CN116922098A

CN116922098A - Production method for welding parallel-wire inserting sheets

Info

Publication number: CN116922098A
Application number: CN202310698012.5A
Authority: CN
Inventors: 隋中華
Original assignee: Thinking Yichang Electronic Co ltd
Current assignee: Thinking Yichang Electronic Co ltd
Priority date: 2021-12-29
Filing date: 2021-12-29
Publication date: 2023-10-24
Also published as: CN114310332B; CN114310332A

Abstract

A doubling insert welding production method comprises the steps of fixing double doubling wires by adopting a conveyor belt and an adhesive tape, conveying the double doubling wires forwards, and shearing the tail parts of wires by adopting a first shearing mechanism; the head of the wire rod can be sheared by adopting the second shearing mechanism, the double-doubling wire is tightly pressed between the adhesive tape and the conveyor belt by the pressing mechanism in the shearing process, and then the fixation is completed by utilizing the adhesive force of the adhesive tape; the double-doubling bonding tape is combined with the tin liquid tank or the soldering flux tank, and the size of the tin liquid tank or the soldering flux tank is changed, so that double-doubling tin dipping liquid or soldering flux can be carried out in batches at one time; the wire harness of the wire end can be clamped and closed through the wire end closing mechanism; the wire upper and lower wire bundles are clamped to the chip through the left and right pushing mechanisms. The parallel wire inserting sheet welding production method provided by the application can simplify the production process.

Description

Production method for welding parallel-wire inserting sheets

Technical Field

The application relates to a temperature sensor, in particular to a parallel wire inserting sheet welding production method.

Background

The existing temperature sensor production process generally comprises wire cutting, tin dipping, chip clamping, welding, heating and the like. The existing production line has the following defects: 1) The cut wires are placed on a transfer jig or a belt with grooves, and the wires are repeatedly sheared before welding chips due to equipment vibration and other reasons, so that the lengths of all the wires are consistent, and the wires are wasted in the mode; 2) After the wire is sheared, the wire is generally clamped by the clamps, the clamps are arranged on the turntable in a plurality of groups, each group of clamps is required to complete the actions such as clamping, stretching, overturning and the like, the structure is complex, the precision requirement on the clamps is high, and the repeated action failure rate of the clamps is greatly increased; 3) And one group of clamps can only clamp one group of wires at a time, so that the operation efficiency is low. 4) The existing wire rods are scattered after being welded with the chips, and need to be cleaned one by one manually and operated manually, so that the efficiency is low, and the accuracy of the sensor is greatly reduced due to damage in the circulation process.

The ' line arranging tool and line arranging process for welding the wires of the ' 201610542559.6 patent ' require that the wires in the process are firstly transferred from a bottom plate to an adhesive tape and then transferred from the adhesive tape to a paper tape for welding. The wires in the device are dispersed, and due to shaking of conveying equipment, the wires can be aligned before the adhesive tape is adhered by the aid of the front-stage shearing for many times. The bottom plate, the adhesive tape and the paper tape are all in strip-shaped structures with limited lengths, so that the equipment works continuously, and the bottom plate, such as a movable jig, needs to be conveyed by a chain or other modes and needs to be repeatedly lowered in the early stage; the adhesive tape and the paper tape need to be continuously sheared by a shearing mechanism; in addition, the base plate, the adhesive tape, the paper tape and the like are inconvenient to directly reverse, and the chip is difficult to clamp in the middle.

Disclosure of Invention

The application aims to solve the technical problem of providing a parallel wire inserting sheet welding production method which can simplify the equipment structure, simplify the production process and improve the product precision and quality.

In order to solve the technical problems, the application adopts the following technical scheme:

a production method for welding parallel wires with inserting sheets comprises the following steps:

step 1), driving the wheel group to drive the double-doubling adhesive tape to forward and stop moving after a fixed distance, and driving the double-doubling adhesive tape to forward move for a certain distance by the wire clamping and conveying mechanism, so that the double-doubling adhesive tape passes through the positioning groove and stretches out for a certain length. And then the first base of the second shearing mechanism is closed towards the positioning groove, and after the second shearing mechanism is in place, the double parallel wires pass through the space between the second pressing block and the first base, and the double parallel wire ends extend out of the upper slice and the lower slice. The second pneumatic clamping jaw of the second shearing mechanism is closed to finish shearing. Subsequently, the second shear mechanism releases the back reset. At this time, the double doubling wires still extend out of the positioning groove for a certain length;

step 2), the wire clamping and conveying mechanism drives the double-doubling wire to move backwards for a certain distance, so that the end head of the double-doubling wire is aligned with one side of the conveying belt; then, the pressing mechanism moves downwards to press the adhesive tape at the pressing mechanism on the conveyor belt; when in compression, the first shearing mechanism shears; then the compressing mechanism and the first shearing mechanism are reset in sequence; the first pneumatic clamping jaw of the wire rod clamping and conveying mechanism is opened, and the second cylinder of the wire rod clamping and conveying mechanism extends out and returns to the rear. The driving wheel set continuously drives the double-parallel bonding belt to forward and stop moving after a fixed distance, and then the next shearing is carried out;

step 3), when the double-doubling adhesive tape moves to the peeling mechanism to be in position, the sixth air cylinder stretches out to enable the pressing plate to press the middle part of the double-doubling, at the moment, the peeling blade is inserted into the rubber skin of the double-doubling, then the seventh air cylinder stretches out, the peeling blade moves backwards to peel the rubber skin outwards, and the wire harness in the double-doubling is exposed to one section; when the double-doubling adhesive tape continues to move to the wire tail trimming mechanism, the eighth cylinder stretches out, the trimming blade moves downwards, and the trimming Ji Daopian cuts off a certain position of the double-doubling wire harness, so that the tail of the double-doubling wire harness on the subsequent double-doubling adhesive tape is exposed out of the wire harness, and the tail ends of all the double-doubling wire harnesses are kept flush;

step 4), carrying double doubling by the double doubling adhesive tape, clamping and forward conveying through a wheel assembly, and changing direction through a reversing wheel assembly, wherein the double doubling is changed from a horizontal state to a vertical state. Then, through the soldering flux groove, the soldering flux is adhered; then through the tin liquid tank, the tin liquid tank is scraped by the scraper, and then jacked up by the ninth cylinder, and when the double-doubling adhesive tape passes through the tin liquid tank, the double-doubling adhesive tape is adhered with the tin liquid. The tin dipping part mainly fixes wires in two double-wire-combined wire harnesses respectively;

step 5), when the double-doubling adhesive tape horizontally passes through the wire end closing mechanism, the fourth air cylinder contracts, the leveling block of the leveling assembly is pressed down, the wire bundles of the double-doubling wire can be leveled, and then the wire bundles reach the positioning block. At the moment, the first air cylinder stretches out, so that the end head of the double-parallel wire penetrates through the positioning block and is opposite to the clamping plate of the first pneumatic clamping jaw. The first pneumatic clamping jaw acts to clamp the wire harness ends of the double doubling, so that the wire harness ends of the double doubling are bent, deformed and mutually closed. The pneumatic clamping jaw is then released and the cylinder is retracted. When the wire rod end closing mechanism continues to move forwards, the flattening block positioned on the right side of the wire rod end closing mechanism through the flattening component is flattened again, and then the wire rod end closing mechanism continues to convey;

step 6), when the double-doubling adhesive tape vertically passes through the chip feeding mechanism, the second cylinder contracts, so that the sliding bottom plate approaches the double-doubling adhesive tape; after in place, the wire harness ends of the double-doubling wire are put into the slots. At the moment, the left clamping plate and the right clamping plate clamp the chip and are positioned at the left side of the double-parallel line, and the lower end face of the chip is contacted with the upper end face of the supporting plate;

step 7), then the left pushing mechanism pushes the mounting seat to move rightwards; because the front end of the right clamping plate is a tip, the right clamping plate passes through the interval between the upper and lower wire harnesses of the double doubling and enters the interval between the upper and lower wire harnesses of the double doubling. After the chip is continuously moved to the right to be in place, when the chip is positioned between the upper and lower wire harnesses of the double-doubling wire, the left clamping plate and the right clamping plate loosen the chip, and the upper and lower wire harnesses of the double-doubling wire can clamp the chip through bending force due to bending deformation of the wire harness ends of the double-doubling wire. After the double-doubling adhesive tape continuously moves downwards for a small distance, the other pneumatic clamping jaw stretches out to clamp the chip and the double-doubling again, and then the chip and the double-doubling adhesive tape are loosened and retreated, so that falling in the subsequent conveying process is avoided, and reliability in later welding is ensured;

step 8), the second cylinder stretches out to enable the sliding bottom plate to be far away from the double-doubling adhesive tape;

step 9) the mount is then pushed to the left into position by the push mechanism on the right, with the left clamp plate and the right clamp plate on the left side of the slot. The manipulator clamps the chip that the vibration dish shifted out the access port and places on the layer board between left splint, right splint, no. three cylinder shrink, left splint, right splint are close to and press from both sides the chip. The state is restored to the initial state;

step 10), repeating the processes 5) to 9), and repeatedly carrying out feeding clamping of the chip in the intermittent forward conveying process of the double-parallel bonding tape;

step 11), after the chip is clamped, the chip passes through a second group of tin dipping mechanisms again to finish welding;

step 12), guiding the welded double-doubling adhesive tape to form a labyrinth mechanism through a wheel assembly, and washing out the soldering flux through an automatic cleaning device by utilizing ultrasonic waves; then detecting, heating, cutting, and transferring to other working procedures.

The application discloses a production method for welding a parallel wire inserting sheet, which has the following technical effects:

1) The double-doubling wire is fixed and conveyed forwards by adopting the conveyor belt and the adhesive tape, the adhesive fixation and the wire shearing are carried out simultaneously, and the glued wire cannot move relatively, so that multiple cutting is not needed in the later stage, and the wire waste is reduced.

2) And the double parallel wires are fixed and conveyed forwards by adopting the conveyor belt and the adhesive tape, so that the wire is not required to be clamped by the clamp, the structure is simpler, and the failure rate is greatly reduced.

3) The double-doubling adhesive tape is in a strip shape, and compared with the existing double-doubling adhesive tape which is in a loose shape and needs to be cleaned manually one by one and operated manually, the double-doubling adhesive tape can be coiled, is convenient to circulate and automatically operate, and reduces damage to a sensor caused by excessive manual intervention in the circulation process.

4) Through set up the through-hole on the conveyer belt, can avoid the conveyer belt to take place the skew like this, can also make the conveyer belt change the horizontality from vertical state simultaneously, change the horizontality into vertical state from the horizontality, the installation of station equipment such as convenient shearing like this, tin pick up, chip clamp, and partial station can carry out batch operation, simple high-efficient.

5) The double-doubling is adopted as a wire raw material, and because the double-doubling is formed by wrapping the rubber sleeve outside the two wire harnesses, the two wire harnesses are connected into a whole through the rubber sleeve, so that two cut wires are not required to be combined in the earlier stage, alignment is not required, secondary cutting is not required, and the working procedure is saved.

6) The tail of the wire rod can be sheared by adopting a first shearing mechanism; the head of the wire rod can be sheared by the second shearing mechanism, the double doubling is tightly pressed between the adhesive tape and the conveyor belt through the pressing mechanism in the shearing process, and then the fixation is completed by using the adhesive force of the adhesive tape, so that the double doubling adhesive tape is connected and fixed while shearing, the position change of the double doubling caused by equipment vibration in the later period is prevented, and the position precision of the double doubling is ensured to be reliable.

7) The double-doubling bonding tape is combined with the tin liquid tank or the scaling powder tank, and the size of the tin liquid tank or the scaling powder tank is changed, so that double-doubling tin dipping liquid or scaling powder can be dipped in batches at one time, the efficiency is improved, the clamp operation is not needed, and the method is simple and quick.

8) The wire harness of the wire end can be clamped and closed through the wire end closing mechanism, and the wire harness is pressed through the pressing blocks before and after being clamped and closed, so that the wire harness is kept flat, and the chip insertion in the later stage is facilitated; the left clamping plate and the right clamping plate can move back and forth through the arrangement of the second telescopic cylinder, the chip is driven to approach or depart from the double-doubling adhesive tape, the left clamping plate and the right clamping plate can move left and right through the left and right pushing mechanism, the chip is driven to pass through the space between the upper wire harness and the lower wire harness, and therefore the upper wire harness and the lower wire harness clamp the chip; compared with the prior structure, the mechanism greatly saves the operation procedure of clamping the chip, and compared with other structures, the mechanism has the advantages of simpler assembly and installation, lower cost and low failure rate; the corresponding functional parts are driven to act through the air cylinder, so that the action precision is high, personnel monitoring is not needed, the labor cost is reduced, and the product qualification rate is higher.

Drawings

The application is further illustrated by the following examples in conjunction with the accompanying drawings:

fig. 1 is a front view of a parallel wire conveyor mechanism in accordance with the present application.

Fig. 2 is a schematic structural view of a punching mechanism in the present application.

Fig. 3 is a front cross-sectional view of the punching mechanism of the present application.

Fig. 4 is a schematic structural view of a driving wheel set in the present application.

Fig. 5 is a schematic view of a partial structure of a guide wheel set according to the present application.

FIG. 6 is a schematic view of the structure of the elastic pressing plate in the present application.

Fig. 7 is a front view (not attached) of a double-sided adhesive tape of the present application.

Fig. 8 is a front view (attachment) of a double-sided adhesive tape according to the present application.

Fig. 9 is a top view of a double-sided adhesive tape according to the present application.

Fig. 10 is a schematic structural view of a shearing mechanism in the present application.

Fig. 11 is a schematic structural view of a shearing mechanism in the present application.

Fig. 12 is a schematic structural view of the wire clamping and conveying mechanism of the present application.

Fig. 13 is a schematic structural view of a first shearing mechanism in the present application.

Fig. 14 is a schematic structural view of a pressing mechanism in the present application.

Fig. 15 is a schematic structural view of a second shearing mechanism in the present application.

Fig. 16 is a schematic structural view of a second shearing mechanism in the present application.

Fig. 17 is a schematic view showing a partial structure of the second shearing mechanism in the present application.

Fig. 18 is a mounting arrangement of the peeling mechanism in the present application.

Fig. 19 is a schematic view of the peeling mechanism in the present application.

Fig. 20 is a schematic view of the peeling mechanism according to the present application.

Fig. 21 is a view showing the installation and arrangement of the tin pick-up mechanism in the present application.

Fig. 22 is a schematic structural view of a tin pick-up mechanism according to the present application.

Fig. 23 is a schematic structural view of a tin pick-up mechanism in the present application.

Fig. 24 is a schematic structural view of a flux dipping mechanism in the present application.

Fig. 25 is a schematic structural view of a chip clamping mechanism in the present application.

Fig. 26 is a schematic view of the wire end closure mechanism of the present application.

Fig. 27 is a schematic view of the wire end closure mechanism of the present application.

Fig. 28 is a schematic structural diagram of a chip feeding mechanism in the present application.

Fig. 29 is a schematic view of a partial structure of a chip feeding mechanism according to the present application.

Fig. 30 is a front view of the chip clamping mechanism according to the present application.

Fig. 31 is a top view showing an operation state of the chip clamping mechanism in the present application.

FIG. 32 is a schematic diagram showing a variation of the dual parallel wires of the chip clamping mechanism of the present application.

Detailed Description

A parallel wire inserting sheet welding production line comprises a parallel wire conveying mechanism 1, a shearing mechanism 2, a tin dipping mechanism 3 and a chip clamping mechanism 4.

As shown in fig. 1 and 7-9, the parallel wire conveying mechanism 1 comprises a conveyor belt 1.1 and an adhesive tape 1.2. The conveyer belt 1.1 is the kraft paper tape, and the kraft paper tape is drawn forth through the kraft paper tape reel, installs punching mechanism 1.3 in kraft paper tape reel one side, and punching mechanism 1.3 is used for punching to the kraft paper tape, makes things convenient for the later stage to convey spacingly, or commutates, avoids the kraft paper tape to take place the skew. And a support is arranged at the position of the shearing mechanism 2 corresponding to the right side of the punching mechanism 1.3, a tape disc is placed on the support, two adhesive tapes 1.2 are led out from the tape disc, the outer sides of the two adhesive tapes 1.2 are respectively aligned with the outer sides of the conveyor belt 1.1, and the tail ends and the middle parts of the double doubling 1.4 are adhered to kraft paper tapes. One side of the adhesive tape 1.2 is a smooth surface, and the other side is an adhesive surface, and the adhesive tape can be adhered on the kraft paper tape through the adhesive surface. On a platform at the shearing mechanism 2, the double doubling 1.4 can fall on kraft paper after being sheared, and the conveyor belt 1.1, the double doubling 1.4 and the adhesive tape 1.2 can be adhered and fixed by extruding the adhesive tape 1.2 through corresponding mechanisms.

As shown in fig. 1 and 6, an elastic pressing plate 1.18 is arranged above the rear half section of the platform at the shearing mechanism 2, and the elastic pressing plate 1.18 can properly press the double-parallel bonding belt to ensure reliable bonding. And the right side of the shearing mechanism 2 is provided with a wheel assembly 1.5, and the wheel assembly 1.5 conveys the double-doubling adhesive tape.

As shown in fig. 2-3, the punching mechanism 1.3 includes a punching support 1.6, a first cylinder 1.7 is installed on a horizontal plate at the upper end of the punching support 1.6, the first cylinder 1.7 is connected with a punching upper die 1.8, a plurality of punching rods 1.9 are arranged on the punching upper die 1.8, and the punching rods 1.9 are arranged at intervals in a row. And a suction chamber 1.11 is arranged on a horizontal plate at the lower end of the punching support 1.6, and the lower end of the suction chamber 1.11 is connected with an exhaust fan through a pipeline. The upper end of the suction chamber 1.11 is connected with a punching lower die 1.10, and a punching hole corresponding to the punch rod 1.9 is arranged on the punching lower die 1.10.

In operation, the conveyor belt 1.1 is conveyed forward and passes between the punching upper die 1.8 and the punching lower die 1.10, the first cylinder 1.7 extends out, the plurality of punching rods 1.9 simultaneously act to punch the conveyor belt 1.1, and then the first cylinder 1.7 retracts. The conveyor belt 1.1 is conveyed forward with holes. The chips left by the perforation are led out through the suction chamber 1.11.

As shown in fig. 4-5, the wheel assembly 1.5 comprises a driving wheel set and a guiding wheel set, the driving wheel set comprises a driving wheel 1.12, and protrusions 1.13 with the same interval and size as those of the punch pins 1.9 are uniformly arranged on the driving wheel 1.12 in the circumferential direction, so that when the conveyor belt 1.1 passes through the driving wheel 1.12, through holes of the conveyor belt 1.1 are in one-to-one correspondence with the protrusions 1.13, and the protrusions 1.13 can pass through the through holes and limit the conveyor belt 1.1. Preferably, the protrusion 1.13 is hemispherical, so that tearing is avoided when the double-sided adhesive tape is detached from the protrusion 1.13. The drive wheel 1.12 is driven by a first motor 1.14; an auxiliary clamping wheel 1.15 is arranged on one side of the driving wheel 1.12, the auxiliary clamping wheel 1.15 is tangential with the driving wheel 1.12, and an annular groove 1.16 is formed in the auxiliary clamping wheel 1.15 at a position corresponding to the bulge 1.13. When the first motor 1.14 is started, the driving wheel 1.12 rotates, and meanwhile, the driving wheel 1.12 drives the auxiliary clamping wheel 1.15 to rotate, so that the double-doubling adhesive tape is also conveyed forwards along with the double-doubling adhesive tape.

As shown in fig. 4-5, the guide wheel structure of the guide wheel set 1.17 is identical to the drive wheel 1.12. A plurality of driving wheel sets and a plurality of guiding wheel sets 1.17 are arranged on the whole production line, wherein the guiding wheels in the guiding wheel sets 1.17 can be arranged up and down alternately, so that a labyrinth structure can be formed, the adhesive tape 1.2 can be repeatedly extruded, and the fixation of double-doubling 1.4 is ensured to be firm. In the later stage, the labyrinth structure can conveniently clean the soldering flux in a smaller space. In addition, the guide wheels in the guide wheel set 1.17 can enable the double-doubling adhesive tape to be arranged horizontally or vertically or longitudinally, so that the installation operation of station equipment such as shearing, tin dipping, chip clamping and the like is convenient, the flexibility is high, and the layout is more compact.

As shown in fig. 10-11, the shearing mechanism 2 comprises a workbench 2.1, a wire clamping and conveying mechanism 2.2 is arranged on the workbench 2.1, and the wire clamping and conveying mechanism 2.2 is used for carrying out fixed-length conveying on the double-doubling 1.4. A first shearing mechanism 2.4 is arranged in front of the wire clamping and conveying mechanism 2.2, and the tail of the double doubling 1.4 extending into the conveyor belt 1.1 is sheared by the first shearing mechanism 2.4, so that one section of double doubling 1.4 on the conveyor belt 1.1 is sheared and separated from the rear end double doubling. The front of the first shearing mechanism 2.4 is provided with a pressing mechanism 2.5, and the pressing mechanism 2.5 is used for extruding downwards, so that the adhesive tape 1.2 is attached to the conveyor belt 1.1 and the double parallel wires 1.4 between the adhesive tape 1.2 and the conveyor belt 1.1 are fixed. The adhesive tape 1.2 and the conveyor belt 1.1 fix the double doubling 1.4 to form a double doubling adhesive tape, the double doubling adhesive tape is clamped by the wheel assembly 1.5, and the double doubling adhesive tape is driven to be conveyed forwards when the wheel assembly 1.5 rolls and rotates. And a positioning groove 2.8 is fixed on one side of the conveyor belt 1.1, the notch of the positioning groove 2.8 is in a horizontal U shape, and the opening is towards the right and is used for supporting and guiding the double-doubling 1.4. And a second shearing mechanism 2.9 is arranged on the other side of the positioning groove 2.8, and the second shearing mechanism 2.9 shears the heads of the double parallel wires 1.4, so that the heads of all the double parallel wires 1.4 are ensured to be consistent.

As shown in fig. 12, the wire clamping and conveying mechanism 2.2 includes a second cylinder 2.10, a piston rod of the second cylinder 2.10 is connected with a first pneumatic clamping jaw 2.11 through a connecting plate, clamping fingers on the upper and lower sides of one end of the first pneumatic clamping jaw 2.11 are connected with a first clamping plate 2.12, the first clamping plate 2.12 clamps or loosens the double-parallel wire 1.4, and the other end of the first pneumatic clamping jaw 2.11 is connected with a guide rod 2.13 in a sliding fit manner. When the double doubling 1.4 is fed forward, the first pneumatic clamping jaw 2.11 clamps the double doubling 1.4 first, and then the second cylinder 2.10 contracts, which in turn moves the double doubling 1.4 forward a certain distance. When the double doubling 1.4 is fed backwards, the first pneumatic clamping jaw 2.11 clamps the double doubling 1.4, after which the second cylinder 2.10 is extended, which in turn moves the double doubling 1.4 backwards a certain distance.

As shown in fig. 13, the first shearing mechanism 2.4 includes a third cylinder 2.14, the lower end of the third cylinder 2.14 is connected with a first sliding plate 2.15, the rear end of the first sliding plate 2.15 is slidably disposed on a first sliding rail 2.16 through a sliding block, and the front end of the first sliding plate 2.15 is fixedly connected with a shearing blade 2.17. When the tail of the double doubling 1.4 is required to be sheared in the later period, the third cylinder 2.14 extends out, and the shearing blade 2.17 cuts off the double doubling 1.4 downwards.

As shown in fig. 14, the pressing mechanism 2.5 includes a fourth cylinder 2.18, the upper end of the fourth cylinder 2.18 is hinged with one end of a lever 2.19, the middle of the lever 2.19 is hinged on a supporting column, and the other end of the lever 2.19 is hinged with a connecting plate 2.20. One side of the connecting plate 2.20 is arranged on the second sliding rail 2.21 in a sliding way, and the bottom end of the connecting plate 2.20 is connected with the first pressing block 2.22. The distance of the first pressing block 2.22 moving up and down is smaller and is about 5 mm. When the adhesive tape 1.2 is required to be pressed down, the fourth cylinder 2.18 extends, the connecting plate 2.20 moves downwards, the first pressing block 2.22 moves downwards, and the adhesive tape 1.2 is pressed on the conveyor belt 1.1.

15-17, the second shearing mechanism 2.9 includes a fifth cylinder 2.23, the fifth cylinder 2.23 drives the first base 2.24 to move back and forth, the second pneumatic clamping jaw 2.25 is installed at the upper rear end of the first base 2.24, the front end of the first base 2.24 is fixed with a wire supporting portion, one side of the wire supporting portion is provided with a sliding rail, and the sliding rail is provided with a second pressing block 2.26 in a sliding manner. The upper and lower clamping fingers on the front end of the corresponding second pneumatic clamping jaw 2.25 are respectively fixed with an upper slice 2.27 and a lower slice 2.28, and the upper slice 2.27 and the lower slice 2.28 are opposite. The front ends of the upper clamping fingers of the second pneumatic clamping jaw 2.25 are additionally connected with a second pressing block 2.26, and the second pressing block 2.26 is opposite to the supporting part at the front end of the first base 2.24. When the upper chip 2.27 moves down, the second briquette 2.26 also moves down synchronously.

When the head of the double-doubling wire 1.4 is required to be sheared, the fifth cylinder 2.23 is contracted, so that the upper slice 2.27 and the lower slice 2.28 approach the positioning groove 2.8, after being in place, the wire rod stretches into the space between the second pressing block 2.26 and the first base 2.24, and the end head of the wire rod penetrates through the upper slice 2.27 and the lower slice 2.28. The second pneumatic clamping jaw 2.25 acts, the upper clamping finger and the lower clamping finger are closed, so that the second pressing block 2.26 and the first base 2.24 can support and clamp wires, and the upper slicing 2.27 and the lower slicing 2.28 finish shearing.

As shown in fig. 18-20, a peeling mechanism 2.3 and a wire tail trimming mechanism 2.6 are sequentially arranged on one side of the shearing mechanism 2, and the peeling mechanism 2.3 is used for peeling the tail of the double-doubling wire 1.4; the wire tail trimming mechanism 2.6 is used for cutting the tail of the double doubling 1.4. Specifically, the peeling mechanism 2.3 comprises a support 2.29, a sixth air cylinder 2.30 is fixed at the upper end of the support 2.29, the output end of the sixth air cylinder 2.30 is connected with a pressing plate 2.31, the lower end of the pressing plate 2.31 is opposite to the double doubling 1.4 and can compress the double doubling 1.4, a seventh air cylinder 2.32 is fixed on the back surface of the pressing plate 2.31, and the seventh air cylinder 2.32 is connected with the peeling blade 2.7 and drives the peeling blade 2.7 to move back and forth through the seventh air cylinder 2.32.

As shown in fig. 19, the wire tail trimming mechanism 2.6 includes an eighth cylinder 2.33, the output end of the eighth cylinder 2.33 drives a second slide plate 2.34 to move up and down, the second slide plate 2.34 is slidably arranged on a slide rail on the back through a slide block, a trimming blade 2.35 is mounted at the front end of the second slide plate 2.34, the trimming blade 2.35 is opposite to the double doubling 1.4, and the double doubling 1.4 can be trimmed.

When the double-doubling adhesive tape is moved into place, the sixth cylinder 2.30 is extended, pressing the platen 2.31 against the middle part of the double-doubling 1.4, at which time the stripping blade 2.7 is inserted onto the rubber skin of the double-doubling 1.4, and then the seventh cylinder 2.32 is extended, the stripping blade 2.7 is moved backwards, stripping the rubber skin outwards, and the wire harness in the double-doubling 1.4 is exposed for a section. When the double-doubling adhesive tape moves to the position of the wire tail trimming mechanism 2.6, the eighth cylinder 2.33 extends out, the cutter Ji Daopian 2.35.35 moves downwards, and the cutter Ji Daopian 2.35.35 cuts off a certain position of the wire harness of the double-doubling 1.4, so that the tail of the double-doubling 1.4 on the subsequent double-doubling adhesive tape is exposed out of the wire harness and the tail ends of all the double-doubling 1.4 wire harnesses are kept flush.

As shown in fig. 21 to 23, the tin pick-up mechanism 3 includes a tin bath 3.6, and the tin bath 3.6 is filled with tin liquid. The lower end of the tin bath 3.6 is driven to lift by a ninth air cylinder 3.7 on a bracket (not shown); a tenth air cylinder 3.8 is fixed on one side of the tin bath 3.6, the tenth air cylinder 3.8 drives a second connecting plate 3.9 to move back and forth, an eleventh air cylinder 3.10 is arranged on the second connecting plate 3.9, and the eleventh air cylinder 3.10 drives a scraping plate 3.11 to move up and down.

Before tin dipping is needed, the eleventh air cylinder 3.10 drives the scraping plate 3.11 to lift upwards, and then the tenth air cylinder 3.8 drives the second connecting plate 3.9, the eleventh air cylinder 3.10 and the scraping plate 3.11 to move forwards until the scraping plate 3.11 is positioned at the front end of the tin bath 3.6. Then, the eleventh cylinder 3.10 drives the scraping plate 3.11 to move downwards, and the lower end of the scraping plate 3.11 stretches into the position below the liquid level of the molten tin. Then, the tenth air cylinder 3.8 drives the second connecting plate 3.9, the eleventh air cylinder 3.10 and the scraping plate 3.11 to retract backwards for scraping. After the liquid scraping is finished, the ninth air cylinder 3.7 is lifted, so that the lower end of the double-parallel line 14 is immersed into the tin liquid, and the tin dipping is finished.

As shown in fig. 24, in addition, before tin dipping, the flux dipping mechanism is arranged below the double-parallel bonding tape, the flux dipping mechanism comprises a flux groove 3.1, liquid flux in the flux groove 3.1 is led out through a pump body 3.2, the other end of the pump body 3.2 is connected with a return pipe 3.3, a flux dipping support nozzle 3.5 is arranged at the output end of the return pipe 3.3, an opening 3.4 is arranged above the flux groove 3.1 by the flux dipping support nozzle 3.5, and the flux in the opening 3.4 is contacted with the double-parallel bonding tape 1.4. The double-doubling 1.4 is always in contact with the flux as the double-doubling adhesive tape passes, continuously receiving the flux.

As shown in fig. 25, the chip clamping mechanism 4 comprises a wire end closing mechanism 4.3 and a chip feeding mechanism 4.4.

As shown in fig. 26-27, the wire end closure mechanism 4.3 is mounted on the horizontal segment side of the double-doubling adhesive tape. The wire end closing mechanism 4.3 comprises a base 4.5, and the base 4.5 is arranged on the slide rail seat 4.6 in a sliding manner and is driven to move back and forth through a first cylinder 4.7; the front end above the base 4.5 is provided with the positioning block 4.8, the rear end is provided with the pneumatic clamping jaw 4.9, and the pneumatic clamping jaw 4.9 clamps and closes the wire end, so that the chip can be conveniently clamped in the later stage.

When the double doubling 1.4 of the double doubling adhesive tape is aligned with the positioning block 4.8, the first cylinder 4.7 extends out, and the base 4.5 is close to the double doubling 1.4. After being in place, the double doubling 1.4 passes through the positioning block 4.8, and the end of the double doubling 1.4 is opposite to the clamping plate of the first pneumatic clamping jaw 4.9. Because the front half section of the double doubling 1.4 is peeled after being sheared at the front station, the left and right wire harnesses in the double doubling 1.4 are spaced, and the ends of the two wire harnesses of the double doubling 1.4 can be extruded and closed through the closing action of the first pneumatic clamping jaw 4.9.

As shown in fig. 26 to 27, in addition, a pressing mechanism 4.18 is installed on one side of the wire end closing mechanism 4.3, the pressing mechanism 4.18 includes a fourth air cylinder 4.19, the fourth air cylinder 4.19 drives a first slide plate 4.20 to move up and down along a vertical slide way 4.21, and a leveling component 4.22 is fixed on the top end of the first slide plate 4.20. The leveling component 4.22 has three groups, and one group of inverted U-shaped rubber blocks is used for extruding the two groups of adhesive tapes 1.2, so that the adhesive tapes 1.2 can be firmly fixed again. The pressing blocks are positioned on one side of the wire end closing mechanism 4.3 and can be used for pressing the front half section of the double doubling 1.4 before closing to keep the double doubling in a straight state; and the other group of pressing blocks are positioned on the other side of the wire end closing mechanism 4.3 and can be used for pressing the front half section of the double-doubling wire 1.4 after closing so as to keep the double-doubling wire in a straight state again and prepare chips for subsequent clamping. When the double doubling 1.4 of the double doubling adhesive tape is aligned with the pallet at the pressing mechanism 4.18, the fourth cylinder 4.19 contracts, and the leveling component 4.22 moves downwards to complete the corresponding extrusion action. Subsequently, the fourth cylinder 4.19 is extended and reset.

As shown in fig. 28-29, the chip feeding mechanism 4.4 includes a sliding bottom plate 4.10, and the sliding bottom plate 4.10 is driven to move back and forth by a second cylinder 4.11. A slideway is arranged on the sliding bottom plate 4.10, and the mounting seat 4.12 is arranged on the slideway of the sliding bottom plate 4.10 in a sliding way. The connecting plates 4.26 are fixed on the left and right sides of the mounting seat 4.12, the travelling wheels 4.25 are mounted at the ends of the connecting plates 4.26, the outer sides of the travelling wheels 4.25 are kept in contact with the positioning plates 4.24, and the positioning plates 4.24 are driven to move left and right through the No. five cylinders 4.23. When the No. five air cylinder 4.23 at one end stretches out, the No. five air cylinder 4.23 at the other end contracts, the travelling wheel 4.25 is always attached to the positioning plate 4.24, and the mounting seat 4.12 moves left and right under the action of the No. five air cylinder 4.23.

The right clamping plate 4.14 is fixed on the mounting seat 4.12, and the front end of the right clamping plate 4.14 is a tip, so that the right clamping plate can conveniently pass through the space between two wire bundles of the double-doubling 1.4. The right clamping plate 4.14 is opposite to the left clamping plate 4.13, the left clamping plate 4.13 is fixed on the first sliding block 4.15, and the first sliding block 4.15 slides left and right along the slideway of the mounting seat 4.12. The rear end of the mounting seat 4.12 is fixedly provided with a third air cylinder 4.16, and the third air cylinder 4.16 drives a first sliding block 4.15 to act. When the chip is required to be clamped, the third air cylinder 4.16 is contracted, the left clamping plate 4.13 is closed to the right clamping plate 4.14, and the chip is clamped.

In addition, a supporting plate 4.1 is fixed on the sliding bottom plate 4.10, the supporting plate 4.1 is positioned at the lower ends of the left clamping plate 4.13 and the right clamping plate 4.14, and the upper end face of the supporting plate 4.1 is contacted with the lower end faces of the left clamping plate 4.13 and the right clamping plate 4.14. The supporting plate 4.1 is convenient for placing chips at a later stage. The supporting plate 4.1 is provided with a groove 4.2 at the position corresponding to the left clamping plate 4.13 and the right clamping plate 4.14. When the chip and the double-parallel line 1.4 are clamped, the grooving 4.2 can avoid the collision between the supporting plate 4.1 and the double-parallel line 1.4.

1) The driving wheel group drives the double-doubling adhesive tape to be conveyed forwards for a fixed distance and then to stop moving, and the wire clamping and conveying mechanism 2.2 drives the double-doubling 1.4 to move forwards for a certain distance, so that the double-doubling 1.4 passes through the positioning groove 2.8 and stretches out for a certain length. Then the first base 2.24 of the second shearing mechanism 2.9 is closed towards the positioning groove 2.8, and after being in place, the double doubling 1.4 passes through the space between the second pressing block 2.26 and the first base 2.24, and the end head of the double doubling 1.4 extends out of the upper slice 2.27 and the lower slice 2.28. The second pneumatic clamping jaw 2.25 of the second shearing mechanism 2.9 is closed, completing the shearing. Subsequently, the second shearing mechanism 2.9 releases the back reset. At this point, the double doubling 1.4 still protrudes through the positioning slot 2.8 for a certain length.

2) The wire clamping and conveying mechanism 2.2 drives the double doubling 1.4 to move backwards for a certain distance, so that the end of the double doubling 1.4 is aligned with one side of the conveyor belt 1.1. Then, the pressing mechanism 2.5 moves downwards to press the adhesive tape 1.2 on the conveyor belt 1.1; when in compression, the first shearing mechanism 2.4 shears; then the compressing mechanism 2.5 and the first shearing mechanism 2.4 are reset in sequence; the first pneumatic clamping jaw 2.11 of the wire clamping and conveying mechanism 2.2 is opened, and the second cylinder 2.10 of the wire clamping and conveying mechanism 2.2 is extended to reset backwards. The driving wheel group continuously drives the double-doubling adhesive tape to forward and stop moving after a fixed distance, and then the next shearing is carried out.

3) When the double-doubling adhesive tape moves to the peeling mechanism to be in place, the sixth air cylinder 2.30 stretches out to enable the pressing plate 2.31 to press the middle part of the double-doubling 1.4, at the moment, the peeling blade 2.7 is inserted into the rubber skin of the double-doubling 1.4, then the seventh air cylinder 2.32 stretches out, the peeling blade 2.7 moves backwards to peel the rubber skin outwards, and the wire harness in the double-doubling 1.4 is exposed to one section; when the double-doubling adhesive tape continues to move to the position of the wire tail trimming mechanism 2.6, the eighth cylinder 2.33 extends out, the cutter Ji Daopian 2.35.35 moves downwards, and the cutter Ji Daopian 2.35.35 cuts off a certain position of the wire harness of the double-doubling 1.4, so that the tail of the double-doubling 1.4 on the subsequent double-doubling adhesive tape is exposed out of the wire harness and the tail ends of all the double-doubling 1.4 wire harnesses are kept flush.

4) The double doubling adhesive tape carries double doubling 1.4, is clamped and conveyed forwards through the wheel assembly 1.5, and is changed into a vertical state from a horizontal state after being changed into a direction through the reversing wheel set. Then, through the soldering flux groove 3.1, soldering flux is adhered; then through tin liquid tank 3.6, tin liquid tank 3.6 is scraped through scraper 3.11, jack-up through ninth cylinder 3.7, when the double doubling adhesive tape passes through tin liquid tank 3.6, double doubling 1.4 is stained with tin liquid. The tin dipping part mainly fixes wires in the two wire bundles of the double-doubling 1.4 respectively.

5) When the double-doubling adhesive tape horizontally passes through the wire end closing mechanism 4.3, the fourth air cylinder 4.19 contracts, the leveling block of the leveling assembly 4.22 is pressed down, the wire harness of the double-doubling 1.4 can be leveled, and then the wire harness reaches the positioning block 4.8. At the moment, the first air cylinder 4.7 stretches out, so that the end head of the double-doubling 1.4 passes through the positioning block 4.8 and is opposite to the clamping plate of the first pneumatic clamping jaw 4.9. The first pneumatic clamping jaw 4.9 acts to clamp the wire harness end of the double-doubling 1.4, so that the wire harness end of the double-doubling 1.4 is bent, deformed and mutually closed. Subsequently the pneumatic clamping jaw 4.9 is released and the cylinder 4.7 is retracted. The flattened block located on the right side of the wire end closure mechanism 4.3 by the flattening assembly 4.22 is again flattened as the forward movement is continued and then conveyed further.

6) When the double-doubling adhesive tape vertically passes through the chip feeding mechanism 4.4, the position in which the adhesive tape is positioned in fig. 1 is taken as an initial state. At this time, the second cylinder 4.11 is contracted, so that the slide base 4.10 is brought closer to the double-doubling adhesive tape, and the movement locus is as in (1) of fig. 10. After being in place, the wire harness end of the double doubling 1.4 enters the slot 4.2. At this time, the left clamping plate 4.13 and the right clamping plate 4.14 clamp the chip and are positioned at the left side of the double-parallel line 1.4, and the lower end surface of the chip is contacted with the upper end surface of the supporting plate 4.1.

7) The push mechanism 4.17 on the left side then pushes the mount 4.12 to move to the right, the movement trace being as in (2) of fig. 10. Since the front end of the right clamping plate 4.14 is pointed, the right clamping plate 4.14 passes through the interval between the upper and lower wire harnesses of the double doubling 1.4 and enters between the upper and lower wire harnesses of the double doubling 1.4. After the chip is continuously moved to the right to be in place, when the chip is positioned between the upper wire harness and the lower wire harness of the double-doubling 1.4, the left clamping plate 4.13 and the right clamping plate 4.14 loosen the chip, and the upper wire harness and the lower wire harness of the double-doubling 1.4 can clamp the chip through bending force due to bending deformation of the wire harness end of the double-doubling 1.4. After the double-doubling adhesive tape continuously moves downwards for a small distance, the other pneumatic clamping jaw stretches out to clamp the chip and the double-doubling 1.4 again, and then the chip is loosened and retreated, so that the chip is prevented from falling in the subsequent conveying process, and the reliability in later welding is ensured.

8) The second cylinder 4.11 extends out to enable the sliding bottom plate 4.10 to be far away from the double-parallel bonding belt. The movement trace is as in (3) of fig. 10.

9) The mounting 4.12 is then pushed into position to the left by the right push mechanism 4.17, the movement path being as in (4) of fig. 10. At this point the left clamping plate 4.13 and the right clamping plate 4.14 are located to the left of the slot 4.2. The chip of the vibration disk moving out of the channel opening is clamped by the manipulator and placed on the supporting plate 4.1 between the left clamping plate 4.13 and the right clamping plate 4.14, the third air cylinder 4.16 is contracted, the left clamping plate 4.13 and the right clamping plate 4.14 are close to each other and clamp the chip. The state is restored to the original state.

10 Repeating the processes 5) -9), and repeatedly carrying out feeding clamping of the chip in the intermittent forward conveying process of the double-doubling adhesive tape.

11 And (3) clamping the chip, and then passing through the second group of tin dipping mechanisms 3 again to finish welding.

12 Guiding the welded double-parallel bonding belt through a wheel assembly to form a labyrinth mechanism, and washing out the soldering flux through an automatic cleaning device by utilizing ultrasonic waves; then detecting, heating, cutting, and transferring to other working procedures.

Claims

1. A production method for welding parallel wires with inserting sheets comprises the following steps:

step 1), driving a wheel set to drive a double-doubling adhesive tape to forward and stop after a fixed distance, and driving a double-doubling (1.4) to move forward by a certain distance by a wire clamping and conveying mechanism (2.2) so that the double-doubling (1.4) passes through a positioning groove (2.8) and stretches out by a certain length;

then the first base (2.24) of the second shearing mechanism (2.9) is closed towards the positioning groove (2.8), after being in place, the double doubling wire (1.4) passes through the space between the second pressing block (2.26) and the first base (2.24), and the end head of the double doubling wire (1.4) extends out of the upper slice (2.27) and the lower slice (2.28); closing a second pneumatic clamping jaw (2.25) of the second shearing mechanism (2.9) to finish shearing; subsequently, the second shearing mechanism (2.9) releases the back reset; at the moment, the double-doubling wire (1.4) still penetrates through the positioning groove (2.8) to extend out for a certain length;

step 2), the wire clamping and conveying mechanism (2.2) drives the double-doubling (1.4) to move backwards for a certain distance, so that the end head of the double-doubling (1.4) is aligned with one side of the conveyor belt (1.1); then, the pressing mechanism (2.5) moves downwards to press the adhesive tape (1.2) at the position on the conveyor belt (1.1); when in compression, the first shearing mechanism (2.4) shears; then the pressing mechanism (2.5) and the first shearing mechanism (2.4) are reset in sequence; the first pneumatic clamping jaw (2.11) of the wire rod clamping and conveying mechanism (2.2) is opened, and the second cylinder (2.10) of the wire rod clamping and conveying mechanism (2.2) stretches out and returns to the back; the driving wheel set continuously drives the double-parallel bonding belt to forward and stop moving after a fixed distance, and then the next shearing is carried out;

step 3), when the double-doubling adhesive tape moves to the peeling mechanism to be in position, the sixth cylinder (2.30) stretches out to enable the pressing plate (2.31) to press the middle part of the double-doubling (1.4), at the moment, the peeling blade (2.7) is inserted into the rubber skin of the double-doubling (1.4), then the seventh cylinder (2.32) stretches out, the peeling blade (2.7) moves backwards to peel the rubber skin outwards, and the wire harness in the double-doubling (1.4) is exposed for a section; when the double-doubling adhesive tape continues to move to the position of the wire tail cut Ji Jigou (2.6), the eighth cylinder (2.33) stretches out, the cut Ji Daopian (2.35) moves downwards, the cut Ji Daopian (2.35) cuts off a certain position of the wire harness of the double-doubling (1.4), so that the tail of the double-doubling (1.4) on the subsequent double-doubling adhesive tape exposes the wire harness and the tail ends of all the double-doubling (1.4) wire harnesses are kept flush;

step 4), carrying double doubling wires (1.4) by the double doubling adhesive tape, clamping and conveying the double doubling wires forwards through a wheel assembly (1.5), and changing the double doubling wires from a horizontal state to a vertical state under the double doubling wires (3.1) after reversing the double doubling wires through a reversing wheel set; then, through the soldering flux groove (3.1), the soldering flux is adhered; then through a tin liquid tank (3.6), after the tin liquid tank (3.6) scrapes liquid through a scraper (3.11), jacking the tin liquid through a ninth air cylinder (3.7), and when the double-parallel bonding tape passes through the tin liquid tank (3.6), adhering the tin liquid to the double-parallel bonding tape (1.4); the tin dipping part mainly fixes wires in two wire bundles of the double-doubling (1.4) respectively;

step 5), when the double-doubling adhesive tape horizontally passes through the wire end closing mechanism (4.3), the fourth air cylinder (4.19) contracts, the leveling block of the leveling component (4.22) is pressed down, the wire bundles of the double-doubling adhesive tape (1.4) can be leveled, and then the wire bundles reach the positioning block (4.8); at the moment, the first air cylinder (4.7) stretches out, so that the end head of the double-doubling wire (1.4) passes through the positioning block (4.8) and is opposite to the clamping plate of the first pneumatic clamping jaw (4.9); the first pneumatic clamping jaw (4.9) acts to clamp the wire harness ends of the double-doubling wire (1.4) so that the wire harness ends of the double-doubling wire (1.4) are bent, deformed and mutually closed; subsequently, the pneumatic clamping jaw (4.9) is loosened, and the air cylinder (4.7) is retracted;

the leveling block positioned on the right side of the wire end closing mechanism (4.3) through the leveling component (4.22) is pressed again to be leveled when the forward movement is continued, and then the conveying is continued;

step 6), when the double-parallel-line adhesive tape vertically passes through the chip feeding mechanism (4.4), the second cylinder (4.11) contracts, so that the sliding bottom plate (4.10) is close to the double-parallel-line adhesive tape; after being in place, the wire harness end of the double-doubling wire (1.4) enters a slot (4.2); at the moment, the left clamping plate (4.13) and the right clamping plate (4.14) clamp the chip and are positioned at the left side of the double-parallel line (1.4), and the lower end face of the chip is contacted with the upper end face of the supporting plate (4.1);

step 7), then the left pushing mechanism (4.17) pushes the mounting seat (4.12) to move rightwards; because the front end of the right clamping plate (4.14) is a tip, the right clamping plate (4.14) passes through the interval between the upper and lower wire harnesses of the double doubling (1.4) and enters between the upper and lower wire harnesses of the double doubling (1.4); after the chip is continuously moved to the right to be in place, when the chip is positioned between the upper wire harness and the lower wire harness of the double-parallel wire (1.4), the left clamping plate (4.13) and the right clamping plate (4.14) loosen the chip, and as the end heads of the wire harnesses of the double-parallel wire (1.4) are bent and deformed, the upper wire harness and the lower wire harness of the double-parallel wire (1.4) can clamp the chip through bending force; after the double-doubling adhesive tape continuously moves downwards for a small distance, the other pneumatic clamping jaw stretches out to clamp the chip and the double-doubling (1.4) again, and then the chip is loosened and retreated, so that falling in the subsequent conveying process is avoided, and the reliability in later welding is ensured;

step 8), the second cylinder (4.11) stretches out to enable the sliding bottom plate (4.10) to be far away from the double-parallel bonding belt;

step 9), then pushing the mounting seat (4.12) leftwards to be in place through a pushing mechanism (4.17) on the right side, wherein the left clamping plate (4.13) and the right clamping plate (4.14) are positioned on the left side of the groove (4.2); the chip of which the vibration disc is taken out of the channel opening by the manipulator is placed on a supporting plate (4.1) between a left clamping plate (4.13) and a right clamping plate (4.14), a third cylinder (4.16) is contracted, the left clamping plate (4.13), and the right clamping plate (4.14) is close to and clamps the chip; the state is restored to the initial state;

step 11), after the chip is clamped, the chip passes through a second group of tin dipping mechanisms (3) again to finish welding;