CN116888749A - Transfer system, transfer position determining device, and transfer method - Google Patents

Transfer system, transfer position determining device, and transfer method Download PDF

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Publication number
CN116888749A
CN116888749A CN202180094785.1A CN202180094785A CN116888749A CN 116888749 A CN116888749 A CN 116888749A CN 202180094785 A CN202180094785 A CN 202180094785A CN 116888749 A CN116888749 A CN 116888749A
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light emitting
transfer
holding unit
emitting elements
substrate
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和田浩光
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95001—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
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    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

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Abstract

Provided are a transfer system, a transfer position determining device, and a transfer method, which can form a display without unevenness while maintaining a high yield of light emitting elements. Specifically, the transfer system (1) transfers a plurality of light emitting elements (2) held by a holding unit (3) to a substrate (4) to be transferred, and the transfer system (1) includes: a light emission characteristic measurement unit (20) that measures the light emission characteristics of each light emitting element (2) in a state held by the holding means (3); a transfer position determination unit (30) that generates transfer availability and/or transfer position information on the transfer substrate (4) for each light-emitting element (2) based on the information on the light-emitting characteristics of each light-emitting element (2) on the holding unit (3) obtained by the light-emitting characteristic measurement unit (20); and a transfer unit (10) for transferring the light-emitting element (2) from the holding unit (3) to the substrate (4) to be transferred, based on the transfer position information generated by the transfer position determination unit (30).

Description

Transfer system, transfer position determining device, and transfer method
Technical Field
The present application relates to a transfer system and a transfer method for transferring a light emitting element such as an LED to a wiring board or the like.
Background
In recent years, as a next-generation display method for replacing a conventional liquid crystal display, a display using LEDs has been developed. In the LED display, 1920×1080 red LEDs in FHD (Full High Definition: full high definition) panels and 3840×2160 red LEDs, green LEDs and blue LEDs in 4K panels are mounted on a wiring board in a grid-like arrangement at high density.
Each of the LEDs mounted on the wiring board at high density is a so-called micro LED having a micro size of, for example, about 50 μm×50 μm, and is obtained by a process of epitaxially growing a gallium nitride crystal on a growth substrate such as sapphire, for example, as shown in patent document 1, and is cut into chips of the above size on the substrate. The LED chip thus formed is transferred from the growth substrate to the wiring substrate through 1 or more transfer processes. Then, the LED chip is fixed to the wiring board through a mounting process such as thermocompression bonding.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2002-170993
Disclosure of Invention
Problems to be solved by the application
Such LED displays are required to emit light uniformly without unevenness. However, the LED chips themselves have a large individual difference in emission wavelength even among a plurality of LED chips obtained from the same growth substrate in terms of their characteristics. Here, when a predetermined number or more of LED chips that emit light at emission wavelengths greatly deviated from the emission wavelengths of the Mode (Mode value) in the distribution of emission wavelengths are collected in a state where the LED chips are mounted on the wiring board, the collected portion is visually recognized as uneven when the display emits light, and the display cannot be used as a product unless the LED chips in the uneven range are replaced.
On the other hand, when the LED chip having an emission wavelength different from the mode emission wavelength by a predetermined length or more is not used for transfer to the wiring board, the occurrence of unevenness can be reduced, but in this case, the yield of the LED chip is deteriorated, and therefore, there is a problem that the manufacturing cost of the LED display is increased.
In view of the above-described problems, an object of the present application is to provide a transfer system, a transfer position determining device, and a transfer method for forming a display that does not cause unevenness while maintaining a high yield of light-emitting elements.
Means for solving the problems
In order to solve the above-described problems, a transfer system according to the present application transfers a plurality of light emitting elements held by a holding unit to a substrate to be transferred, the transfer system including: a light emission characteristic measurement unit that measures light emission characteristics of the respective light emitting elements in a state held by the holding unit; a transfer position determining unit that generates transfer availability and/or transfer position information on the transferred substrate for each of the light emitting elements based on the information of the light emitting characteristics of each of the light emitting elements on the holding unit obtained by the light emitting characteristic measuring unit; and a transfer unit that transfers the light emitting element from the holding unit to the transferred substrate based on the transfer position information generated by the transfer position determination unit.
According to the transfer system, transfer availability and/or transfer position information on a transfer substrate are generated for each light emitting element based on information obtained by measuring light emitting characteristics of each light emitting element, and the transfer position information is generated so that light emitting elements having relatively poor light emitting characteristics are used for forming a display without causing unevenness in a product, whereby a display without causing unevenness can be formed while maintaining a high yield of light emitting elements.
The light emission characteristic measuring unit may be a wavelength measuring unit that measures wavelengths of fluorescence and phosphorescence emitted from the light emitting elements by irradiating the light emitting elements held by the holding means with active energy rays.
Thus, the light emission characteristics of the light emitting elements can be easily checked without wiring the light emitting elements on the holding unit.
The transfer section may transfer the light emitting elements on the holding unit to the transferred substrate by laser lift-off.
The transfer unit may transfer the light emitting elements on the holding unit to the transferred substrate by thermocompression bonding.
The transfer unit may transfer the light emitting elements on the holding unit to the transferred substrate by ultrasonic waves.
In order to solve the above-described problems, in the transfer position determining apparatus according to the present application, when transferring a plurality of light emitting elements held by a holding unit to a substrate to be transferred, the transfer position determining apparatus generates transfer availability and/or transfer position information on the substrate to be transferred for each of the light emitting elements based on information on light emitting characteristics of each of the light emitting elements on the holding unit.
By this transfer position determining apparatus, transfer availability and/or transfer position information on the transfer target substrate is generated for each light emitting element based on information obtained by measuring the light emitting characteristics of each light emitting element, and the transfer position information is generated so that light emitting elements having relatively poor light emitting characteristics are also used for the formation of a display in a range where no unevenness occurs in the product, whereby information for forming a display in which no unevenness occurs while maintaining a high yield of light emitting elements can be delivered to a downstream process.
In order to solve the above-described problems, a transfer method according to the present application is a transfer method for transferring a plurality of light emitting elements held by a holding unit to a substrate to be transferred, the transfer method including: a light emission characteristic measurement step of measuring light emission characteristics of the respective light emitting elements in a state held by the holding unit; a transfer position determining step of generating transfer availability and/or transfer position information on the transferred substrate for each of the light emitting elements based on the information of the light emitting characteristics of each of the light emitting elements on the holding unit obtained by the light emitting characteristic measuring step; and a transfer step of transferring the light emitting element from the holding unit to the substrate to be transferred based on the transfer position information generated in the transfer position determining step.
According to the transfer method, transfer availability and/or transfer position information on the transfer substrate are generated for each light emitting element based on information obtained by measuring the light emitting characteristics of each light emitting element, and the transfer position information is generated so that light emitting elements having relatively poor light emitting characteristics are also used for the formation of a display in a range where no unevenness occurs in the product, whereby a display free from unevenness can be formed while maintaining a high yield of light emitting elements.
Effects of the application
The transfer system, the transfer position determining device, and the transfer method of the present application can form a display without unevenness.
Drawings
Fig. 1 is a diagram illustrating a transfer system in an embodiment of the present application.
Fig. 2 is a diagram showing the light emission wavelength distribution of the light emitting elements on the holding unit obtained by the wavelength measuring section provided in the transfer system and the grouping result of the transfer position determining section.
Fig. 3 is a diagram showing light emitting elements on the holding unit reflecting the grouping by the transfer position determining section.
Fig. 4 is a diagram showing an example of a transferred substrate to which a light emitting element is transferred, reflecting transfer position information determined by a transfer position determining unit.
Fig. 5 is a diagram illustrating a transfer method in an embodiment of the present application.
Fig. 6 is a diagram showing the results of grouping of transfer position determining units in another embodiment.
Detailed Description
A transfer system 1 according to an embodiment of the present application will be described with reference to fig. 1.
The transfer system 1 of the present embodiment includes a transfer unit 10, a wavelength measuring unit 20, and a transfer position determining unit 30, and transfers the plurality of light emitting elements 2 held by the holding unit 3 to the transferred substrate 4 by the transfer unit 10. In addition, the wavelength measurement unit 20 measures the emission wavelength of each light emitting element 2 on the holding unit 3, instead of reflecting the arrangement (layout) of the light emitting elements 2 on the holding unit 3 as it is in the layout on the transferred substrate 4, and the transfer position determination unit 30 determines the transfer position of each light emitting element 2 on the transferred substrate 4 based on the information of the emission wavelength of each light emitting element 2 obtained here. Based on the transfer position information, the transfer section 10 transfers each light emitting element 2 to the transferred substrate 4.
In the present embodiment, the light emitting element 2 is a micro LED chip, and the transfer substrate 4 is a circuit substrate for a display. The red, green, and blue light emitting elements 2 are arranged on the transferred substrate 4, and the number of the light emitting elements arranged on the transferred substrate 4 is 1920×1080 for each color when the transferred substrate 4 is a circuit substrate facing a FHD (Full High Definition) panel, and the number of the light emitting elements arranged on the transferred substrate 4 is 3840×2160 when the transferred substrate 4 is a circuit substrate facing a 4K panel.
The holding unit 3 may be a growth substrate that serves as a base for epitaxially growing the LED chip, or may be an intermediate substrate in the case where transfer of the light emitting element 2 from the growth substrate to the circuit substrate is completed through multiple transfers. The shape of the holding unit 3 may be a wafer shape or a square plate shape. The holding means 3 holds the light emitting element 2 in a known manner that can generate laser ablation is applied to the present embodiment.
In the present description, the directions that are horizontal and orthogonal to each other are referred to as an X-axis direction and a Y-axis direction, respectively, and the vertical direction is referred to as a Z-axis direction.
In the present embodiment, the transfer unit 10 transfers the light emitting element 2 held by the holding unit 3 onto the transferred substrate 4 by laser lift-off, and includes a laser light source 11, an electron microscope 12, an fθ lens 13, a suction hand 14, and a placement unit 15.
In the transfer section 10, the holding unit 3 holds the back surface by suction by the suction hand 14 so that the surface (the front surface) holding the light emitting element 2 is horizontal and downward. The transfer substrate 4 is sucked and held on the back surface by the placement portion 15 so that the surface (the front surface) of the transfer light emitting element 2 is horizontal and upward. The holding unit 3 and the transferred substrate 4 are vertically opposed to each other, and the holding unit 3 is located on the upper side.
The laser light source 11 is a device that emits 1 laser beam L1, and in the present embodiment emits laser beams such as YAG laser beam, visible light laser beam, and ultraviolet laser beam.
The galvanometer mirror 12 has 2 mirrors, and the position and angle of these mirrors are controlled to emit incident light in any direction.
The pulsed laser light L1 emitted from the laser light source 11 is irradiated to the holding unit 3 gripped by the suction hand 14 via the galvanometer mirror 12 and the fθ lens 13. Then, the laser light L1 irradiated to the holding unit 3 passes through the holding unit 3 to reach the interface between the holding unit 3 and the light emitting element 2, and laser ablation occurs at the interface. By this laser ablation, the light emitting element 2 is separated from the holding unit 3 by being biased, and transferred onto the transferred substrate 4 immediately below. In the present description, the separation of the light emitting element 2 from the holding unit 3 by laser ablation in this way is referred to as laser lift-off.
Here, the optical path of the laser light L1 is controlled by the galvano mirror 12, and can be irradiated to an arbitrary position of the holding unit 3. By providing the galvanometer 12 in this way, the light emitting element 2 held at an arbitrary position of the holding unit 3 can be peeled off by the laser.
The mounting portion 15 is movable in the X-axis direction and the Y-axis direction by the movable table 16, and moves the transferred substrate 4 relative to the holding unit 3 in the X-axis direction and the Y-axis direction. By combining the position control of the transfer target substrate 4 by the moving stage 16 and the irradiation position control of the laser beam L1 by the galvano mirror 12, the light emitting element 2 held at an arbitrary position on the holding unit 3 can be transferred to an arbitrary position on the transfer target substrate 4.
The wavelength measuring unit 20 is an embodiment of the emission characteristic measuring unit described in the present specification, and in the present embodiment, uses photoluminescence to measure an emission wavelength, which is one of emission characteristics of each light emitting element 2 on the holding unit 3, and includes a laser light source 21, a wavelength measuring device 22, and a mounting unit 23.
In the wavelength measuring section 20, the holding unit 3 holds the back surface by suction by the mounting section 23 so that the surface (front surface) holding the light emitting element 2 is horizontal and upward.
The laser light source 21 is a device that emits 1 laser beam L2, and in the present embodiment emits laser beams such as YAG laser light, visible light laser light, and ultraviolet laser light.
The laser beam is one embodiment of the active energy beam in the present application, and the active energy beam includes electromagnetic waves, particle beams, quantum beams, basic particle beams, and the like, in addition to the laser beam.
The wavelength measuring device 22 measures the wavelength of light entering itself, and a known optical wavelength meter is used.
When the laser light L2 is incident on the light-emitting element 2 at a predetermined position on the holding unit 3, electrons in the light-emitting element 2 are excited. When the electrons return to the ground state, the electrons emit light L3 (so-called photoluminescence) such as fluorescence or phosphorescence. The emitted light L3 is taken in by the wavelength measuring device 22, and the wavelength of the emitted light L3 is measured, whereby the emission wavelength of the predetermined light emitting element 2 can be measured without wiring the light emitting element 2.
The mounting portion 23 is movable in the X-axis direction and the Y-axis direction by the movable table 24, and the holding unit 3 is movable relative to the laser light source 21 and the wavelength measuring device 22 in the X-axis direction and the Y-axis direction. By controlling the position of the holding unit 3 by the mobile station 24, the emission wavelength of the light emitting element 2 held at an arbitrary position of the holding unit 3 can be measured. The wavelength measuring unit 20 measures the emission wavelengths of all the light emitting elements 2 held by the holding unit 3.
The transfer position determining unit 30 is also referred to as a transfer position determining device in the present description, and is a computer that controls the operations of the transfer unit 10 and the wavelength measuring unit 20 in the present embodiment, and includes a program that generates information (transfer position information) on the transfer positions of the light emitting elements 2 on the transferred substrate 4 based on the information on the emission wavelengths of the light emitting elements 2 on the holding unit 3 obtained by the wavelength measuring unit 20. Based on the transfer position information, the transfer unit 10 transfers the predetermined light emitting element 2 on the holding unit 3 to a predetermined position on the transferred substrate 4.
Next, a process of generating transfer position information by the transfer position determining unit 30 will be described with reference to fig. 2 to 4.
Fig. 2 is a graph showing the distribution of the emission wavelengths of the light emitting elements 2 on the holding unit 3 obtained by the wavelength measuring section 20. The horizontal axis represents the emission wavelength, and the vertical axis represents the number of light emitting elements 2 (element number) that emit light at each emission wavelength.
Even in the light-emitting elements 2 of the same color epitaxially grown from the same growth substrate, there is some difference in emission wavelength among the light-emitting elements 2, resulting in a distribution similar to the normal distribution shown in fig. 2.
Here, the group a is classified into two groups, i.e., a group a having a predetermined wavelength range including emission wavelengths for which the distribution is Mode (Mode value), and a group B which is a group outside the group a. The light-emitting element 2 having the emission wavelength belonging to the group a is referred to as a mode element 2A, and the light-emitting element 2 having the emission wavelength belonging to the group B is referred to as a non-mode element 2B. At this time, the boundary value between the group a and the group B is set so that the number of mode elements 2A is smaller than the number of non-mode elements 2B.
Fig. 3 is a diagram showing an example of the arrangement of the light emitting elements 2 on the holding unit 3 when the above-described grouping is reflected, and the non-mode element 2B is hatched.
As shown in fig. 3, in the case where the non-mode elements 2B are densely arranged on the holding unit 3, if such an arrangement on the holding unit 3 is transferred onto the transferred substrate 4, when the light emitting elements 2 on the transferred substrate 4 emit light, there is a possibility that the difference in color tone between the set of non-mode elements 2B and the mode elements 2A around them is significant, and it is perceived as non-uniform by the visual perception. On the other hand, in the present application, the transfer position determining unit 30 generates transfer position information so that the non-mode elements 2B are arranged on the transfer target substrate 4 within a range where unevenness does not occur in the display as a final product, based on the information of the light emission characteristics of the respective light emitting elements 2 on the holding unit 3.
Fig. 4 is a diagram showing an example of the transferred substrate 4 to which the light emitting element 2 is transferred, reflecting the transfer position information determined by the transfer position determining unit 30.
In human vision, unevenness in the outer peripheral portion of the display is less likely to become noticeable than in the central portion or the like. Therefore, in the example shown in fig. 4, the transfer position determining unit 30 generates transfer position information so that the non-mode element 2B is first used and transferred to the outer side Zhou Buyou of the transfer target substrate 4, and based on this, the light emitting element 2 is transferred from the holding unit 3 to the transfer target substrate 4.
In this way, by effectively utilizing the outer peripheral portion where unevenness is less likely to be noticeable, the non-mode element 2B can be used for forming a display, and a display in which unevenness does not occur can be formed while maintaining a high yield of light-emitting elements.
Here, in the present embodiment, the emission wavelength that becomes the boundary between the group a and the group B in fig. 2 can be manually set in view of the distribution of the emission wavelengths. For example, the range of emission wavelengths from 600nm to 780nm in the red LED, the range of emission wavelengths from 505nm to 530nm in the green LED, and the range of emission wavelengths from 470nm to 485nm in the blue LED are manually set as group a, the range of emission wavelengths outside of this range is manually set as group B, and the transfer position determination unit 30 calculates the arrangement of the mode element 2A and the non-mode element 2B based on this condition. The range of the emission wavelength may be automatically determined by the transfer position determining unit 30.
Fig. 5 is a flowchart illustrating a transfer method using the transfer system of the above embodiment.
Fig. 5 (a) is a flowchart showing a series of steps related to transfer of the light emitting element 2 from the holding unit 3 to the transferred substrate 4.
First, the holding unit 3 is placed in the wavelength measuring unit 20 (step S1), and the emission wavelength of each light emitting element 2 on the holding unit 3 is measured by the wavelength measuring unit 20 (step S2). In the present description, the step of measuring the emission characteristics such as the emission wavelength of each light emitting element 2 held by the holding unit 3 as in step S2 is referred to as an emission characteristic measurement step.
Next, the light-emitting elements 2 are classified based on the information of the emission wavelength of the light-emitting elements 2 obtained in the emission characteristic measurement step, and the transfer position to the transfer target substrate 4 is determined. Specifically, the conditions for classification are set (step S3), and the transfer position determining unit 30 generates transfer position information of each light emitting element 2 to the transferred substrate 4 so that the light emitting element 2 identified as the non-mode element 2B by the classification is arranged on the outer peripheral portion of the transferred substrate 4 (step S4). In the present description, the step of generating transfer position information of each light emitting element 2 to the transferred substrate 4 as in step S4 is referred to as a transfer position determining step.
Fig. 5 (b) shows details of the classification condition setting in step S3. In this step, a boundary value identifying the group a and the group B in fig. 2 is set for each color light emitting element 2. In the present embodiment, the light emitting elements 2 include 3 types of red, green, and blue light emitting elements 2, and a boundary value of the group (class) is set for each color of light emitting elements 2 (step S11, step S12, and step S13). The setting of the boundary value may be performed manually, or may be performed automatically by the transfer position determining unit 30, for example. In the present embodiment, the step of setting the classification condition is incorporated in a series of processes, but the setting may be performed in advance at a stage before step S1.
Returning to the description of the flow of fig. 5 (a). After the transfer position information is generated in step S4, the holding unit 3 is taken out from the wavelength measuring section 20 and put into the transfer section 10. The transfer substrate 4 is also placed in the transfer section 10 (step S5). Finally, the transfer section 10 transfers the mode element 2A and the non-mode element 2B from the holding unit 3 to the transferred substrate 4 based on the transfer position information (step S6). In the present description, the step of transferring the light emitting element 2 from the holding unit 3 to the transferred substrate 4 based on the transfer position information obtained in the transfer position determining step as in step S6 is referred to as a transfer step.
By completing the transfer process, the transferred substrate 4 on which the light emitting elements 2 are transferred so as not to be uneven is completed. Thereafter, the process may be shifted to a post-process such as mounting, or the unevenness inspection may be performed to detect any trouble.
Fig. 6 is a diagram showing the results of grouping by the transfer position determining unit 30 in another embodiment.
The grouping of the distribution of the emission wavelengths for the light emitting elements 2 may not necessarily be two groups. In the present embodiment, the light emitting elements 2 on the holding unit 3 are classified into 3 groups, that is, group D which is a group including a range of light emitting wavelengths of mode, group E which is a group of light emitting wavelength ranges adjacent to the outside of group D, and group F which is a group of light emitting wavelength ranges adjacent to the outside of group E.
The transfer position determining unit 30 generates transfer position information so that, when the light emitting element 2 is transferred onto the transfer target substrate 4, only the mode element belonging to the group D and the non-mode element belonging to the group E are transferred except for the light emitting element 2 belonging to the group F, which is the wavelength range farthest from the mode of the light emitting wavelength. In this way, the transfer position determining unit 30 may generate not only the transfer position to the target substrate 4 but also information on whether or not transfer is possible as information.
In this way, although the yield is slightly reduced, the number of non-mode elements can be made relatively small, and therefore the transfer position determining section 30 can easily form transfer position information in which non-mode element groups are arranged so as not to generate unevenness.
With the above transfer system, transfer position determining device, and transfer method, it is possible to form a display that does not cause unevenness while maintaining a high yield of light emitting elements.
The transfer system, the transfer position determining apparatus, and the transfer method of the present application are not limited to the above-described embodiments, and may be other embodiments within the scope of the present application. For example, the light emission characteristics of the light emitting elements 2 measured by the light emission characteristic measuring section are not limited to the light emission wavelength, and for example, the light emission luminance of each light emitting element 2 may be measured.
The transfer method of the transfer portion 10 to the light emitting element 2 is not limited to laser lift-off, and other known methods may be used. For example, the light emitting element 2 may be transferred by so-called bonding using thermocompression bonding, ultrasonic waves, or the like.
Description of the reference numerals
1. Transfer printing system
2. Light-emitting element
2A mode element
2B non-mode element
3. Holding unit
4. Transferred substrate
10. Transfer part
11. Laser light source
12. Electronic mirror
13 Fθ lens
14. Adsorption hand
15. Mounting part
16. Mobile station
20. Wavelength measuring unit
21. Laser light source
22. Wavelength measurer
23. Mounting part
24. Mobile station
30. Transfer position determining unit
Group A
Group B
Group C
Group D
Group E
L1 laser
L2 laser
L3 emits light
W distance

Claims (7)

1. A transfer system for transferring a plurality of light emitting elements held by a holding unit to a substrate to be transferred, characterized in that,
the transfer system is provided with:
a light emission characteristic measurement unit that measures light emission characteristics of the respective light emitting elements in a state held by the holding unit;
a transfer position determining unit that generates transfer availability and/or transfer position information on the transferred substrate for each of the light emitting elements based on the information of the light emitting characteristics of each of the light emitting elements on the holding unit obtained by the light emitting characteristic measuring unit; and
and a transfer unit that transfers the light emitting element from the holding unit to the transferred substrate based on the transfer position information generated by the transfer position determination unit.
2. The transfer system according to claim 1, wherein the light emission characteristic measurement section is a wavelength measurement section that measures a wavelength of fluorescence or phosphorescence emitted from the light emitting element by irradiating the active energy rays to the respective light emitting elements held in the holding unit.
3. The transfer system according to claim 1 or 2, wherein the transfer portion transfers the respective light emitting elements on the holding unit to the transferred substrate by laser lift-off.
4. The transfer system according to claim 1 or 2, wherein the transfer portion transfers the respective light emitting elements on the holding unit to the transferred substrate by thermocompression bonding.
5. The transfer system according to claim 1 or 2, wherein the transfer portion transfers each of the light emitting elements on the holding unit to the transferred substrate by ultrasonic waves.
6. The transfer position determination device is characterized in that when a plurality of light emitting elements held by a holding unit are transferred to a substrate to be transferred, the transfer position determination device generates transfer availability and/or transfer position information on the substrate to be transferred for each light emitting element based on information on light emitting characteristics of each light emitting element on the holding unit.
7. A transfer method for transferring a plurality of light emitting elements held by a holding unit to a substrate to be transferred, the transfer method comprising:
a light emission characteristic measurement step of measuring light emission characteristics of the respective light emitting elements in a state held by the holding unit;
a transfer position determining step of generating transfer availability and/or transfer position information on the transferred substrate for each of the light emitting elements based on the information of the light emitting characteristics of each of the light emitting elements on the holding unit obtained by the light emitting characteristic measuring step; and
and a transfer step of transferring the light emitting element from the holding unit to the transferred substrate based on the transfer position information generated in the transfer position determining step.
CN202180094785.1A 2021-03-05 2021-12-23 Transfer system, transfer position determining device, and transfer method Pending CN116888749A (en)

Applications Claiming Priority (3)

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JP2021035380A JP2022135521A (en) 2021-03-05 2021-03-05 Transfer system, transfer position determination device, and transfer method
JP2021-035380 2021-03-05
PCT/JP2021/047870 WO2022185686A1 (en) 2021-03-05 2021-12-23 Transfer system, transfer position determination device, and transfer method

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