CN116801477A - Thick film multi-piece integrated ceramic substrate and manufacturing method thereof - Google Patents
Thick film multi-piece integrated ceramic substrate and manufacturing method thereof Download PDFInfo
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- CN116801477A CN116801477A CN202211205257.1A CN202211205257A CN116801477A CN 116801477 A CN116801477 A CN 116801477A CN 202211205257 A CN202211205257 A CN 202211205257A CN 116801477 A CN116801477 A CN 116801477A
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- 239000000758 substrate Substances 0.000 title claims abstract description 120
- 239000000919 ceramic Substances 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000000465 moulding Methods 0.000 claims abstract description 3
- 238000013461 design Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 238000007639 printing Methods 0.000 abstract description 12
- 238000009966 trimming Methods 0.000 abstract description 6
- 239000000523 sample Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Abstract
The application discloses a thick film multi-piece integrated ceramic substrate and a manufacturing method thereof, wherein the thick film multi-piece integrated ceramic substrate comprises a ceramic substrate frame (1) with two perpendicular positioning edges (2), a group of through holes (3) are arranged in the ceramic substrate frame (1), a circuit substrate (4) is arranged in each through hole (3), the edges of the circuit substrate (4) are integrally and fixedly connected with the corresponding through holes (3) through at least two connecting parts (5), and each circuit substrate (4) and each positioning edge (2) have a definite dimensional relationship; the circuit board (4) is a circuit molding board provided with electronic components. The application solves the problem of consistency of printing registered patterns through the process edges and the alignment marks. The multiple-piece structure eliminates errors in multiple positioning of a single substrate. When a pattern is printed once, a plurality of singlechips are positioned once, automatic laser trimming of the singlechips is realized, the distance between the round substrates is set through a laser trimming program, and uninterrupted automatic trimming of a plurality of continuous chips connected end to end is realized.
Description
Technical Field
The application belongs to the technical field of thick film integrated circuit manufacturing, and particularly relates to a thick film multi-piece integrated ceramic substrate and a manufacturing method thereof.
Background
At present, a single thick film substrate mainly comprises the following manufacturing processes: manufacturing a single screen printing plate by using a single optical drawing layout, finding out two-point positioning fixed by a camera by using a manual rotating substrate, manually fine-adjusting and registering cross coordinates of a screen printer, and then printing the single screen printing, wherein the second layer of printing also tracks the alignment direction of the first layer of printing so as to ensure that a second layer of printing pattern is aligned with the first layer of pattern, registering the patterns for multiple times according to design requirements, and registering the patterns for multiple times;
laser resistance: placing the single chip on a workbench, positioning the edge, vacuum adsorbing the single chip substrate, and adjusting the XY direction position and levelness of the workbench according to the placing position of each single chip, so that a bonding pad in a contact pattern of a laser trimming probe card is tested, and the coordinates of a laser notch are required to be positioned for each resistor. When the position of the workbench of each single chip is consistent with that of each single chip, the probe card can fall into the corresponding bonding pad. However, in the practical situation, the printing position of each single chip pattern has a certain error, the laser machine can not be registered through the pattern, and the coordinates of each resistor need to be changed, so that each round single chip is positioned on the workbench, after the edge positioning is performed, the levelness of the workbench is adjusted every time, the substrate placement position is horizontal, and then the positioning of the workbench is adjusted, so that the probe accurately falls. Thus, each resistor coordinate in the previous laser procedure needs to be manually repositioned (step), that is, each resistor needs to be manually repositioned in turn. Because of each adjustment of levelness, the probe contact is inconsistent. Each resistor positioning coordinate in each adjustment procedure causes inconsistent initial cuts of the laser trimming resistor, which can cause inaccurate test, inaccurate resistance value and even miscut phenomenon.
After the laser resistance adjustment is finished, the single film-forming substrate is placed on a wafer carrying table and fixed by a positioning clamp, then the angle of the single film-forming substrate is adjusted and positioned, then a clamp base is rotated to find the proper patch angle of each component to be taken and placed, then the components are attached and bonded, and finally the test and the encapsulation are carried out.
As can be seen from the above fabrication process, each process flow of a single substrate requires repositioning. For some special-shaped ceramic substrates, because the outline of the special-shaped ceramic substrate is irregular, even if the special-shaped ceramic substrate is positioned through straight edges or notches, the problems of inconvenient positioning and inaccurate precision are easy to occur, and when the procedures are repeatedly positioned, positioning error accumulation is inevitably caused, so that the product quality and the processing efficiency are influenced; especially, the laser resistance-adjusting fine-tuning procedure has higher requirements on positioning accuracy, and the resistance-adjusting performance and efficiency can be affected by slightly lower positioning accuracy.
In the prior art, the positioning accuracy of the thick film substrate is improved mainly by manufacturing a positioning fixture, for example, the Chinese patent literature with publication number of CN113942288A discloses a manufacturing method of a high-temperature-resistant continuous printing fixture based on the thick film printing design of a circular substrate, and accurate positioning of the substrate is realized by arranging splayed positioning columns in the fixture. However, because the contours of the thick film substrates with different specifications are different, the positioning fixtures are required to be correspondingly manufactured, and meanwhile, the processing cost is increased.
Disclosure of Invention
Aiming at the defects of the technical problems, the application provides a thick film multi-piece integrated ceramic substrate and a manufacturing method thereof.
The application adopts the following technical scheme:
the utility model provides a thick film multi-chip integrated ceramic substrate, includes ceramic substrate frame, its characterized in that: the outer contour of the ceramic substrate frame is provided with two perpendicular positioning edges, a group of through holes are formed in the ceramic substrate frame, a circuit substrate is arranged in each through hole, the edges of the circuit substrate are integrally and fixedly connected with the corresponding through holes through at least two connecting parts, and each circuit substrate and each positioning edge have a definite dimensional relationship; the circuit substrate is a circuit molding substrate provided with electronic components.
Further, the outer contour of the ceramic substrate frame is rectangular, and two adjacent vertical sides are positioning sides.
Further, the circuit substrates are round, and four connecting parts connected with each other are uniformly distributed on each circuit substrate at the center of the circle.
Further, the connection portion is a half-scribe point left by intermittent cutting along the contour of the circuit substrate.
Further, the surface of the ceramic substrate frame is provided with an alignment mark, and the alignment mark has a definite dimensional relationship with each circuit substrate.
The application also provides a manufacturing method of the thick film multi-piece integrated ceramic substrate, which comprises the following steps:
s1, cutting to manufacture a blank ceramic substrate with multiple connecting pieces according to a design layout, and carrying out finish machining on two adjacent vertical edges of a ceramic substrate frame to form positioning edges; simultaneously, printing an alignment mark on the ceramic substrate frame, wherein the alignment mark and the positioning edge have a definite size relation with each circuit substrate;
s2, carrying out screen printing on the blank ceramic substrates with multiple pieces, drying and sintering to form printed circuits and film elements with certain electrical functions;
s3, performing laser resistance adjustment:
1) Positioning by using two positioning edges and an alignment mark, and simultaneously adjusting a workbench to enable the ceramic substrates with multiple pieces to meet the corresponding position requirements;
2) And (3) importing the size relation between the alignment mark and each circuit substrate into the laser resistance adjusting device in a program mode, and operating the laser resistance adjusting device to perform laser resistance adjustment.
S4, carrying out surface mounting by adopting a conventional automatic surface mounting machine and carrying out wire bonding by adopting a conventional automatic bonding machine.
Further, when the resistance is regulated by laser, whether the single-chip resistor is qualified or not can be judged by a program, and the laser automatically marks the R pattern on the unqualified single chip, and the R pattern is marked for the subsequent sticking and bonding processes of the single chip without sticking and bonding.
Compared with the prior art, the application has the beneficial effects that:
1. the scheme solves the problem of consistency of printing registered patterns through the process edges and the alignment marks. The multiple-piece structure eliminates errors in multiple positioning of a single substrate. When a pattern is printed once, a plurality of singlechips are positioned once, so that automatic laser trimming of the singlechips is realized, the distance between the round substrates is set through a laser trimming program, and uninterrupted automatic trimming of a plurality of continuous chips connected end to end is realized.
2. The arrangement of the connecting part not only enables a plurality of substrates to form a connecting piece structure, but also effectively resists the pressing deformation in the printing and laser resistance adjustment process.
Drawings
FIG. 1 is a schematic diagram of a thick film multi-piece integrated ceramic substrate embodiment of the present application;
FIG. 2 is a schematic diagram of a method for manufacturing a thick film multi-piece integrated ceramic substrate according to step 1 of the present application;
fig. 3 is a schematic diagram of step 2 of a method for manufacturing a thick film multi-piece integrated ceramic substrate according to the present application.
Reference numerals illustrate: 1. a ceramic substrate frame; 2. positioning edges; 3. a through hole; 4. a circuit substrate; 5. a connection part; 6. an alignment mark; 7. semi-scribe points.
Detailed Description
In order that the application may be more clearly understood, a thick film multi-piece integrated ceramic substrate and method of making the same will be further described with reference to the accompanying drawings, the specific embodiments described herein are for purposes of illustration only and are not intended to be limiting.
As shown in fig. 1, a thick film multi-piece integrated ceramic substrate comprises a rectangular ceramic substrate frame 1, wherein two adjacent vertical sides of the ceramic substrate frame 1 are positioning sides 2, a group of through holes 3 are equidistantly arrayed in the ceramic substrate frame 1, a circuit substrate 4 is arranged in each through hole 3, the orifice shape of the through hole 3 is set in a matching manner according to the appearance of the circuit substrate 4, and the orifice size of the through hole 3 is slightly larger than the size of the circuit substrate 4. The circuit board 4 may be rectangular, square or a special-shaped contour with an arc surface, and in this embodiment, the contour of the circuit board 4 is circular, and one side of the circuit board is provided with a straight edge for positioning. The circuit board 4 is a ceramic substrate, and is a post-film substrate formed by printing, resistance adjustment, bonding, and other processes.
The outline edge of the circuit substrate 4 is integrally and fixedly connected with the corresponding through hole 3 through four connecting parts 5, and the connecting parts 5 are uniformly distributed at the center of the circuit substrate 4. The connection portion 5 is a half-scribe point 7 left by intermittent cutting along the outline of the circuit substrate 4. For example, the thickness of the area of the half-scribing point 7 is half of the thickness of the ceramic substrate, so that after finished product processing, a laser scanning dividing plate enables single chips to be separated, and each circuit substrate 4 is cut for assembly test.
Each circuit substrate 4 and each positioning edge 2 have a determined size relationship, and the corresponding size relationship is input into automatic production equipment for substrate circuits, so that each circuit substrate 4 is positioned accurately and quickly. In addition, an alignment mark 6 is provided on the surface of the ceramic substrate frame 1, and the alignment mark 6 has a certain dimensional relationship with each circuit substrate 4, thereby further improving the positioning accuracy of each circuit substrate 4.
The manufacturing method of the structure comprises the following steps:
s1, as shown in FIG. 2, cutting to manufacture a blank ceramic substrate with nine connecting pieces according to a design layout, wherein the surface of the blank ceramic substrate is required to be smooth and meets the requirements. The ceramic substrate is internally provided with a ceramic substrate frame 1 and nine through holes 3, and each through hole 3 is internally provided with a disc-shaped blank substrate which is intermittently connected. Two adjacent vertical sides of the ceramic substrate frame 1 are finished to form a positioning side 2, and simultaneously, an alignment mark 6 is printed on the ceramic substrate frame 1, and the alignment mark 6 and the positioning side 2 have a definite dimensional relationship with each circuit substrate 4.
S2, as shown in FIG. 3, screen printing is carried out on the nine-piece blank ceramic substrate for multiple times according to the design layout, and drying and sintering are carried out to form printed circuits and film elements with certain electrical functions, such as wire loops, resistor film elements, capacitor film elements, inductance film elements and the like.
S3, performing laser resistance adjustment:
1) Positioning and fixing are carried out by using the two positioning edges 2 and the alignment mark 6 of the ceramic substrate frame 1, and the XY direction position and levelness of the workbench are adjusted until nine ceramic substrates are in line with the corresponding position requirements;
2) According to the size relation between the alignment mark 6 and each circuit substrate 4, the alignment mark is led into the laser resistance adjusting equipment in a program mode, and the laser resistance adjusting equipment is operated to perform laser resistance adjustment;
when the laser is in fine adjustment, whether the circular unit resistor is qualified or not can be judged through a program, the laser automatically marks the R graph on the unqualified single chip, and the pasting and bonding processes of the subsequent step of marking the R graph single chip are not carried out.
S4, adopting a conventional automatic chip mounter to carry out chip mounting and adopting a conventional automatic bonding machine to carry out wire bonding, so as to form the structure shown in FIG. 1.
After the thick film multi-piece integrated ceramic substrate is prepared, the ceramic substrate is split through a fixture (or split plates are divided by scanning four half-scribing points of each circular substrate through laser), and finally single-piece assembly and testing are carried out.
The above examples of the present application are merely illustrative of the present application and are not intended to limit the embodiments of the present application. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While those obvious variations or modifications which come within the spirit of the application remain within the scope of the application.
Claims (7)
1. The utility model provides a thick film multi-chip integrated ceramic substrate, includes ceramic substrate frame (1), its characterized in that: the outer contour of the ceramic substrate frame (1) is provided with two perpendicular positioning edges (2), a group of through holes (3) are formed in the ceramic substrate frame (1), a circuit substrate (4) is arranged in each through hole (3), the edges of the circuit substrate (4) are integrally and fixedly connected with the corresponding through holes (3) through at least two connecting parts (5), and each circuit substrate (4) and each positioning edge (2) have a definite size relationship; the circuit board (4) is a circuit molding board provided with electronic components.
2. The thick film multi-piece integrated ceramic substrate of claim 1, wherein: the outer contour of the ceramic substrate frame (1) is rectangular, and two adjacent vertical sides are positioning sides (2).
3. The thick film multi-piece integrated ceramic substrate of claim 1, wherein: the circuit substrates (4) are round, and four connecting parts (5) connected with each other are uniformly distributed on each circuit substrate (4) at the center of the circle.
4. The thick film multi-piece integrated ceramic substrate of claim 1, wherein: the connecting part (5) is a half-scribing point (7) which is cut along the contour of the circuit substrate (4) intermittently.
5. The thick film multi-piece integrated ceramic substrate of claim 1, wherein: the surface of the ceramic substrate frame (1) is provided with an alignment mark (6), and the alignment mark (6) and each circuit substrate have a determined dimensional relationship.
6. The manufacturing method of the thick film multi-piece integrated ceramic substrate is characterized by comprising the following steps of:
s1, cutting to manufacture a blank ceramic substrate with multiple pieces according to a design layout, and carrying out finish machining on two adjacent vertical edges of a ceramic substrate frame (1) to form a positioning edge (2); simultaneously, an alignment mark (6) is printed on the ceramic substrate frame (1), and the alignment mark (6) and the positioning edge (2) have a definite size relation with each circuit substrate (4);
s2, carrying out screen printing on the blank ceramic substrates with multiple pieces, drying and sintering to form printed circuits and film elements with certain electrical functions;
s3, performing laser resistance adjustment:
1) Positioning is carried out by using the two positioning edges (2) and the alignment mark (6), and meanwhile, the workbench is adjusted to enable the ceramic substrates with multiple pieces to meet the corresponding position requirements;
2) The size relation between the alignment mark (6) and each circuit substrate (4) is led into the laser resistance adjusting equipment in a program mode, and the laser resistance adjusting equipment is operated to perform laser resistance adjustment;
s4, carrying out surface mounting by adopting a conventional automatic surface mounting machine and carrying out wire bonding by adopting a conventional automatic bonding machine.
7. The method for manufacturing the thick film multi-piece integrated ceramic substrate according to claim 6, wherein the method comprises the following steps: when the resistance of the laser is regulated, whether the single-chip resistor is qualified or not can be judged through a program, the laser automatically marks the R graph on the unqualified single chip, and the R graph is marked for subsequent sticking and bonding in the bonding process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211205257.1A CN116801477A (en) | 2022-09-30 | 2022-09-30 | Thick film multi-piece integrated ceramic substrate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211205257.1A CN116801477A (en) | 2022-09-30 | 2022-09-30 | Thick film multi-piece integrated ceramic substrate and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116801477A true CN116801477A (en) | 2023-09-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211205257.1A Pending CN116801477A (en) | 2022-09-30 | 2022-09-30 | Thick film multi-piece integrated ceramic substrate and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116801477A (en) |
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2022
- 2022-09-30 CN CN202211205257.1A patent/CN116801477A/en active Pending
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