CN116880139A - Glue spreading developing device and control method thereof - Google Patents

Glue spreading developing device and control method thereof Download PDF

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Publication number
CN116880139A
CN116880139A CN202310848172.3A CN202310848172A CN116880139A CN 116880139 A CN116880139 A CN 116880139A CN 202310848172 A CN202310848172 A CN 202310848172A CN 116880139 A CN116880139 A CN 116880139A
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China
Prior art keywords
wafer
box
cassette
manipulator
module
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Pending
Application number
CN202310848172.3A
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Chinese (zh)
Inventor
张建
陈兴隆
曲征辉
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Kingsemi Co ltd
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Kingsemi Co ltd
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Priority to CN202310848172.3A priority Critical patent/CN116880139A/en
Publication of CN116880139A publication Critical patent/CN116880139A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/905—Control arrangements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0235—Containers
    • B65G2201/025—Boxes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a photoresist coating and developing device and a control method thereof, wherein the device is applied to a photoresist coating and developing process scene of a wafer and comprises a wafer box module and a process module which are connected with each other; the wafer box module is provided with rotary wafer box loading units and interlayer manipulators, N rotary wafer box loading units are symmetrically distributed on two sides of the interlayer manipulators about symmetry axes, N is an integer which is arbitrarily larger than 1, and the symmetry axes are positioned on straight lines pointing to the process module from the wafer box module; the rotary type wafer box loading unit is used for loading the wafer conveying box; the interlayer manipulator is used for sending the wafer into the wafer transfer box or taking the wafer out of the wafer transfer box; the process module comprises a plurality of vertically arranged process layers, wherein each process layer is internally provided with an intra-layer manipulator and a plurality of process units; the in-layer manipulator is used for bearing the wafer and driving the wafer to move so as to enable the wafer to pass through different process units. The device is used for improving the productivity of the gluing and developing process.

Description

Glue spreading developing device and control method thereof
Technical Field
The invention relates to the field of wafer processing, in particular to a glue spreading and developing device and a control method thereof.
Background
In the existing photoetching process for semiconductor processing, photoresist coating process flow, photoetching process flow and developing process flow are respectively completed by photoresist coating equipment, photoetching equipment and developing equipment. With the improvement of the semiconductor processing technology level, the market mainstream connects the photoresist coating and developing device and the photolithography device together to complete the whole set of photolithography process flow, wherein the photoresist coating process flow and the developing process flow are generally integrated on the same device, and the capacity of the photoresist coating and developing device is required to be larger than that of the photolithography device.
At present, wafers in a photoresist coating and developing device are stored in a rotary wafer box loading unit (load port) when the process is not performed, and because the rotary wafer box loading unit in the prior art is far away from a process layer, the stroke of a manipulator is large when the manipulator conveys the wafers back and forth, the consumed time is long, and therefore, the productivity of the photoresist coating and developing device is insufficient. Accordingly, there is a need for a new gumming developing apparatus and a control method thereof to improve the above-mentioned problems.
Disclosure of Invention
The invention aims to provide a glue coating and developing device and a control method thereof, wherein the device is used for improving the productivity of a glue coating and developing process.
In a first aspect, the present invention provides a photoresist coating and developing apparatus, applied to a photoresist coating and developing process scenario of a wafer, including a wafer box module and a process module connected to each other; the wafer box module is provided with rotary wafer box loading units and interlayer manipulators, N rotary wafer box loading units are symmetrically distributed on two sides of the interlayer manipulators about symmetry axes, N is an integer which is arbitrarily larger than 1, and the symmetry axes are positioned on straight lines pointing to the process module from the wafer box module; the rotary type wafer box loading unit is used for loading the wafer conveying box; the interlayer manipulator is used for sending the wafer into the wafer transfer box or taking the wafer out of the wafer transfer box; the process module comprises a plurality of vertically arranged process layers, wherein each process layer is internally provided with an intra-layer manipulator and a plurality of process units; the in-layer manipulator is used for bearing the wafer and driving the wafer to move so as to enable the wafer to pass through different process units.
The method has the beneficial effects that: the N rotary type wafer box loading units are symmetrically distributed on the two sides of the interlayer mechanical arm about the symmetry axis, so that the interlayer mechanical arm can conveniently and directly take the wafers to be processed from the rotary type wafer box loading units, and the interlayer mechanical arm can conveniently put the processed wafers into the rotary type wafer box loading units. The invention shortens the travel of the interlayer manipulator when conveying the wafers back and forth, and consumes short time, thereby being beneficial to improving the productivity of the gluing and developing equipment.
Optionally, a wafer cassette buffer position and a wafer cassette manipulator are also arranged in the wafer cassette module; the wafer box buffer memory is used for loading a wafer transfer box; the wafer cassette manipulator is used for transferring the wafer transfer cassette from the wafer cassette cache position to the rotary wafer cassette loading unit or transferring the wafer transfer cassette from the rotary wafer cassette loading unit to the wafer cassette cache position.
Optionally, the device further comprises a wall penetrating unit, wherein a first end of the wall penetrating unit is arranged in the wafer box module, and a second end of the wall penetrating unit is arranged in the process module; the wall penetrating units are arranged in one-to-one correspondence with the process layers; each wall penetrating unit comprises a first wall penetrating manipulator and a second wall penetrating manipulator, and the first wall penetrating manipulator and the second wall penetrating manipulator in the same wall penetrating unit are used for reversely conveying wafers.
Optionally, the interlayer robot is configured to send the wafer in the wafer transfer box to a first wall-penetrating robot, where the first wall-penetrating robot is configured to transfer the wafer to a process module; or the second through-wall manipulator is used for transmitting the wafer to the wafer box module; the interlayer robot is used for conveying the wafer from the second through-wall robot into the second wafer conveying box.
Optionally, the N rotary type cartridge loading units include a first rotary type cartridge loading unit and a second rotary type cartridge loading unit; the number of the first rotary type wafer box loading units is 2, the first rotary type wafer box loading units are symmetrically distributed on two sides of the interlayer manipulator about a symmetry axis, and a first wafer conveying box is loaded on the first rotary type wafer box loading units; the interlayer manipulator is used for conveying the wafers in the first wafer conveying box to the first wall penetrating manipulator; the number of the second rotary type wafer box loading units is 2, the second rotary type wafer box loading units are symmetrically distributed on two sides of the interlayer manipulator about a symmetry axis, and a second wafer conveying box is loaded on the second rotary type wafer box loading units; the interlayer manipulator is used for conveying the wafers in the second wafer conveying box to the second wall penetrating manipulator.
Optionally, the interlayer manipulator and the intra-layer manipulator are provided with a plurality of end effectors; when the wafer is grabbed, a plurality of end effectors positioned on the same side of the symmetry axis are close to each other; when the wafer is released, a plurality of end effectors positioned on the same side of the symmetry axis are far away from each other; when the wafer is taken out of the process unit or the round transfer box, the end effectors positioned on different sides of the symmetry axis are close to each other; the end effectors located on different sides of the axis of symmetry are remote from each other when wafers are fed into the process unit or the pod.
Optionally, the number of the end effectors is 4, and the 4 end effectors are symmetrically arranged at two sides of the symmetry axis.
Optionally, the rotary type wafer box loading unit comprises a carrier and a rotating plate which are movably connected; the carrying platform is relatively fixed with the wafer box window; the rotating plate is used for driving the wafer conveying box to rotate relative to the carrying platform.
Optionally, a window plate is slidably connected to the window of the wafer box; when the wafer box manipulator drives the wafer transfer box to pass through the wafer box window, the window plate slides to an open state; when the wafer box manipulator drives the wafer to be conveyed away from the wafer box window, the window plate slides to a closed state.
In a second aspect, the present invention provides a control method of a gumming developing apparatus, applied to the gumming developing apparatus as set forth in any one of the first aspects, comprising: s1, controlling an interlayer manipulator in a wafer box module, and taking out wafers in a wafer conveying box; s2, controlling an in-layer manipulator in the process module to bear the wafer and drive the wafer to move so as to enable the wafer to pass through different process units; controlling different process units to process the wafer; s3, controlling an interlayer manipulator in the wafer box module to send the processed wafers into the wafer conveying box.
Optionally, before the first execution of the interlayer robot in the control box module takes out the wafers in the wafer transfer box, the method further comprises: and controlling the wafer cassette manipulator to transfer the wafer transfer cassette from the cassette cache position to the rotary cassette loading unit.
Optionally, after the processed wafer is sent into the wafer transfer box by the interlayer manipulator in the control box module, the control box module further comprises: judging whether the wafer conveying box is full of wafers or not; when the wafer transfer box is full of wafers, the wafer transfer box is controlled by a box manipulator to be transferred from the rotary box loading unit to a box caching position.
Drawings
Fig. 1 is a schematic top view of a gumming developing apparatus provided with 8 heat treatment units and 6 liquid treatment units according to the present invention;
fig. 2 is a schematic top view of a gumming developing apparatus provided with 6 heat treatment units and 4 liquid treatment units according to the present invention;
fig. 3 is a schematic perspective view of a cartridge module of a glue developing apparatus according to the present invention;
fig. 4 is a schematic flow chart of a control method of a glue spreading and developing device provided by the invention.
Reference numerals in the drawings:
1. a cassette module; 101. a cassette buffer location; 102. a rotary cassette loading unit; 1021. a carrier; 1022. a rotating plate; 1023. a connecting pin; 1024. a window panel; 103. a cassette manipulator; 104. a cassette window; 105. a wall penetrating window; 106. an interlayer window; 107. a partition plate; 2. a process module; 201. a heat treatment unit; 202. a liquid treatment unit; 203. an interlayer manipulator; 301. a wafer transfer box; 311. a first end effector; 312. a second end effector; 313. a third end effector; 314. and a fourth end effector.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items.
Aiming at the problems in the prior art, as shown in fig. 1-3, the invention provides a photoresist coating and developing device which is applied to a photoresist coating and developing process scene of a wafer and comprises a wafer box module 1 and a process module 2 which are connected with each other; the process module 2 is arranged in the first direction of the wafer box module 1; the cassette module 1 is provided with a rotary cassette loading unit 102 and an interlayer robot 203. The symmetry axis is directed from the cassette module 1 to the process module 2 along a first direction; the rotary cassette loading unit 102 is used for loading a wafer cassette 301; the interlayer robot 203 is used for sending the wafer into the wafer transfer box 301 or taking the wafer out of the wafer transfer box 301; the process module 2 comprises 3 process layers arranged vertically.
Referring to fig. 1, in particular, each process layer is provided with an in-layer manipulator and a process unit. The in-layer manipulator is used for bearing the wafer and driving the wafer to move so as to enable the wafer to pass through different process units. The process unit comprises 8 heat treatment units 201 and 6 liquid treatment units 202 which are symmetrical about an axis of symmetry; wherein, 4 heat treatment units 201 are arranged in the first direction of the 6 liquid treatment units 202, and the other 4 heat treatment units 201 are arranged in the second direction of the 6 liquid treatment units 202. The second direction is the opposite direction of the first direction.
Referring to fig. 2, in other embodiments, the process units include 6 heat treatment units 201 and 4 liquid treatment units 202 that are symmetrical about an axis of symmetry; wherein 2 heat treatment units 201 are arranged in a first direction of the 4 liquid treatment units 202, and the other 4 heat treatment units 201 are arranged in a second direction of the 4 liquid treatment units 202.
In still other specific embodiments, the 2 rotary cassette loading units 102 are symmetrically distributed on both sides of the interlayer robot 203 about a symmetry axis; in still other specific embodiments, the 4 rotary cassette loading units 102 are symmetrically distributed on both sides of the interlayer robot 203 about an axis of symmetry; it should be noted that the number of rotary cassette loading units 102 may be any positive integer.
It should be noted that, in this embodiment, N rotary type wafer box loading units 102 may be symmetrically disposed on two sides of the interlayer mechanical arm 203 about a symmetry axis, where N is any positive integer, so that the interlayer mechanical arm 203 can directly take the wafer to be processed from the rotary type wafer box loading unit 102, and the interlayer mechanical arm 203 can also place the processed wafer into the rotary type wafer box loading unit 102. The invention shortens the travel of the interlayer manipulator 203 when conveying wafers back and forth, and consumes short time, thus being beneficial to improving the productivity of the gluing and developing equipment.
As shown in fig. 3, in some embodiments, a cassette buffer location 101 and a cassette manipulator 103 are further provided in the cassette module 1; the cassette manipulator 103 is disposed between the cassette buffer 101 and the rotary cassette loading unit 102. The wafer cassette buffer memory location 101 is used for loading a wafer transfer cassette 301; the cassette robot 103 is configured to transfer the wafer cassette 301 from the cassette buffer location 101 to the rotary cassette loading unit 102. In other embodiments, the cassette robot 103 is configured to transfer the pod 301 from the rotary cassette loading unit 102 to the cassette cache location 101.
Specifically, the number of cassette buffer bits 101 is 8, and the upper and lower 2 layers are arranged in the cassette module 1. The number of the rotary cassette loading units 102 is 4, and the upper and lower 2 layers are arranged in the cassette module 1. When the cassette robot 103 moves in a first direction, it is configured to transfer the wafer cassette 301 from the cassette cache location 101 to the rotary cassette loading unit 102. When the cassette robot 103 moves in the second direction, the wafer cassette 301 is transferred from the rotary cassette loading unit 102 to the cassette cache location 101. When the cassette manipulator 103 moves along the third direction or the fourth direction, the positive cassette buffer storage position 101 of the same layer is used for buffering the positive cassettes. When the cassette manipulator 103 moves along the fifth direction or the sixth direction, the positive cassette buffer storage position 101 for aligning different layers is used.
In other embodiments, a cassette window 104 is provided in the cassette module 1. The inner diameter of the wafer cassette window 104 is larger than the outer diameter of the wafer cassette 301, so that the wafer cassette manipulator 103 drives the wafer cassette 301 to be placed on the rotary wafer cassette loading unit 102 through the wafer cassette window 104; or facilitate the threading of cassette robot 103 from cassette window 104 to take cassette 301 on rotary cassette loading unit 102.
Illustratively, the width d1 of the cassette window 104 is greater than the width d2 of the wafer cassette 301, and the height h1 of the cassette window 104 is greater than the height h2 of the wafer cassette 301.
As shown in fig. 3, in some embodiments, rotary cassette loading unit 102 includes a platen 1021 and a rotor plate 1022 that are movably connected; the carrier 1021 is fixed relative to the cassette window 104; the rotating plate 1022 is used to drive the wafer cassette to rotate relative to the carrier 1021.
Specifically, the top end of the rotating plate 1022 is provided with three connecting pins 1023 for matching with the bottom end surface of the wafer transfer box. Illustratively, the rotary cassette loading unit 102 further includes a servo motor, a housing of the servo motor is fixedly connected to the carrier 1021, a spindle of the servo motor is fixedly connected to the rotating plate 1022, and when the servo motor works, the spindle drives the rotating plate 1022, the connecting pins 1023 and the wafer transfer cassette to rotate by 90 degrees together. This example can make the wafer transfer box turn to, is applicable to the wafer transfer box that the wafer box buffering position required place the orientation of orientation different of orientation and layer window.
In some embodiments, the rotatable cassette loading unit 102 has a window 1024 slidably coupled thereto; when the interlayer robot 3 approaches the rotatable cassette loading unit 102, the louver 1024 slides to an open state; when the interlayer robot 3 is away from the rotatable cassette loading unit 102, the window plate 1024 slides to a closed state.
In some embodiments, the apparatus further comprises a wall-penetrating unit, wherein a first end of the wall-penetrating unit is arranged in the wafer box module 1, and a second end of the wall-penetrating unit is arranged in the process module 2; the wall penetrating units are arranged in one-to-one correspondence with the process layers; each wall penetrating unit comprises a first wall penetrating manipulator and a second wall penetrating manipulator, and the first wall penetrating manipulator and the second wall penetrating manipulator in the same wall penetrating unit are used for reversely conveying wafers.
Specifically, the first through-wall manipulator is used for conveying the wafer along a first direction; the second through-wall robot is used for conveying the wafer along a second direction. The bottom of first wall-through manipulator and second wall-through manipulator all is equipped with baffle 107, baffle 107 is used for bearing first wall-through manipulator and second wall-through manipulator.
In other specific embodiments, the cassette module 1 is further provided with an interlayer window 106 and a wall-penetrating window 105; the interlayer windows 106 are arranged in one-to-one correspondence with the wall penetrating manipulators; the interlayer manipulator 203 is configured to take out a wafer to be processed from the first wafer transfer box 301, and drive the wafer to be processed to pass through the interlayer window 106 to the first wall penetrating manipulator; the first wall-penetrating robot is configured to drive the wafer to be processed into the process module 2 from the wall-penetrating window 105.
In yet other embodiments, the second through-wall robot is configured to drive the processed wafer from the through-wall window 105 into the cassette module 1; the interlayer robot 203 is configured to take the processed wafer from the second through-wall robot through the interlayer window 106; the interlayer robot 203 is configured to feed the processed wafers into a second pod 301.
It should be noted that the first pod 301 and the second pod are different pods 301, the first pod 301 is used for loading wafers to be processed, and the second pod 301 is used for loading processed wafers. This arrangement can avoid cross contamination of the processed wafer and the wafer to be processed in the same cassette 301.
Referring to fig. 1 and 2, in some embodiments, the inter-layer robot 203 and the intra-layer robot are each provided with a first end effector 311, a second end effector 312, a third end effector 313, and a fourth end effector 314; first end effector 311 and second end effector 312 are symmetrical about the axis of symmetry; the third end effector 313 and the fourth end effector 314 are symmetrical about the symmetry axis.
Specifically, when the wafer is grasped, the first end effector 311 and the third end effector 313 are brought close to each other, while the second end effector 312 and the fourth end effector 314 are brought close to each other. In other embodiments, upon release of the wafer, the first end effector 311 and the third end effector 313 are moved away from each other while the second end effector 312 and the fourth end effector 314 are moved away from each other.
In yet other embodiments, the first end effector 311 and the second end effector 312 are positioned adjacent to each other while the third end effector 313 and the fourth end effector 314 are positioned adjacent to each other when the wafer is removed from the process unit or the wafer cassette. When a wafer is fed into a process unit or a pod, the first end effector 311 and the second end effector 312 are moved away from each other while the third end effector 313 and the fourth end effector 314 are moved away from each other.
As shown in fig. 4, the present invention further provides a control method of a gumming developing apparatus, which is applied to the gumming developing apparatus as set forth in any one of the above embodiments, including: s1, controlling an interlayer manipulator in a wafer box module, and taking out wafers in a wafer conveying box; s2, controlling an in-layer manipulator in the process module to bear the wafer and drive the wafer to move so as to enable the wafer to pass through different process units; controlling different process units to process the wafer; s3, controlling an interlayer manipulator in the wafer box module to send the processed wafers into the wafer conveying box.
Specifically, before the first execution of the interlayer manipulator in the wafer cassette module and the wafer in the wafer transfer cassette is taken out, the method further comprises: and controlling the wafer cassette manipulator to transfer the wafer transfer cassette from the cassette cache position to the rotary cassette loading unit.
In other embodiments, the control pod module further includes: judging whether the wafer conveying box is full of wafers or not; when the wafer transfer box is full of wafers, the wafer transfer box is controlled by a box manipulator to be transferred from the rotary box loading unit to a box caching position.
In still other embodiments, the in-layer robot in the process module is controlled to carry the wafer and drive the wafer to move so that the wafer passes through different process units; controlling the different process units to process the wafer further comprises: and controlling an in-layer manipulator in the target process layer to take the wafer to be processed from the first through-wall manipulator, and controlling the in-layer manipulator to send the wafer to be processed into a first heat treatment unit, a liquid treatment unit and a second heat treatment unit in the target process layer so as to enable the wafer to be subjected to first baking, first gluing and second baking treatment. And driving the wafer subjected to the secondary baking treatment to be sent into a second wall penetrating manipulator.
In still other embodiments, the control pod module further comprises, prior to delivering the processed wafers to the wafer cassette, an inter-layer robot comprising: updating the target process layer, and repeatedly executing the embodiment until the wafer processing is completed.
While embodiments of the present invention have been described in detail hereinabove, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. It is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the invention described herein is capable of other embodiments and of being practiced or of being carried out in various ways.

Claims (11)

1. The glue coating and developing equipment is applied to a glue coating and developing process scene of a wafer and is characterized by comprising a wafer box module and a process module which are connected with each other;
the wafer box module is provided with rotary wafer box loading units and interlayer manipulators, N rotary wafer box loading units are symmetrically distributed on two sides of the interlayer manipulators about symmetry axes, N is an integer which is arbitrarily larger than 1, and the symmetry axes are positioned on straight lines pointing to the process module from the wafer box module;
the rotary type wafer box loading unit is used for loading the wafer conveying box; the interlayer manipulator is used for sending the wafer into the wafer transfer box or taking the wafer out of the wafer transfer box;
the process module comprises a plurality of vertically arranged process layers, wherein each process layer is internally provided with an intra-layer manipulator and a plurality of process units; the in-layer manipulator is used for bearing the wafer and driving the wafer to move so as to enable the wafer to pass through different process units.
2. The apparatus of claim 1, wherein cassette module further comprises a cassette buffer location and a cassette robot; the wafer box buffer memory is used for loading a wafer transfer box;
the wafer cassette manipulator is used for transferring the wafer transfer cassette from the wafer cassette cache position to the rotary wafer cassette loading unit or transferring the wafer transfer cassette from the rotary wafer cassette loading unit to the wafer cassette cache position.
3. The apparatus of claim 1, further comprising a wall-through unit having a first end disposed within the cassette module and a second end disposed within the process module;
the wall penetrating units are arranged in one-to-one correspondence with the process layers;
each wall penetrating unit comprises a first wall penetrating manipulator and a second wall penetrating manipulator, and the first wall penetrating manipulator and the second wall penetrating manipulator in the same wall penetrating unit are used for reversely conveying wafers.
4. The apparatus of claim 3, wherein the inter-layer robot is configured to deliver wafers in a wafer cassette to a first through-wall robot configured to transfer the wafers to a process module; or alternatively, the process may be performed,
the second through-the-wall manipulator is used for transmitting the wafer to the wafer box module; the interlayer manipulator is used for conveying the wafer in the second through-the-wall manipulator to the wafer conveying box.
5. The apparatus of claim 1, wherein the N rotary cassette loading units include a first rotary cassette loading unit and a second rotary cassette loading unit;
the number of the first rotary type wafer box loading units is 2, the first rotary type wafer box loading units are symmetrically distributed on two sides of the interlayer manipulator about a symmetry axis, and a first wafer conveying box is loaded on the first rotary type wafer box loading units; the interlayer manipulator is used for conveying the wafers in the first wafer conveying box to the first wall penetrating manipulator;
the number of the second rotary type wafer box loading units is 2, the second rotary type wafer box loading units are symmetrically distributed on two sides of the interlayer manipulator about a symmetry axis, and a second wafer conveying box is loaded on the second rotary type wafer box loading units; the interlayer robot is used for conveying the wafer from the second through-wall robot into the second wafer conveying box.
6. The apparatus of claim 1, wherein the inter-layer robot and the intra-layer robot are each provided with a number of end effectors;
when the wafer is grabbed, a plurality of end effectors positioned on the same side of the symmetry axis are close to each other; when the wafer is released, a plurality of end effectors positioned on the same side of the symmetry axis are far away from each other;
when the wafer is taken out of the process unit or the round transfer box, the end effectors positioned on different sides of the symmetry axis are close to each other; the end effectors located on different sides of the axis of symmetry are remote from each other when wafers are fed into the process unit or the pod.
7. The apparatus of claim 6, wherein the rotary cassette loading unit comprises a movably coupled stage and a rotating plate; the carrying platform is relatively fixed with the wafer box window; the rotating plate is used for driving the wafer conveying box to rotate relative to the carrying platform.
8. The apparatus of claim 2, wherein the rotatable cassette loading unit has a window plate slidably coupled thereto; when the interlayer manipulator approaches the rotatable cassette loading unit, the window plate slides to an open state; when the interlayer manipulator is away from the rotatable cassette loading unit, the window plate slides to a closed state.
9. A control method of a gumming developing apparatus as set forth in any one of claims 1 to 8, characterized by comprising:
s1, controlling an interlayer manipulator in a wafer box module, and taking out wafers in a wafer conveying box;
s2, controlling an in-layer manipulator in the process module to bear the wafer and drive the wafer to move so as to enable the wafer to pass through different process units; controlling different process units to process the wafer;
s3, controlling an interlayer manipulator in the wafer box module to send the processed wafers into the wafer conveying box.
10. The method of claim 9, wherein before the first execution of the inter-layer robot in the cassette module to remove the wafers in the wafer cassette, further comprising:
and controlling the wafer cassette manipulator to transfer the wafer transfer cassette from the cassette cache position to the rotary cassette loading unit.
11. The method of claim 9, wherein the controlling the inter-layer robot in the cassette module after the processed wafers are transferred to the wafer cassette further comprises:
judging whether the wafer conveying box is full of wafers or not;
when the wafer transfer box is full of wafers, the wafer transfer box is controlled by a box manipulator to be transferred from the rotary box loading unit to a box caching position.
CN202310848172.3A 2023-07-10 2023-07-10 Glue spreading developing device and control method thereof Pending CN116880139A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310848172.3A CN116880139A (en) 2023-07-10 2023-07-10 Glue spreading developing device and control method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310848172.3A CN116880139A (en) 2023-07-10 2023-07-10 Glue spreading developing device and control method thereof

Publications (1)

Publication Number Publication Date
CN116880139A true CN116880139A (en) 2023-10-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310848172.3A Pending CN116880139A (en) 2023-07-10 2023-07-10 Glue spreading developing device and control method thereof

Country Status (1)

Country Link
CN (1) CN116880139A (en)

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