CN113993291A - Nickel-gold construction process based on electronic product processing - Google Patents
Nickel-gold construction process based on electronic product processing Download PDFInfo
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- CN113993291A CN113993291A CN202111293634.7A CN202111293634A CN113993291A CN 113993291 A CN113993291 A CN 113993291A CN 202111293634 A CN202111293634 A CN 202111293634A CN 113993291 A CN113993291 A CN 113993291A
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- Prior art keywords
- flexible circuit
- circuit board
- gold
- nickel
- layer
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- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 238000010276 construction Methods 0.000 title claims abstract description 16
- 238000012545 processing Methods 0.000 title claims abstract description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052737 gold Inorganic materials 0.000 claims abstract description 46
- 239000010931 gold Substances 0.000 claims abstract description 46
- 238000007747 plating Methods 0.000 claims abstract description 21
- 238000004140 cleaning Methods 0.000 claims abstract description 13
- 239000012459 cleaning agent Substances 0.000 claims abstract description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 36
- 229910052763 palladium Inorganic materials 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 15
- 238000007654 immersion Methods 0.000 claims description 11
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 9
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052725 zinc Inorganic materials 0.000 claims description 9
- 239000011701 zinc Substances 0.000 claims description 9
- 239000012670 alkaline solution Substances 0.000 claims description 8
- 239000000243 solution Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000003929 acidic solution Substances 0.000 claims description 6
- 150000002941 palladium compounds Chemical class 0.000 claims description 6
- 238000002791 soaking Methods 0.000 claims description 6
- 239000007888 film coating Substances 0.000 claims description 4
- 238000009501 film coating Methods 0.000 claims description 4
- 230000008595 infiltration Effects 0.000 claims description 4
- 238000001764 infiltration Methods 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 claims description 3
- AOWPVIWVMWUSBD-RNFRBKRXSA-N [(3r)-3-hydroxybutyl] (3r)-3-hydroxybutanoate Chemical compound C[C@@H](O)CCOC(=O)C[C@@H](C)O AOWPVIWVMWUSBD-RNFRBKRXSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- -1 aluminum ions Chemical class 0.000 claims description 3
- 229930195733 hydrocarbon Natural products 0.000 claims description 3
- 150000002430 hydrocarbons Chemical class 0.000 claims description 3
- 239000003599 detergent Substances 0.000 claims description 2
- 239000003759 ester based solvent Substances 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 42
- 229910052759 nickel Inorganic materials 0.000 abstract description 21
- 238000009713 electroplating Methods 0.000 abstract description 10
- 238000004381 surface treatment Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000005234 chemical deposition Methods 0.000 abstract description 4
- 239000002253 acid Substances 0.000 abstract 1
- 239000000047 product Substances 0.000 description 22
- 238000005516 engineering process Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a nickel-gold construction process based on electronic product processing, which relates to the field of high-density printed circuit boards and flexible circuit boards, and comprises the following steps of cleaning the flexible circuit boards, replacing the flexible circuit boards, plating layers of the flexible circuit boards, wiring the flexible circuit boards, and cleaning the flexible circuit boards: placing the flexible circuit board into a cleaning agent, cleaning stains on the surface of the flexible circuit board, and replacing the flexible circuit board: then the flexible circuit board is put into acid solution, and the product is soaked in nitric acid. The invention can adjust the surface treatment production flow to achieve the target of ultra-low thickness ultra-dense line fingers, and through chemical deposition of nickel and gold, the thickness uniformity is better, the nickel thickness difference can be reduced from 5um of nickel electroplating to 1um, and the gold thickness difference can be reduced from 0.1um of gold electroplating to 0.05um, so that the product quality is better than that of the existing similar products, and the application field of the flexible circuit board is very wide.
Description
Technical Field
The invention relates to the field of high-density printed circuit boards and flexible circuit boards, in particular to a nickel-gold construction process based on electronic product processing.
Background
Along with the rapid development of photoelectric and micro-electric manufacturing process technologies, electronic products are always developed towards smaller, lighter and cheaper directions, nickel and gold on a plate are different by electroplating nickel gold threads, nickel and gold are coated by nickel palladium gold threads in a chemical deposition mode, the thickness of the nickel and gold is thinner, circuit boards are thinner and denser, the electronic product is suitable for high-end products and is mainly used for 5G products, the model conductivity of the products is better, an IMC layer is formed during tin soldering, and the welding rejection situation is prevented.
The existing nickel-gold construction process achieves the effects that the thickness is ultra-dense and large, and the thickness of chemically deposited nickel-gold is not uniform in the surface treatment production process, so that the use quality of electronic products cannot achieve interest, and the performance of the electronic products is reduced.
Disclosure of Invention
The invention aims to provide a nickel-gold construction process based on electronic product processing, which aims to solve the problems that the nickel-gold construction process provided by the background technology achieves the effects of ultra-dense thickness and uneven thickness of chemically deposited nickel-gold, so that the use quality of electronic products cannot reach interest and the performance of the electronic products is reduced in the surface treatment production process.
In order to achieve the purpose, the invention provides the following technical scheme: the nickel-gold construction process based on electronic product processing comprises the following steps of cleaning a flexible circuit board, replacing the flexible circuit board, plating the flexible circuit board and wiring the flexible circuit board;
cleaning the flexible circuit board: placing the flexible circuit board into a cleaning agent, and cleaning stains on the surface of the flexible circuit board;
flexible circuit board replacement: then putting the flexible circuit board into an acidic solution, putting the product into nitric acid for soaking, removing a first relatively loose zinc replacement layer, then soaking the product into a zinc replacement solution, wherein zinc ions and aluminum ions on the surface of the flexible circuit board are subjected to replacement reaction, a compact zinc-nickel layer is formed on the surface of the flexible circuit board by the second zinc replacement, then putting the flexible circuit board into an alkaline solution, pouring formaldehyde into the alkaline solution, and reducing a palladium compound, wherein the palladium compound forms a layer of palladium on the surface of the zinc-nickel layer;
plating of the flexible circuit board: forming a copper layer on the surface of the palladium layer through copper plating, and then putting the flexible circuit board into a solution for gold immersion and gold infiltration to form a gold layer on the surface of the copper layer;
flexible circuit board wiring: and (3) carrying out wire connection welding on the surface of the gold layer, wherein silver is used for welding during wire connection welding.
Preferably, the zinc-nickel layer, the palladium layer, the copper plating layer and the gold layer form an alloy plating layer on the surface of the flexible circuit board.
Preferably, the concentration of the acidic solution is 20-76%, and the concentration of the alkaline solution is 35-83%.
Preferably, the detergent component is mainly a hydrocarbon, alcohol, or ketone ester solvent.
Preferably, after the flexible circuit board is manufactured, the flexible circuit board is placed above the processing device and is subjected to punching treatment.
Preferably, after the circuit board is punched, the circuit of the circuit board is inserted into the punched inner wall, and then the pins of the circuit are welded with the punched inner wall by silver.
Preferably, after the flexible circuit board is manufactured, a film coating machine is used for carrying out film coating treatment on the surface of the flexible circuit board.
The invention has the technical effects and advantages that: the surface treatment production flow can be adjusted, the target of ultra-low-thickness ultra-dense circuit fingers is achieved, the thickness uniformity is better through chemical deposition of nickel and gold, the nickel thickness difference can be reduced to 1um from 5um of nickel electroplating, the gold thickness difference is reduced to 0.05um from 0.1um of gold electroplating, the product quality is superior to that of the existing like products, and the application field of the flexible circuit board is very wide.
Drawings
FIG. 1 is a schematic view of the product process structure of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a nickel-gold construction process based on electronic product processing as shown in figure 1.
Detailed description of the preferred embodiment
As shown in fig. 1, the steps of cleaning the flexible circuit board, replacing the flexible circuit board, plating the flexible circuit board, connecting the flexible circuit board and cleaning the flexible circuit board are as follows: placing the flexible circuit board into a cleaning agent, wherein the cleaning agent mainly comprises hydrocarbon, alcohol and ketone ester solvents, cleaning stains on the surface of the flexible circuit board, fully cleaning the surface of the flexible circuit board, and removing the stains on the surface;
detailed description of the invention
As shown in fig. 1, the flexible circuit board replaces: then putting the flexible circuit board into an acidic solution, putting the product into nitric acid for soaking, wherein the concentration of the acidic solution is 20-76%, removing a first relatively loose zinc replacement layer, then soaking the product into the zinc replacement solution, wherein zinc ions and aluminum ions on the surface of the flexible circuit board are subjected to replacement reaction, a compact zinc-nickel layer is formed on the surface of the flexible circuit board by the second zinc replacement, then putting the flexible circuit board into an alkaline solution, wherein the concentration of the alkaline solution is 35-83%, then pouring formaldehyde into the solution, reducing a palladium compound, wherein the palladium compound forms a layer of palladium on the surface of the zinc-nickel layer, and a flexible circuit board coating: forming a copper layer on the surface of the palladium layer through copper plating, then putting the flexible circuit board into a solution for gold immersion and gold infiltration, so that a gold layer is formed on the surface of the copper layer, and the flexible circuit board is connected with wires: the surface of the gold layer is subjected to wiring welding, the welding is carried out by using silver during the wiring welding, the zinc nickel layer, the palladium layer, the copper plating and the gold layer form an alloy coating on the surface of the flexible circuit board, the surface treatment production flow is adjusted, the target of ultra-low-thickness ultra-dense circuit fingers is achieved, the thickness uniformity is better through chemical deposition of nickel and gold, the nickel thickness difference can be reduced to 1um by 5um of nickel electroplating, the gold thickness difference is reduced to 0.05um by 0.1um of gold electroplating, and the product quality is superior to that of the existing similar products.
Detailed description of the preferred embodiment
As shown in fig. 1, after the flexible circuit board preparation was accomplished, place the processingequipment top with flexible circuit board, it handles to punch it, the circuit board punches the back and pegs graft the inner wall that punches with the circuit of circuit board, then use silver to weld the stitch of circuit and the inner wall that punches, after the flexible circuit board preparation is accomplished, use the coating machine to carry out coating film treatment to flexible circuit board's surface, can carry out quick equipment production with flexible circuit board, satisfy the basic user demand of circuit board, and through silver welding, the copper layer of deuterogamying flexible circuit board plating, the gold layer, can carry out fine intercommunication to the information transfer between the circuit.
The working principle of the invention is as follows: the structure of the tin layer, the palladium layer and the gold layer is characterized in that a layer of copper is added between palladium and gold, the chemical palladium plating layer can protect the nickel layer from being excessively corroded by exchange gold in the deposition reaction of gold replacement, palladium can fully prepare for gold immersion while preventing the corrosion phenomenon caused by the replacement reaction, the technology is applied to the surface treatment of a flexible circuit board, in the process of a nickel-palladium gold immersion process, the precise deposition thickness and the gold layer uniformity are obtained by controlling chemical palladium plating and gold immersion on the nickel layer, a good contact surface is achieved through the copper layer, the gold infiltration problem in the gold immersion process is optimally controlled, and the requirement of small spacing of a welding area is met;
through test comparison of lead bonding capability, weldability and ageing resistance of the chemical nickel plating palladium immersion gold surface treatment welding area and the nickel electroplating gold surface treatment welding area, the chemical nickel plating palladium immersion gold control technology is verified to have lead bonding reliability and tin soldering reliability which are superior to those of nickel electroplating gold, the deposition thickness of nickel is about 5 microns, the gold thickness difference can be reduced to 1 micron and is reduced to 0.05 micron from 0.1 micron of the electroplating gold, the chemical nickel plating palladium immersion gold control technology can obtain surface treatment with excellent reliability, all requirements of a lead-free assembly process are met, and the chemical nickel plating palladium immersion gold control technology is very suitable for surface treatment manufacturing of flexible circuit boards.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (7)
1. The nickel-gold construction process based on electronic product processing is characterized by comprising the following steps: cleaning a flexible circuit board, replacing the flexible circuit board, plating the flexible circuit board and wiring the flexible circuit board according to the following steps;
cleaning the flexible circuit board: placing the flexible circuit board into a cleaning agent, and cleaning stains on the surface of the flexible circuit board;
flexible circuit board replacement: then putting the flexible circuit board into an acidic solution, putting the product into nitric acid for soaking, removing a first relatively loose zinc replacement layer, then soaking the product into a zinc replacement solution, wherein zinc ions and aluminum ions on the surface of the flexible circuit board are subjected to replacement reaction, a compact zinc-nickel layer is formed on the surface of the flexible circuit board by the second zinc replacement, then putting the flexible circuit board into an alkaline solution, pouring formaldehyde into the alkaline solution, and reducing a palladium compound, wherein the palladium compound forms a layer of palladium on the surface of the zinc-nickel layer;
plating of the flexible circuit board: forming a copper layer on the surface of the palladium layer through copper plating, and then putting the flexible circuit board into a solution for gold immersion and gold infiltration to form a gold layer on the surface of the copper layer;
flexible circuit board wiring: and (3) carrying out wire connection welding on the surface of the gold layer, wherein silver is used for welding during wire connection welding.
2. The nickel-gold construction process based on electronic product processing as claimed in claim 1, wherein: the zinc nickel layer, the palladium layer, the copper plating layer and the gold layer form an alloy plating layer on the surface of the flexible circuit board.
3. The nickel-gold construction process based on electronic product processing as claimed in claim 1, wherein: the concentration of the acidic solution is 20-76%, and the concentration of the alkaline solution is 35-83%.
4. The nickel-gold construction process based on electronic product processing as claimed in claim 1, wherein: the detergent component mainly comprises hydrocarbon, alcohol and ketone ester solvents.
5. The nickel-gold construction process based on electronic product processing as claimed in claim 1, wherein: and after the flexible circuit board is manufactured, the flexible circuit board is placed above the processing device and is subjected to punching treatment.
6. The nickel-gold construction process based on electronic product processing as claimed in claim 5, wherein: and after the circuit board is punched, inserting the circuit of the circuit board into the punched inner wall, and then welding the pins of the circuit and the punched inner wall by using silver.
7. The nickel-gold construction process based on electronic product processing as claimed in claim 6, wherein: and after the flexible circuit board is manufactured, performing film coating treatment on the surface of the flexible circuit board by using a film coating machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111293634.7A CN113993291A (en) | 2021-11-03 | 2021-11-03 | Nickel-gold construction process based on electronic product processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111293634.7A CN113993291A (en) | 2021-11-03 | 2021-11-03 | Nickel-gold construction process based on electronic product processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113993291A true CN113993291A (en) | 2022-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111293634.7A Pending CN113993291A (en) | 2021-11-03 | 2021-11-03 | Nickel-gold construction process based on electronic product processing |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070104929A1 (en) * | 2005-10-25 | 2007-05-10 | Samsung Electro-Mechanics Co., Ltd. | Method for plating printed circuit board and printed circuit board manufactured therefrom |
| CN104419916A (en) * | 2013-08-26 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Manufacturing method of chemical nickel palladium gold plating plated with thick palladium |
| CN106987829A (en) * | 2017-04-11 | 2017-07-28 | 深圳市创智成功科技有限公司 | Apply the chemical nickel formula in the chemical NiPdAu coating of FPC |
| CN106987830A (en) * | 2017-04-11 | 2017-07-28 | 深圳市创智成功科技有限公司 | Aluminium base printed wiring board chemistry NiPdAu technique |
| CN110468394A (en) * | 2019-08-02 | 2019-11-19 | 长沙理工大学 | A kind of silver-based wiring board of chemical nickel plating porpezite and preparation method thereof |
| CN110565133A (en) * | 2019-08-27 | 2019-12-13 | 东莞康源电子有限公司 | method for manufacturing low-roughness electroplated nickel and gold |
| CN112981379A (en) * | 2020-10-21 | 2021-06-18 | 东莞小禹科技有限公司 | Plastic part processing method |
-
2021
- 2021-11-03 CN CN202111293634.7A patent/CN113993291A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070104929A1 (en) * | 2005-10-25 | 2007-05-10 | Samsung Electro-Mechanics Co., Ltd. | Method for plating printed circuit board and printed circuit board manufactured therefrom |
| CN104419916A (en) * | 2013-08-26 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Manufacturing method of chemical nickel palladium gold plating plated with thick palladium |
| CN106987829A (en) * | 2017-04-11 | 2017-07-28 | 深圳市创智成功科技有限公司 | Apply the chemical nickel formula in the chemical NiPdAu coating of FPC |
| CN106987830A (en) * | 2017-04-11 | 2017-07-28 | 深圳市创智成功科技有限公司 | Aluminium base printed wiring board chemistry NiPdAu technique |
| CN110468394A (en) * | 2019-08-02 | 2019-11-19 | 长沙理工大学 | A kind of silver-based wiring board of chemical nickel plating porpezite and preparation method thereof |
| CN110565133A (en) * | 2019-08-27 | 2019-12-13 | 东莞康源电子有限公司 | method for manufacturing low-roughness electroplated nickel and gold |
| CN112981379A (en) * | 2020-10-21 | 2021-06-18 | 东莞小禹科技有限公司 | Plastic part processing method |
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