CN116825659A - Wafer pressing control method and device - Google Patents

Wafer pressing control method and device Download PDF

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Publication number
CN116825659A
CN116825659A CN202210278557.6A CN202210278557A CN116825659A CN 116825659 A CN116825659 A CN 116825659A CN 202210278557 A CN202210278557 A CN 202210278557A CN 116825659 A CN116825659 A CN 116825659A
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wafer
pressing
press
slow
preset
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司得政
赵雄峰
白龙
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Beijing U Precision Tech Co Ltd
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Beijing U Precision Tech Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a wafer pressing control method and device, comprising the following steps: respectively fixing a first wafer to be pressed and a second wafer to be pressed to corresponding positions of a wafer pressing device; controlling the wafer pressing device to press the first wafer and the second wafer at a preset rapid pressing speed, and obtaining a first pressed wafer structure when the pressing force of the rapid pressing reaches a set value of a rapid pressing force parameter; and slowly pressing the first pressed wafer structure step by step at a preset slow pressing speed. The invention can solve the problems that the prior wafer pressing technology is too dependent on the space position of the pressing device, the pressing has larger error, the corresponding relation between the space position and the pressing force is required to be tested for multiple times, and the like.

Description

Wafer pressing control method and device
Technical Field
The present invention relates to the field of semiconductor integrated circuits, and more particularly, to a wafer press-fit control method and apparatus.
Background
With the continuous shrinking of feature sizes of semiconductor processes, conventional two-dimensional integration technologies are approaching physical size limits, and development difficulty of semiconductor manufacturing technologies is gradually increasing, so that three-dimensional integrated circuits are presented to solve the current situation. The conventional two-dimensional integrated circuit is to place a plurality of wafers on a plane, and the three-dimensional integrated circuit is to stack the plurality of wafers, so that the packaging efficiency is improved, and the integration level and performance of the integrated circuit are greatly improved. In addition, the three-dimensional integrated circuit not only needs a three-dimensional stacked structure formed by multiple layers of chips, but also realizes electrical connection between devices of different chip layers by utilizing three-dimensional vertical interconnection penetrating through a substrate, and realizes high-efficiency interconnection.
Wafer-to-wafer bonding is a key technique for implementing three-dimensional integrated circuits, and in wafer bonding techniques, wafer bonding quality is an important characterization parameter. The reduction of the bonding quality index of the wafer can seriously affect the later stage of the process, further affect the connection of circuits and reduce the yield of the wafer. The pressing effect in the wafer bonding process is particularly critical, and the circuit connection and the functionality of the process are directly affected. If the pressing effect does not meet the requirement, the requirement on the surface quality of the wafer is increased, and the application of the wafer bonding process in various fields is limited.
In the pressing process, the pressing force and the pressing time are particularly critical, and the bonding effect of the wafer can be better improved only by controlling the pressing force and the pressing time to a relatively stable state. Because the pressing device is controlled according to the space position, accurate control on the pressing force and the pressing time cannot be achieved. Therefore, in the current pressing process, it is difficult to precisely combine the pressing force with the pressing position of the pressing device, and small resistance is generated to improve the bonding precision, so that the application of the bonding method in many fields is greatly limited.
In the lamination process, how to tightly combine the pressing position of the lamination device with the lamination force on the wafer in the whole three-dimensional space, and the precise control of the lamination device is achieved through the lamination force, and more complex logic operation is required, so that the logic and control complexity is improved. Because of special process requirements, the pressing device needs to meet very strict pressing requirements, and accurate control of pressing position, pressing speed and pressing time of the pressing device is very critical through pressing force, and depending conditions are harsh and complex.
In summary, the current pressing scheme depends on the condition that the spatial position of the pressing device needs to repeatedly measure the corresponding relationship between the pressing position of the pressing device and the pressing force, so as to meet the requirement of a specific pressing force; however, the material, the pressing speed and the long-time use of the moving assembly of the pressing device are easy to affect the pressing force, so that the measured data is deviated, and larger errors are caused.
Disclosure of Invention
In view of the above problems, the present invention is to provide a wafer pressing control method and device, so as to solve the problems of the existing wafer pressing technology that the space position of the pressing device is too dependent, the pressing has a large error, the correspondence between the space position and the pressing force needs to be tested for multiple times, and the feasibility is not strong.
The invention provides a wafer pressing control method, which comprises the following steps:
respectively fixing a first wafer to be pressed and a second wafer to be pressed to corresponding positions of a wafer pressing device;
controlling the wafer pressing device to press the first wafer and the second wafer at a preset rapid pressing speed, and obtaining a first pressed wafer structure when the pressing force of the rapid pressing reaches a set value of a rapid pressing force parameter;
slowly pressing the first pressed wafer structure step by step at a preset slow pressing speed, and finishing the slow pressing of the step when a slow pressing force parameter set value corresponding to the slow pressing of the step is reached in the process of slowly pressing of each step until the pressing force between the wafer pressing device and the first wafer and the second wafer reaches an end point value of a preset pressing force parameter; wherein the preset slow press down speed is less than the preset fast press down speed.
Furthermore, preferably, the fixing the first wafer to be bonded and the second wafer to be bonded to the corresponding positions of the wafer bonding device includes:
fixing the first wafer on a lower wafer carrying table of the wafer pressing device;
and fixing the second wafer on an upper wafer carrying platform of the wafer pressing device.
In addition, preferably, the wafer pressing device is controlled to press down the first wafer and the second wafer at a preset fast pressing speed, and when the pressing force of the fast pressing reaches the set value of the fast pressing force parameter, the first pressing wafer structure is obtained,
the pressing force between the wafer pressing device and the first wafer and the pressing force between the wafer pressing device and the second wafer generated in the rapid pressing process are obtained in real time through a pressure sensor, and when the pressing force reaches the set value of the rapid pressing force parameter, the wafer pressing device is controlled to stop rapid pressing, and first static pressing is carried out on the first wafer and the second wafer;
and when the execution time of the first static pressing reaches a first preset static pressure time, obtaining a first pressed wafer structure.
In addition, preferably, in the process of obtaining the first pressed wafer structure when the execution time of the static pressing reaches the first preset static pressure time,
acquiring a pressure feedback value generated in a static pressing process in real time, and calculating a relative error according to the pressure feedback value and the fast pressing force parameter set value to obtain a first pressure relative error;
and when the first pressure relative error exceeds a first preset error range, generating alarm information of lamination failure.
In addition, preferably, the first preset error range is-10%.
In addition, preferably, the step-by-step pressing the first pressed wafer structure at a preset slow pressing speed, and in the process of slowly pressing each step, when a set value of a slow pressing force parameter corresponding to the slow pressing of the step is reached, completing the slow pressing of the step until the pressing force between the wafer pressing device and the first wafer and the second wafer reaches an end value of a preset pressing force parameter, completing the pressing of the first wafer and the second wafer includes:
slowly pressing the first pressed wafer structure at a first preset slow pressing speed, and obtaining a second pressed wafer structure when the pressing force of the slow pressing reaches a first slow pressing force parameter set value corresponding to the slow pressing of the step;
if the pressing force between the wafer pressing device and the first wafer and the second wafer in the second pressing wafer structure reaches the end point value of the preset pressing force parameter, the pressing of the first wafer and the second wafer is completed; and if the pressing force between the wafer pressing device and the first wafer and the second wafer in the second pressing wafer structure does not reach the end value of the preset pressing force parameter, slowly pressing the second pressing wafer structure at a second preset slow pressing speed again until the pressing force between the wafer pressing device and the first wafer and the second wafer reaches the end value of the preset pressing force parameter, and finishing pressing the first wafer and the second wafer.
In addition, preferably, the first pressing wafer structure is pressed down slowly step by step at a preset slow pressing speed, and in the process of pressing down slowly step by step, when the set value of the slow pressing force parameter corresponding to the slow pressing of the step is reached, the slow pressing of the step is completed, until the pressing force between the wafer pressing device and the first wafer and the second wafer reaches the end value of the preset standard pressing force parameter, and in the process of pressing the first wafer and the second wafer,
gradually slowly pressing the first pressed wafer structure in a mode that the preset slowly pressing speed is gradually decreased; wherein, the slow down of each step corresponds to a corresponding preset slow down speed and a corresponding slow down pressure parameter set value;
in the process of slowly pressing down each step, stopping slowly pressing down the step when the pressing force between the wafer pressing device and the first wafer and the second wafer reaches a slowly pressing force parameter set value corresponding to the slowly pressing down of the step, and continuously performing second static pressing on the first wafer and the second wafer with the current pressure until reaching a second static pressing time;
in the process of each second static pressing, calculating a second pressure relative error according to a pressure feedback value between the wafer pressing device and the first wafer and the second wafer obtained in real time and a slow pressing force parameter set value corresponding to slow pressing of the step, and generating alarm information when the second pressure relative error exceeds a second preset error range; wherein, the slow pressing down of each step is set with a corresponding second static pressing time.
The wafer pressing control device provided by the invention comprises:
the wafer fixing and placing module is used for respectively fixing the first wafer to be pressed and the second wafer to be pressed to the corresponding positions of the wafer pressing device;
the rapid pressing module is used for controlling the wafer pressing device to rapidly press the first wafer and the second wafer at a preset rapid pressing speed, and when the pressing force of the rapid pressing reaches a set value of a rapid pressing force parameter, a first pressing wafer structure is obtained;
the slow pressing module is used for slowly pressing the first pressed wafer structure step by step at a preset slow pressing speed, and in the process of slowly pressing each step, when a slow pressing force parameter set value corresponding to the slow pressing of the step is reached, the slow pressing of the step is completed until the pressing force between the wafer pressing device and the first wafer and the second wafer reaches an end point value of a preset pressing force parameter, and the pressing of the first wafer and the second wafer is completed; wherein the preset slow press down speed is less than the preset fast press down speed.
In addition, preferably, the wafer fixing and placing module comprises a first wafer fixing and placing unit and a second wafer fixing and placing unit; wherein,,
the first wafer fixing and placing unit is used for fixing the first wafer on a lower wafer carrying platform of the wafer pressing device;
the second wafer fixing and placing unit is used for fixing the second wafer on an upper wafer carrying platform of the wafer pressing device.
Furthermore, preferably, the quick-press-down module includes: a quick pressing unit and a static pressing control unit; wherein,,
the rapid pressing unit is used for acquiring the pressing force between the wafer pressing device and the first wafer and the second wafer generated in the rapid pressing process in real time through a pressure sensor, and controlling the wafer pressing device to stop rapid pressing and performing first static pressing on the first wafer and the second wafer when the pressing force reaches the set value of the rapid pressing force parameter;
and the static press fit control unit is used for obtaining a first press fit wafer structure when the execution time of the first static press fit reaches a first preset static pressure time.
According to the wafer press-fit control method and device provided by the invention, the press-down process of the press-fit device is divided into quick press-down and slow press-down of a plurality of steps, each press-down step depends on three parameter values of press-fit force, press-fit time and press-down speed, and the purpose of accurately controlling the press-fit device is achieved by presetting the parameter values of each step; the invention can reduce the error, and can reduce the time required by the process by changing the pressing speed, thereby greatly improving the bonding efficiency; the invention converts the space position on which the pressing device is pressed down into the pressing force which can be measured by the pressure sensor; then the step-by-step downward pressing control of the pressing device is achieved through the pressing force; the pressing device can be directly controlled by the pressing force, so that the corresponding relation between the pressing force and the spatial position of the pressing device is not required to be measured, and the measuring workload is reduced.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Furthermore, the invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and attainments together with a more complete understanding of the invention will become apparent and appreciated by referring to the following description taken in conjunction with the accompanying drawings. In the drawings:
FIG. 1 is a flow chart of a wafer press-fit control method according to an embodiment of the invention;
fig. 2 is a block diagram of a wafer pressing control device according to an embodiment of the invention.
The same reference numerals will be used throughout the drawings to refer to similar or corresponding features or functions.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details.
Aiming at the problems that the prior wafer pressing technology is too dependent on the space position of a pressing device, large errors exist in pressing, the corresponding relation between the space position and the pressing force needs to be tested for multiple times, the feasibility is not strong, and the like, the wafer pressing control method and the device are provided.
Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In order to illustrate the wafer press-fit control method and apparatus provided by the present invention, fig. 1 shows a flow of the wafer press-fit control method according to an embodiment of the present invention.
As shown in fig. 1, the wafer press-fit control method provided by the invention comprises the following steps:
s1, respectively fixing a first wafer to be pressed and a second wafer to be pressed to corresponding positions of a wafer pressing device;
s2, controlling a wafer pressing device to press the first wafer and the second wafer at a preset rapid pressing speed, and obtaining a first pressed wafer structure when the pressing force of the rapid pressing reaches a set value of a rapid pressing force parameter;
s3, slowly pressing the first pressed wafer structure step by step at a preset slow pressing speed, and finishing the slow pressing of the step when a slow pressing preset pressing force parameter set value corresponding to the slow pressing of the step is reached in the process of slowly pressing of each step, until the pressing force between the wafer pressing device and the first wafer and the second wafer reaches an end point value of a preset pressing force parameter, finishing the pressing of the first wafer and the second wafer; wherein the preset slow press down speed is less than the preset fast press down speed.
The pressing process of the pressing device is divided into rapid pressing and slow pressing of a plurality of steps, each pressing step depends on three parameter values of pressing force, pressing time and pressing speed, and the purpose of accurately controlling the pressing device is achieved through the parameter values preset in each step; the invention can reduce the error, and can reduce the time required by the process by changing the pressing speed, thereby greatly improving the bonding efficiency; the invention converts the space position on which the pressing device is pressed down into the pressing force which can be measured by the pressure sensor; then the step-by-step downward pressing control of the pressing device is achieved through the pressing force; the pressing device can be directly controlled by the pressing force, so that the corresponding relation between the pressing force and the spatial position of the pressing device is not required to be measured, and the measuring workload is reduced.
As a preferred embodiment of the present invention, fixing the first wafer to be bonded and the second wafer to be bonded to the respective positions of the wafer bonding apparatus respectively includes:
fixing the first wafer on a lower wafer carrying table of the wafer pressing device;
the second wafer is fixed on the upper wafer carrier of the wafer pressing device.
The first wafer is fixed on a lower wafer carrying platform which is a downloading platform of an aligning device of the wafer pressing device, and the second wafer is fixed on an upper wafer carrying platform which is an uploading platform of the aligning device of the wafer pressing device, and the process can be fixed by adopting machine automation or can be fixed manually.
As a preferred embodiment of the present invention, in controlling the wafer pressing device to press down the first wafer and the second wafer at a preset rapid pressing speed, when the pressing force of the rapid pressing reaches the set value of the rapid pressing force parameter, the first pressed wafer structure is obtained,
the method comprises the steps that a pressure sensor is used for acquiring the pressing force between a wafer pressing device and a first wafer and a second wafer in the rapid pressing process in real time, and when the pressing force reaches a set value of a rapid pressing force parameter, the wafer pressing device is controlled to stop rapid pressing, and the first wafer and the second wafer are subjected to first static pressing;
and when the execution time of the first static pressing reaches a first preset static pressure time, obtaining a first pressed wafer structure.
The pressing force between the wafer pressing device and the first wafer and the second wafer generated in the rapid pressing process can be obtained in real time by presetting a pressure sensor and the like on the wafer pressing device, the feedback pressure value of the comparison pressure sensor and the rapid pressing force parameter set value corresponding to the rapid pressing are fed back, when the feedback pressure value reaches the rapid pressing force parameter set value, the wafer pressing device is controlled to stop rapid pressing, the first wafer and the second wafer are subjected to first static pressing (the general rapid pressing time is set to 0 second and can be ignored) with the current pressing force, the first static pressing execution time reaches the first preset static pressing time, a first pressed wafer structure is obtained, the rapid pressing step is ended, and the wafer pressing device is controlled to execute the slow pressing step at a lower pressing speed.
As a preferred embodiment of the present invention, in the process of obtaining the first bonded wafer structure when the execution time of the stationary bonding reaches the first preset static pressure time,
acquiring a pressure feedback value generated in the static pressing process in real time, and calculating a relative error according to the pressure feedback value and a quick pressing force parameter set value to obtain a first pressure relative error;
and when the relative error of the first pressure exceeds a first preset error range, generating alarm information of lamination failure.
In the first static pressing process, the relative error between the pressure feedback value and the pressure parameter set value of the quick pressing is required to be monitored in real time, if the relative error of the pressure exceeds the preset error range, the quick pressing is judged to be failed, alarm information of the pressing failure is generated to prompt, if the relative error of the pressure does not exceed the preset error range, the quick pressing is judged to be successful, and the following step of slow pressing is continued.
As a preferred embodiment of the present invention, the first preset error range is-10% to 10%. The range can be modified according to the actual requirements.
As a preferred embodiment of the present invention, the first pressing wafer structure is pressed down slowly step by step at a preset slow pressing speed, and in the process of pressing down slowly step by step, when a set value of a slow pressing force parameter corresponding to the slow pressing of the step is reached, the slow pressing of the step is completed, until the pressing force between the wafer pressing device and the first wafer and the second wafer reaches an end value of a preset pressing force parameter, the completion of the pressing of the first wafer and the second wafer includes:
slowly pressing the first pressed wafer structure at a first preset slow pressing speed, and obtaining a second pressed wafer structure when the pressing force of the slow pressing reaches a first slow pressing force parameter set value corresponding to the slow pressing of the step;
if the pressing force between the wafer pressing device and the first wafer and the second wafer in the second pressing wafer structure reaches the end point value of the preset pressing force parameter, the pressing of the first wafer and the second wafer is completed; and if the pressing force between the wafer pressing device and the first wafer and the second wafer in the second pressing wafer structure does not reach the end value of the preset pressing force parameter, slowly pressing the second pressing wafer structure at a second preset slow pressing speed again until the pressing force between the wafer pressing device and the first wafer and the second wafer reaches the end value of the preset pressing force parameter, and finishing pressing the first wafer and the second wafer.
The slow pressing is performed step by step, each slow pressing step corresponds to a corresponding pressing speed, a corresponding static pressing time and a corresponding slow pressing force parameter set value, and when the pressing force between the wafer pressing device and the first wafer and the second wafer reaches the end point value of the preset pressing force parameter, the first wafer and the second wafer are judged to be pressed.
As a preferred embodiment of the present invention, the first press-fit wafer structure is slowly pressed down step by step at a preset slow pressing down speed, and in the course of each step of slow pressing down, when the slow pressing force parameter set value corresponding to the slow pressing down of the step is reached, the slow pressing down of the step is completed until the pressing force between the wafer pressing device and the first and second wafers reaches the end point value of the preset standard pressing force parameter, and in the course of pressing the first and second wafers,
gradually slowly pressing the first pressed wafer structure in a mode of decreasing the preset slowly pressing speed; wherein, the slow down of each step corresponds to a corresponding preset slow down speed and a corresponding slow down pressure parameter set value;
in the process of slowly pressing down each step, stopping slowly pressing down when the pressing force between the wafer pressing device and the first wafer and the second wafer reaches a set value of a pressing force parameter of the slow pressing corresponding to the slowly pressing down of the step, and continuously performing second static pressing on the first wafer and the second wafer with the current pressure until reaching the second static pressing time;
in the process of each second static pressing, calculating a second pressure relative error according to a pressure feedback value between the wafer pressing device and the first wafer and the second wafer obtained in real time and a slow pressing force parameter set value corresponding to the slow pressing of the step, and generating alarm information when the second pressure relative error exceeds a second preset error range; wherein, the slow pressing down of each step is set with a corresponding second static pressing time.
In the step-by-step slow pressing process, the pressing speed of each slow pressing is smaller than the pressing speed of the slow pressing of the previous step, so that the pressing accuracy is improved, and preset slow pressing speed, second static pressing time and slow pressing force parameter setting values are set in each slow pressing step, so that the pressing end point of each slow pressing step and whether the relative error exceeds a second preset error range (namely whether the accuracy meets the requirement) are judged.
Fig. 2 shows a structure of a wafer bonding control device according to an embodiment of the present invention.
As shown in fig. 2, the wafer press-fit control device provided by the present invention includes:
the wafer fixing and placing module is used for respectively fixing the first wafer to be pressed and the second wafer to be pressed to the corresponding positions of the wafer pressing device;
the rapid pressing module is used for controlling the wafer pressing device to rapidly press the first wafer and the second wafer at a preset rapid pressing speed, and when the pressing force of the rapid pressing reaches a set value of a rapid pressing force parameter, a first pressing wafer structure is obtained;
the slow pressing module is used for slowly pressing the first pressed wafer structure step by step at a preset slow pressing speed, and in the process of slowly pressing each step, when a set value of a slow pressing force parameter corresponding to the slow pressing of the step is reached, the slow pressing of the step is completed, and the pressing force between the wafer pressing device and the first wafer and the second wafer reaches an end point value of a preset pressing force parameter, so that the pressing of the first wafer and the second wafer is completed; wherein the preset slow press down speed is less than the preset fast press down speed.
As a preferred embodiment of the present invention, the wafer-holding module includes a first wafer-holding unit and a second wafer-holding unit; wherein,,
the first wafer fixing and placing unit is used for fixing the first wafer on a lower wafer carrying table of the wafer pressing device;
the second wafer fixing and placing unit is used for fixing the second wafer on the upper wafer carrying platform of the wafer pressing device.
As a preferred embodiment of the present invention, the quick-press-down module includes: a quick pressing unit and a static pressing control unit; wherein,,
the rapid pressing unit is used for acquiring the pressing force between the wafer pressing device and the first wafer and the second wafer generated in the rapid pressing process in real time through the pressure sensor, and controlling the wafer pressing device to stop rapid pressing and performing first static pressing on the first wafer and the second wafer when the pressing force reaches a set value of a rapid pressing force parameter;
and the static press fit control unit is used for obtaining a first press fit wafer structure when the execution time of the first static press fit reaches a first preset static pressure time.
According to the wafer press-fit control method and device provided by the invention, the press-down process of the press-fit device is divided into quick press-down and slow press-down of a plurality of steps, each press-down step depends on three parameter values of press-fit force, press-fit time and press-down speed, and the purpose of accurately controlling the press-fit device is achieved by presetting the parameter values of each step; the invention can reduce the error, and can reduce the time required by the process by changing the pressing speed, thereby greatly improving the bonding efficiency; the invention converts the space position on which the pressing device is pressed down into the pressing force which can be measured by the pressure sensor; then the step-by-step downward pressing control of the pressing device is achieved through the pressing force; the pressing device can be directly controlled by the pressing force, so that the corresponding relation between the pressing force and the spatial position of the pressing device is not required to be measured, and the measuring workload is reduced.
The wafer press control method and apparatus according to the present invention are described above by way of example with reference to the accompanying drawings. However, it should be understood by those skilled in the art that various modifications can be made to the wafer press-fit control method and apparatus according to the present invention without departing from the scope of the present invention. Accordingly, the scope of the invention should be determined from the following claims.

Claims (10)

1. The wafer pressing control method is characterized by comprising the following steps of:
respectively fixing a first wafer to be pressed and a second wafer to be pressed to corresponding positions of a wafer pressing device;
controlling the wafer pressing device to press the first wafer and the second wafer at a preset rapid pressing speed, and obtaining a first pressed wafer structure when the pressing force of the rapid pressing reaches a set value of a rapid pressing force parameter;
slowly pressing the first pressed wafer structure step by step at a preset slow pressing speed, and finishing the slow pressing of the step when a slow pressing force parameter set value corresponding to the slow pressing of the step is reached in the process of slowly pressing of each step until the pressing force between the wafer pressing device and the first wafer and the second wafer reaches an end point value of a preset pressing force parameter; wherein the preset slow press down speed is less than the preset fast press down speed.
2. The wafer bonding control method according to claim 1, wherein the fixing the first wafer to be bonded and the second wafer to be bonded to the respective positions of the wafer bonding apparatus respectively comprises:
fixing the first wafer on a lower wafer carrying table of the wafer pressing device;
and fixing the second wafer on an upper wafer carrying platform of the wafer pressing device.
3. The wafer press-fit control method according to claim 1, wherein, in the process of controlling the wafer press-fit device to press down the first wafer and the second wafer at a predetermined rapid press-down speed, when the press-fit force of the rapid press-down reaches a set value of a rapid press-fit force parameter, a first press-fit wafer structure is obtained,
the pressing force between the wafer pressing device and the first wafer and the pressing force between the wafer pressing device and the second wafer generated in the rapid pressing process are obtained in real time through a pressure sensor, and when the pressing force reaches the set value of the rapid pressing force parameter, the wafer pressing device is controlled to stop rapid pressing, and first static pressing is carried out on the first wafer and the second wafer;
and when the execution time of the first static pressing reaches a first preset static pressure time, obtaining a first pressed wafer structure.
4. The wafer press-fit control method according to claim 3, wherein, in the process of obtaining the first press-fit wafer structure when the execution time of the stationary press-fit reaches a first preset static pressure time,
acquiring a pressure feedback value generated in a static pressing process in real time, and calculating a relative error according to the pressure feedback value and the fast pressing force parameter set value to obtain a first pressure relative error;
and when the first pressure relative error exceeds a first preset error range, generating alarm information of lamination failure.
5. The wafer pressing control method of claim 4, wherein,
the first preset error range is-10%.
6. The wafer press-fit control method according to claim 1, wherein the step-wise slowly pressing the first press-fit wafer structure at a preset slow pressing speed, and the step-wise slowly pressing is completed when a slow pressing force parameter set value corresponding to the step-wise slowly pressing is reached in a process of slowly pressing each step until a pressing force between the wafer press-fit device and the first wafer and the second wafer reaches an end point value of a preset pressing force parameter, and the step-wise completing the pressing of the first wafer and the second wafer comprises:
slowly pressing the first pressed wafer structure at a first preset slow pressing speed, and obtaining a second pressed wafer structure when the pressing force of the slow pressing reaches a first slow pressing force parameter set value corresponding to the slow pressing of the step;
if the pressing force between the wafer pressing device and the first wafer and the second wafer in the second pressing wafer structure reaches the end point value of the preset pressing force parameter, the pressing of the first wafer and the second wafer is completed; and if the pressing force between the wafer pressing device and the first wafer and the second wafer in the second pressing wafer structure does not reach the end value of the preset pressing force parameter, slowly pressing the second pressing wafer structure at a second preset slow pressing speed again until the pressing force between the wafer pressing device and the first wafer and the second wafer reaches the end value of the preset pressing force parameter, and finishing pressing the first wafer and the second wafer.
7. The wafer press-fit control method according to claim 1, wherein the first press-fit wafer structure is slowly pressed down step by step at a preset slow pressing down speed, and in the course of each step of slowly pressing down, when a slow pressing down force parameter set value corresponding to the slow pressing down of the step is reached, the slow pressing down of the step is completed until the press-fit force between the wafer press-fit device and the first wafer and the second wafer reaches an end point value of a preset standard press-fit force parameter,
gradually slowly pressing the first pressed wafer structure in a mode that the preset slowly pressing speed is gradually decreased; wherein, the slow down of each step corresponds to a corresponding preset slow down speed and a corresponding slow down pressure parameter set value;
in the process of slowly pressing down each step, stopping slowly pressing down the step when the pressing force between the wafer pressing device and the first wafer and the second wafer reaches a slowly pressing force parameter set value corresponding to the slowly pressing down of the step, and continuously performing second static pressing on the first wafer and the second wafer with the current pressure until reaching a second static pressing time;
in the process of each second static pressing, calculating a second pressure relative error according to a pressure feedback value between the wafer pressing device and the first wafer and the second wafer obtained in real time and a slow pressing force parameter set value corresponding to slow pressing of the step, and generating alarm information when the second pressure relative error exceeds a second preset error range; wherein, the slow pressing down of each step is set with a corresponding second static pressing time.
8. The wafer pressing control device is characterized by comprising:
the wafer fixing and placing module is used for respectively fixing the first wafer to be pressed and the second wafer to be pressed to the corresponding positions of the wafer pressing device;
the rapid pressing module is used for controlling the wafer pressing device to rapidly press the first wafer and the second wafer at a preset rapid pressing speed, and when the pressing force of the rapid pressing reaches a set value of a rapid pressing force parameter, a first pressing wafer structure is obtained;
the slow pressing module is used for slowly pressing the first pressed wafer structure step by step at a preset slow pressing speed, and in the process of slowly pressing each step, when a slow pressing force parameter set value corresponding to the slow pressing of the step is reached, the slow pressing of the step is completed until the pressing force between the wafer pressing device and the first wafer and the second wafer reaches an end point value of a preset pressing force parameter, and the pressing of the first wafer and the second wafer is completed; wherein the preset slow press down speed is less than the preset fast press down speed.
9. The wafer press-fit control device according to claim 8, wherein: the wafer fixing and placing module comprises a first wafer fixing and placing unit and a second wafer fixing and placing unit; wherein,,
the first wafer fixing and placing unit is used for fixing the first wafer on a lower wafer carrying platform of the wafer pressing device;
the second wafer fixing and placing unit is used for fixing the second wafer on an upper wafer carrying platform of the wafer pressing device.
10. The wafer press-fit control device according to claim 8, wherein: the quick-press-down module includes: a quick pressing unit and a static pressing control unit; wherein,,
the rapid pressing unit is used for acquiring the pressing force between the wafer pressing device and the first wafer and the second wafer generated in the rapid pressing process in real time through a pressure sensor, and controlling the wafer pressing device to stop rapid pressing and performing first static pressing on the first wafer and the second wafer when the pressing force reaches the set value of the rapid pressing force parameter;
and the static press fit control unit is used for obtaining a first press fit wafer structure when the execution time of the first static press fit reaches a first preset static pressure time.
CN202210278557.6A 2022-03-21 2022-03-21 Wafer pressing control method and device Pending CN116825659A (en)

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CN116825659A true CN116825659A (en) 2023-09-29

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