CN116885057A - Manufacturing method of aluminum foil LED lamp strip - Google Patents
Manufacturing method of aluminum foil LED lamp strip Download PDFInfo
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- CN116885057A CN116885057A CN202310846646.0A CN202310846646A CN116885057A CN 116885057 A CN116885057 A CN 116885057A CN 202310846646 A CN202310846646 A CN 202310846646A CN 116885057 A CN116885057 A CN 116885057A
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- Prior art keywords
- aluminum foil
- led lamp
- lamp strip
- emitting chip
- circuit board
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 241
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 241
- 239000011888 foil Substances 0.000 title claims abstract description 241
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 230000005496 eutectics Effects 0.000 claims abstract description 49
- 239000003292 glue Substances 0.000 claims abstract description 37
- 238000005520 cutting process Methods 0.000 claims abstract description 20
- 238000012360 testing method Methods 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 15
- 229910052709 silver Inorganic materials 0.000 claims abstract description 11
- 239000004332 silver Substances 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims abstract description 8
- 230000004927 fusion Effects 0.000 claims abstract description 7
- 238000002372 labelling Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 17
- 230000002950 deficient Effects 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 239000003086 colorant Substances 0.000 claims description 5
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 238000007711 solidification Methods 0.000 abstract description 2
- 230000008023 solidification Effects 0.000 abstract description 2
- 238000007781 pre-processing Methods 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 238000005034 decoration Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 239000011368 organic material Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000003698 laser cutting Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 241001417935 Platycephalidae Species 0.000 description 1
- 241001417523 Plesiopidae Species 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000004886 head movement Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a manufacturing method of an aluminum foil LED lamp strip, which comprises the following steps: when feeding, detecting whether the material meets the feeding standard, preprocessing the aluminum foil into an aluminum foil circuit board comprising an anode aluminum foil, a cathode aluminum foil and an aluminum foil carrier, plating copper on the aluminum foil circuit board to form a conductive bonding pad, and plating silver in the conductive bonding pad; preheating and heating an aluminum foil circuit board in a eutectic machine, and connecting an LED light-emitting chip and a protection resistor into a conductive bonding pad for eutectic fusion; cutting off the anode aluminum foil, the cathode aluminum foil and the aluminum foil carrier, packaging with light-transmitting glue, heating for solidification, cutting into a plurality of aluminum foil LED lamp strips, electrifying for testing, coiling the aluminum foil LED lamp strips qualified in testing, sealing, packaging and labeling. The invention has the beneficial effects that: the aluminum foil LED lamp strip is produced, aluminum foil is used as a carrier of an LED light-emitting chip, the structure is simple, the brightness of the LED light-emitting chip is uniform, the production cost is low, the production efficiency is high, and the heat dissipation is good.
Description
Technical Field
The invention relates to the technical field of LED lamp strips, in particular to a manufacturing method of an aluminum foil LED lamp strip.
Background
The lamp strip is obtained by welding an LED lamp on a copper wire or a strip-shaped flexible circuit board by a special processing technology, and connecting a power supply to emit light. The lamp strip has been widely used in the fields of buildings, bridges, roads, gardens, courtyards, floors, ceilings, furniture, automobiles, ponds, water floors, advertisements, signboards, signs and the like as decorations or illumination, adding endless happy and holiday atmospheres to various festival activities such as christmas, hallowmas, morgans, easter joints, national celebrations and the like, taking five major markets of advertisements, decorations, buildings, businesses, gifts with a stubborn vitality, and selling a plurality of countries and regions, and is widely used in places of building profiles, bridges, guardrails, hotels, lin Yuan, dance halls, advertisement decorations.
The light strip welded on the strip-shaped flexible circuit board is called an FPC light strip, the FPC light strip is a light strip assembled by taking a flexible circuit board FPC as a carrier, because the FPC has flexibility and ultra-thin property, the application range is wider, the LEDs assembled on the FPC light strip are provided with a patch LED, a direct-insert LED and a flip-chip LED, the flip-chip LED is also called a COB, the patch LED has the sizes of 0603, 0805, 1206, 1210, 5050, 5060 and the like, and the colors are red, yellow, blue, green, white, yellow-green, purple, RGB seven colors and the like; the direct-insert LEDs comprise phi 3, phi 5, phi 6 and the like, have round heads and flat heads (commonly called straw hat lamps), have red, yellow, blue, green, white and the like, and the FPC lamp strip is mainly applied to places such as advertisement decoration, automobile decoration, home decoration and the like, and can also be applied to reflective vests and be used for some special purposes. The universal specification of the FPC light belt is 20cm long 8 LEDs, 30cm long 18 LEDs, 30cm long 24 LEDs, 50cm long 15 LEDs, 50cm long 24 LEDs, 50cm long 30 LEDs, 60cm and 80cm long, different users have different specifications, and the FPC light belt can be freely bent, folded and coiled in a three-dimensional space without breaking due to the fact that the FPC is soft, can be freely moved and stretched in the three-dimensional space, can be freely sheared, can be freely prolonged to emit light without being influenced, is suitable for being used in irregular places and places with small space, and is also suitable for being freely combined with various patterns in advertisement decoration due to the fact that the FPC light belt can be freely bent and coiled.
The existing FPC lamp strip production mode is that a circuit is etched on a flexible organic material to form a carrier, then an LED is pasted on the carrier and then soldered by spot tin, and then the carrier is packaged by transparent glue, the etched circuit is narrower in line width due to the process, so that current limitation is large, voltage drop is obvious, the head and tail brightness difference of lamp beads on the lamp strip is large, and production efficiency is low; and because the heat dispersion of flexible organic material and printing opacity glue is relatively poor, so FPC lamp area also relatively easily burns out this just narrower circuit in the use.
Disclosure of Invention
In order to solve the problems in the prior art, the aluminum foil LED lamp strip is produced, aluminum foil is used as a carrier of an LED light-emitting chip, the structure is simple, the brightness of the LED light-emitting chip is uniform, the production cost is low, the production efficiency is high, the heat dissipation is good, and the problems that the brightness of the LED light-emitting chip is uneven, the heat dissipation is poor, the circuit is relatively narrow and easy to burn out and the spot tin welding production efficiency is low due to obvious pressure drop of the FPC lamp strip in the prior art are solved.
The manufacturing method of the aluminum foil LED lamp strip comprises the following steps:
step 1: the method comprises the steps of feeding detection and aluminum foil pretreatment, wherein during feeding, whether an aluminum foil, an LED luminous chip and a protection resistor meet the feeding standard or not is detected, the aluminum foil is pretreated into an aluminum foil circuit board comprising an anode aluminum foil, a cathode aluminum foil and an aluminum foil carrier, copper is plated on the anode aluminum foil, the cathode aluminum foil and the aluminum foil carrier to form conductive pads, and silver is plated in the conductive pads;
step 2: mounting an LED light-emitting chip and a protective resistor, putting an aluminum foil circuit board into a eutectic machine, heating to 280 ℃ through a preheating zone and a heating zone in sequence, connecting the LED light-emitting chip and the protective resistor into a silver-plated conductive bonding pad on the aluminum foil circuit board in a mounting zone, eutectic fusion in the eutectic machine, and sending out the eutectic machine after passing through a cooling zone;
step 3: packaging, testing and packaging products, cutting off the space between the anode aluminum foil, the cathode aluminum foil and the aluminum foil bearing sheet of the cooled aluminum foil circuit board, packaging with transparent glue, heating and solidifying, cutting into a plurality of aluminum foil LED lamp strips, carrying out power-on test, marking and repairing defective products, coiling the aluminum foil LED lamp strips qualified in test, sealing and packaging, and labeling.
The invention is further improved, in the step 1, the method further comprises the following steps,
step 101: detecting whether the surfaces of the aluminum foil, the LED light-emitting chip and the protection resistor are clean and intact during feeding;
step 102: when the surfaces of the aluminum foil, the LED light-emitting chip and the protection resistor are clean and intact, detecting whether the size specifications of the aluminum foil, the LED light-emitting chip and the protection resistor meet the feeding standard or not;
step 103: when the size specifications of the aluminum foil, the LED light-emitting chip and the protection resistor are detected to meet the feeding standard, the aluminum foil is cut or stamped into an anode aluminum foil, a cathode aluminum foil and an aluminum foil carrier sheet;
step 104: and plating copper on the anode aluminum foil, the cathode aluminum foil and the aluminum foil carrier to form conductive pads, and plating silver in the conductive pads.
The invention is further improved, in the step 3, the method further comprises the following steps,
step 301: silica gel with heat resistance higher than 260 ℃ and fluorescent powder are selected and uniformly stirred according to a proportion to prepare light-transmitting glue;
step 302: cutting the cooled positive aluminum foil and the aluminum foil carrier sheet of the aluminum foil circuit board and the cooled negative aluminum foil and the aluminum foil carrier sheet by laser;
step 303: placing the prepared light-transmitting glue and the cut aluminum foil circuit board on a glue dispenser for glue dispensing, and baking the glue by an oven to fully solidify the glue to form a glue sealing layer;
step 304: cutting the baked product into a plurality of aluminum foil LED lamp strips by using laser, putting the aluminum foil LED lamp strips on a power supply test frame for lighting test, marking defective products and repairing the defective products;
step 305: and (3) rolling up the aluminum foil LED lamp strip which is qualified in test by using a reel machine, sealing and packaging the rolled aluminum foil LED lamp strip by using a sealing bag, and labeling.
The invention is further improved, in the steps 101 and 102, when the surfaces of the aluminum foil, the LED light-emitting chip and the protection resistor are detected to be unclean or defective, or the size specifications of the aluminum foil, the LED light-emitting chip and the protection resistor do not meet the feeding standard, the aluminum foil, the LED light-emitting chip and the protection resistor, the surfaces of which are unclean or defective or do not meet the feeding standard, are removed.
The invention is further improved in that in step 103, the aluminum foil carrier sheets are separated from each other by cutting, and the positive aluminum foil and the aluminum foil carrier sheets, and the negative aluminum foil and the aluminum foil carrier sheets are not separated from each other.
In the step 104, each aluminum foil carrier is provided with 2 silver-plated conductive pads, the positive aluminum foil is provided with at least 1 silver-plated conductive pad, and the negative aluminum foil is provided with at least 1 silver-plated conductive pad.
According to a further improvement of the present invention, in the step 301, the light-transmitting glue may be modulated into any color, so that the LED light-emitting chip can emit light with different colors, and nano-scale titanium dioxide powder can be added into the light-transmitting glue according to different application requirements.
The invention is further improved in that in said step 303, the cross section of the sealing glue layer is circular or elliptical.
According to the invention, in the step 2, the eutectic machine is sequentially provided with a preheating zone, a heating zone, a surface mounting zone and a cooling zone, and a conveyor belt in the eutectic machine can drive an aluminum foil circuit board to sequentially pass through the preheating zone, the heating zone, the surface mounting zone and the cooling zone.
According to the invention, in the steps 1, 2 and 3, the width of the aluminum foil is 110cm, the widths of the aluminum foil circuit board and the aluminum foil LED lamp strips are 2cm, and the eutectic machine can simultaneously produce at most 55 aluminum foil LED lamp strips at one time.
The beneficial effects of the invention are as follows: according to the manufacturing method of the aluminum foil LED lamp strip, the aluminum foil is used as the carrier of the LED light-emitting chip by producing the aluminum foil LED lamp strip, the structure is simple, all the LED light-emitting chips directly use the aluminum foil as the circuit carrier, the circuit for conducting is wide, the influence of voltage drop is reduced to the minimum, and the brightness of the LED light-emitting chip is uniform; the circuit is directly formed by cutting the aluminum foil by laser without etching the circuit, and the positive aluminum foil, the negative aluminum foil and the aluminum foil bearing sheet form the circuit, so that the production cost is low; the LED patch is directly subjected to eutectic fusion in a eutectic machine without spot soldering on an aluminum foil, and then is formed by laser cutting, so that the production efficiency is high; the aluminum foil circuit board has much better heat dissipation performance than flexible organic materials, and solves the problems of uneven brightness, poor heat dissipation, relatively narrow circuit, easy burning out and low spot soldering production efficiency of an LED light-emitting chip caused by obvious pressure drop of an FPC lamp strip in the prior art.
Drawings
FIG. 1 is a flow chart of a method of manufacturing an aluminum foil LED lamp strip of the present invention;
FIG. 2 is a flow chart of a method of manufacturing an aluminum foil LED lamp strip according to the present invention;
fig. 3 is a flowchart of a method for manufacturing an aluminum foil LED lamp strip according to the present invention.
Detailed Description
The invention will be described in further detail with reference to the drawings and examples.
Referring to fig. 1-3, the manufacturing method of the aluminum foil LED lamp strip of the present invention comprises the following steps:
step 1: and (3) feeding detection and aluminum foil pretreatment, wherein during feeding, whether the aluminum foil, the LED light-emitting chip and the protection resistor meet the feeding standard or not is detected, the aluminum foil is pretreated into an aluminum foil circuit board containing an anode aluminum foil, a cathode aluminum foil and an aluminum foil carrier, the anode aluminum foil, the cathode aluminum foil and the aluminum foil carrier are plated with copper respectively to form conductive bonding pads, and silver is plated in the conductive bonding pads. In the embodiment, aluminum foil is used as a carrier of the LED light-emitting chips, the structure is simple, all the LED light-emitting chips directly use aluminum foil as a circuit carrier, the circuit for conducting is wide, the influence of voltage drop is reduced to the minimum, and the brightness of the LED light-emitting chips is uniform; the circuit is directly formed by cutting the aluminum foil by laser without etching the circuit, and the positive aluminum foil, the negative aluminum foil and the aluminum foil bearing sheet form the circuit, so that the production cost is low; the LED patch is directly subjected to eutectic fusion in a eutectic machine without spot soldering on an aluminum foil, and then is formed by laser cutting, so that the production efficiency is high; the heat radiation performance of the aluminum foil circuit board is much better than that of the flexible organic material, and the price of the aluminum foil is much cheaper than that of the organic material of the strip-shaped flexible circuit board, so that the aluminum foil circuit board has greatly reduced production cost compared with that of the FPC lamp strip; the surface of the aluminum foil can be rapidly and naturally oxidized to form an insulating aluminum oxide protective film, so that the service life of the aluminum foil LED lamp strip can be prolonged in an anti-corrosion manner, and the safety of the aluminum foil LED lamp strip can be improved.
Step 2: mounting an LED light-emitting chip and a protective resistor, putting an aluminum foil circuit board into a eutectic machine, heating to 280 ℃ through a preheating zone and a heating zone in sequence, connecting the LED light-emitting chip and the protective resistor into a silver-plated conductive bonding pad on the aluminum foil circuit board in a mounting zone, eutectic fusion in the eutectic machine, and sending out the eutectic machine after passing through a cooling zone; the eutectic machine is provided with a preheating zone, a heating zone, a paster zone and a cooling zone in sequence, and a conveyor belt in the eutectic machine can drive an aluminum foil circuit board to pass through the preheating zone, the heating zone, the paster zone and the cooling zone in sequence.
Step 3: packaging, testing and packaging products, cutting off the space between the anode aluminum foil, the cathode aluminum foil and the aluminum foil bearing sheet of the cooled aluminum foil circuit board, packaging with transparent glue, heating for solidification, cutting into a plurality of aluminum foil LED lamp strips, carrying out power-on test, marking and repairing defective products, coiling the aluminum foil LED lamp strips qualified in test, sealing, packaging and labeling; the width of the aluminum foil is 110cm, the widths of the aluminum foil circuit board and the aluminum foil LED lamp strips are 2cm, and the eutectic machine can simultaneously produce at most 55 aluminum foil LED lamp strips at one time. In the embodiment, the circuit of the aluminum foil LED lamp strip is formed by directly forming a positive aluminum foil, a negative aluminum foil and an aluminum foil bearing sheet by laser cutting of the aluminum foil without etching, so that the production cost is low and the production efficiency is high.
Eutectic refers to an alloy liquid of a composition that cools, solidifies, crystallizes into a mixture of two or more dense crystals at the eutectic reaction temperature. The simple binary alloy can be represented by the general formula La+beta. The alloy structure deviating from the eutectic composition is hypoeutectic or hypereutectic. The eutectic adopts the mutual excitation nuclei, dendritic first eutectic structures are separated out from the liquid, then the liquid among dendrites is solidified into eutectic structures, and the eutectic structures alternately grow through branch bridging to form lamellar; the eutectic structure is formed by short-range separation, diffusion and growth, and is typically lamellar or rod-shaped; the shape of the added tissue is strip-shaped, punctiform or spiral; atypical eutectic is two independent nucleation interface junctions related to the growth mode, and has primary compatibility and easy generation of off-eutectic, namely, one phase in the eutectic grows around the primary phase in an isolated way, and the eutectic alloy has low melting point and is easy to flow and cast; the pressure processing and welding performance are poor, and the cutting performance is good.
Eutectic machines refer to the phenomenon that eutectic solder fuses at relatively low temperatures, and the eutectic alloy changes directly from a solid state to a liquid state, without going through a plastic stage, and is a liquid state and simultaneously generates two solid equilibrium reactions. Its melting temperature is called eutectic temperature. The most critical of the eutectic welding technology is the selection of the eutectic material and the control of the welding temperature. The bottom of the crystal grain of the new generation of InGaN high-brightness LED can be plated with pure tin (Sn) or gold-tin (Au-Sn) alloy as a contact surface, and the crystal grain can be welded on a substrate plated with gold or silver. When the substrate is heated to a suitable eutectic temperature, the gold or silver element penetrates the gold-tin alloy layer, and the change in composition of the alloy layer increases the melting point, solidifying the eutectic layer and firmly soldering the LED to the heat sink or substrate. When considering the eutectic die bonder, besides high position accuracy, another important condition is flexible and stable temperature control, and the addition of nitrogen or mixed gas devices is beneficial to the oxidation protection in the eutectic process. Of course, as the silver paste die bonding, the die bonding with high precision is achieved, and the welding head movement and welding force control are just right only by means of strict mechanical design and high-precision motor movement, so that the requirements of high productivity and high yield are not damaged. In this embodiment, the power supply pins of the LED light emitting chip are tin or tin alloy, and can be fused with copper and silver eutectic in the conductive bonding pad.
Referring to fig. 2, in step 1, the method further includes the following steps,
step 101: detecting whether the surfaces of the aluminum foil, the LED light-emitting chip and the protection resistor are clean and intact during feeding; when the surfaces of the aluminum foil, the LED light-emitting chip and the protection resistor are detected to be unclean or defective, the aluminum foil, the LED light-emitting chip and the protection resistor with the unclean or defective surfaces are removed.
Step 102: when the surfaces of the aluminum foil, the LED light-emitting chip and the protection resistor are clean and intact, detecting whether the size specifications of the aluminum foil, the LED light-emitting chip and the protection resistor meet the feeding standard or not; when the aluminum foil, the LED light-emitting chip and the protection resistor are detected to be out of compliance with the feeding standard, the aluminum foil, the LED light-emitting chip and the protection resistor, the size specifications of which are out of compliance with the feeding standard, are removed.
Step 103: when the size specifications of the aluminum foil, the LED light-emitting chip and the protection resistor are detected to meet the feeding standard, the aluminum foil is cut or stamped into an anode aluminum foil, a cathode aluminum foil and an aluminum foil carrier sheet; the aluminum foil carrier sheets are mutually cut off and separated, and the positive aluminum foil and the aluminum foil carrier sheets and the negative aluminum foil and the aluminum foil carrier sheets are not cut off.
Step 104: and plating copper on the positive aluminum foil, the negative aluminum foil and the aluminum foil carrier sheets respectively to form conductive pads, and plating silver in the conductive pads, wherein each aluminum foil carrier sheet is provided with 2 silver-plated conductive pads, the positive aluminum foil is at least provided with 1 silver-plated conductive pad, and the negative aluminum foil is at least provided with 1 silver-plated conductive pad.
Referring to fig. 3, in step 3, further steps are included,
step 301: silica gel with heat resistance higher than 260 ℃ and fluorescent powder are selected and uniformly stirred according to a proportion to prepare light-transmitting glue; the transparent glue can be modulated into any color, the LED light-emitting chips can emit light with different colors, nano-scale titanium dioxide powder can be added into the transparent glue according to different application requirements, nano-scale titanium dioxide white particle powder is mixed in the transparent glue, and the refractive index of the sealing glue layer can be improved to increase the brightness of the aluminum foil LED lamp strip. Wherein, silica gel (Silica; silica) alias is a high activity adsorption material, belongs to amorphous substance, and has a chemical molecular formula of mSiO2.nH2O; besides strong alkali and hydrofluoric acid, the silica gel does not react with any substance, is insoluble in water and any solvent, is nontoxic and odorless, has stable chemical property, forms different microporous structures due to different manufacturing methods, has the characteristics of difficult substitution of a plurality of other similar materials due to the chemical components and the physical structure of the silica gel, and has the advantages of high adsorption performance, good thermal stability, stable chemical property, higher mechanical strength and the like. In the embodiment, the silica gel containing fluorescent powder is adopted to prepare the light-transmitting glue, so that the service life and the safety of the aluminum foil LED lamp strip can be prolonged, and meanwhile, the brightness of the LED light-emitting chip can be more uniform.
Step 302: cutting the cooled positive aluminum foil and the aluminum foil carrier sheet of the aluminum foil circuit board and the cooled negative aluminum foil and the aluminum foil carrier sheet by laser.
Step 303: placing the prepared light-transmitting glue and the cut aluminum foil circuit board on a glue dispenser for glue dispensing, and baking the glue by an oven to fully solidify the glue to form a glue sealing layer; the cross section of the sealing adhesive layer is round or oval.
Step 304: cutting the baked product into a plurality of aluminum foil LED lamp strips by using laser, putting the aluminum foil LED lamp strips on a power supply test frame for lighting test, and marking and repairing defective products.
Step 305: and (3) rolling up the aluminum foil LED lamp strip which is qualified in test by using a reel machine, sealing and packaging the rolled aluminum foil LED lamp strip by using a sealing bag, and labeling.
From the above, the beneficial effects of the invention are as follows: the invention provides a manufacturing method of an aluminum foil LED lamp strip, which is characterized in that an aluminum foil is used as a carrier of an LED light-emitting chip by producing the aluminum foil LED lamp strip, the structure is simple, all the LED light-emitting chips directly use the aluminum foil as a circuit carrier, the circuit for conducting is wide, the influence of voltage drop is reduced to the minimum, and the brightness of the LED light-emitting chip is uniform; the circuit is directly formed by cutting the aluminum foil by laser without etching the circuit, and the positive aluminum foil, the negative aluminum foil and the aluminum foil bearing sheet form the circuit, so that the production cost is low; the LED patch is directly subjected to eutectic fusion in a eutectic machine without spot soldering on an aluminum foil, and then is formed by laser cutting, so that the production efficiency is high; the aluminum foil circuit board has much better heat dissipation performance than flexible organic materials, and solves the problems of uneven brightness, poor heat dissipation, relatively narrow circuit, easy burning out and low spot soldering production efficiency of an LED light-emitting chip caused by obvious pressure drop of an FPC lamp strip in the prior art.
The above embodiments are preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, which includes but is not limited to the embodiments, and equivalent modifications according to the present invention are within the scope of the present invention.
Claims (10)
1. A manufacturing method of an aluminum foil LED lamp strip is characterized by comprising the following steps,
step 1: the method comprises the steps of feeding detection and aluminum foil pretreatment, wherein during feeding, whether an aluminum foil, an LED luminous chip and a protection resistor meet the feeding standard or not is detected, the aluminum foil is pretreated into an aluminum foil circuit board comprising an anode aluminum foil, a cathode aluminum foil and an aluminum foil carrier, copper is plated on the anode aluminum foil, the cathode aluminum foil and the aluminum foil carrier to form conductive pads, and silver is plated in the conductive pads;
step 2: mounting an LED light-emitting chip and a protective resistor, putting an aluminum foil circuit board into a eutectic machine, heating to 280 ℃ through a preheating zone and a heating zone in sequence, connecting the LED light-emitting chip and the protective resistor into a silver-plated conductive bonding pad on the aluminum foil circuit board in a mounting zone, eutectic fusion in the eutectic machine, and sending out the eutectic machine after passing through a cooling zone;
step 3: packaging, testing and packaging products, cutting off the space between the anode aluminum foil, the cathode aluminum foil and the aluminum foil bearing sheet of the cooled aluminum foil circuit board, packaging with transparent glue, heating and solidifying, cutting into a plurality of aluminum foil LED lamp strips, carrying out power-on test, marking and repairing defective products, coiling the aluminum foil LED lamp strips qualified in test, sealing and packaging, and labeling.
2. The method for manufacturing an aluminum foil LED lamp strip according to claim 1, further comprising the step of, in the step 1,
step 101: detecting whether the surfaces of the aluminum foil, the LED light-emitting chip and the protection resistor are clean and intact during feeding;
step 102: when the surfaces of the aluminum foil, the LED light-emitting chip and the protection resistor are clean and intact, detecting whether the size specifications of the aluminum foil, the LED light-emitting chip and the protection resistor meet the feeding standard or not;
step 103: when the size specifications of the aluminum foil, the LED light-emitting chip and the protection resistor are detected to meet the feeding standard, the aluminum foil is cut or stamped into an anode aluminum foil, a cathode aluminum foil and an aluminum foil carrier sheet;
step 104: and plating copper on the anode aluminum foil, the cathode aluminum foil and the aluminum foil carrier to form conductive pads, and plating silver in the conductive pads.
3. The method for manufacturing an aluminum foil LED lamp strip according to claim 2, further comprising the step of, in the step 3,
step 301: silica gel with heat resistance higher than 260 ℃ and fluorescent powder are selected and uniformly stirred according to a proportion to prepare light-transmitting glue;
step 302: cutting the cooled positive aluminum foil and the aluminum foil carrier sheet of the aluminum foil circuit board and the cooled negative aluminum foil and the aluminum foil carrier sheet by laser;
step 303: placing the prepared light-transmitting glue and the cut aluminum foil circuit board on a glue dispenser for glue dispensing, and baking the glue by an oven to fully solidify the glue to form a glue sealing layer;
step 304: cutting the baked product into a plurality of aluminum foil LED lamp strips by using laser, putting the aluminum foil LED lamp strips on a power supply test frame for lighting test, marking defective products and repairing the defective products;
step 305: and (3) rolling up the aluminum foil LED lamp strip which is qualified in test by using a reel machine, sealing and packaging the rolled aluminum foil LED lamp strip by using a sealing bag, and labeling.
4. The method for manufacturing the aluminum foil LED lamp strip according to claim 3, wherein: in the steps 101 and 102, when the surface of the aluminum foil, the LED light emitting chip and the protection resistor is not clean or defective, or the size specifications of the aluminum foil, the LED light emitting chip and the protection resistor are not in conformity with the feeding standard, the aluminum foil, the LED light emitting chip and the protection resistor with the surface not clean or defective or not in conformity with the feeding standard are removed.
5. The method for manufacturing the aluminum foil LED lamp strip according to claim 4, wherein: in step 103, the aluminum foil carrier sheets are separated from each other in a cutting way, and the positive aluminum foil and the aluminum foil carrier sheets, and the negative aluminum foil and the aluminum foil carrier sheets are not separated from each other.
6. The method for manufacturing the aluminum foil LED lamp strip according to claim 5, wherein: in step 104, each aluminum foil carrier is provided with 2 silver-plated conductive pads, the positive aluminum foil is provided with at least 1 silver-plated conductive pad, and the negative aluminum foil is provided with at least 1 silver-plated conductive pad.
7. The method for manufacturing the aluminum foil LED lamp strip according to claim 6, wherein: in step 301, the transparent glue may be modulated into any color, so that the LED light-emitting chip can emit light with different colors, and nano-scale titanium dioxide powder can be added into the transparent glue according to different application requirements.
8. The method for manufacturing the aluminum foil LED lamp strip according to claim 7, wherein: in the step 303, the cross section of the sealant layer is circular or elliptical.
9. The method for manufacturing the aluminum foil LED lamp strip according to claim 8, wherein: in the step 2, the eutectic machine is provided with a preheating zone, a heating zone, a paster zone and a cooling zone in sequence, and a conveyor belt in the eutectic machine can drive an aluminum foil circuit board to pass through the preheating zone, the heating zone, the paster zone and the cooling zone in sequence.
10. The method for manufacturing the aluminum foil LED lamp strip according to claim 9, wherein: in the steps 1, 2 and 3, the width of the aluminum foil is 110cm, the widths of the aluminum foil circuit board and the aluminum foil LED lamp strips are 2cm, and the eutectic machine can simultaneously produce at most 55 aluminum foil LED lamp strips at a time.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310846646.0A CN116885057A (en) | 2023-07-11 | 2023-07-11 | Manufacturing method of aluminum foil LED lamp strip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310846646.0A CN116885057A (en) | 2023-07-11 | 2023-07-11 | Manufacturing method of aluminum foil LED lamp strip |
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| CN116885057A true CN116885057A (en) | 2023-10-13 |
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| CN202310846646.0A Pending CN116885057A (en) | 2023-07-11 | 2023-07-11 | Manufacturing method of aluminum foil LED lamp strip |
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| CN (1) | CN116885057A (en) |
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- 2023-07-11 CN CN202310846646.0A patent/CN116885057A/en active Pending
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