, starting the glue dispenser, clicking a glue discharging switch for 10 times to dot paste tin-based solder on the test paper, weighing the weight G2 of the test paper containing the paste tin-based solder again, subtracting the weight G1 from the weight G2, and taking an average value to obtain the glue discharging amount of 0.28G (0.255-0.284G which is required to meet the weight requirement) each time;
s22) coating: placing the fixed fixture on an operation table of a dispensing machine, opening a preset dispensing machine mode, starting the dispensing machine, and uniformly coating paste tin-based paste solder with known weight at the joint position of two parts;
s23) preheating and S24) heating: starting heating equipment, calling a preset program until the equipment works normally, using a temperature tester to test whether the heating equipment meets the preheating condition (the duration is 110 seconds within the temperature range of 157-187 ℃ and the standard is 50-120 seconds) and the heating condition (the duration is 105 seconds within the temperature range of 287-327 ℃ and the standard is 60-120 seconds), placing the parts on a conveying tool, conveying the tool into the heating equipment, and finishing the preheating process and the heating process;
s25) cooling: and taking out the part from the heating area, placing the part in a cooling area, and naturally cooling to room temperature to finish solidification.
The formation of the metal compound layer was completed so far, and the thickness of the metal compound layer was 0.53mm.
The performance of the intermetallic metal compound layer between the metal parts prepared in the example was examined, and compared with the metal plating layer prepared in the prior art, the results are shown in table 1;
table 1 table of performance data of intermetallic compound layers between metal parts prepared in examples and prior art
Note that: the prior art method for preparing the coating between metal parts is electroplating tin, and the basic flow of the method is pretreatment, electroplating tin, reflow, passivation, rust-proof oil coating and other processes; wherein the pretreatment generally comprises two procedures of alkali washing and acid washing, and aims to remove organic oil and oxide film on the surface of the low-carbon steel so as to expose the fresh steel surface and prepare for subsequent electroplating; besides acid and alkali used for pretreatment, the whole electroplating process can produce pollution such as waste gas, waste water and the like, and the complete treatment flow and equipment are required to be provided to meet the requirements of criticism, so that the method is not suitable for being imported into the production environment of high and new technology or medical industry.
The tin layer with the conventional thickness of the plating layer is generally between 0.2 and 2.0 microns, and the tin layer with the high thickness can reach more than 5 microns, but still has the thickness of micron level, which is not beneficial to welding among parts after lamination.
In the prior art, soldering is performed by using solder wires, and the soldering of the solder wires generally adopts a manual or automatic equipment mode, but the production efficiency is generally not high, and the requirement of mass production cannot be met.
Example 2
1. Raw materials
The material of the parts is as follows: brass;
paste tin-based solder: thousands of M705-GRN360;
2. process of implementation
S10) implementation process of metal surface coating
S11) weighing: firstly, weighing the weight G1 of test paper by using a balance, opening a preset dispenser mode, starting the dispenser, clicking a glue discharging switch for 10 times to dot paste tin-based solder on the test paper, weighing the weight G2 of the test paper containing the paste tin-based solder again, subtracting the weight G1 from the weight G2, and taking an average value to obtain the glue discharging amount of 0.16G each time (0.155-0.185G should be met);
s12) coating: fixing the parts on an operating platform of a dispensing machine by using a fixture, opening a preset dispensing machine mode, starting the dispensing machine, and uniformly coating paste tin-based paste solder with known weight on three outer surfaces of metal to be plated respectively;
s13) preheating and S14) heating: starting the heating equipment and calling a preset program until the equipment works normally, and using a temperature tester to test whether the heating equipment meets the preheating condition (the duration is 70 seconds in the temperature range of 157-187 ℃ and the standard is 50-120 seconds) and the heating condition (the duration is 45 seconds in the temperature range of 257-277 ℃ and the standard is 30-80 seconds); the parts are placed on a conveying tool, and the tool is conveyed into heating equipment to finish a preheating process and a heating process;
s15) cooling: taking out the part from the heating area, placing the part in a cooling area, and naturally cooling the part to room temperature to finish solidification;
the preparation of the metal surface plating layer is completed, wherein the plating layer comprises a metal compound layer and a tin-based solder plating layer, the thickness of the metal compound layer is 2 mu m, and the thickness of the tin-based solder plating layer is 0.18mm;
parts 1 and 2 were prepared in the manner described above;
s20) implementation of intermetallic Compounds
S21) fixing: pressing the joint surfaces of the metal part 1 and the metal part 2 together through a fixing tool, and oppositely placing the plating layers of the metal part 1 and the metal part 2;
s22) weighing: firstly, weighing the weight G1 of test paper by using a balance, starting a preset glue dispenser mode, starting the glue dispenser, clicking a glue discharging switch for 10 times to dot paste tin-based solder on the test paper, weighing the weight G2 of the test paper containing the paste tin-based solder again, subtracting the weight G1 from the weight G2, and taking an average value to obtain the glue discharging amount of 0.26G each time (0.255-0.284G which is required to meet the weight requirement);
s22) coating: placing the fixed fixture on an operation table of a dispensing machine, opening a preset dispensing machine mode, starting the dispensing machine, and uniformly coating paste tin-based paste solder with known weight at the joint position of two parts;
s23) preheating and S24) heating: starting heating equipment, calling a preset program until the equipment works normally, using a temperature tester to test whether the heating equipment meets the preheating condition (the duration is 70 seconds within the temperature range of 157-187 ℃ and the standard is 50-120 seconds) and the heating condition (the duration is 75 seconds within the temperature range of 287-327 ℃ and the standard is 60-120 seconds), placing the parts on a conveying tool, conveying the tool into the heating equipment, and finishing the preheating process and the heating process;
s25) cooling: and taking out the part from the heating area, placing the part in a cooling area, and naturally cooling to room temperature to finish solidification.
The formation of the metal compound layer was completed so far, and the thickness of the metal compound layer was 0.48mm.
The performance of the intermetallic metal compound layer between the metal parts prepared in the example was examined, and compared with the metal plating layer prepared in the prior art, the results are shown in table 2;
table 2 table of performance data of intermetallic compound layers between metal parts prepared in examples and prior art
The above description of the embodiments is only for aiding in the understanding of the method of the present application and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the application can be made without departing from the principles of the application and these modifications and adaptations are intended to be within the scope of the application as defined in the following claims.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The preparation method of the intermetallic metal compound layer between the metal parts is characterized by comprising the following steps of:
a) Preparing tin-based solder on a surface to be plated of the surface of the metal part;
b) Preheating the metal part obtained in the step A), heating, and cooling to obtain a metal coating, wherein the metal coating comprises a metal compound layer and a tin-based solder coating which are sequentially compounded, and the metal compound layer is compounded on the surface of the metal part;
c) Fixing the metal parts obtained in the step B) to be connected, and oppositely placing metal plating layers of the metal parts to prepare tin-based brazing filler metal between the metal plating layers;
d) Preheating the metal part obtained in the step C), then heating, and cooling to obtain the intermetallic metal compound layer of the metal part.
2. The method according to claim 1, wherein in the step B), the preheating temperature is 40-70 ℃ lower than the melting point temperature of the tin-based solder, and the time is 50-120 s.
3. The method according to claim 1, wherein in the step B), the heating temperature is 30-50 ℃ higher than the melting point temperature of the Yu Xiji solder, and the time is 30-80 s.
4. The method according to claim 1, wherein in the step D), the preheating temperature is 40-70 ℃ lower than the melting point temperature of the tin-based solder, and the time is 50-120 s.
5. The method according to claim 1, wherein in the step D), the heating temperature is 80-100 ℃ higher than the melting point temperature of the Yu Xiji solder, and the time is 60-120 s.
6. The method of claim 1, wherein the metal part is made of one or more of copper, copper alloy, gold, silver, zinc, and nickel.
7. The method of manufacturing according to claim 1, wherein the tin-based solder comprises a metal alloy and a flux paste in a volume ratio of 1:1.
8. The method of claim 7, wherein the metal alloy is selected from SAC305 or SAC307 tin silver copper, and the flux paste is selected from activators, thixotropic agents, resins, and organic solvents.
9. The method according to claim 1, wherein the thickness of the metal compound layer is 1 to 3 μm, the thickness of the tin-based solder plating layer is 0.1mm or more, and the thickness of the intermetallic metal compound layer is 0.2mm or more.
10. The method according to claim 1, wherein in the step a), the tin-based solder is prepared by coating, and in the step C), the tin-based solder is prepared by coating.
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