CN116945494A - Plastic packaging material filling structure for chip plastic packaging device - Google Patents
Plastic packaging material filling structure for chip plastic packaging device Download PDFInfo
- Publication number
- CN116945494A CN116945494A CN202310992296.9A CN202310992296A CN116945494A CN 116945494 A CN116945494 A CN 116945494A CN 202310992296 A CN202310992296 A CN 202310992296A CN 116945494 A CN116945494 A CN 116945494A
- Authority
- CN
- China
- Prior art keywords
- injection molding
- hole
- mold
- plastic packaging
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 51
- 229920003023 plastic Polymers 0.000 title claims abstract description 51
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 27
- 239000005022 packaging material Substances 0.000 title claims abstract description 15
- 238000001746 injection moulding Methods 0.000 claims abstract description 60
- 238000003825 pressing Methods 0.000 claims abstract description 58
- 238000000465 moulding Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 10
- 238000005266 casting Methods 0.000 claims description 6
- 238000005267 amalgamation Methods 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 210000002445 nipple Anatomy 0.000 claims 1
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
Abstract
The application discloses a plastic packaging material filling structure for a chip plastic packaging device, which comprises a pressing plate piece, a mold and an injection molding head, wherein the mold is connected with the pressing plate piece in a matched manner, the injection molding head is arranged above the pressing plate piece, the mold comprises an upper mold and a lower mold, corresponding grooves are formed in the mutually-spliced positions of the upper mold and the lower mold, a cavity is formed after the two corresponding grooves are spliced, a second through hole is vertically formed in the upper mold, grooves are further formed in the upper mold and positioned on two sides of the second through hole, a pressing piece vertically slides in the grooves, a hole is formed in the center of the pressing piece, and cutter heads are fixed on the two sides of the pressing piece, which are close to the cavity. According to the application, when the injection molding head is downwards spliced with the mold for injection molding, the pressing piece can be automatically pressed down, so that the cutter head firstly cuts the chips in a row and then blocks the connection of the two cavities, the two chips cannot be connected during injection molding, and waste materials are not required to be sheared in the later period.
Description
Technical Field
The application relates to the technical field of chip plastic packaging, in particular to a plastic packaging material filling structure for a chip plastic packaging device.
Background
A chip plastic packaging machine is an apparatus for packaging chips. It is mainly used for mounting chips in plastic packages to protect the chips from external physical and environmental influences. Chip plastic packaging machines are generally composed of several main parts: and (3) plastic packaging mould: for securing the chip and forming a plastic package. A heating system: for melting the plastic and filling it into the mold. Pressure system: for applying pressure, ensures that the plastic encapsulating material fills sufficiently into the mould and ensures the encapsulation quality. And (3) a control system: for controlling the temperature and pressure of the heating and pressure system to ensure a proper encapsulation process. In the chip plastic packaging process, the chip is firstly placed in a plastic packaging mould, and the chip is ensured to be positioned correctly. The heating system then heats the plastic encapsulating material to a suitable temperature to melt it. Once the plastic material is melted, the pressure system applies pressure to fill the melted plastic material into the mold while compacting the material to ensure that the chip is fully encapsulated. Finally, after waiting for the plastic material to cool and solidify, the mold can be opened and the packaged chip can be removed.
And the filling of the plastic packaging material is an important step in the chip plastic packaging process, and is used for filling the melted plastic packaging material into a chip packaging mold so as to form a complete package.
The following is a general molding compound filling step:
preparation: first, a molding compound and a die for chip packaging need to be prepared. The molding compound may be in the form of a sheet, pellet, or powder, and may need to be pre-melted or heated to an appropriate temperature depending on the material requirements. The encapsulation mold should be cleaned and inspected to ensure that there are no impurities and damage.
And (3) die installation: the packaging mold is installed in the chip packaging equipment, so that good sealing and positioning are ensured.
Filling plastic packaging materials: and filling the prepared molten plastic packaging material into a chip packaging mold in an injection or spraying mode. The filling amount and position need to be controlled according to the design and packaging requirements of the mould. Typically, the loading is sufficient to allow the molding compound to completely cover the die and fill the cavity of the mold. Care is taken to avoid the creation of bubbles or impurities.
Compression: the pressure system applies a certain pressure to compact the molding compound and ensure that it fills the void around the chip sufficiently. The pressure and the duration time are required to be adjusted according to the characteristics of the plastic package material and the equipment requirements.
Cooling and solidifying: after the plastic package material is fully filled and compacted, the plastic package material is rapidly cooled and solidified by controlling the temperature or other cooling methods. The cooling time is required to be adjusted according to the characteristics of the plastic packaging material and the packaging requirement.
The existing filler structure is simple to realize and has no other functions through injection molding or spraying, and when the chips in the continuous rows are simultaneously subjected to plastic packaging, the injection molding opening is usually arranged at the center of the die so as to be in plastic packaging with the chips in the continuous rows, but after injection molding is finished, waste materials among the chips in the continuous rows are also required to be cut off.
Disclosure of Invention
The application aims to solve the problems that the existing filling structure is simply realized through injection molding or spraying and has no other functions, when the chips in the continuous rows are simultaneously subjected to plastic packaging, the injection molding opening is usually arranged at the center part of a mold so as to carry out injection molding and plastic packaging on the chips in the continuous rows, but after injection molding is finished, waste materials among the chips in the continuous rows subjected to injection molding are also required to be cut off, and the filling structure of the plastic packaging material for the chip plastic packaging device is provided.
The aim of the application can be achieved by the following technical scheme:
the utility model provides a plastic packaging material filling structure for chip plastic packaging device, includes clamp plate spare, mould and injection molding head, the mould is connected with the clamp plate spare cooperation, the injection molding head sets up the clamp plate spare top, the mould includes mould and bed die, go up the mould with the recess that corresponds has all been seted up to the mutual amalgamation department of bed die, two correspond form the cavity after the amalgamation between the recess, go up the mould and go up the vertical second through-hole that has seted up, it still sets up the groove to lie in the second through-hole both sides to go up the mould, the vertical slip in groove has the casting die down, casting die center department has seted up the hole, casting die both sides are close to cavity department is fixed with the tool bit, the head end of moulding plastics is formed with convex protruding head, the head accessible of moulding plastics the second through-hole inserts in the last mould, protruding head insertible in the hole.
As a further scheme of the application: the injection molding head is internally provided with a cavity, and an outlet communicated with the cavity is formed in the inner wall of the injection molding head.
As a further scheme of the application: an injection molding channel is arranged in the upper die, one end of the injection molding channel is communicated with the second through hole, the other end of the injection molding channel is communicated with the groove, and a feeding hole of the injection molding channel is spliced with a discharging hole of the outlet.
As a further scheme of the application: the outer diameter of the injection molding head is larger than the inner diameter of the hole.
As a further scheme of the application: the lower die is internally provided with an opening below the lower pressing piece, an elastic piece is arranged between the lower pressing pieces in the groove, and the elastic piece can drive the lower pressing piece to rebound and reset.
As a further scheme of the application: the pressing plate piece is provided with a first through hole.
The application has the beneficial effects that: according to the application, when the injection molding head is downwards spliced with the mold for injection molding, the pressing piece can be automatically pressed down, so that the cutter head firstly cuts the chips in a row and then blocks the connection of the two cavities, the two chips cannot be connected during injection molding, and waste materials are not required to be sheared in the later period.
Drawings
The application is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of the structure of the present application;
FIG. 2 is a schematic view of the upper die structure of the present application;
FIG. 3 is a schematic view of the structure of the hold-down member of the present application;
FIG. 4 is a chip placement position in accordance with the present application;
fig. 5 is a schematic view of the location of the elastic member in the present application.
In the figure: 101. an upper press plate; 1011. a first through hole; 102. a lower pressing plate; 2. an upper die; 201. a second through hole; 202. a groove; 204. a first groove; 205. an injection molding channel; 3. a lower die; 301. an opening; 302. a second groove; 4. a pressing piece; 401. a hole; 402. a cutter head; 5. a chip; 6. an injection molding head; 601. a cavity; 602. an outlet; 603. a raised head.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1-3, the application discloses a filling structure of plastic packaging material for a chip plastic packaging device, which comprises a pressing plate, a mold and an injection molding head 6, wherein the mold is connected with the pressing plate in a matched manner, the injection molding head 6 is arranged above the pressing plate, the pressing plate comprises an upper pressing plate 101 and a lower pressing plate 102, the mold comprises an upper mold 2 and a lower mold 3, the upper mold 2 is matched with the upper pressing plate 101, the lower mold 3 is matched with the lower pressing plate 102, corresponding grooves are respectively formed at the mutually-spliced positions of the upper mold 2 and the lower mold 3, the grooves are respectively a first groove 204 and a second groove 302, a cavity is formed between the two corresponding grooves after being spliced, a second through hole 201 is vertically formed in the upper mold 2, grooves 202 are further formed at two sides of the second through hole 201 and are communicated with the grooves 202, a lower pressing member 4 vertically slides in the grooves 202, a hole 401 is formed in the center of the lower pressing member 4, two sides of the lower pressing member 4 are close to the cavity, a cutter head 402 is fixed, and the cutter head 402 can be inserted into the second through hole 603, and the end part of the injection molding head can be inserted into the second through the first through hole 603.
In a second embodiment, please refer to fig. 1-4, the application discloses a plastic packaging material filling structure for a chip plastic packaging device, which comprises a pressing plate, a mold and an injection molding head 6, wherein the mold is connected with the pressing plate in a matched manner, the injection molding head 6 is arranged above the pressing plate, the pressing plate comprises an upper pressing plate 101 and a lower pressing plate 102, the mold comprises an upper mold 2 and a lower mold 3, the upper mold 2 is matched with the upper pressing plate 101, the lower mold 3 is matched with the lower pressing plate 102, grooves are respectively formed at the mutually spliced positions of the upper mold 2 and the lower mold 3, the grooves are respectively a first groove 204 and a second groove 302, a cavity is formed between the two corresponding grooves after being spliced, a second through hole 201 is vertically formed in the upper mold 2, grooves 202 are also formed at two sides of the second through hole 201, a lower pressing member 4 is vertically slid in the groove 202, a hole 401 is formed in the center of the lower pressing member 4, two sides of the lower pressing member 4 are matched with the lower pressing plate 102, the two sides of the lower pressing member 4 are close to the cavity 205, a tool bit 205 is fixed at the position, the inner diameter of the tool bit 205 is inserted into the cavity 602 through the inner diameter of the injection molding head 6, the cavity 602 is formed at the end portion of the injection molding head 2, the injection molding head is inserted into the cavity 602, the cavity 602 is formed at the end portion of the injection molding head 602, the injection molding head is inserted into the cavity 602, the cavity 602 is formed at the end portion of the cavity 602, the cavity 602 is formed by the end 602, and the end of the injection molding head 602 is inserted into the cavity 602, and the cavity is filled into the cavity 602 through the cavity 602, and finally flows into the cavity to mold the chip 5.
Referring to fig. 1-4, the application provides a filling structure of molding compound for a chip molding device, comprising a pressing plate, a mold and an injection molding head 6, wherein the mold is connected with the pressing plate in a matching manner, the injection molding head 6 is arranged above the pressing plate, the pressing plate comprises an upper pressing plate 101 and a lower pressing plate 102, the mold comprises an upper mold 2 and a lower mold 3, the upper mold 2 is matched with the upper pressing plate 101, the lower mold 3 is matched with the lower pressing plate 102, corresponding grooves are respectively formed at the mutually-spliced positions of the upper mold 2 and the lower mold 3, the grooves are respectively a first groove 204 and a second groove 302, a cavity is formed after the two corresponding grooves are spliced, a second through hole 201 is vertically formed in the upper mold 2, grooves 202 are further formed at two sides of the second through hole 201 in the upper mold 2, the second through hole 201 is communicated with the grooves 202, the inside of the groove 202 is vertically slid with a lower pressing piece 4, the shape of the lower pressing piece 4 is H-shaped, a hole 401 is formed in the center of the lower pressing piece 4, a cutter head 402 is fixed at two sides of the lower pressing piece 4 near the cavity, the cutter head 402 is vertically fixed, a convex head 603 is formed at the end part of the injection molding head 6, the injection molding head 6 can be inserted into the upper die 2 through the second through hole 201, the convex head 603 can be inserted into the hole 401, the outer diameter of the injection molding head 6 is larger than the inner diameter of the hole 401, a cavity 601 is formed in the injection molding head 6, an outlet 602 communicated with the cavity 601 is formed at the inner wall of the injection molding head 6, an injection molding channel 205 is formed in the upper die 2, one end of the injection molding channel 205 is communicated with the second through hole 201, the other end of the injection molding channel 205 is communicated with the groove, a feeding hole of the injection molding channel 205 is spliced with a discharging hole of the outlet 602, the molding compound will enter the injection molding channel 205 through the outlet 602 from the cavity 601 and finally flow into the cavity to mold the chip 5.
Referring to fig. 5, an opening 301 is formed in the lower mold 3 below the pressing member 4, an elastic member, which may be a spring or an elastic article with rebound ability, is disposed between the pressing members 4 in the groove 202, the elastic member may drive the pressing member 4 to rebound and reset, and a first through hole 1011 is formed in the pressing member.
The foregoing describes one embodiment of the present application in detail, but the description is only a preferred embodiment of the present application and should not be construed as limiting the scope of the application. All such equivalent changes and modifications as come within the scope of the following claims are intended to be embraced therein.
Claims (6)
1. The utility model provides a plastic packaging material filling structure for chip plastic packaging device, includes clamp plate spare, mould and injection molding head (6), the mould is connected with the clamp plate spare cooperation, injection molding head (6) set up clamp plate spare top, the mould includes mould (2) and bed die (3), go up mould (2) with mould (3) each other amalgamation department has all seted up corresponding recess, two correspondence form the cavity after the amalgamation between the recess, a serial communication port, second through-hole (201) has been seted up on last mould (2), be located in last mould (2) second through-hole (201) both sides have still seted up groove (202), vertical slip has under casting die (4) in groove (202), under casting die (4) center department has seted up hole (401), under casting die (4) both sides are close to cavity department is fixed with tool bit (402), injection molding head (6) tip is formed with convex protruding nipple (603), injection molding head (6) accessible second through-hole (201) insert in mould (201) in can inserting in the hole (401).
2. The filling structure of the molding compound for the chip molding device according to claim 1, wherein a cavity (601) is formed inside the injection molding head (6), and an outlet (602) communicated with the cavity (601) is formed at the inner wall of the injection molding head (6).
3. The filling structure of the plastic packaging material for the chip plastic packaging device according to claim 2, wherein an injection molding channel (205) is formed in the upper die (2), one end of the injection molding channel (205) is communicated with the second through hole (201), the other end of the injection molding channel is communicated with the groove, and a feeding hole of the injection molding channel (205) is spliced with a discharging hole of the outlet (602).
4. A molding compound filling structure for a chip molding device according to claim 2 or 3, wherein the outer diameter of the injection head (6) is larger than the inner diameter of the hole (401).
5. The filling structure of plastic package material for a chip plastic package device according to any one of claims 1 or 4, wherein an opening (301) is formed in the lower die (3) and located below the lower pressing piece (4), an elastic piece is arranged between the lower pressing pieces (4) and located in the groove (202), and the elastic piece can drive the lower pressing pieces (4) to rebound and reset.
6. The filling structure of molding compound for a chip molding device according to claim 5, wherein the platen member is provided with a first through hole (1011).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310992296.9A CN116945494A (en) | 2023-08-08 | 2023-08-08 | Plastic packaging material filling structure for chip plastic packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310992296.9A CN116945494A (en) | 2023-08-08 | 2023-08-08 | Plastic packaging material filling structure for chip plastic packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116945494A true CN116945494A (en) | 2023-10-27 |
Family
ID=88451191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310992296.9A Pending CN116945494A (en) | 2023-08-08 | 2023-08-08 | Plastic packaging material filling structure for chip plastic packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116945494A (en) |
-
2023
- 2023-08-08 CN CN202310992296.9A patent/CN116945494A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100373567C (en) | Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device and resin material | |
| EP0787569B1 (en) | Method of producing epoxy resin-encapsulated semiconductor device | |
| JP5054923B2 (en) | Resin sealing molding method for electronic parts | |
| US20130140737A1 (en) | Stacked substrate molding | |
| CN201247780Y (en) | LED and encapsulation device thereof | |
| CN116945494A (en) | Plastic packaging material filling structure for chip plastic packaging device | |
| CN202241834U (en) | IC (integrated circuit) plastic packaging mold with low mold injection speed and high holding pressure | |
| JP2003324118A (en) | Method for molding electronic part by resin sealing and metal mold | |
| WO2009048330A1 (en) | Method and device for encapsulating electronic components with portioned liquid encapsulating material | |
| JP2694293B2 (en) | High compression molding resin tablet molding method | |
| JPH11176854A (en) | Molding machine for synthetic resin package in electronic component | |
| JP2666630B2 (en) | Method for manufacturing semiconductor device | |
| JP2518661B2 (en) | Method and apparatus for resin encapsulation molding of semiconductor element | |
| CN217373175U (en) | Injection mold for cushion bottom plate embedded bolt | |
| JP2690662B2 (en) | Mold for semiconductor device sealing | |
| JP2992982B2 (en) | Mold device for molding resin-sealed parts of electronic components | |
| CN102347248B (en) | IC (integrated circuit) plastic package process with low-speed injection molding and high pressure | |
| CN213107824U (en) | Injection molding device convenient for discharging and used for producing azimuth base | |
| JP3795684B2 (en) | Resin sealing molding method for electronic parts | |
| JPH1140592A (en) | Seal molding method and its equipment | |
| JP3543742B2 (en) | Resin sealing molding equipment | |
| JPH10116847A (en) | Method of manufacturing semiconductor device and trasfer molding machine | |
| JP2587539B2 (en) | Mold for resin sealing of semiconductor device | |
| KR200335045Y1 (en) | Press or Injetion Molding Apparatus for Complex Synthetic Mineral Resin Material | |
| JPH0242651B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |