CN116888073A - 具有降低的硅烷醇基团密度的气相二氧化硅粉末 - Google Patents

具有降低的硅烷醇基团密度的气相二氧化硅粉末 Download PDF

Info

Publication number
CN116888073A
CN116888073A CN202280014541.2A CN202280014541A CN116888073A CN 116888073 A CN116888073 A CN 116888073A CN 202280014541 A CN202280014541 A CN 202280014541A CN 116888073 A CN116888073 A CN 116888073A
Authority
CN
China
Prior art keywords
silica powder
fumed silica
silica
sioh
particle size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280014541.2A
Other languages
English (en)
Chinese (zh)
Inventor
M·吉塞尔勒
F·门策尔
A·雷金
R·戈尔凯尔特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Evonik Operations GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evonik Operations GmbH filed Critical Evonik Operations GmbH
Publication of CN116888073A publication Critical patent/CN116888073A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C01B33/181—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3009—Physical treatment, e.g. grinding; treatment with ultrasonic vibrations
    • C09C1/3027—Drying, calcination
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3081—Treatment with organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/309—Combinations of treatments provided for in groups C09C1/3009 - C09C1/3081
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/12—Treatment with organosilicon compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/11—Powder tap density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity
    • C01P2006/82—Compositional purity water content
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
CN202280014541.2A 2021-02-11 2022-01-19 具有降低的硅烷醇基团密度的气相二氧化硅粉末 Pending CN116888073A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP21156545.2 2021-02-11
EP21156545 2021-02-11
PCT/EP2022/051095 WO2022171406A1 (en) 2021-02-11 2022-01-19 Fumed silica powder with reduced silanol group density

Publications (1)

Publication Number Publication Date
CN116888073A true CN116888073A (zh) 2023-10-13

Family

ID=74591845

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280014541.2A Pending CN116888073A (zh) 2021-02-11 2022-01-19 具有降低的硅烷醇基团密度的气相二氧化硅粉末

Country Status (7)

Country Link
US (1) US20240116764A1 (https=)
EP (1) EP4291528A1 (https=)
JP (1) JP2024506276A (https=)
KR (1) KR20230142833A (https=)
CN (1) CN116888073A (https=)
TW (1) TW202244002A (https=)
WO (1) WO2022171406A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230016051A (ko) 2020-05-25 2023-01-31 에보니크 오퍼레이션즈 게엠베하 열 처리를 위한 실리카 과립
EP4382575A1 (en) * 2022-12-06 2024-06-12 Evonik Operations GmbH Milled silica and liquid radiation curable compositions comprising same
KR20240159752A (ko) * 2023-04-28 2024-11-06 오씨아이 주식회사 고분산 흄드 실리카 및 이의 제조방법
TW202513640A (zh) * 2023-09-26 2025-04-01 日商納美仕股份有限公司 樹脂組成物、硬化物及光纖陣列

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2123233A1 (de) * 1971-05-11 1972-11-30 Degussa Verfahren zur Herstellung von fein teihgem grossoberflachigen Silicium dioxid
GB1337329A (en) * 1970-01-31 1973-11-14 Degussa Finely divided highly active silica
US20070299203A1 (en) * 2006-05-26 2007-12-27 Degussa Gmbh Hydrophilic silica for sealants
CN102099425A (zh) * 2008-07-18 2011-06-15 赢创德固赛有限公司 可再分散的经表面改性的二氧化硅颗粒的制备方法
CN107074564A (zh) * 2014-12-10 2017-08-18 东曹硅化工株式会社 疏水性二氧化硅及其制造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2866716A (en) 1955-10-18 1958-12-30 Du Pont Process for modifying the surface of a silica substrate having a reactive silanol surface
DE1767226C3 (de) 1968-04-13 1978-11-02 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Hochdisperses, absolut trockenes, auf pyrogenem Wege hergestelltes Siliciumdioxid
JPS4912480B1 (https=) * 1969-10-15 1974-03-25
DE2240014C3 (de) 1972-08-14 1981-04-16 Degussa Ag, 6000 Frankfurt Verfahren zur Hydrophobierung von hochdispersen Oxiden
JPS61136909A (ja) 1984-12-04 1986-06-24 Mitsubishi Chem Ind Ltd 無水ケイ酸の水分散液組成物
PT725037E (pt) 1995-02-04 2001-07-31 Degussa Granulados a base de dioxido de silicio preparado pirogenicamente processo para a sua preparacao e sua utilizacao
DE10260323A1 (de) 2002-12-20 2004-07-08 Wacker-Chemie Gmbh Wasserbenetzbare silylierte Metalloxide
DE10342827A1 (de) 2003-08-20 2005-03-17 Degussa Ag Reinigung feinverteilter, pyrogen hergestellter Metalloxidpartikel
DE102006054156A1 (de) 2006-11-16 2008-05-21 Wacker Chemie Ag Pyrogene Kieselsäure hergestellt in einer Produktions-Anlage mit großer Kapazität
EP2014622B1 (de) 2007-07-06 2017-01-18 Evonik Degussa GmbH Verfahren zur Herstellung eines Kieselglasgranulats
KR101431932B1 (ko) 2009-12-26 2014-08-19 에보니크 데구사 게엠베하 수분 함유 분말 조성물
JP2014055072A (ja) 2012-09-11 2014-03-27 Nippon Aerosil Co Ltd 非晶質酸化珪素焼結体の製造方法及びこの方法により製造された非晶質酸化珪素焼結体
JP6278979B2 (ja) 2014-02-10 2018-02-14 株式会社日本触媒 シリカ粒子、その粒子を含む樹脂組成物、ならびに、その用途
KR101723994B1 (ko) 2014-02-21 2017-04-06 주식회사 포스코 분리막, 분리막의 제조 방법, 이를 포함하는 리튬 폴리머 이차 전지, 및 이를 이용한 리튬 폴리머 이차 전지의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1337329A (en) * 1970-01-31 1973-11-14 Degussa Finely divided highly active silica
DE2123233A1 (de) * 1971-05-11 1972-11-30 Degussa Verfahren zur Herstellung von fein teihgem grossoberflachigen Silicium dioxid
US20070299203A1 (en) * 2006-05-26 2007-12-27 Degussa Gmbh Hydrophilic silica for sealants
CN102099425A (zh) * 2008-07-18 2011-06-15 赢创德固赛有限公司 可再分散的经表面改性的二氧化硅颗粒的制备方法
CN107074564A (zh) * 2014-12-10 2017-08-18 东曹硅化工株式会社 疏水性二氧化硅及其制造方法

Also Published As

Publication number Publication date
KR20230142833A (ko) 2023-10-11
TW202244002A (zh) 2022-11-16
WO2022171406A1 (en) 2022-08-18
JP2024506276A (ja) 2024-02-13
EP4291528A1 (en) 2023-12-20
US20240116764A1 (en) 2024-04-11

Similar Documents

Publication Publication Date Title
CN115003625B (zh) 具有改性的表面活性的气相法二氧化硅
CN116888073A (zh) 具有降低的硅烷醇基团密度的气相二氧化硅粉末
TWI867143B (zh) 具有提高極性之矽石系疏水性顆粒狀材料
US12528704B2 (en) Silica with reduced tribo-charge for toner applications
TWI920231B (zh) 用於調色劑應用之具有減少的摩擦電荷之二氧化矽
US20240239679A1 (en) Fumed alumina powder with reduced moisture content
RU2856340C2 (ru) Оксид кремния со сниженным трибозарядом для применения в тонере

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination