CN116734202A - Aluminum foil LED lamp strip - Google Patents
Aluminum foil LED lamp strip Download PDFInfo
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- CN116734202A CN116734202A CN202310830272.3A CN202310830272A CN116734202A CN 116734202 A CN116734202 A CN 116734202A CN 202310830272 A CN202310830272 A CN 202310830272A CN 116734202 A CN116734202 A CN 116734202A
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- aluminum foil
- aluminium foil
- led
- foil
- carrier
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 201
- 239000011888 foil Substances 0.000 title claims abstract description 201
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 199
- 239000003292 glue Substances 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims abstract description 9
- 239000005030 aluminium foil Substances 0.000 claims description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 8
- 229910002027 silica gel Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000003698 laser cutting Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005034 decoration Methods 0.000 description 7
- 239000011368 organic material Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 241001417935 Platycephalidae Species 0.000 description 1
- 241001417523 Plesiopidae Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
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- 238000002844 melting Methods 0.000 description 1
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- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The application provides an aluminum foil LED lamp strip, which comprises a plurality of aluminum foil LED lamp groups, wherein each aluminum foil LED lamp group comprises an aluminum foil circuit board and an LED chip, each aluminum foil circuit board comprises an anode aluminum foil, a cathode aluminum foil and an aluminum foil carrying piece, the anode aluminum foil, the cathode aluminum foil and the aluminum foil carrying pieces are not contacted with each other and are all provided with conductive pads, power supply pins of the LED chips are fixedly welded in the conductive pads, the anode aluminum foil, the cathode aluminum foil and the aluminum foil carrying pieces are communicated on a circuit through the LED chips, packaging transparent glue for sealing and fixing is arranged among the anode aluminum foil, the cathode aluminum foil, the aluminum foil carrying pieces and the LED chips, the anode aluminum foil can be connected with the anode of a power supply, and the cathode aluminum foil can be connected with the cathode of the power supply. The beneficial effects of the application are as follows: the aluminum foil is used as the carrier of the LED chip, the structure is simple, the brightness of the LED chip is uniform, the production cost is low, the heat dissipation is good, and the 360-degree two-sided light emission of the aluminum foil LED lamp strip can be realized.
Description
Technical Field
The application relates to the technical field of lamp strips, in particular to an aluminum foil LED lamp strip.
Background
The lamp strip is obtained by welding an LED lamp on a copper wire or a strip-shaped flexible circuit board by a special processing technology, and connecting a power supply to emit light. The lamp strip has been widely used in the fields of buildings, bridges, roads, gardens, courtyards, floors, ceilings, furniture, automobiles, ponds, water floors, advertisements, signboards, signs and the like as decorations or illumination, adding endless happy and holiday atmospheres to various festival activities such as christmas, hallowmas, morgans, easter joints, national celebrations and the like, taking five major markets of advertisements, decorations, buildings, businesses, gifts with a stubborn vitality, and selling a plurality of countries and regions, and is widely used in places of building profiles, bridges, guardrails, hotels, lin Yuan, dance halls, advertisement decorations.
The light strip welded on the strip-shaped flexible circuit board is called an FPC light strip, the FPC light strip is a light strip assembled by taking a flexible circuit board FPC as a carrier, because the FPC has flexibility and ultra-thin property, the application range is wider, the LEDs assembled on the FPC light strip are provided with a patch LED, a direct-insert LED and a flip-chip LED, the flip-chip LED is also called a COB, the patch LED has the sizes of 0603, 0805, 1206, 1210, 5050, 5060 and the like, and the colors are red, yellow, blue, green, white, yellow-green, purple, RGB seven colors and the like; the direct-insert LEDs comprise phi 3, phi 5, phi 6 and the like, have round heads and flat heads (commonly called straw hat lamps), have red, yellow, blue, green, white and the like, and the FPC lamp strip is mainly applied to places such as advertisement decoration, automobile decoration, home decoration and the like, and can also be applied to reflective vests and be used for some special purposes. The universal specification of the FPC light belt is 20cm long 8 LEDs, 30cm long 18 LEDs, 30cm long 24 LEDs, 50cm long 15 LEDs, 50cm long 24 LEDs, 50cm long 30 LEDs, 60cm and 80cm long, different users have different specifications, and the FPC light belt can be freely bent, folded and coiled in a three-dimensional space without breaking due to the fact that the FPC is soft, can be freely moved and stretched in the three-dimensional space, can be freely sheared, can be freely prolonged to emit light without being influenced, is suitable for being used in irregular places and places with small space, and is also suitable for being freely combined with various patterns in advertisement decoration due to the fact that the FPC light belt can be freely bent and coiled.
The existing FPC lamp strip production mode is that a circuit is etched on a flexible organic material to form a carrier, then an LED is attached to the carrier and then packaged by light-transmitting glue, and the etched circuit is narrower in line width due to the process, so that current limit is large, voltage drop is obvious, and the head-tail brightness difference of lamp beads on the lamp strip is large; and because the heat dispersion of flexible organic material and printing opacity glue is relatively poor, so FPC lamp area also relatively easily burns out this just narrower circuit in the use.
Disclosure of Invention
In order to solve the problems in the prior art, the aluminum foil LED lamp strip provided by the application uses aluminum foil as a carrier of an LED chip, has the advantages of simple structure, uniform brightness of the LED chip, low production cost and good heat dissipation, can realize 360-degree two-sided light emission of the aluminum foil LED lamp strip, and solves the problems that the LED chip is uneven in brightness, poor in heat dissipation and relatively narrow in circuit and easy to burn caused by obvious pressure drop of the FPC lamp strip in the prior art.
The aluminum foil LED lamp strip comprises a plurality of aluminum foil LED lamp groups which are sequentially connected, wherein each aluminum foil LED lamp group comprises an aluminum foil circuit board and a plurality of LED chips, each aluminum foil circuit board comprises an anode aluminum foil, a cathode aluminum foil and a plurality of aluminum foil carrier sheets, an aluminum foil carrier sheet array is arranged between the anode aluminum foil and the cathode aluminum foil, the anode aluminum foil, the cathode aluminum foil and the aluminum foil carrier sheets are not contacted with each other, each anode aluminum foil is provided with a conductive bonding pad, each cathode aluminum foil is provided with a conductive bonding pad, two conductive bonding pads are arranged on each aluminum foil carrier sheet, power supply pins of the LED chips are fixedly welded in the conductive bonding pads, the anode aluminum foil, the cathode aluminum foil, the LED chips, and the aluminum foil carrier sheets, are provided with packaging transparent glue for sealing and fixing, the anode aluminum foil can be connected with a power supply anode, the cathode aluminum foil can be connected with a power supply cathode, and the LED chips can be powered on when the anode aluminum foil and the anode aluminum foil can be powered on.
According to the application, the aluminum foil circuit board is further improved, and the whole aluminum foil is cut into the positive aluminum foil, the negative aluminum foil and a plurality of aluminum foil carrier sheets in a laser cutting mode.
According to the application, the overall shape of the positive aluminum foil and the negative aluminum foil is L-shaped or strip-shaped, the width of the positive aluminum foil is more than 0.5mm, and the width of the negative aluminum foil is more than 0.5mm.
According to the application, the thicknesses of the positive aluminum foil, the negative aluminum foil and the aluminum foil carrier are all more than 0.03mm and less than 0.1mm.
According to the application, a plurality of light-transmitting through holes are formed in the positive aluminum foil, the negative aluminum foil and the aluminum foil carrier.
According to the aluminum foil LED lamp group, the number of LED chips in the aluminum foil LED lamp group is 8, the number of power supply pins of each LED chip is 2, and each power supply pin is fixedly welded in different conductive bonding pads.
According to the application, the conductive bonding pad is a copper plating bonding pad, and the power supply pin is fixedly arranged on the conductive bonding pad in a tin soldering connection mode.
According to the application, a buffer protection resistor is further arranged in the aluminum foil LED lamp group, and the buffer protection resistor is connected with the LED chip in series.
The application is further improved, and the packaging transparent glue is made of epoxy resin or silica gel containing fluorescent powder.
Compared with the prior art, the application has the beneficial effects that: the application provides an aluminum foil LED lamp strip, which uses aluminum foil as a carrier of LED chips through an aluminum foil circuit board and a plurality of LED chips which are matched with each other, has a simple structure, and all the LED chips directly use aluminum foil as a circuit carrier for conducting wires, so that the influence of voltage drop is reduced to the minimum, and the brightness of the LED chips is uniform; the circuit is directly formed by cutting the aluminum foil by laser without etching the circuit, and the positive aluminum foil, the negative aluminum foil and the aluminum foil bearing sheet form the circuit, so that the production cost is low; the anode aluminum foil, the cathode aluminum foil and the aluminum foil carrier can be provided with a plurality of light transmission through holes, and then the aluminum foil, the cathode aluminum foil and the aluminum foil carrier are packaged by packaging light transmission glue, so that the 360-degree two-sided light emission of the aluminum foil LED lamp strip can be realized; the aluminum foil circuit board has much better heat radiation performance than flexible organic materials, and solves the problems that the FPC lamp band voltage drop obviously causes uneven brightness of an LED chip, poor heat radiation and narrower circuit and is easy to burn in the prior art.
Drawings
In order to more clearly illustrate the application or the solutions of the prior art, a brief description will be given below of the drawings used in the description of the embodiments or the prior art, it being obvious that the drawings in the description below are some embodiments of the application and that other drawings can be obtained from them without the inventive effort of a person skilled in the art.
Fig. 1 is a diagram of an aluminum foil LED lamp group structure of an aluminum foil LED lamp strip of the present application.
In the figure, a 1-aluminum foil circuit board, a 11-positive aluminum foil, a 12-negative aluminum foil, a 13-aluminum foil carrier, a 14-conductive bonding pad, a 2-LED chip and a 21-power supply pin.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
In order to make the person skilled in the art better understand the solution of the present application, the technical solution of the embodiment of the present application will be clearly and completely described below with reference to the accompanying drawings.
As shown in fig. 1, the aluminum foil LED lamp strip provided by the application comprises a plurality of aluminum foil LED lamp groups which are sequentially connected, wherein the aluminum foil LED lamp groups comprise an aluminum foil circuit board 1 and a plurality of LED chips 2, the aluminum foil circuit board 1 comprises an anode aluminum foil 11, a cathode aluminum foil 12 and a plurality of aluminum foil carrier pieces 13, the aluminum foil carrier pieces 13 are arranged between the anode aluminum foil 11 and the cathode aluminum foil 12 in an array manner, the anode aluminum foil 11, the cathode aluminum foil 12 and the aluminum foil carrier pieces 13 are not contacted with each other, the anode aluminum foil 11 is provided with a conductive bonding pad 14, the cathode aluminum foil 12 is provided with a conductive bonding pad 14, the aluminum foil carrier pieces 13 are all provided with two conductive bonding pads 14, the power supply pins 21 of the LED chips 2 are fixedly welded in the conductive bonding pads 14, the anode aluminum foil 11, the cathode aluminum foil 12 and the aluminum foil carrier pieces 13 are communicated on a circuit through the LED chips 2, light-transmitting packaging glue for sealing and fixing is arranged between the anode aluminum foil 11, the cathode aluminum foil 12, the aluminum foil carrier pieces 13 and the LED chips 2, the anode aluminum foil 11 can be connected with a power supply anode, and the aluminum foil 12 can be connected with a power supply. In the embodiment, when the positive aluminum foil is connected with the positive electrode of the power supply and the negative aluminum foil is connected with the negative electrode of the power supply, the LED chip, the aluminum foil carrier, the positive aluminum foil, the negative aluminum foil and the power supply form a closed electrified loop, the LED chip can be electrified to emit light at the moment, the LED chip can also be replaced by an LED lamp bead or an LED or other luminous electric components, wherein the aluminum foil is used as a carrier of the LED chip, the structure is simple, all the LED chips directly use the aluminum foil as a circuit carrier, the circuit for conducting is wide, the influence of voltage drop is minimized, and the brightness of the LED chip is uniform; the heat radiation performance of the aluminum foil circuit board is much better than that of the flexible organic material, and the price of the aluminum foil is much cheaper than that of the organic material of the strip-shaped flexible circuit board, so that the aluminum foil circuit board has greatly reduced production cost compared with an FPC (flexible printed circuit) lamp strip; the surface of the aluminum foil can be rapidly and naturally oxidized to form an insulating aluminum oxide protective film, so that the service life of the aluminum foil LED lamp strip can be prolonged in an anti-corrosion manner, and the safety of the aluminum foil LED lamp strip can be improved.
As shown in fig. 1, the aluminum foil circuit board 1 is formed by cutting a complete aluminum foil into an anode aluminum foil 11, a cathode aluminum foil 12 and a plurality of aluminum foil carrier sheets 13 by means of laser cutting. In the embodiment, the circuit of the aluminum foil LED lamp strip is formed by directly forming a positive aluminum foil, a negative aluminum foil and an aluminum foil bearing sheet by laser cutting of the aluminum foil without etching, so that the production cost is low and the production efficiency is high.
As shown in fig. 1, the overall shapes of the positive aluminum foil 11 and the negative aluminum foil 12 are L-shaped or strip-shaped, the width of the positive aluminum foil 11 is larger than 0.5mm, the width of the negative aluminum foil 12 is larger than 0.5mm, and the thicknesses of the positive aluminum foil 11, the negative aluminum foil 12 and the aluminum foil carrier piece 13 are larger than 0.03mm and smaller than 0.1mm; the anode aluminum foil 11, the cathode aluminum foil 12 and the aluminum foil carrier 13 are all provided with a plurality of light transmission through holes, and the material of the packaging light transmission glue is epoxy resin or silica gel containing fluorescent powder. In the embodiment, the widths of the positive aluminum foil and the negative aluminum foil for conducting are both larger than 0.5mm, compared with a circuit etched on a flexible organic material by an FPC (flexible printed circuit) lamp strip, the width of the positive aluminum foil and the width of the negative aluminum foil are far wider, so that the current limit is small during conducting, the influence on the voltage drop of an LED chip is reduced to the minimum, and the brightness of the LED chip is uniform; and a plurality of printing opacity through-holes that anodal aluminium foil, negative pole aluminium foil and aluminium foil carrier piece were seted up can realize 360 two sides of aluminium foil LED lamp area and give out light, and not just one side of FPC lamp area gives out light, has promoted user's use experience by a wide margin. The epoxy resin is a high molecular polymer, the molecular formula is (C11H 12O 3) n, the epoxy resin is a generic name of a polymer containing more than two epoxy groups in the molecule, the epoxy resin is a polycondensation product of epichlorohydrin and bisphenol A or polyalcohol, and due to the chemical activity of the epoxy groups, the epoxy resin can be subjected to ring opening by using various compounds containing active hydrogen, and is solidified and crosslinked to form a network structure, so that the epoxy resin is a thermosetting resin and has the characteristics of good light transmittance, dust prevention, water prevention and insulation. Silica gel (Silica; silica alias: silica gel is a high-activity adsorption material, belongs to amorphous substances, and has a chemical formula of mSiO2.nH2O; besides strong alkali and hydrofluoric acid, the silica gel does not react with any substance, is insoluble in water and any solvent, is nontoxic and odorless, has stable chemical property, forms different microporous structures due to different manufacturing methods, has the characteristics of difficult substitution of a plurality of other similar materials due to the chemical components and the physical structure of the silica gel, and has the advantages of high adsorption performance, good thermal stability, stable chemical property, higher mechanical strength and the like. In this embodiment, epoxy resin or silica gel containing fluorescent powder is used as the material of the packaging transparent glue, so that the service life and safety of the aluminum foil LED lamp strip can be improved, and meanwhile, the brightness of the LED chip can be more uniform.
As shown in fig. 1, the number of LED chips 2 in the aluminum foil LED lamp group is 8, the number of power supply pins 21 of each LED chip 2 is 2, and each power supply pin 21 is fixedly welded in a different conductive bonding pad 14; the conductive pad 14 is a copper-plated pad, and the power supply pin 21 is fixedly arranged on the conductive pad 14 in a tin soldering connection mode; and a buffer protection resistor is also arranged in the aluminum foil LED lamp group, and the buffer protection resistor is connected with the LED chip in series. In the embodiment, each aluminum foil LED lamp group is provided with 8 3V LED chips which are in accordance with the market specification, and the aluminum foil LED lamp can work by directly using a 24V power supply, so that the aluminum foil LED lamp group is convenient to use and popularize; the conductive bonding pad is a copper plating bonding pad, namely copper is plated on the aluminum foil to serve as the conductive bonding pad, the power supply pin is directly welded in the conductive bonding pad in a soldering manner, the structure is stable and firm, the soldering manner is that a die bonder is adopted for hot melting die bonding, the production efficiency is high, the operation is simple, the process step of tin dropping is omitted, and the welding quality is stable; the buffer protection resistor is used for protecting the electric components and prevents the electric components from being burnt out due to overlarge current or abnormal current.
According to the aluminum foil LED lamp strip, the aluminum foil circuit board and the LED chips are matched with each other, the aluminum foil is used as a carrier of the LED chips, the structure is simple, all the LED chips directly use the aluminum foil as a circuit carrier, the circuit for conducting electricity is wide, the influence of voltage drop is reduced to the minimum, and the brightness of the LED chips is uniform; the circuit is directly formed by cutting the aluminum foil by laser without etching the circuit, and the positive aluminum foil, the negative aluminum foil and the aluminum foil bearing sheet form the circuit, so that the production cost is low; the anode aluminum foil, the cathode aluminum foil and the aluminum foil carrier can be provided with a plurality of light transmission through holes, and then the aluminum foil, the cathode aluminum foil and the aluminum foil carrier are packaged by packaging light transmission glue, so that the 360-degree two-sided light emission of the aluminum foil LED lamp strip can be realized; the aluminum foil circuit board has much better heat radiation performance than flexible organic materials, and solves the problems that the FPC lamp band voltage drop obviously causes uneven brightness of an LED chip, poor heat radiation and narrower circuit and is easy to burn in the prior art.
The above embodiments are preferred embodiments of the present application, and are not intended to limit the scope of the present application, which includes but is not limited to the embodiments, and equivalent modifications according to the present application are within the scope of the present application.
Claims (9)
1. An aluminium foil LED lamp area, its characterized in that: including a plurality of aluminium foil LED banks that connect gradually, aluminium foil LED banks includes aluminium foil circuit board and a plurality of LED chip, aluminium foil circuit board includes anodal aluminium foil, negative pole aluminium foil and a plurality of aluminium foil carrier, aluminium foil carrier array set up in anodal aluminium foil with between the negative pole aluminium foil, anodal aluminium foil the negative pole aluminium foil the aluminium foil carrier is mutual contactless, anodal aluminium foil is equipped with a conductive bonding pad, the negative pole aluminium foil is equipped with a conductive bonding pad, all be equipped with two conductive bonding pads on the aluminium foil carrier, the power supply foot fixed welding of LED chip is in the conductive bonding pad, anodal aluminium foil the negative pole aluminium foil the aluminium foil carrier passes through the LED chip communicates on the circuit, anodal aluminium foil the negative pole aluminium foil the aluminium foil carrier be equipped with the encapsulation printing opacity glue that is used for seal to fix between the LED chip, anodal aluminium foil can connect the power supply positive pole, the negative pole aluminium foil can connect the power supply negative pole, the LED chip can be in anodal aluminium foil when the negative pole power supply is luminous switch on.
2. The aluminum foil LED strip of claim 1, wherein: the aluminum foil circuit board is formed by cutting a complete aluminum foil into the positive aluminum foil, the negative aluminum foil and a plurality of aluminum foil carrier sheets in a laser cutting mode.
3. The aluminum foil LED strip of claim 2, wherein: the whole shape of the positive aluminum foil and the negative aluminum foil is L-shaped or strip-shaped, the width of the positive aluminum foil is larger than 0.5mm, and the width of the negative aluminum foil is larger than 0.5mm.
4. The aluminum foil LED strip of claim 3, wherein: the thicknesses of the positive aluminum foil, the negative aluminum foil and the aluminum foil carrier are all more than 0.03mm and less than 0.1mm.
5. The aluminum foil LED strip of claim 4, wherein: the positive aluminum foil, the negative aluminum foil and the aluminum foil carrier are all provided with a plurality of light-transmitting through holes.
6. The aluminum foil LED strip of claim 5, wherein: the number of LED chips in the aluminum foil LED lamp group is 8, the number of power supply pins of each LED chip is 2, and each power supply pin is fixedly welded in different conductive bonding pads respectively.
7. The aluminum foil LED strip of claim 6, wherein: the conductive bonding pad is a copper plating bonding pad, and the power supply pin is fixedly arranged on the conductive bonding pad in a tin soldering connection mode.
8. The aluminum foil LED strip of claim 7, wherein: and a buffer protection resistor is further arranged in the aluminum foil LED lamp group, and the buffer protection resistor is connected with the LED chip in series.
9. The aluminum foil LED strip of claim 8, wherein: the packaging transparent glue is made of epoxy resin or silica gel containing fluorescent powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310830272.3A CN116734202A (en) | 2023-07-07 | 2023-07-07 | Aluminum foil LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310830272.3A CN116734202A (en) | 2023-07-07 | 2023-07-07 | Aluminum foil LED lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116734202A true CN116734202A (en) | 2023-09-12 |
Family
ID=87908035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310830272.3A Pending CN116734202A (en) | 2023-07-07 | 2023-07-07 | Aluminum foil LED lamp strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116734202A (en) |
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2023
- 2023-07-07 CN CN202310830272.3A patent/CN116734202A/en active Pending
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