CN116867873A - 导电性粘接剂、导电性粘接剂的烧结体、烧结体的制造方法、电子部件及电子部件的制造方法 - Google Patents

导电性粘接剂、导电性粘接剂的烧结体、烧结体的制造方法、电子部件及电子部件的制造方法 Download PDF

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Publication number
CN116867873A
CN116867873A CN202280015214.9A CN202280015214A CN116867873A CN 116867873 A CN116867873 A CN 116867873A CN 202280015214 A CN202280015214 A CN 202280015214A CN 116867873 A CN116867873 A CN 116867873A
Authority
CN
China
Prior art keywords
silver particles
conductive adhesive
mass
sintered body
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280015214.9A
Other languages
English (en)
Chinese (zh)
Inventor
川崎英也
桥立优
加藤谅
森崇充
三并淳一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osaka Soda Co Ltd
Kansai University
Original Assignee
Osaka Soda Co Ltd
Kansai University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osaka Soda Co Ltd, Kansai University filed Critical Osaka Soda Co Ltd
Publication of CN116867873A publication Critical patent/CN116867873A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202280015214.9A 2021-02-18 2022-02-14 导电性粘接剂、导电性粘接剂的烧结体、烧结体的制造方法、电子部件及电子部件的制造方法 Pending CN116867873A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-024327 2021-02-18
JP2021024327 2021-02-18
PCT/JP2022/005713 WO2022176809A1 (ja) 2021-02-18 2022-02-14 導電性接着剤、導電性接着剤の焼結体、焼結体の製造方法、電子部品、及び電子部品の製造方法

Publications (1)

Publication Number Publication Date
CN116867873A true CN116867873A (zh) 2023-10-10

Family

ID=82930543

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280015214.9A Pending CN116867873A (zh) 2021-02-18 2022-02-14 导电性粘接剂、导电性粘接剂的烧结体、烧结体的制造方法、电子部件及电子部件的制造方法

Country Status (5)

Country Link
US (1) US12534651B2 (https=)
EP (1) EP4296326A4 (https=)
JP (1) JPWO2022176809A1 (https=)
CN (1) CN116867873A (https=)
WO (1) WO2022176809A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5574761B2 (ja) 2009-04-17 2014-08-20 国立大学法人山形大学 被覆銀超微粒子とその製造方法
JP5707754B2 (ja) 2010-07-12 2015-04-30 横浜ゴム株式会社 導電性組成物および太陽電池セル
JP5795096B2 (ja) 2014-02-25 2015-10-14 田中貴金属工業株式会社 低温焼結性に優れる銀ペースト及び該銀ペーストの製造方法
JP5806760B1 (ja) * 2014-05-29 2015-11-10 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
TWI702262B (zh) 2015-06-15 2020-08-21 日商大阪曹達股份有限公司 金屬奈米微粒子製造用組合物
WO2017169534A1 (ja) * 2016-03-30 2017-10-05 株式会社大阪ソーダ 導電性接着剤
KR102705720B1 (ko) 2019-08-26 2024-09-11 교세라 가부시키가이샤 은 입자, 은 입자의 제조 방법, 페이스트 조성물, 반도체 장치 및 전기·전자부품
WO2021044817A1 (ja) 2019-09-02 2021-03-11 株式会社大阪ソーダ 銀粒子

Also Published As

Publication number Publication date
JPWO2022176809A1 (https=) 2022-08-25
US20240052213A1 (en) 2024-02-15
EP4296326A1 (en) 2023-12-27
US12534651B2 (en) 2026-01-27
WO2022176809A1 (ja) 2022-08-25
EP4296326A4 (en) 2024-12-25

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