JPWO2022176809A1 - - Google Patents
Info
- Publication number
- JPWO2022176809A1 JPWO2022176809A1 JP2023500827A JP2023500827A JPWO2022176809A1 JP WO2022176809 A1 JPWO2022176809 A1 JP WO2022176809A1 JP 2023500827 A JP2023500827 A JP 2023500827A JP 2023500827 A JP2023500827 A JP 2023500827A JP WO2022176809 A1 JPWO2022176809 A1 JP WO2022176809A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021024327 | 2021-02-18 | ||
| PCT/JP2022/005713 WO2022176809A1 (ja) | 2021-02-18 | 2022-02-14 | 導電性接着剤、導電性接着剤の焼結体、焼結体の製造方法、電子部品、及び電子部品の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022176809A1 true JPWO2022176809A1 (https=) | 2022-08-25 |
Family
ID=82930543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023500827A Pending JPWO2022176809A1 (https=) | 2021-02-18 | 2022-02-14 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12534651B2 (https=) |
| EP (1) | EP4296326A4 (https=) |
| JP (1) | JPWO2022176809A1 (https=) |
| CN (1) | CN116867873A (https=) |
| WO (1) | WO2022176809A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015224329A (ja) * | 2014-05-29 | 2015-12-14 | 田中貴金属工業株式会社 | 熱伝導性導電性接着剤組成物 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5574761B2 (ja) | 2009-04-17 | 2014-08-20 | 国立大学法人山形大学 | 被覆銀超微粒子とその製造方法 |
| JP5707754B2 (ja) | 2010-07-12 | 2015-04-30 | 横浜ゴム株式会社 | 導電性組成物および太陽電池セル |
| JP5795096B2 (ja) | 2014-02-25 | 2015-10-14 | 田中貴金属工業株式会社 | 低温焼結性に優れる銀ペースト及び該銀ペーストの製造方法 |
| TWI702262B (zh) | 2015-06-15 | 2020-08-21 | 日商大阪曹達股份有限公司 | 金屬奈米微粒子製造用組合物 |
| WO2017169534A1 (ja) * | 2016-03-30 | 2017-10-05 | 株式会社大阪ソーダ | 導電性接着剤 |
| KR102705720B1 (ko) | 2019-08-26 | 2024-09-11 | 교세라 가부시키가이샤 | 은 입자, 은 입자의 제조 방법, 페이스트 조성물, 반도체 장치 및 전기·전자부품 |
| WO2021044817A1 (ja) | 2019-09-02 | 2021-03-11 | 株式会社大阪ソーダ | 銀粒子 |
-
2022
- 2022-02-14 JP JP2023500827A patent/JPWO2022176809A1/ja active Pending
- 2022-02-14 EP EP22756127.1A patent/EP4296326A4/en active Pending
- 2022-02-14 US US18/546,658 patent/US12534651B2/en active Active
- 2022-02-14 CN CN202280015214.9A patent/CN116867873A/zh active Pending
- 2022-02-14 WO PCT/JP2022/005713 patent/WO2022176809A1/ja not_active Ceased
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015224329A (ja) * | 2014-05-29 | 2015-12-14 | 田中貴金属工業株式会社 | 熱伝導性導電性接着剤組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116867873A (zh) | 2023-10-10 |
| US20240052213A1 (en) | 2024-02-15 |
| EP4296326A1 (en) | 2023-12-27 |
| US12534651B2 (en) | 2026-01-27 |
| WO2022176809A1 (ja) | 2022-08-25 |
| EP4296326A4 (en) | 2024-12-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20230809 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250121 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260331 |