CN101041901A - Iron-nickel alloy coating with good weldability and uses thereof - Google Patents
Iron-nickel alloy coating with good weldability and uses thereof Download PDFInfo
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- CN101041901A CN101041901A CN 200610046164 CN200610046164A CN101041901A CN 101041901 A CN101041901 A CN 101041901A CN 200610046164 CN200610046164 CN 200610046164 CN 200610046164 A CN200610046164 A CN 200610046164A CN 101041901 A CN101041901 A CN 101041901A
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- 239000011248 coating agent Substances 0.000 title claims abstract description 91
- 238000000576 coating method Methods 0.000 title claims abstract description 91
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 title claims abstract description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 23
- 229910052742 iron Inorganic materials 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 10
- 239000000956 alloy Substances 0.000 claims abstract description 10
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000012535 impurity Substances 0.000 claims abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 16
- 238000005476 soldering Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 7
- 238000007772 electroless plating Methods 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 6
- 238000004377 microelectronic Methods 0.000 claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 2
- 230000003064 anti-oxidating effect Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 14
- 238000006557 surface reaction Methods 0.000 description 14
- 239000010949 copper Substances 0.000 description 10
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- 230000036632 reaction speed Effects 0.000 description 7
- 230000005496 eutectics Effects 0.000 description 5
- 238000009736 wetting Methods 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005272 metallurgy Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 206010027439 Metal poisoning Diseases 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 239000010793 electronic waste Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- NNIPDXPTJYIMKW-UHFFFAOYSA-N iron tin Chemical compound [Fe].[Sn] NNIPDXPTJYIMKW-UHFFFAOYSA-N 0.000 description 1
- 208000008127 lead poisoning Diseases 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000008239 natural water Substances 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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Abstract
The invention discloses a weldable Fe-Ni alloy coating and application in the electronic industrial, astronautical and general purpose engineering domain, which is characterized by the following: coating 5-80% Fe and residual nickel or nickel phosphor and inevitable impurity on the sample surface; improving anti-oxidizing property; forming flat boundary reacting product among welding materials under high temperature with slow boundary reacting speed; lengthening using time effectively.
Description
Technical field
The present invention relates to the alloy layer of welding field, specifically a kind of alloy layer that contains elemental iron and nickel and application thereof that is applicable to welding, this coating can be widely used in electronic industry, aerospace and general engineering.
Background technology
Soldering is a kind of very ancient technology, and it is widely used in the connection between the device.In recent years along with the rise of microelectronics industry, soldering tech has also obtained vigorous growth.According to statistics, reached 1.2 trillion dollars to the output value of global information technology in 2000 and electronic market, become the largest industrial sector of the world today, the Electronic Packaging industry plays a part very important as one of mainstay industry of this industry in electron trade.
In encapsulation field, connection the earliest mainly is to adopt wiping solder that copper conductor is directly coupled together, but owing between copper and the scolder surface reaction speed is faster arranged, is unfavorable for the formation at stable interface.Especially along with the development of microelectronic industry, pad is more and more littler, and surface reaction can run out of the copper on the pad very soon fast, thereby causes the damage of solder joint finally to cause the inefficacy of entire device.In order to slow down the appearance of this problem, people adopt the method for plating or electroless plating to plate one deck nickel or nickel-phosphorus alloy on traditional copper pad, because nickel has wettability and slower surface reaction speed preferably, thereby can prolong the out-of-service time of solder joint greatly.
Studies show that lead is a kind of deleterious metal, the lead of absorption of human body low dosage will cause lead poisoning.The annual according to statistics world has 20,000 tons lead to be applied in the electron trade approximately.Be accompanied by plumbous a large amount of uses, electronic waste increases day by day, and processing is discarded or buried to a large amount of waste and old electric devices.Toxic substance lead finally causes expendable environmental pollution to physical environment, soil, natural water body and animals and plants biologic chain thereof gradually by the aqueous corrosion in the physical environment, dissolving, diffusion and enrichment in the alloy.Along with the more and more attention of people, forbid in scolder, using plumbous cry more and more higher to environmental problem.People begin to seek the substitute of wiping solder, mainly concentrate on Xi Yin, tin copper and the SAC wiping solder height that the fusing point of these several scolders is all more traditional at present.Even minimum its fusing point of SAC scolder of fusing point is 217 ℃ and also exceeds 34 ℃ than 183 ℃ of eutectic tin-lead solder in three kinds of scolders.In welding process, need so just to require higher welding temperature.Between lead-free solder under the higher welding temperature and nickel coating that uses at present or nickel-phosphorus coating, have surface reaction speed faster, and can form a large amount of spiculation compounds at the interface, as shown in Figure 1.As everyone knows, electronic devices and components are the circulation service states that are in a kind of cold and hot loading, because the thermal expansivity of each material is inconsistent at the interface, thereby can in solder joint, produce the loading repeatedly of stress, and these acicular compounds very easily cause cracking in the solder joint, thereby influence the work-ing life and the safe reliability of solder joint greatly.
Summary of the invention
In view of the practical situation of above-mentioned prior art, the purpose of this invention is to provide a kind of have the good wet performance and and scolder between slower iron-nickel alloy coating and the application thereof of interface speed of response, to satisfy the requirement of existing welding technique development.
For realizing above purpose, technical scheme of the present invention is as follows:
Surface at the sample of required welding makes the alloy layer that one deck contains iron and nickel, and this coating has good wettability and slower surface reaction speed.This coating serves as main the composition with iron, nickel, wherein can also contain other elements such as P.The weight percent of each composition consists of in the coating:
Fe 5-80％；
P 0-15％
Other are nickel and other inevitable impurity.
The present invention is applied in the iron-nickel alloy coating in the soldering, contains a certain amount of iron and nickel in the coating.It specifically is the method codeposition one deck iron-nickel alloy coating on the specimen surface of required soldering that adopts plating or electroless plating.This alloy layer has excellent wetting capacity energy and surface reaction performance.
Iron level in the iron-nickel alloy coating of the present invention has bigger adjustable extent, and its weight percent is 5-80%, and surplus is nickel or nickel phosphorus and inevitable impurity.
The iron-nickel alloy coating coefficient of expansion of the present invention can be regulated by the content of iron in the coating, applicable to the matrix of difference requirement.
Iron-nickel alloy coating of the present invention has excellent wetting capacity energy and antioxidant property, can be used as finishing coating, and directly welds on this coating.
Iron-nickel alloy coating of the present invention only is not limited to as overlay coating, can also be at other coating such as its surface deposition gold, platinum, palladium, tin and alloys thereof, and the existence of other coating does not influence the surface reaction performance of this coating.
Iron-nickel alloy coating of the present invention especially is applicable to the microelectronics Packaging industry applicable to various welding technique.
The invention provides iron-nickel alloy coating can obtain by common electroplating technology or electroless plating technology, and can obtain the coating of different components by the various ionic ratios in the adjusting plating bath.Because the adjustable ratio of element in the coating, the thermal expansivity of coating also can change along with the variation of composition, thereby this coating goes on the different matrixes, as copper, nickel, iron, silicon, pottery etc.
The present invention has following advantage:
1, good wettability, because this coating has the good oxidization resistance energy, coating surface is difficult for generating the oxide compound that the wetting reaction of influence is carried out, thereby the wettability of coating is good.
2, the surface reaction speed between coating and scolder is slow, owing to contain iron in this coating, iron reacts with tin than nickel is easier, so and the surface reaction product that contains between tinsolder mainly be the iron tin compound, this compound is comparatively smooth, can stop further carrying out of surface reaction, thus more many slowly than the surface reaction speed of other coating, as shown in Figure 2.
3, because this coating can be adjusted the content of the iron in the coating, thereby can obtain the coating of different heat expansion coefficient, this has increased the use range of this coating greatly.This coating not only can obtain heat coupling preferably with the bigger matrix of thermal expansivity such as copper, also can and the less matrix of thermal expansivity such as pottery, silicon chip between obtain good heat and mate.
What 4, this coating adopted is the method for plating or electroless plating, and technology is simple, and is applied widely.
5, this method is applicable to the surface of Any shape and size, can carry out plating to entire device, also can carry out plating to the part of device.
Description of drawings
Fig. 1 is the sectional view of nickel coating and eutectic SAC solder reflow postwelding sample.
Fig. 2 is the sectional view of iron nickel coating and eutectic SAC solder reflow postwelding sample.
Fig. 3 is the wetting curve of FeNi33 coating.
Fig. 4 is the weldprocedure curve.
Fig. 5 is the pad structure that has the iron nickel coating.
Fig. 6 is the welding spot structure that scribbles soldering paste.
Fig. 7 is the welding spot structure that has the iron nickel coating.
Embodiment
Below in conjunction with drawings and Examples the present invention is described in further detail.
Embodiment 1:FeNi57 coating
Adopting electro-plating method to make composition on the copper billet of 10 * 10 * 1.7mm is FeNi57 coating 3 (the Ni weight percentage is 57%).In the sample of two usefulness method preparations of the same race, be coated with last layer SAC soldering paste, adopt the BGA﹠amp of U.S. ok company; Weld at CSP reclamation work station, and setting warm up time is 155 seconds, and flowing time set again is 110 seconds.The reflux temperature curve that obtains according to this technology as shown in Figure 4.Wherein the suffered top temperature of solder joint is 257 ℃ in the welding process, and above (217 ℃) time of scolder fusing point is 90 seconds.Again this welded sample is adopted the line cutting to cut, polish and polished finish, adopt FeCl again with sand paper
3The spirituous solution corrosion is with its section structure structure of scanning electron microscopic observation, as shown in Figure 2.Interface compound between this coating and scolder 50 minutes is smooth as can be seen from Figure 2, and number in the figure 1 is represented the eutectic tin silver-copper brazing alloy.
Comparative example 1: nickel coating
Adopting uses the same method makes nickel coating 2 on copper, and handles by embodiment 1 described method, and its section structure structure as shown in Figure 1.Can find that from Fig. 1 the interface compound 4 between nickel coating and eutectic SAC scolder is thicker, and a large amount of needle-like compound formation is arranged.
Embodiment 2:FeNi33 coating
Regulate the ratio of the iron nickel ion in the plating bath, make nickel weight percentage in the coating and be 33% iron nickel coating, adopt SKC-8H weldability tester to test its solderability then, its result as shown in Figure 3.As can be seen from Figure 3, this coating has good wettability.
Embodiment 3: the pad structure that has the iron nickel coating
On the Cu of pcb board 6 pad 7, adopt the method for electroless plating to plate the iron, nickel, phosphorus coating 8 of one deck 5um, percentage composition meter by weight, in this coating, iron accounts for 20%, and nickel accounts for 73%, and phosphorus accounts for 7%; On this coating, electroplate the gold plate 9 of one deck 1.5um again.Its structural representation as shown in Figure 5.
Embodiment 4: the welding spot structure that has the iron nickel coating
Adopt electric plating methods to plate one deck iron nickel coating 12 at the UBM of ceramic chip 10 (metallurgy layer under the salient point) 11, percentage composition meter by weight, in this coating, iron accounts for 36%, and nickel accounts for 64%; Then adopt typography on this coating, to coat an amount of soldering paste 13, as shown in Figure 6.And then reflux according to the technology of soldering paste and to obtain having the welding spot structure of salient point 14, as shown in Figure 7.
Embodiment 5:FeNi95 coating
Make nickel weight percentage in the coating and be 95% iron nickel coating on the copper matrix, adopt SKC-8H weldability tester to test its solderability then, this coating wettability is good.
Embodiment 6:FeNi20 coating
Stainless steel is a kind of welding-resistant metal, for improving its solderability, makes the iron weight percentage and be 80% iron nickel coating on stainless steel-based surface, and the stainless steel with this coating can carry out soldering at an easy rate.
Compare with common coating, alloy layer of the present invention has good solderability, antioxidant property and good surface reaction performance, can generate the smooth surface reaction product of pattern under the higher temperature and between the scolder, and has slower surface reaction speed, help obtaining functional, the device of long service life.In addition, because the iron level in the coating has bigger adjustable extent among the present invention, thereby can be applied on the matrix of the different coefficients of expansion, has range of application comparatively widely.The present invention can be used for UBM (metallurgy layer under the salient point) and make, and also can be used for the modification of other braze surface, is particularly suitable for using the microelectronic packaging technology of lead-free solder.
Claims (7)
1, a kind of iron-nickel alloy coating of good weldability is characterized in that: this coating serves as main the composition with iron, nickel, and the iron weight percent is 5-80%, and surplus is nickel or nickel phosphorus and inevitable impurity.
2, according to the described iron-nickel alloy coating of claim 1, it is characterized in that: the phosphorus weight percent is 0-15%.
3, according to the application of the described iron-nickel alloy coating of claim 1, it is characterized in that: the method codeposition one deck iron-nickel alloy coating on device, matrix or the specimen surface of required soldering that adopts plating or electroless plating.
4, according to the application of the described iron-nickel alloy coating of claim 3, it is characterized in that: the coefficient of expansion of iron-nickel alloy coating is regulated by the content of iron in the coating, is applicable to the different matrixes that require.
5, according to the application of the described iron-nickel alloy coating of claim 3, it is characterized in that: iron-nickel alloy coating can be as finishing coating, and directly weld on this coating.
6, according to the application of the described iron-nickel alloy coating of claim 5, it is characterized in that: can also be at the other deposited gold in iron-nickel alloy coating surface, platinum, palladium, tin or its alloy layer.
7, according to the application of the described iron-nickel alloy coating of claim 3, it is characterized in that: iron-nickel alloy coating is applicable to various welding technique, especially is applicable to the microelectronics Packaging industry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610046164 CN101041901A (en) | 2006-03-24 | 2006-03-24 | Iron-nickel alloy coating with good weldability and uses thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610046164 CN101041901A (en) | 2006-03-24 | 2006-03-24 | Iron-nickel alloy coating with good weldability and uses thereof |
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| Publication Number | Publication Date |
|---|---|
| CN101041901A true CN101041901A (en) | 2007-09-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200610046164 Pending CN101041901A (en) | 2006-03-24 | 2006-03-24 | Iron-nickel alloy coating with good weldability and uses thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104170086A (en) * | 2012-03-28 | 2014-11-26 | 富士电机株式会社 | Semiconductor device, and method for manufacturing semiconductor device |
| CN104772560A (en) * | 2015-03-13 | 2015-07-15 | 临沂大学 | FSW (Friction Stir Welding) method of nickel-plated aluminum alloy plate doped by rare-earth lanthanum |
-
2006
- 2006-03-24 CN CN 200610046164 patent/CN101041901A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104170086A (en) * | 2012-03-28 | 2014-11-26 | 富士电机株式会社 | Semiconductor device, and method for manufacturing semiconductor device |
| CN104170086B (en) * | 2012-03-28 | 2018-01-16 | 富士电机株式会社 | The manufacture method of semiconductor device and semiconductor device |
| CN104772560A (en) * | 2015-03-13 | 2015-07-15 | 临沂大学 | FSW (Friction Stir Welding) method of nickel-plated aluminum alloy plate doped by rare-earth lanthanum |
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Open date: 20070926 |