CN220603850U - Glue spreading and developing equipment - Google Patents
Glue spreading and developing equipment Download PDFInfo
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- CN220603850U CN220603850U CN202322342188.5U CN202322342188U CN220603850U CN 220603850 U CN220603850 U CN 220603850U CN 202322342188 U CN202322342188 U CN 202322342188U CN 220603850 U CN220603850 U CN 220603850U
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- 239000003292 glue Substances 0.000 title claims abstract description 61
- 238000003892 spreading Methods 0.000 title description 2
- 230000007480 spreading Effects 0.000 title description 2
- 238000000034 method Methods 0.000 claims abstract description 151
- 230000008569 process Effects 0.000 claims abstract description 150
- 239000010410 layer Substances 0.000 claims abstract description 85
- 239000011229 interlayer Substances 0.000 claims abstract description 55
- 238000000576 coating method Methods 0.000 claims abstract description 39
- 230000003287 optical effect Effects 0.000 claims abstract description 24
- 238000001514 detection method Methods 0.000 claims abstract description 23
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 21
- 230000000149 penetrating effect Effects 0.000 claims abstract description 20
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 235000012431 wafers Nutrition 0.000 claims description 124
- 238000001816 cooling Methods 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000003139 buffering effect Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000001259 photo etching Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a glue coating developing device, which comprises a film box module, an interlayer process module and a first process module which are sequentially arranged along the horizontal direction; each gluing process layer in the first process module is sequentially stacked from bottom to top; a wall-penetrating optical detection unit is arranged between the interlayer process module and the first process module and comprises a second wall-penetrating part, a light source and a camera; the first end of the second wall penetrating part is fixed, and the second end of the second wall penetrating part moves relative to the first end and is used for conveying the wafer; the light source is used for projecting light rays to the surface of the wafer, and the camera is used for receiving the light rays reflected by the surface of the wafer so as to realize optical detection of the wafer. The device is used for improving the production efficiency of the gluing and developing device.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to a gluing and developing device.
Background
In the existing photoetching process for semiconductor processing, photoresist coating process flow, photoetching process flow and developing process flow are respectively completed by photoresist coating equipment, photoetching equipment and developing equipment. With the improvement of the semiconductor processing technology level, the market mainstream integrates the photoresist coating and developing process flow on the same equipment, and meanwhile, the capacity of the photoresist coating and developing equipment is required to be larger than that of the photoetching equipment, and is determined by the bottleneck capacity of a process unit and the bottleneck of a robot. And (3) high-temperature baking is needed after the surface of the wafer is coated with the adhesive, and the next process is carried out after the wafer is cooled.
In the prior art, the wafer needs to be sent into the optical detection unit, the optical detection unit carries out an optical detection process on the wafer, and the wafer is taken out from the optical detection unit to carry out a next process after the optical detection process is finished, so that the occupied production time is long, and the production efficiency is low. Accordingly, a new gumming developing apparatus is needed to improve the above-mentioned problems.
Disclosure of Invention
The utility model aims to provide a glue coating and developing device which is used for improving the production efficiency of the glue coating and developing device.
In a first aspect, the present utility model provides a glue developing apparatus, including a film box module, an interlayer process module, and a first process module sequentially arranged in a horizontal direction; each gluing process layer in the first process module is sequentially stacked from bottom to top; a wall-penetrating optical detection unit is arranged between the interlayer process module and the first process module and comprises a second wall-penetrating part, a light source and a camera; the first end of the second wall penetrating part is fixed, and the second end of the second wall penetrating part moves relative to the first end and is used for conveying the wafer; the light source is used for projecting light rays to the surface of the wafer, and the camera is used for receiving the light rays reflected by the surface of the wafer so as to realize optical detection of the wafer.
The method has the beneficial effects that: according to the utility model, the through-wall type optical detection unit is arranged between the process module and the interlayer process module, so that the optical detection process is carried out while the wafer is transmitted, the time for carrying out optical detection on the wafer can be saved, and the production efficiency is improved.
Optionally, a wall-penetrating cooling unit is arranged between the first process module and the interlayer process module, and comprises a first wall-penetrating part and a cooling part; the first end of the first wall penetrating part is fixed, and the second end of the first wall penetrating part moves relative to the first end and is used for conveying wafers; the cooling part is used for refrigerating and contacting with the surface of the wafer so as to cool the wafer.
Optionally, the first process module includes a first glue coating process layer, a second glue coating process layer, and a third glue coating process layer, where the first glue coating process layer, the second glue coating process layer, and the third glue coating process layer include heat treatment units, and the heat treatment units are used for baking the wafer when in a working state; the wall-through type cooling unit is arranged between the first gluing process layer and the interlayer process module and is used for transmitting the wafer in the interlayer process module to the first gluing process layer and cooling the wafer at the same time; and a first wall penetrating manipulator is arranged between the first gluing process layer and the interlayer process module and used for conveying the wafer in the first gluing process layer to the interlayer process module.
Optionally, the through-wall optical detection unit is disposed between the third glue coating process layer and the interlayer process module, and is configured to transmit the wafer in the third glue coating process layer to the interlayer process module, and perform optical detection on the wafer at the same time.
Optionally, a second through-wall manipulator is further disposed between the second glue coating process layer and the interlayer process module, and is used for transmitting the wafer in the interlayer process module to the second glue coating process layer.
Optionally, the wafer box module is provided with a wafer box manipulator for loading and transmitting a wafer transfer box, and the wafer transfer box is used for loading wafers; an interlayer manipulator is arranged in the interlayer process module and used for conveying wafers in the interlayer process module; and the first gluing process layer, the second gluing process layer and the third gluing process layer are respectively provided with an in-layer manipulator for conveying the wafer in the in-layer so as to enable the wafer to be subjected to process treatment.
Optionally, the wafer box module is provided with a wafer manipulator for transferring the wafer in the wafer transfer box to the wafer placement position of the interlayer process module or transferring the wafer on the wafer placement position of the interlayer process module to the wafer transfer box.
Optionally, the first glue coating process layer, the second glue coating process layer and the third glue coating process layer all comprise liquid processing units, and the liquid processing units are used for carrying out glue coating treatment on the surface of the wafer.
Optionally, a cache position, a space and a manual position are also arranged in the film box module; the overhead travelling crane is used for loading the wafer conveying box which is taken down from the overhead travelling crane; the manual position is used for loading a wafer conveying box which is conveyed by manpower; the wafer box manipulator is used for taking the wafer conveying box from the crown block position or the manual position; the buffer memory is arranged between the wafer manipulator and the wafer box loading unit and is used for buffering and placing the wafer transfer box.
Drawings
Fig. 1 is a schematic top sectional view of a gumming developing apparatus according to the present utility model;
FIG. 2 is a schematic side sectional view of a gumming developing apparatus according to the present utility model;
FIG. 3 is a schematic diagram of a through-wall cooling unit according to the present utility model;
fig. 4 is a schematic structural diagram of a through-wall optical detection unit according to the present utility model.
Reference numerals in the drawings:
1. a cassette module; 11. a cassette manipulator; 12. a wafer robot; 13. a cassette loading unit; 14. a wafer transfer box; 15. caching bits; 16. a sky parking place; 17. a human station; 2. an interlayer process module; 22. an interlayer manipulator; 301. a first glue coating process layer; 302. a second glue coating process layer; 303. a third gluing process layer; 31. a first process module; 32. a second process module; 331. a first intra-layer manipulator; 333. a third layer of inner manipulators; 341. a liquid treatment unit; 342. a heat treatment unit; 7. a wall-penetrating optical detection unit; 701. a camera; 702. a light source; 703. a second wall penetrating portion; 801. a cooling unit; 802. a first wall penetrating portion; 81. a through-wall cooling unit; 91. the first wall penetrating manipulator; 92. and the second wall penetrating manipulator.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items.
In view of the problems of the prior art, as shown in fig. 1, the present utility model provides a glue developing apparatus including a cartridge module 1, an interlayer process module 2, and a first process module 31 arranged in a first direction. As shown in fig. 2, the first glue process layer 301, the second glue process layer 302 and the third glue process layer 303 in the first process module 31 are sequentially stacked from bottom to top.
Referring to fig. 1, specifically, a through-wall cooling unit 81 is disposed between the first process module 31 and the interlayer process module 2. In other embodiments, a wall-through cooling unit 81 is disposed between the first process module 31 and the interlayer process module 2.
In still other specific embodiments, the number of cassette loading units 13 is 4 for loading 2 first pods and 2 second pods; the first wafer transfer box is used for loading the wafer which is not subjected to the gumming developing process, and the first wafer transfer box is used for loading the wafer which is subjected to the gumming developing process.
The third glue coating process layer 303 of the first process module 31 includes 3 liquid processing units 341 and 3 heat processing units 342, wherein 2 heat processing units 342 are disposed on a first direction side of the 3 liquid processing units 341, and 1 heat processing unit 342 is disposed on a second direction side of the 3 liquid processing units 341; the second direction is the opposite direction of the first direction.
Referring to fig. 2, in some embodiments, the apparatus further includes a second process module 32, the first process module 31 and the second process module 32 are disposed on the first direction side of the interlayer process module 2, and the second process module 32 and the first process module 31 are disposed in duplex symmetry.
In other examples, the number of the liquid processing units 341 and the number of the heat processing units 342 may be any positive integer, so long as the N-th glue layer of the first process module 31 and the N-th glue layer of the second process module 32 are symmetrically arranged, where N is any positive integer, so that the manipulator in the N-th layer can take and place the wafers in the first process module 31 and the second process module 32 synchronously, which is beneficial to improving the production efficiency.
It should be noted that, the cassette module 1 further includes a cassette loading unit 13 and a wafer robot 12, where the cassette loading unit 13 is used for loading the wafer cassette 14 and controlling the wafer cassette 14 to be opened or closed. Illustratively, the wafer robot 12 is used to transfer wafers in the wafer cassette 14 into wafer placement locations of the inter-layer process module 2. In other examples, the wafer robot 12 is used to transfer wafers at the wafer placement location of the inter-layer process module 2 into the wafer cassette 14.
It should be noted that, the first glue process layer 301, the second glue process layer 302 and the third glue process layer 303 each include a heat treatment unit 342, and the heat treatment unit 342 is used for baking the wafer when in an operating state.
Referring to fig. 2, specifically, the through-wall cooling unit 81 is disposed between the first glue coating process layer 301 and the interlayer process module 2, and is used for transferring the wafer in the interlayer process module 2 to the first glue coating process layer 301 and cooling the wafer. A first through-wall manipulator 91 is further disposed between the first glue coating process layer 301 and the interlayer process module 2, and is configured to transfer the wafer in the first glue coating process layer 301 to the interlayer process module 2.
In other specific embodiments, the wafer cassette module 1 is provided with a wafer cassette robot 11 for loading and transporting a wafer cassette 14, and the wafer cassette 14 is used for loading wafers; an interlayer manipulator 22 is arranged in the interlayer process module 2 and is used for conveying wafers in the interlayer process module 2; the first glue coating process layer 301, the second glue coating process layer 302 and the third glue coating process layer 303 are respectively provided with an in-layer manipulator for conveying the wafer in the layer so as to process the wafer.
In still other specific embodiments, each of the first glue coating process layer 301, the second glue coating process layer 302, and the third glue coating process layer 303 includes a liquid processing unit 341, where the liquid processing unit 341 is configured to perform a glue coating process on a surface of a wafer.
It is worth to say that the inside of the film box module 1 is also provided with a buffer memory position 15, a crown block position 16 and a manual position 17; the overhead space 16 is used for loading the wafer transfer box 14 removed from the overhead travelling crane; the manual position 17 is used for loading the wafer transfer box 14 which is carried by manpower; the cassette robot 11 is used to take the wafer cassette 14 from the overhead gantry 16 or the manual station 17. The buffer storage position 15 is disposed between the wafer robot 12 and the cassette loading unit 13, and is used for buffering and placing the wafer transfer cassette 14.
As shown in fig. 3, it is worth noting that the through-wall cooling unit 81 includes a first through-wall portion 802 and a cooling portion 801; the first end of the first wall penetrating portion 802 is fixed, and the second end of the first wall penetrating portion 802 is movable relative to the first end for transporting the wafer; the cooling portion 801 is used for cooling and contacting the surface of the wafer to cool the wafer.
As shown in fig. 1 and fig. 2, specifically, the first intra-layer manipulator 331 is disposed in the first glue process layer 301; a second intra-layer manipulator is arranged in the second gluing process layer 302; a third inner manipulator 333 is arranged in the third glue coating process layer 303; illustratively, the third in-layer robot 333 is disposed between the third glue process layer 303 of the first process module 31 and the third glue process layer 303 of the second process module 32. In other examples, the first process module 31 and the second process module 32 are each provided with N process layers, where N is any positive integer, and the intra-nth robot is disposed between the N process layers of the first process module 31 and the N process layers of the second process module 32.
As shown in fig. 4, in some embodiments, a wall-through optical detection unit 7 is further included, the wall-through optical detection unit 7 including a second wall-through portion 703, a light source 702, and a camera 701; the first end of the second wall penetrating portion 703 is fixed, and the second end of the second wall penetrating portion 703 is movable relative to the first end for transporting the wafer; the light source 702 is configured to project light toward the wafer surface, and the camera 701 is configured to receive light reflected by the wafer surface.
Specifically, the through-wall optical detection unit 7 is disposed between the third glue coating process layer 303 and the interlayer process module 2, and is configured to transmit the wafer in the third glue coating process layer 303 to the interlayer process module 2, and perform optical detection on the wafer at the same time.
In other specific embodiments, a second through-wall robot 92 is further disposed between the second glue process layer 302 and the interlayer process module 2, and is configured to transfer the wafer in the interlayer process module 2 to the second glue process layer 302.
It should be noted that, the through-wall cooling unit 81 or the through-wall optical detection unit 7 may also be disposed on the mth process layer, where M is any positive integer; the embodiment can meet different process requirements.
While embodiments of the present utility model have been described in detail hereinabove, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. It is to be understood that such modifications and variations are within the scope and spirit of the present utility model as set forth in the following claims. Moreover, the utility model described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (10)
1. The glue coating and developing equipment is characterized by comprising a film box module, an interlayer process module and a first process module which are sequentially arranged along the horizontal direction;
each gluing process layer in the first process module is sequentially stacked from bottom to top;
a wall-penetrating optical detection unit is arranged between the interlayer process module and the first process module and comprises a second wall-penetrating part, a light source and a camera; the first end of the second wall penetrating part is fixed, and the second end of the second wall penetrating part moves relative to the first end and is used for conveying the wafer; the light source is used for projecting light rays to the surface of the wafer, and the camera is used for receiving the light rays reflected by the surface of the wafer so as to realize optical detection of the wafer.
2. The apparatus of claim 1, further comprising a second process module, the second process module and the first process module being disposed on a same side of the interlayer process module, the second process module being disposed duplex symmetrically with the first process module.
3. The apparatus of claim 1, wherein a wall-through cooling unit is disposed between the first process module and the interlayer process module, comprising a first wall-through portion and a cooling portion; the first end of the first wall penetrating part is fixed, and the second end of the first wall penetrating part moves relative to the first end and is used for conveying wafers; the cooling part is used for refrigerating and contacting with the surface of the wafer so as to cool the wafer.
4. The apparatus of claim 3, wherein the first process module comprises a first glue process layer, a second glue process layer, and a third glue process layer, each comprising a heat treatment unit for baking a wafer when in an operational state;
the wall-through type cooling unit is arranged between the first gluing process layer and the interlayer process module and is used for transmitting the wafer in the interlayer process module to the first gluing process layer and cooling the wafer at the same time;
and a first wall penetrating manipulator is arranged between the first gluing process layer and the interlayer process module and used for conveying the wafer in the first gluing process layer to the interlayer process module.
5. The apparatus of claim 4, wherein the through-wall optical inspection unit is disposed between the third glue process layer and the interlayer process module for transferring the wafer in the third glue process layer to the interlayer process module while optically inspecting the wafer.
6. The apparatus of claim 5, wherein a second through-the-wall robot is further disposed between the second glue process layer and the interlayer process module for transferring wafers in the interlayer process module to the second glue process layer.
7. The apparatus of claim 4, wherein the cassette module is provided with a cassette robot for loading and transporting a wafer cassette for loading wafers;
an interlayer manipulator is arranged in the interlayer process module and used for conveying wafers in the interlayer process module;
and the first gluing process layer, the second gluing process layer and the third gluing process layer are respectively provided with an in-layer manipulator for conveying the wafer in the in-layer so as to enable the wafer to be subjected to process treatment.
8. The apparatus of claim 4, wherein the cassette module is provided with a wafer robot for transferring wafers in the wafer cassette into a wafer placement position of the inter-layer process module or for transferring wafers in the wafer placement position of the inter-layer process module into the wafer cassette.
9. The apparatus of claim 4, wherein the first, second, and third glue process layers each comprise a liquid treatment unit for applying a glue to a surface of a wafer.
10. The apparatus of claim 1, wherein the cassette module further comprises a buffer location, a sky parking location, and a manual location; the overhead travelling crane is used for loading the wafer conveying box which is taken down from the overhead travelling crane; the manual position is used for loading a wafer conveying box which is conveyed by manpower; the wafer box manipulator is used for taking the wafer conveying box from the crown block position or the manual position; the buffer memory is arranged between the wafer manipulator and the wafer box loading unit and is used for buffering and placing the wafer transfer box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322342188.5U CN220603850U (en) | 2023-08-29 | 2023-08-29 | Glue spreading and developing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322342188.5U CN220603850U (en) | 2023-08-29 | 2023-08-29 | Glue spreading and developing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220603850U true CN220603850U (en) | 2024-03-15 |
Family
ID=90177099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322342188.5U Active CN220603850U (en) | 2023-08-29 | 2023-08-29 | Glue spreading and developing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220603850U (en) |
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2023
- 2023-08-29 CN CN202322342188.5U patent/CN220603850U/en active Active
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